TWI412223B - Piezoelectric transducer - Google Patents
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本發明係關於一種壓電換能裝置,尤其是,一種具整流功能之壓電換能裝置。The present invention relates to a piezoelectric transducer, and more particularly to a piezoelectric transducer having a rectifying function.
壓電性為一種機電能量互換的現象,最早於1880年由Pierre Curie及Jacques Curie所發現;當時發現若對電氣石施加一機械壓力,將可在其表面上得到電荷,此因物質機械變形所產生的電極化現象被W. G. Hankel定名為壓電性。次年Pierre Curie及Jacques Curie利用M. G. Lippmann的熱力學理論證實了壓電性的逆效應存在,亦即外加電場可導致晶體的機械形變。自壓電材料被發現以來,被廣泛應用於通訊元件、感測元件、微致動器、發電元件等各種應用領域之中。Piezoelectricity is a phenomenon of electromechanical energy exchange, first discovered by Pierre Curie and Jacques Curie in 1880; it was found that if a mechanical pressure was applied to the tourmaline, it would be able to obtain a charge on its surface due to mechanical deformation of the material. The resulting polarization phenomenon was named piezoelectric by WG Hankel. The following year, Pierre Curie and Jacques Curie used M. G. Lippmann's thermodynamic theory to confirm the existence of the inverse effect of piezoelectricity, that is, the applied electric field can cause mechanical deformation of the crystal. Since the discovery of piezoelectric materials, it has been widely used in various applications such as communication components, sensing components, microactuators, and power generation components.
鋯鈦酸鉛(PZT)及氧化鋅(ZnO)是目前最常被使用之壓電材料,如第1a、1b及1c圖所示,一壓電元件91係由非傳導性材料構成,其內部沒有自由電子來幫助傳導,惟若施加一應力(例如:一張應力92或一壓縮應力93)於該壓電元件91上,造成其內部晶體形變,將導致電子94移動,使該壓電元件91之受力面聚集與該應力大小成比例之電荷(電壓),當該應力方向相反,電荷(電壓)之極性亦隨之相反。因此,當該壓電材料受力振動而變形時,其上下兩面會分別受到該張應力與該壓縮應力作用而聚集不同電荷,因此,可輸出一交流電,如第2圖所示。惟,一般電子元件之供電需求均以直流電居多,故當上述之壓電材料受力振動以供電給一電子元件時,即需外接一整流電路,將輸出之交流電轉為直流電。整流電路分為半波整流與全波整流,半波整流會將負半週截掉,其整流方式為利用二極體組成;全波整流則將負半週轉為正值,其整流方式有兩種:第一種利用中心抽頭式的變壓器和兩個二極體構成一個整流電路,第二種利用四個二極體設計,其電路構造與電橋相似,特稱為橋式整流電路,如第3圖所示,係一習用壓電換能裝置之橋式整流電路圖。Lead zirconate titanate (PZT) and zinc oxide (ZnO) are the most commonly used piezoelectric materials. As shown in Figures 1a, 1b and 1c, a piezoelectric element 91 is composed of a non-conductive material and its interior. There is no free electron to help conduct, but if a stress (for example, a stress 92 or a compressive stress 93) is applied to the piezoelectric element 91, causing internal crystal deformation, it will cause the electron 94 to move, making the piezoelectric element The force surface of 91 accumulates a charge (voltage) proportional to the magnitude of the stress. When the stress direction is opposite, the polarity of the charge (voltage) is also reversed. Therefore, when the piezoelectric material is deformed by vibration, the upper and lower sides are respectively subjected to the tensile stress and the compressive stress to collect different charges, and therefore, an alternating current can be output, as shown in FIG. However, the power supply requirements of general electronic components are mostly DC power. Therefore, when the piezoelectric material is vibrated to supply power to an electronic component, an external rectifier circuit is required to convert the output alternating current into direct current. The rectifier circuit is divided into half-wave rectification and full-wave rectification. The half-wave rectification will cut off the negative half cycle. The rectification mode is composed of diodes. The full-wave rectification turns the negative half cycle into a positive value. Kind: The first type uses a center-tapped transformer and two diodes to form a rectifier circuit, and the second uses four diode designs, the circuit structure is similar to that of a bridge, especially called a bridge rectifier circuit, such as As shown in Fig. 3, it is a bridge rectifier circuit diagram of a conventional piezoelectric transducer.
按,以全波橋式整流為例,若以矽二極體構成的橋式整流電路,來進行該習用壓電換能裝置之輸出整流,則會使該習用壓電換能裝置損失約1.4伏特(Volt)的電壓,且四個二極體的內阻亦會造成耗能;若以鍺二極體構成的橋式整流電路,則會損失約0.5至0.8伏特的電壓,同時四個二極體的內阻也會造成耗能;若使用順向切入電壓較小的1N5711二極體進行整流,則會損失0.46伏特,其內阻也會造成耗能,並且因為該二極體屬於特殊二極體,所以單價成本較高。For example, in the case of full-wave bridge rectification, if the bridge rectifier circuit composed of the 矽 diode is used to perform the output rectification of the conventional piezoelectric transducer, the conventional piezoelectric transducer can be lost by about 1.4. Volt voltage, and the internal resistance of the four diodes also cause energy consumption; if the bridge rectifier circuit composed of 锗 diodes, it will lose about 0.5 to 0.8 volts, while four The internal resistance of the polar body also causes energy consumption; if the 1N5711 diode with a small forward cut-in voltage is used for rectification, it will lose 0.46 volts, and its internal resistance will also cause energy consumption, and because the diode is special Diode, so the unit price is higher.
因此,若能使壓電換能裝置具有整流功能而直接輸出直流電,即可去除一整流電路所造成之壓電換能裝置功率損耗,並減少該整流電路之體積及成本。Therefore, if the piezoelectric transducer can have a rectifying function and directly output direct current, the power loss of the piezoelectric transducer caused by a rectifier circuit can be removed, and the volume and cost of the rectifier circuit can be reduced.
本發明之目的乃改良上述缺點,以提供一種壓電換能裝置,該壓電換能裝置係可利用振動而產生該交流電,並利用壓電材料與金屬材料接觸時,所產生的電位障壁來進行整流。因此,無外接整流電路之功率損耗,可提升壓電換能效率。It is an object of the present invention to improve the above disadvantages to provide a piezoelectric transducer capable of generating the alternating current by vibration and utilizing a potential barrier formed by the contact of the piezoelectric material with the metallic material. Perform rectification. Therefore, the power loss of the external rectifier circuit can improve the piezoelectric transducing efficiency.
本發明之次一目的,係提供一種壓電換能裝置,該壓電換能裝置係可利用振動而產生該交流電,並利用壓電材料與金屬材料接觸時,所產生的電位障壁來進行整流。因此,無外接整流電路所需之成本,可降低建置壓電換能系統之成本。A second object of the present invention is to provide a piezoelectric transducer capable of generating the alternating current by vibration and rectifying the potential barrier by using a piezoelectric material in contact with the metal material. . Therefore, the cost of the external rectifier circuit can be reduced, and the cost of constructing the piezoelectric transducer system can be reduced.
本發明之再一目的,係提供一種壓電換能裝置,該壓電換能裝置係可利用振動而產生該交流電,並利用壓電材料與金屬材料接觸時,所產生的電位障壁來進行整流。因此,無外接整流電路所需之體積,可減少使用空間及增加單位體積之裝置數量。Still another object of the present invention is to provide a piezoelectric transducer capable of generating the alternating current by vibration and rectifying a potential barrier by using a piezoelectric material in contact with a metal material. . Therefore, the volume required for the external rectification circuit can reduce the number of devices that use space and increase the unit volume.
本發明之壓電換能裝置,主要係由一基板,係具有撓性;一壓電層,具有相對之一第一表面及一第二表面;一第一導電層,係設置於該壓電層之第一表面;一第二導電層,係設置於該壓電層之第二表面;其中,該第一導電層或該第二導電層係結合於該基板;該第一導電層與該壓電層間為一歐姆接觸;該第二導電層與該壓電層間為一蕭特基接觸。藉由該蕭特基接觸形成具有整流功能之壓電換能裝置。The piezoelectric transducer device of the present invention is mainly composed of a substrate having flexibility; a piezoelectric layer having a first surface and a second surface; and a first conductive layer disposed on the piezoelectric layer a first surface of the layer; a second conductive layer disposed on the second surface of the piezoelectric layer; wherein the first conductive layer or the second conductive layer is bonded to the substrate; the first conductive layer and the The piezoelectric layers are an ohmic contact; the second conductive layer and the piezoelectric layer are in a Schottky contact. A piezoelectric transducer having a rectifying function is formed by the Schottky contact.
為讓本發明之上述及其他目的、特徵及優點能更明顯易懂,下文特舉本發明之較佳實施例,並配合所附圖式,作詳細說明如下:請參照第4圖所示,其係本發明壓電換能裝置之第一實施例,該壓電換能裝置係包含一基板1、一第一導電層2、一壓電層3及一第二導電層4。該基板1上可形成該第一導電層2,該壓電層3係設置於該第一導電層2與該第二導電層4之間。其中,該第一導電層2與該壓電層3間為一歐姆接觸(Ohmic contact);該第二導電層4與該壓電層3間為一蕭特基接觸(Schottky contact)。因此,該壓電換能裝置受力振動所產生之交流電,可藉由該蕭特基接觸進行整流。The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims. It is a first embodiment of the piezoelectric transducer device of the present invention. The piezoelectric transducer device comprises a substrate 1, a first conductive layer 2, a piezoelectric layer 3 and a second conductive layer 4. The first conductive layer 2 is formed on the substrate 1 , and the piezoelectric layer 3 is disposed between the first conductive layer 2 and the second conductive layer 4 . The first conductive layer 2 and the piezoelectric layer 3 are in an ohmic contact; the second conductive layer 4 and the piezoelectric layer 3 are in a Schottky contact. Therefore, the alternating current generated by the piezoelectric transducer of the piezoelectric transducer can be rectified by the Schottky contact.
詳言之,該基板1較佳係由塑膠等具有撓性之基板構成,該基板1可具導電性或不具導電性,該基板1可供成長其他材料層。該第一導電層2較佳係由具有導電性之金屬材料形成,該第一導電層2係設置於該基板1之一表面。該壓電層3較佳係由鋯鈦酸鉛或氧化鋅等材料,以射頻濺鍍法、直流濺鍍法、溶膠凝膠法、熱壓法、網印法、化學氣相沉積法、電子束蒸鍍法、雷射沉積法或原子層沉積法等方式構成。該壓電層3具有相對之一第一表面31及一第二表面32,該第一表面31係結合於該第一導電層2,且該第一表面31與該第一導電層2間為該歐姆接觸。該第二導電層4較佳係由金、鉑、銀或銅等金屬材料,以射頻濺鍍法、直流濺鍍法、熱蒸鍍法、網印法、化學氣相沉積法、電子束蒸鍍法、雷射沉積法、原子層沉積法或塗佈法等方式製成。該第二導電層4係結合於該壓電層3之第二表面32,且該第二導電層4與該壓電層3之第二表面32間為該蕭特基接觸。In detail, the substrate 1 is preferably made of a flexible substrate such as plastic, and the substrate 1 can be electrically conductive or non-conductive, and the substrate 1 can be used to grow other material layers. The first conductive layer 2 is preferably formed of a conductive metal material, and the first conductive layer 2 is disposed on one surface of the substrate 1. The piezoelectric layer 3 is preferably made of lead zirconate titanate or zinc oxide, by radio frequency sputtering, direct current sputtering, sol-gel method, hot pressing method, screen printing method, chemical vapor deposition method, electron It is composed of a beam evaporation method, a laser deposition method or an atomic layer deposition method. The piezoelectric layer 3 has a first surface 31 and a second surface 32. The first surface 31 is bonded to the first conductive layer 2, and the first surface 31 and the first conductive layer 2 are The ohmic contact. The second conductive layer 4 is preferably made of a metal material such as gold, platinum, silver or copper by radio frequency sputtering, direct current sputtering, thermal evaporation, screen printing, chemical vapor deposition, or electron beam evaporation. It is made by plating, laser deposition, atomic layer deposition or coating. The second conductive layer 4 is bonded to the second surface 32 of the piezoelectric layer 3, and the Schottky contact is between the second conductive layer 4 and the second surface 32 of the piezoelectric layer 3.
本發明之壓電換能裝置的運作係詳述如後,其中,由於該基板1具有撓性,當該基板1之一端受力而振動(例如:反覆擺動)時,可使設置於該基板1上之各材料層亦隨其振動而變形。如第5a圖所示,當該基板1向上擺動時,該壓電層3之第一表面31及第二表面32分別受一張應力及一壓縮應力作用,因而在該第一表面31聚集負電荷,並在該第二表面32聚集正電荷;反之,如第5b圖所示,當該基板1向下擺動時,則在該壓電層3之第一表面31及第二表面32分別聚集正電荷及負電荷。The operation of the piezoelectric transducer of the present invention is as follows. In the following, since the substrate 1 has flexibility, when one end of the substrate 1 is vibrated (for example, repeatedly oscillated), it can be disposed on the substrate. The layers of material on 1 are also deformed as they vibrate. As shown in FIG. 5a, when the substrate 1 is swung upward, the first surface 31 and the second surface 32 of the piezoelectric layer 3 are respectively subjected to a stress and a compressive stress, and thus are concentrated on the first surface 31. And charging a positive charge on the second surface 32; conversely, as shown in FIG. 5b, when the substrate 1 is swung downward, the first surface 31 and the second surface 32 of the piezoelectric layer 3 are respectively collected. Positive and negative charges.
此外,該歐姆接觸係一金屬半導體接面,其雙向皆可導通,且其接觸電阻值遠小於一半導體之串聯電阻值,當電流通過時,其壓降可忽略;該蕭特基接觸係另一金屬半導體接面,當構成此金屬半導體接面之金屬及半導體接觸時,該半導體之電子親和力與該金屬之功函數將形成一蕭特基位障(Schottky Barrier),該蕭特基位障減掉一費米能階(Fermi Level)及該半導體傳導帶(Conduction Band)之電位差,可得一內建電位障,該內建電位障即是該半導體傳導帶中之電子試圖移動進入該金屬時所看到之位障。於順向偏壓情形下,由該金屬至該半導體之位障不變,但是由該半導體至該金屬的位障減少;反之,於逆向偏壓情形下,由該金屬至該半導體之位障不變,但是由該半導體至該金屬的位障增加。In addition, the ohmic contact is a metal semiconductor junction, which can be turned in both directions, and the contact resistance value is much smaller than the series resistance of a semiconductor. When the current passes, the voltage drop is negligible; the Schottky contact is another a metal semiconductor junction, when the metal and semiconductor forming the junction of the metal semiconductor are in contact, the electron affinity of the semiconductor and the work function of the metal will form a Schottky barrier, the Schottky barrier By subtracting the potential difference between a Fermi Level and the conduction conduction band, a built-in potential barrier is obtained, and the built-in potential barrier is an electron in the semiconductor conduction band that attempts to move into the metal. The obstacles you see when you see it. In the case of forward bias, the barrier from the metal to the semiconductor is unchanged, but the barrier from the semiconductor to the metal is reduced; conversely, in the case of reverse bias, the barrier from the metal to the semiconductor It does not change, but the barrier from the semiconductor to the metal increases.
綜上所述,由於該第一導電層2與該壓電層3間為該歐姆接觸,且該第二導電層4與該壓電層3間為該蕭特基接觸,因此,當該壓電層3向上擺動時,該第一表面31聚集負電荷且該第二表面32聚集正電荷,若將具有該歐姆接觸之第一導電層2接地,該第一導電層2與該第二導電層4間為順向偏壓,由該半導體至該金屬的位障減少,具有該蕭特基接觸之第二導電層4可輸出一正電壓;反之,當該壓電層3向下擺動時,該第一表面31聚集正電荷且該第二表面32聚集負電荷,若將具有該歐姆接觸之第一導電層2接地,該第一導電層2與該第二導電層4間為逆向偏壓,由該半導體至該金屬的位障增加,具有該蕭特基接觸之第二導電層4輸出之電壓值為零。請閱第6圖所示,其係為本發明之壓電換能裝置的理想輸出電壓波形圖。因此,本發明所揭示之壓電換能裝置不需透過任何整流電路,即可直接提供經過整流之電力。In summary, since the ohmic contact is between the first conductive layer 2 and the piezoelectric layer 3, and the Schottky contact is between the second conductive layer 4 and the piezoelectric layer 3, when the pressure is When the electrical layer 3 swings upward, the first surface 31 collects a negative charge and the second surface 32 collects a positive charge. If the first conductive layer 2 having the ohmic contact is grounded, the first conductive layer 2 and the second conductive layer The layer 4 is forward biased, and the barrier from the semiconductor to the metal is reduced, and the second conductive layer 4 having the Schottky contact can output a positive voltage; otherwise, when the piezoelectric layer 3 is swung downward The first surface 31 collects a positive charge and the second surface 32 collects a negative charge. If the first conductive layer 2 having the ohmic contact is grounded, the first conductive layer 2 and the second conductive layer 4 are reversely biased. The voltage increases from the semiconductor to the metal, and the voltage value of the output of the second conductive layer 4 having the Schottky contact is zero. Please refer to FIG. 6, which is an ideal output voltage waveform diagram of the piezoelectric transducer of the present invention. Therefore, the piezoelectric transducer disclosed in the present invention can directly provide rectified power without passing through any rectifier circuit.
請閱第7圖所示,其係本發明之第二實施例,該第二實施例與該第一實施例差異在於,可先在該基板1上形成該第二導電層4,再於該第二導電層4上依序形成該壓電層3及第一導電層2。其中,該第二導電層4與該壓電層3間為該蕭特基接觸,該第一導電層2與該壓電層3間為該歐姆接觸,因此,當該壓電層3向上擺動時,若將具有該歐姆接觸之第一導電層2接地,該第一導電層2與該第二導電層4間為逆向偏壓,具有該蕭特基接觸之第二導電層4輸出之電壓值為零;反之,當該壓電層3向下擺動時,若將具有該歐姆接觸之第一導電層2接地,該第一導電層2與該第二導電層4間為順向偏壓,具有該蕭特基接觸之第二導電層4輸出一正電壓。Referring to FIG. 7, which is a second embodiment of the present invention, the second embodiment is different from the first embodiment in that the second conductive layer 4 can be formed on the substrate 1 first. The piezoelectric layer 3 and the first conductive layer 2 are sequentially formed on the second conductive layer 4. Wherein, the Schottky contact is between the second conductive layer 4 and the piezoelectric layer 3, and the ohmic contact is between the first conductive layer 2 and the piezoelectric layer 3, so when the piezoelectric layer 3 swings upward When the first conductive layer 2 having the ohmic contact is grounded, the first conductive layer 2 and the second conductive layer 4 are reversely biased, and the voltage of the second conductive layer 4 having the Schottky contact is output. The value is zero; conversely, when the piezoelectric layer 3 is swung downward, if the first conductive layer 2 having the ohmic contact is grounded, the first conductive layer 2 and the second conductive layer 4 are forward biased. The second conductive layer 4 having the Schottky contact outputs a positive voltage.
因此,本發明所揭示之壓電換能裝置可選擇以該第一導電層2或該第二導電層4結合於該基板,不需透過任何整流電路,即可直接提供經過整流之電力。Therefore, the piezoelectric transducer device disclosed in the present invention can selectively combine the first conductive layer 2 or the second conductive layer 4 on the substrate, and directly provide rectified power without passing through any rectifier circuit.
本發明之壓電換能裝置,係可利用振動而產生該交流電,並利用壓電材料與金屬材料接觸時,所產生的電位障壁來進行整流。因此,無外接整流電路之功率損耗,具有提升壓電換能效率之功效。In the piezoelectric transducer device of the present invention, the alternating current can be generated by vibration, and the potential barrier formed by the piezoelectric material in contact with the metal material can be rectified. Therefore, there is no power loss of the external rectifying circuit, which has the effect of improving the piezoelectric transducing efficiency.
本發明之壓電換能裝置,係可利用振動而產生該交流電,並利用壓電材料與金屬材料接觸時,所產生的電位障壁來進行整流。因此,無外接整流電路所需之成本,具有降低建置壓電換能系統成本之功效。In the piezoelectric transducer device of the present invention, the alternating current can be generated by vibration, and the potential barrier formed by the piezoelectric material in contact with the metal material can be rectified. Therefore, the cost required for the external rectification circuit has the effect of reducing the cost of constructing the piezoelectric transducing system.
本發明之壓電換能裝置,係可利用振動而產生該交流電,並利用壓電材料與金屬材料接觸時,所產生的電位障壁來進行整流。因此,無外接整流電路所需之體積,具有減少使用空間及增加單位體積之裝置數量之功效。In the piezoelectric transducer device of the present invention, the alternating current can be generated by vibration, and the potential barrier formed by the piezoelectric material in contact with the metal material can be rectified. Therefore, the volume required for the external rectification circuit has the effect of reducing the space of use and increasing the number of devices per unit volume.
雖然本發明已利用上述較佳實施例揭示,然其並非用以限定本發明,任何熟習此技藝者在不脫離本發明之精神和範圍之內,相對上述實施例進行各種更動與修改仍屬本發明所保護之技術範疇,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.
1...基板1. . . Substrate
2...第一導電層2. . . First conductive layer
3...壓電層3. . . Piezoelectric layer
31...第一表面31. . . First surface
32...第二表面32. . . Second surface
4...第二導電層4. . . Second conductive layer
91...壓電元件91. . . Piezoelectric element
92...張應力92. . . Tensile stress
93...壓縮應力93. . . Compressive stress
94...電子94. . . electronic
第1a圖:習用壓電換能裝置未受力之示意圖。Figure 1a: Schematic diagram of a conventional piezoelectric transducer that is unstressed.
第1b圖:習用壓電換能裝置受到張應力之示意圖。Figure 1b: Schematic diagram of the tensile stress experienced by a conventional piezoelectric transducer.
第1c圖:習用壓電換能裝置受到壓縮應力之示意圖。Figure 1c: Schematic diagram of a conventional piezoelectric transducer that is subjected to compressive stress.
第2圖:習用壓電換能裝置發電後之電壓波形圖。Figure 2: Voltage waveform diagram after power generation by a conventional piezoelectric transducer.
第3圖:習用壓電換能裝置之橋式整流電路圖。Figure 3: Bridge rectifier circuit diagram of a conventional piezoelectric transducer.
第4圖:本發明壓電換能裝置第一實施例之組合立體圖。Fig. 4 is a perspective view showing the combination of the first embodiment of the piezoelectric transducer of the present invention.
第5a圖:本發明壓電換能裝置第一實施例向上擺動發電之示意圖。Fig. 5a is a schematic view showing the upward swing power generation of the first embodiment of the piezoelectric transducer device of the present invention.
第5b圖:本發明壓電換能裝置第一實施例向下擺動發電之示意圖。Fig. 5b is a schematic view showing the first embodiment of the piezoelectric transducer device of the present invention which swings downward to generate electricity.
第6圖:本發明壓電換能裝置第一實施例發電後自整流之電壓波形圖。Fig. 6 is a view showing voltage waveforms of self-rectification after power generation in the first embodiment of the piezoelectric transducer device of the present invention.
第7圖:本發明壓電換能裝置第二實施例之組合立體圖。Figure 7 is a perspective view showing the combination of the second embodiment of the piezoelectric transducer of the present invention.
1...基板1. . . Substrate
2...第一導電層2. . . First conductive layer
3...壓電層3. . . Piezoelectric layer
31...第一表面31. . . First surface
32...第二表面32. . . Second surface
4...第二導電層4. . . Second conductive layer
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JP2004146640A (en) * | 2002-10-25 | 2004-05-20 | Matsushita Electric Ind Co Ltd | Piezoelectric thin film element and actuator using the same, ink jet head and ink jet recoding device |
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