TWI409978B - - Google Patents

Info

Publication number
TWI409978B
TWI409978B TW099112690A TW99112690A TWI409978B TW I409978 B TWI409978 B TW I409978B TW 099112690 A TW099112690 A TW 099112690A TW 99112690 A TW99112690 A TW 99112690A TW I409978 B TWI409978 B TW I409978B
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting chip
stand
stands
conductive wire
Prior art date
Application number
TW099112690A
Other languages
Chinese (zh)
Other versions
TW201138159A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW099112690A priority Critical patent/TW201138159A/en
Publication of TW201138159A publication Critical patent/TW201138159A/en
Application granted granted Critical
Publication of TWI409978B publication Critical patent/TWI409978B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Led Device Packages (AREA)

Abstract

The package structure of the present invention comprises: a housing; at least two separated stands, at least one light emitting chip, and the conductive rubber. The light emitting chip is arranged on one of the stands. A first conductive wire is arranged between the light emitting chip and the other stand, thereby forming an electrical connection therebetween. The conductive rubber is arranged between the light emitting chip and the stand for forming an adhesive and electrical connection. Furthermore, a second conductive wire is arranged between the stand and the conductive rubber. With the interference and guiding effect of the second conductive wire, it is able to assure of the adhesive and electrical connections between the light emitting chip and the stands, thereby increasing the yield rate of light emitting diodes.
TW099112690A 2010-04-22 2010-04-22 Light emitting diode package structure and its manufacturing method TW201138159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099112690A TW201138159A (en) 2010-04-22 2010-04-22 Light emitting diode package structure and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099112690A TW201138159A (en) 2010-04-22 2010-04-22 Light emitting diode package structure and its manufacturing method

Publications (2)

Publication Number Publication Date
TW201138159A TW201138159A (en) 2011-11-01
TWI409978B true TWI409978B (en) 2013-09-21

Family

ID=46759746

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099112690A TW201138159A (en) 2010-04-22 2010-04-22 Light emitting diode package structure and its manufacturing method

Country Status (1)

Country Link
TW (1) TW201138159A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583030B (en) * 2014-08-29 2017-05-11 榮創能源科技股份有限公司 Led package and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043110A (en) * 1997-06-06 2000-03-28 International Business Machines Corporation Wire mesh insert for thermal adhesives
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
TW200818553A (en) * 2006-08-14 2008-04-16 Fujikura Ltd Emitting device and illuminating device
US20080226884A1 (en) * 2007-03-13 2008-09-18 Toray Saehan Inc. Adhesive film for stacking semiconductor chips

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043110A (en) * 1997-06-06 2000-03-28 International Business Machines Corporation Wire mesh insert for thermal adhesives
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
TW200818553A (en) * 2006-08-14 2008-04-16 Fujikura Ltd Emitting device and illuminating device
US20080226884A1 (en) * 2007-03-13 2008-09-18 Toray Saehan Inc. Adhesive film for stacking semiconductor chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583030B (en) * 2014-08-29 2017-05-11 榮創能源科技股份有限公司 Led package and manufacturing method thereof

Also Published As

Publication number Publication date
TW201138159A (en) 2011-11-01

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