TWI408829B - Led submount packaging method and package structure thereof - Google Patents

Abstract

LED submount packaging method comprises the steps of providing a first substrate having an upper surface, a lower surface opposite to the upper surface and a plurality of die attached areas defined on the upper surface, recessing a plurality of heat-dissipating cavities from the lower surface, wherein each heat-dissipating cavity having a bottom corresponds to each die attached area and a support seat is located between each bottom and each die attached area, forming a thermal conductor in each heat-dissipating cavity, disposing a plurality of LEDs on the die attached areas, providing a second substrate having a first surface faced the upper surface of the first substrate, a second surface opposite to the first surface and a plurality of reflective slots communicated with the first surface and the second surface, wherein each reflective slot corresponds to each LED and each die attached area, and bonding the second substrate and the first substrate that allows each LED to be located within each reflective slot.

Description

Light-emitting diode sub-adhesive substrate packaging method and package structure thereof

The invention relates to a method for packaging a light-emitting diode and a structure thereof, in particular to a method for packaging a light-emitting diode sub-adhesive substrate and a package structure thereof.

Conventional light-emitting diode (LED) packaging methods mostly directly fix the LED die on the secondary adhesive substrate on which the reflective groove surface is formed. However, in actual mass production, the size of the reflective groove surface is often too small to cause the crystal. The difficulty in fixing the particles is greatly increased, which in turn leads to an increase in the cost of packaging. In addition, the conventional secondary adhesive substrate has a poor heat dissipation effect on the light-emitting diode, and thus it is easy to cause the light-emitting efficiency of the light-emitting diode to be lowered or deteriorated.

The main purpose of the present invention is to provide a method for packaging a light-emitting diode sub-adhesive substrate and a package structure thereof, the package method comprising providing a first substrate having an upper surface and a surface opposite to the upper surface a lower surface and a plurality of die-bonding regions defined on the upper surface; forming a plurality of heat-dissipating grooves on the lower surface of the first substrate, each of the heat-dissipating grooves corresponding to each of the die-bonding regions, and each of the heat-dissipating recesses The slot has a bottom surface, and each of the bottom surface and each of the die-bonding regions has a carrier; a heat conductor is formed in each of the heat dissipation grooves; and a plurality of light-emitting diodes are disposed on the first substrate a second substrate having a first surface facing the upper surface of the first substrate, a second surface opposite to the first surface, and a plurality of communicating with the first surface And the reflective slot of the second surface, each of the reflective slot corresponds to each of the light emitting diodes and each of the die bonding regions; and the second substrate and the first substrate are combined to enable each of the light emitting diodes Located in each of the reflection slots, the hair The utility model can reduce the packaging difficulty of the light-emitting diode sub-adhesive substrate and increase the heat-dissipating performance of the sub-adhesive substrate to the light-emitting diode, and the light-emitting diodes can also form a line light source by the optical action of the reflective slots The line source can be used to replace the cold cathode fluorescent lamp (CCFL) commonly used in conventional liquid crystal displays.

Please refer to FIGS. 1A to 1E and 2A to 2F, which are a preferred embodiment of the present invention, and a method for packaging a light-emitting diode sub-adhesive substrate, the steps of which are detailed as follows: First, please refer to FIGS. 1A and 2A. A first substrate 10 is provided as a germanium substrate. The first substrate 10 has an upper surface 10a, a lower surface 10b opposite to the upper surface 10a, and a plurality of upper surfaces 10a defined thereon. A plurality of heat dissipating grooves 12 are formed in the lower surface 10b of the first substrate 10, and the heat dissipating grooves 12 correspond to the respective die bonding regions 11 . Each of the heat dissipating recesses 12 has a bottom surface 12a. Each of the bottom surface 12a and each of the adhesive crystal regions 11 has a carrier 13 . In this embodiment, each of the bearing blocks 13 has a thickness T. The thickness T is between 10 micrometers and 50 micrometers; after that, referring to FIGS. 1C and 2C, a heat conductor 70 is formed in each of the heat dissipation grooves 12, and in the embodiment, the heat conductor 70 The material may be copper or silver; then, referring to Figures 1D and 2D, a plurality of LEDs 20 are disposed at the first The accommodating regions 11 of the slabs 10 are disposed on the respective pedestals 13 . In this embodiment, the pedestals 13 can be used to support the illuminating diodes 20 . The heat generated by each of the light-emitting diodes 20 can be conducted to each of the heat-conducting bodies 70 via the respective carriers 13 and then conducted to the outside by the heat-conducting bodies 70 to achieve heat dissipation. The light emitting diodes 20 can be arranged in a straight line; then, referring to FIG. 2E, a second substrate 30 is provided. In this embodiment, the second substrate 30 is a germanium substrate, and the second substrate is The 30 series has a first surface 30a facing the upper surface 10a of the first substrate 10, a second surface 30b opposite to the first surface 30a, and a plurality of communicating with the first surface 30a and the second surface 30b. In the present embodiment, each of the reflective slots 31 has a trapezoidal tapered shape, and each of the reflective slots 31 corresponds to each of the LEDs 20 and the respective die-bonding regions 11, and each The reflective slot 31 has a light reflecting groove surface 31a; finally, please refer to FIGS. 1E and 2F, in combination with the second substrate 30 and the first The plate 10 is disposed such that each of the light-emitting diodes 20 is located in each of the reflective slots 31, wherein each of the light-reflecting groove faces 31a faces each of the light-emitting diodes 20 for reflecting each of the light-emitting diodes 20 The emitted light, in this embodiment, the second substrate 30 can be bonded to the upper surface 10a of the first substrate 10 in an adhesive manner or a metal eutectic manner.

In this embodiment, in order to further increase the heat dissipation rate of each of the light-emitting diodes 20, first, referring to FIGS. 3A and 4A, each of the carrier bases 13 of the first substrate 10 may be formed with at least a permanent through hole 131. Each of the through holes 131 communicates with each of the die bonding regions 11 of the first substrate 10 and each of the bottom surfaces 12a of the heat dissipation grooves 12, and then, referring to FIGS. 3B and 4B, each of the heat conductors 70 may be formed separately. In each of the through holes 131 of each of the carriers 13, after referring to FIGS. 3C and 4C, when the light emitting diodes 20 are disposed on the respective carriers 13, each of the heat conductors 70 can be directly Each of the light-emitting diodes 20 is in contact with each of the light-emitting diodes 20, and the heat generated by each of the light-emitting diodes 20 can be directly conducted to the outside through the heat-conducting body 70 to achieve rapid heat dissipation. In addition, referring to FIG. 5, in another embodiment, a titanium layer 50 may be formed on the upper surface 10a of the first substrate 10 and a gold layer 60 may be formed on the titanium layer 50. Both the titanium layer 50 and the gold layer 60 have a high thermal conductivity and, therefore, also contribute to increasing the heat dissipation performance of the sub-adhesive substrate for each of the light-emitting diodes 20. Alternatively, please refer to FIG. 6A to FIG. 6C. In still another embodiment, first, referring to FIG. 6A, the photodiode 20 may be disposed on the die-bonding regions 12 of the first substrate 10. Previously, a grinding step is performed on the upper surface 10a of the first substrate 10. Referring to FIG. 6B, the purpose is to remove each of the carriers 13 by grinding and expose the heat conducting bodies 70 on the upper surface 10a. Then, referring to FIG. 6C, each of the light-emitting diodes 20 is fixed to each of the heat-conducting bodies 70. In this embodiment, a metal solder layer 80 is formed on each of the light-emitting diodes 20 and Each of the light-emitting diodes 20 can be fixed to each of the heat-conducting bodies 70 by the respective metal solder layers 80, and the heat generated by each of the light-emitting diodes 20 can be The metal solder layer 80 and each of the heat conductors 70 are quickly conducted to the outside to achieve rapid heat dissipation.

Referring to FIGS. 1E and 2F , the package structure obtained by the packaging method of the present invention comprises a first substrate 10 , a plurality of thermal conductors 70 , a plurality of LEDs 20 , and a second substrate 30 . The first substrate 10 is a germanium substrate, and the first substrate 10 has an upper surface 10a, a lower surface 10b opposite to the upper surface 10a, and a plurality of die-bonding regions 11 defined on the upper surface 10a. The surface 10b is formed with a plurality of heat dissipating recesses 12, each of the heat dissipating recesses 12 corresponding to each of the adhesive crystal regions 11, and each of the heat dissipating recesses 12 has a bottom surface 12a, and each of the bottom surface 12a and each of the adhesive crystal regions 11 has a carrier 13 in the embodiment, each of the carrier 13 has a thickness T, the thickness T is between 10 micrometers and 50 micrometers, and the thermal conductors 70 are electroplated. The heat dissipating bodies 70 are respectively formed of copper or silver, and the light emitting diodes 20 are respectively disposed on the first substrate 10. The die-bonding region 11 and each of the light-emitting diodes 20 are disposed on each of the carrier seats 13, in this embodiment, The carrier 13 can be used to support the LEDs 20, and the heat generated by each of the LEDs can be transmitted to each of the heat conductors 70 via the carrier 13, and the heat can be transferred through the heat conduction bodies. The body 70 is conducted to the outside to achieve heat dissipation. Further, preferably, the light emitting diodes 20 are arranged in a line, and the second substrate 30 is bonded to the upper surface 10a of the first substrate 10, the first The second substrate 30 has a first surface 30a facing the upper surface 10a of the first substrate 10, a second surface 30b opposite to the first surface 30a, and a plurality of communicating with the first surface 30a and the second surface. Each of the reflective slots 31 has a trapezoidal tapered shape, and each of the reflective slots 31 corresponds to each of the LEDs 20 and the respective die-bonding regions 11, and each of the reflective slots The light-receiving groove surface 31a is disposed in each of the reflection slots 31, and each of the light-reflecting groove surfaces 31a faces each of the light-emitting diodes 20; For reflecting the light emitted by each of the light-emitting diodes 20.

In addition, in order to further improve the heat dissipation rate of each of the light-emitting diodes 20, please refer to FIG. 4C. In this embodiment, each of the carrier bases 13 of the first substrate 10 can be formed with at least a uniform through hole 131, each of which is formed. The through hole 131 is connected to each of the die-bonding regions 11 of the first substrate 10 and the bottom surface 12a of each of the heat-dissipating recesses 12. Further, each of the heat-conducting bodies 70 may be separately formed on each of the carriers 13 In the through hole 131, each of the heat conductors 70 can directly contact each of the light emitting diodes 20, so that the heat generated by each of the light emitting diodes 20 is directly transmitted to the outside through the heat conducting bodies 70, thereby achieving Fast heat dissipation. In addition, referring to FIG. 5, in another embodiment, the package structure further has a titanium layer 50 and a gold layer 60 formed on the upper surface 10a of the first substrate 10, and The gold layer 60 is formed on the titanium layer 50. Since the titanium layer 50 and the gold layer 60 both have a high thermal conductivity, it helps to increase the heat dissipation performance of the sub-adhesive substrate for each of the light-emitting diodes 20.

In addition, referring to FIG. 7 , in the embodiment, the package structure further has a bonding layer 90 formed on the upper surface 10 a of the first substrate 10 and the second substrate 30 . Between a surface 30a, the second substrate 30 can be bonded to the upper surface 10a of the first substrate 10 by the bonding layer 90, wherein when the second substrate 30 is selectively bonded to the first surface When the upper surface 10a of the substrate 10 is used, the bonding layer 90 is an adhesive layer. Otherwise, when the second substrate 30 is selectively metal-eutectic bonded to the upper surface 10a of the first substrate 10, the bonding is performed. Layer 90 is a metal eutectic bonding layer.

The packaging method of the present invention can reduce the packaging difficulty of the LED sub-adhesive substrate and reduce the packaging cost, and the titanium layer 50, the gold layer 60 and the thermal conductors 70 can greatly enhance the sub-adhesive substrate. The light-emitting diodes 20 can also be used to form a line source by the optical action of the reflective slots 31. The line source can be used to replace the conventional cold-type liquid crystal display. Cathode fluorescent lamp (CCFL).

The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. .

10. . . First substrate

10a. . . Upper surface

10b. . . lower surface

11. . . Zinc crystal region

12. . . Heat sink

12a. . . Bottom

13. . . Carrier

131. . . Through hole

20. . . Light-emitting diode

30. . . Second substrate

30a. . . First surface

30b. . . Second surface

31. . . Reflecting slot

31a. . . Light reflecting groove surface

50. . . Titanium layer

60. . . Gold layer

70. . . Thermal conductor

80. . . Metal solder layer

90. . . Bonding layer

T. . . thickness

1A to 1E are diagrams showing a flow chart of a method for packaging a light-emitting diode sub-adhesive substrate according to a preferred embodiment of the present invention.

Figure 2A: A cross-sectional view of a process for providing a first substrate along line A-A of Figure 1A.

Figure 2B: A cross-sectional view of a process for forming a plurality of heat dissipating grooves along line B-B of Figure 1B.

2C is a cross-sectional view showing a process of forming a heat conductor in each of the heat dissipating grooves along the line C-C of FIG. 1C.

2D is a cross-sectional view showing a process of forming a plurality of LEDs on the first substrate along the D-D line of the 1DD.

Figure 2E is a cross-sectional view showing a process of providing a second substrate.

FIG. 2F is a cross-sectional view showing a process of bonding the second substrate and the first substrate along the line E-E of FIG. 1E.

3A to 3C are views showing a flow chart of a method for manufacturing a heat dissipation rate of a light-emitting diode by using a through hole and a heat conductor according to an embodiment of the present invention.

Figure 4A: A cross-sectional view of the process of forming a through-hole along the F-F line of Figure 3A.

Fig. 4B is a cross-sectional view showing the process of forming a heat conductor in the through hole along the line G-G of Fig. 3B.

Figure 4C: A cross-sectional view of the process in which the light-emitting diode is in contact with the heat conductor along the line H-H of Figure 3C.

FIG. 5 is a schematic view showing the structure of a titanium layer and a gold layer formed on the upper surface of the first substrate according to a preferred embodiment of the present invention.

6A to 6C are views showing a flow chart of a method for fabricating a light-emitting diode directly on a heat conductor according to another embodiment of the present invention.

Figure 7 is a diagram showing a package structure of a light-emitting diode sub-adhesive substrate according to a preferred embodiment of the present invention.

10. . . First substrate

10a. . . Upper surface

10b. . . lower surface

11. . . Zinc crystal region

12. . . Heat sink

12a. . . Bottom

13. . . Carrier

20. . . Light-emitting diode

30. . . Second substrate

30a. . . First surface

30b. . . Second surface

31. . . Reflecting slot

31a. . . Light reflecting groove surface

50. . . Titanium layer

60. . . Gold layer

70. . . Thermal conductor

90. . . Bonding layer

Claims (20)

A method for packaging a light-emitting diode sub-adhesive substrate, comprising: providing a first substrate, wherein the first substrate has an upper surface, a lower surface opposite to the upper surface, and a plurality of die-bonded crystals defined on the upper surface Forming a plurality of heat dissipation grooves on the lower surface of the first substrate, each of the heat dissipation grooves corresponding to each of the die bonding regions, and each of the heat dissipation grooves has a bottom surface, each of the bottom surfaces and each of the die bonds Between the regions, a carrier is formed; a heat conductor is formed in each of the heat dissipation grooves; a plurality of light emitting diodes are disposed on the die bonds of the first substrate; and a second substrate is provided, the second substrate The first surface facing the upper surface of the first substrate, a second surface opposite to the first surface, and a plurality of reflective slots communicating with the first surface and the second surface, each of the reflective grooves The hole system corresponds to each of the light emitting diodes and each of the die bonding regions; and the second substrate and the first substrate are combined such that each of the light emitting diodes is located in each of the reflective slots. The method of encapsulating a light-emitting diode sub-adhesive substrate according to claim 1, wherein the first substrate is a germanium substrate. The method for packaging a light-emitting diode sub-adhesive substrate according to claim 1, further comprising forming a titanium layer on the upper surface of the first substrate. The method of claim 2, wherein the method further comprises forming a gold layer on the titanium layer. The method of claim 2, wherein each of the light emitting diode systems is disposed on each of the carriers of the first substrate. The method for packaging a light-emitting diode sub-adhesive substrate according to claim 5, wherein each of the carrier is formed with at least a uniform through-hole, each of the through-holes communicating with each of the die-bonding regions of the first substrate and each The bottom surface of each of the heat dissipation grooves. The method of claim 2, wherein each of the heat conductors is formed in each of the through holes of each of the carriers. The method of encapsulating a light-emitting diode sub-adhesive substrate according to claim 7, wherein each of the heat-conducting systems contacts each of the light-emitting diodes. The method of claim 2, wherein each of the carrier has a thickness between 10 micrometers and 50 micrometers. The method for packaging a light-emitting diode sub-adhesive substrate according to claim 1, further comprising performing a grinding step on the upper surface of the first substrate to remove each of the carrier and expose each of the heat conductors On the upper surface. The method for packaging a light-emitting diode sub-adhesive substrate according to claim 10, wherein each of the light-emitting diode systems is fixed to each of the heat-conducting bodies. The method for packaging a light-emitting diode sub-adhesive substrate according to claim 11, further comprising forming a metal solder layer between each of the light-emitting diodes and each of the heat-conducting bodies, wherein each of the metal solder layers is fixed Each of the light emitting diodes is on each of the heat conductors. A light-emitting diode sub-adhesive substrate package structure includes: a first substrate having an upper surface, a lower surface opposite to the upper surface, and a plurality of die-bonding regions defined on the upper surface, the lower The surface is formed with a plurality of heat dissipation grooves, each of the heat dissipation grooves corresponding to each of the die bonding regions, and each of the heat dissipation grooves has a bottom surface, and each of the bottom surfaces and each of the die bonding regions has a bearing seat a plurality of heat conductors respectively formed in each of the heat dissipation grooves; a plurality of light emitting diodes respectively disposed on the respective carriers of the first substrate; and a second substrate coupled to The upper surface of the first substrate has a first surface facing the upper surface of the first substrate, a second surface opposite to the first surface, and a plurality of communicating the first surface and the second surface The reflective slot, each of the reflective slots corresponds to each of the light-emitting diodes and each of the die-bonding regions, and each of the light-emitting diode systems is located in each of the reflective slots. The light-emitting diode sub-adhesive substrate package structure according to claim 13, further comprising a titanium layer formed on the upper surface. The light-emitting diode sub-adhesive substrate package structure according to claim 14, further comprising a gold layer formed on the titanium layer. The light-emitting diode sub-adhesive substrate package structure of claim 13, wherein each of the carrier is formed with at least a uniform through-hole, each of the through-holes communicating with each of the die-bonding regions of the first substrate and each The bottom surface of each of the heat dissipation grooves. The light-emitting diode sub-adhesive substrate package structure according to claim 16, wherein each of the heat-conducting bodies is formed in each of the through holes of each of the carrier. The light-emitting diode sub-adhesive substrate package structure according to claim 17, wherein each of the heat-conducting systems contacts each of the light-emitting diodes. The light-emitting diode sub-adhesive substrate package structure of claim 13, wherein each of the carrier has a thickness of between 10 micrometers and 50 micrometers. The light-emitting diode sub-adhesive substrate package structure according to claim 13 , further comprising a bonding layer formed on the upper surface of the first substrate and the first surface of the second substrate Between the surfaces.