TWI407269B - Optical system and method for lithography and exposure - Google Patents

Abstract

Disclosed is an optical system and method for lithography and exposure applicable for exposing patterns on a substrate by light beam, comprising a cylinder having a rotating axle on the center thereof, a substrate disposed winding around the cylinder, a cylinder control apparatus and a light path control apparatus. The cylinder control apparatus manipulates the cylinder by measuring the cylinder to compensate alterations of rotational positions and/or postures. The light path control apparatus includes an optical component set for determining the light beam for the use of exposure and measurement and a moving platform for carrying the optical component set, wherein the moving platform is parallel to the rotating axle of the cylinder to move linearly for enabling the exposure light beam to move relatively with the cylinder to expose patterns onto the substrate, and further to compensate alternations of rotational positions and/or postures of the cylinder according to measured results by the cylinder controlling apparatus, thereby providing greater precision in exposing patterns on the substrate.

Description

Optical lithography exposure system and exposure method thereof

The present invention relates to an optical lithography exposure structure and an exposure method thereof, and more particularly to an optical lithography exposure structure for controlling an optical element by using a moving platform to expose a continuous pattern onto a substrate by using a light beam, and an exposure method thereof .

As display panels, flexible electronics, and solar industries are increasingly potential for size, they are used in solar cells, displays, micro-optical components (DOE), anti-reflective structures (AR), and organic light emitters ( The demand for large-area periodic structures such as OLEDs and radio frequency identification systems (RFID) is bound to increase dramatically.

In general, the lithographic pattern is often produced using a Roll-to-Roll process technology, but the current line width of the product made by the roll-to-roll process can only reach the micron level, that is, only from 5 μm. The diameter of the drum is about 500 mm to 800 mm, and it is difficult to produce a submicron structure.

In addition, in terms of making large-area lithography technology, it is customary to first set up a fixed set of optical paths, and place the roller surrounding the substrate on the roller stage, and the roller stage generates the entire substrate. The relative movement required. Taking the above-described scroll-type technology as an example, in addition to the movement of the drum in the three-dimensional space along the central axis and the rotation of the shaft, there are four degrees of freedom to be measured and controlled, such as the radial of the central axis (radial Degrees of freedom, such as axial and tilt, to maintain the stability of the drum attitude during exposure and to minimize distortion of the exposed stripe joints. However, since the load-receiving components of the stage include a roller and a drum clamping mechanism, and further include a sensor for detecting the displacement of the roller, the overall weight of the mechanism and the roller reduces the reaction speed, positioning accuracy, and anti-disturbance of the stage. ability.

Therefore, in order to achieve the improvement of the degree of bonding of the interference fringes on the substrate, it is necessary to produce a very precise relative motion between the roller and the beam. Therefore, how to provide an optical lithography exposure technique for measuring the roller and Control, and thus improve measurement accuracy and as a basis for control, is an important issue to be solved in the industry.

In order to solve the above problems of the prior art, the present invention proposes an optical lithography exposure system and an exposure method thereof to produce a very precise relative motion between the drum and the light beam.

The invention provides an optical lithography exposure system, comprising: a drum having a rotating shaft and rotating around the rotating shaft; a substrate wound around an outer surface of the drum; and a drum operating device for performing the drum Measuring and controlling the drum according to the measured result to compensate for the change of position and/or posture generated by the drum rotating about its rotating shaft; and the optical path control device comprising an optical component group and a moving platform, the optical The component group is configured to divide the beam into an exposure beam and a measurement beam, and the moving platform is configured to carry the optical component group and linearly move in parallel with the axis direction of the rotation axis of the roller, so that the exposure beam and A relative motion is generated between the rollers to expose the pattern onto the substrate, wherein the moving platform is multiplexed to compensate the position of the roller during the rotation according to the measurement result of the roller by the roller handling device And / or change in posture.

The drum handling device includes a drum measuring module and a drum actuating device. The drum measuring module has a vibration analyzer and a pair of displacement sensors, wherein the vibration analyzer is configured to measure the displacement of the drum along the axis of the rotating shaft, and the pair of displacement sensors are disposed on the The drum is spaced above the predetermined distance and used to measure the tilt of the posture of the drum during the rotation; and the drum actuating device is configured to actuate the drum according to the measurement result of the drum measuring module, Compensating for the tilt of the attitude produced by the drum during the rotation.

The optical path control device further includes a beam measuring module and a beam adjusting module. The beam measuring module has a beam splitter, two convex lenses and two light displacement sensors, and the beam splitter splits the measuring beam into two beams to be respectively focused by the two convex lenses and then projected to the two The light displacement sensor calculates the displacement and angle change of the light beam by measuring the position of the light spot projected onto the light displacement sensor. The beam adjustment module adjusts the light beams according to the results measured by the beam measurement module, and the optical components are adjusted by the actuators to compensate for the relative movement of the moving platform or the rotation of the roller. The effect of the exposure to the pattern of the substrate.

The invention provides an optical lithography exposure method, comprising the steps of: (1) linearly moving a moving platform carrying an optical component group with a parallel outer surface around a shaft axis direction of a drum provided with a substrate, so that the light beam passes through Activating a relative movement between the exposure beam generated by the optical component group and the roller to expose the pattern onto the substrate; and (2) causing the roller handling device to measure the roller to cause the mobile platform to The measurement results of the drum handling device compensate for changes in the position and/or attitude of the drum during rotation.

The above step (2) includes: (2-1) causing a pair of displacement sensors of the drum operating device to measure the tilt of the posture generated by the drum during the rotation, which is generated during the rotation of the drum When the attitude tilt is greater than or equal to the first predetermined value, proceeding to step (2-2), and proceeding to step (2-3) when the posture tilt generated by the drum during the rotation is less than the first predetermined value; (2) 2) causing the drum actuating device of the drum operating device to compensate for the posture tilt generated by the drum during the rotation, and returning to step (2-1); (2-3) measuring the vibration analyzer of the drum operating device Displacement of the drum along the axial direction of the rotating shaft, and proceeding to step (2-4) when the displacement of the drum along the axial direction of the rotating shaft is greater than or equal to a second predetermined value, the drum is along the axis of the rotating shaft When the displacement of the direction is less than the second predetermined value, proceeding to step (2-5); (2-4) causing the moving platform to compensate the displacement of the drum along the axis of the rotating shaft during the rotation, and returning to the step (2) a measurement procedure of -3); and (2-5) exposing the pattern to the substrate by the exposure beam.

Compared with the prior art, the optical lithography exposure system of the present invention and the exposure method thereof use a moving platform to move the optical component group to cause relative displacement between the exposure beam and the roller, so as to expose the pattern to the substrate ( For example, the interference fringes can be tightly coupled and measured by the roller and the beam measuring module to improve the reaction speed, positioning accuracy and anti-disturbance capability of the mobile platform.

The embodiments of the present invention are described in the following specific embodiments, and those skilled in the art can easily understand other advantages and functions of the present invention by the disclosure of the present disclosure, and can also be implemented by other different embodiments. Or application.

Referring to FIG. 1, the optical lithography exposure system of the present invention exposes a pattern onto a substrate by using a light beam such as an argon ion laser, and mainly includes a drum 1, a drum operating device 2, and an optical path manipulation device 3.

The drum 1 has a rotating shaft 10 and rotates around the rotating shaft 10. The outer surface of the drum 1 is provided with a base material 13 on the outer ring. The drum can be a cylindrical body, and the base material can be a photosensitive material. The rotary motion of the drum 1 can be mainly driven by a rotary stepping motor (not shown) for stepwise or continuous rotation, and one end of the rotary stepping motor can be erected in a V-shaped or U-shaped concave. On the socket 11 of the groove, a resilient reed (not shown) is pressed from above the drum 1 (relative to the socket 11) so that the shaft 10 of the drum 1 does not cause non-rotating motion. The pressing drum 1 is moved perpendicular to the direction of the rotating shaft 10. Further, the other end of the drum 1 can be supported by a pair of tapered shafts and holes.

The drum handling device 2 is for measuring the drum 1 and manipulating the drum 1 in accordance with the measured results to compensate for the change in position and/or posture produced by the drum 1 rotating about its axis of rotation 10. In detail, the drum handling device 2 includes a drum measuring module 21 and a drum actuating device 22.

The drum measuring module 21 includes a vibration analyzer 211 and a pair of displacement sensors 212a and 212b. The vibration analyzer 211 is for emitting a laser light source toward the rotating shaft 10 of the drum 1 to measure the vibration of the drum 1 in the direction of the rotating shaft 10. The displacement sensors 212a and 212b can be, for example, laser displacement sensors, the laser source used can be focused to 20 μm, and the displacement sensors 212a and 212b are used to directly measure the curved surface of the drum 1. It can be clamped directly above the drum 1 at a distance of about 15 mm from the surface of the drum 1, and the distance between the two measuring points is about 55 mm to measure the inclination of the drum 1.

The drum actuating device 22 is configured to actuate the drum 1 according to the measurement result of the drum measuring module 21 to compensate for the posture tilt generated by the drum 1 during the rotation. The drum actuating device 22 can be a high precision piezoelectric actuation platform.

Furthermore, the optical path manipulation device 3 mainly includes an optical element group 31 and a moving platform 32.

The optical element group 31 includes a beam splitter 310, a plurality of optical element groups 311, 312, 313, and 314, and a plurality of actuators (not shown in this figure). The optical element groups 311, 312, 313, and 314 are respectively controlled by the actuators, and the light beam 4 enters the optical element group 31 and is divided into an exposure beam 41 and a measuring beam 42, and in this figure, the exposure beam 41 It is used to expose the interference fringes onto the substrate 13.

The moving platform 32 is configured to carry the optical element group 31 and linearly move in the direction parallel to the rotating shaft 10 of the drum 1 to cause relative movement between the exposure beam 41 and the drum 1, and to expose the interference fringes to the substrate 13. The moving platform 32 is movable through the slide rail to linearly move the drum 1 according to the measurement result of the drum 1 by the vibration analyzer 211 to compensate for the displacement of the drum 1 in the direction of the rotating shaft 10 during the rotation. In addition, the moving platform 32 can perform a tilting movement with respect to the direction of the rotating shaft 10 for compensating for the posture tilt generated by the drum 1 during the rotation according to the measurement results of the drum 1 by the displacement sensors 212a and 212b.

Specifically, the pattern exposed to the substrate 13 is mostly streak, and in order to enable longitudinal bonding of the interference fringes on the substrate 13, the drum 1 must be able to rotate 360 degrees. For the key influence of the interference fringe, the drum 1 is displaced in the direction of the rotating shaft 10 and the tilting error with respect to the rotating shaft 10 is as small as possible, and the preset is to be exposed. The period of the interference fringe is 800 nm, and the image placement error in the direction of the rotating shaft 10 (i.e., the direction of the vertical stripe), for example, the period and position of the interference fringe, is preferably less than 80 nm.

On the other hand, the mobile platform 32 may only include some of the required degrees of freedom and lower dynamic performance, and thus the error caused by the relative movement of the drum 1 by the moving platform 32, whether it is a static positioning error or dynamic The tracking error can be compensated by the beam measuring module 33 and the beam adjusting module 34 included in the optical path manipulation device 3. The beam measuring module 33 is configured to measure the measuring beam 42 for the beam adjusting module 34 to adjust the beam 4 according to the result of the measurement, and to compensate for the relative movement of the moving platform 32 to the drum 1 Effects caused by patterns on the substrate 13, such as changes in interference fringe period and position.

The beam measuring module 33 includes a beam splitter 330, two convex lenses 331a and 331b, and two light displacement sensors 332a and 332b. If the beam advance direction is the Z axis, the degree of freedom that must be measured is the displacement of the beam in the X and Y directions and the rotation of the X and Y axes, respectively. In order to enable the four degrees of freedom to be separately measured, the measuring beam 42 can be split into two beams via the beam splitter 330, and projected to the light displacement sensors 332a and 332b through the convex lenses 331a and 331b, respectively, and the light displacement sensing The 332a and 332b are used to measure the position of the spot to be projected, thereby calculating the change in the position and angle of the beam 4 with respect to the drum 1.

Beam adjustment module 34 includes a plurality of optical elements 341 and 342 and actuators 343 and 344 that control optical elements 341 and 342, respectively. The light beams 4 are adjusted by the actuators 343 and 344 controlling the optical elements 341 and 342 to compensate for the effect of the moving platform 32 on the pattern exposed to the substrate 13 when the drum 1 is relatively moved. In addition, the beam adjustment module 34 can compensate the change of the position and/or posture of the drum 1 during the rotation according to the measurement result of the beam measurement module 33.

In detail, the angle between the optical elements 341 and 342 can be set according to requirements. After the light beam 4 is reflected into the optical element group 31 twice, the exposure beam 41 and the measuring beam 42 are generated, and the measuring beam 42 is guided to the beam splitting. The distance between the beam 33 and the convex lenses 331a and 331b and the light displacement sensors 332a and 332b via the design beam splitter 330 is such that the position and angle of the light beam 4 are measured by the light displacement sensors 332a and 332b, respectively. The optical displacement sensors 332a and 332b can send corresponding voltage signals according to the measured photoelectric positions, and convert them into digital signals for processing by the AD converter.

In addition, in order to expose the position and angle of the light beam 4 each time the substrate 13 is exposed, the distance between the convex lenses 331a and 331b and the light displacement sensors 332a and 332b can be set according to the paraxial geometrical optical principle, so that the distance between the convex lenses 331a and 331b and the light displacement sensors 332a and 332b can be set. The position of the light beam 4 on the light displacement sensors 332a and 332b after passing through the optical element group 31 and the convex lenses 331a and 331b can be directly converted into the angle of the light beam 4. Secondly, through the linear movement of the moving platform 32, the exposure beam 41 can completely expose the substrate 13, and by measuring the position and angle of the beam 4, it can be known whether the exposure beam 41 is maintained at a fixed time during the exposure time. When the measurement results show an error in the position and angle, the optical elements 341 and 342 are adjusted by the actuators 343 and 344 to eliminate the error.

The signal transmission operation mode of the drum operating device of the optical micro-film exposure system of the present invention will be described below with reference to FIG.

Referring to Fig. 2, the rotary motor 12 drives the drum to rotate about its rotation axis, and the rotary motor 12 has a resolution of 0.001° and a maximum speed of 2.5°/sec under the command of the control unit 231. The displacement sensors 212a and 212b can have a resolution of up to 10 nm, the internal sampling frequency can reach 50 kHz, the resolution of the measuring roller can be as high as 0.18 μrad, and the displacement signals of the displacement sensors 212a and 212b are sensed. The controller 232 interprets and converts the analog voltage into ±10V, and then converts it into data by the analog-digital converter built in the control host 231 and transmits it back to the main control computer 23. The vibration analyzer 211 performs displacement measurement along the rotation axis direction with the focused HeNe laser, and can also perform spectrum analysis. The measurement resolution can be 0.3 nm, the internal sampling frequency can be up to 1 MHz, and the vibration analyzer 211 will The measured signal is transmitted back to the main control computer 23. The main control computer 23 can issue commands to the piezoelectric platform controller 233 and the control host 231 respectively according to the received back signals of the vibration analyzer 211 and the displacement sensors 212a and 212b to control the piezoelectric platform 22 and the linear motor. 320 and a rotary motor 12. The piezoelectric stage controller 233 can control the piezoelectric platform 22 to tilt the attitude of the actuating drum, and the linear motor 320 can control the linear movement of the moving platform to the axial direction of the rotating shaft of the parallel drum.

As previously mentioned, if the drum is tilted during rotation, the streaks in the two adjacent exposure areas are misaligned, at which point the drum can be actuated by the piezoelectric platform 22. Since the degree of freedom of the drum in the direction perpendicular to the axis of the rotating shaft can be tightened by a set of compression springs, if the drum moves in the direction of the rotating shaft during the rotation, it is usually not compensated by means of manipulating the entire drum. Instead, the moving platform carrying the optical element is moved to cause a relative displacement between the optical path and the roller, so that the stripes are tightly joined. In other words, the linear motion motor 320 is used to drive the moving platform such that the interference optical path moves parallel to the axial direction of the drum. The control host 231 has a built-in adjustable digital controller to optimize the performance of the linear motor 320, so that the maximum displacement of the mobile platform reaches 350 nm and the minimum step distance can reach 10 nm.

Regarding the control results of the drum attitude, please refer to Figs. 3A and 3B, which respectively show the posture changes of the drum before and after adjustment by the piezoelectric platform. Fig. 3A is a result obtained by simply subtracting the signals measured by the two displacement sensors by simply rotating the drum, and the eccentricity and the oscillating differential signals when the drum is rotated can be observed from the figure. Fig. 3B shows the result of the attitude adjustment by the piezoelectric platform based on the differential signal. Therefore, it can be seen that the drum attitude error can be controlled to a very small range, and the engagement of the interference fringes is optimized.

It is understood from the embodiments shown in Figures 1 and 2 that an optical path control device (including an optical component group, a load bearing device) is required to bond the sub-micron periodic structure of the entire curved surface on a roller having a diameter of 50 mm of the substrate. The moving platform of the optical component group, the beam measuring and adjusting module) and the roller handling device (including the roller measuring module and the roller actuating device) are matched with each other, so that the roller rotates and rotates at a small angle with respect to the exposure point. The micro-stepping of the axial direction, and the main control computer can command the drum and the moving platform to perform corresponding movements to compensate for the change of the position and/or posture of the drum during the rotation. In addition, the optical path control device also has to manipulate the optical path to compensate for the effect of the rotation of the drum or the movement of the platform on the pattern exposed to the substrate.

Referring to Figures 4A and 4B, there is shown a flow chart of the optical lithography exposure method of the present invention. First, the light beam is guided to the optical component group by the beam adjustment module, and then the exposure beam and the measurement beam are generated in the optical component group, and then the exposure beam and the measurement beam are respectively projected onto the substrate by the optical component group. And enter the beam measurement module.

Next, please refer to FIG. 4A for the exposure method of the exposure beam to the substrate.

In step S31, the moving platform is linearly moved in the axial direction of the rotating shaft of the parallel roller to cause relative movement between the exposure light beam and the rotating roller, and the pattern is exposed to be wound around the outer surface of the roller and with the roller. On a rotating substrate. Proceed to step S32.

In step S32, the drum operating device is caused to measure the drum so that the moving platform carrying the optical component group compensates for the change in the position and/or posture of the drum during the rotation according to the measurement result of the drum operating device. Furthermore, step S32 includes S321 to S326 as shown in FIG. 4B.

In step S321, the displacement sensor measures the inclination of the drum during the rotation process, so that in step S322, the main control computer determines whether the posture tilt generated by the drum is less than a first predetermined value, and if so, Proceed to step S324; if not, proceed to step S323.

In step S323, the drum actuating device compensates for the posture tilt generated by the drum during the rotation, and returns to step S321.

In step S324, the vibration analyzer is configured to measure the displacement of the drum along the axial direction of the rotating shaft during the rotation, so that the main control computer determines whether the displacement of the drum along the axial direction of the rotating shaft is less than the second predetermined in step S325. The value, if yes, proceeds to step S327; if not, proceeds to step S326.

In step S326, the moving platform compensates the displacement of the drum in the axial direction of the rotating shaft during the rotation, and returns to step S324.

In step S327, the exposure beam is caused to expose the pattern onto the substrate.

Further, in an embodiment, the step S32 shown in FIG. 4A includes the optical path manipulation device measuring the measuring beam. In detail, the optical path control device adjusts the light beam according to the measurement result to compensate for the influence of the moving platform on the pattern exposed to the substrate when the drum is relatively moved, or adjusts the optical path control device according to the measurement result thereof. The beam is used to compensate for the effect of the roller on the pattern exposed to the substrate during rotation.

Therefore, during the rotation of the drum, a position change may occur in the direction of the rotating shaft or an attitude tilt with respect to the rotating shaft thereof, and the moving platform may perform relative movement with the drum parallel to the rotating shaft or may be inclined with respect to the rotating shaft to compensate the position of the drum. Change or posture tilt. In addition, the drum actuating device can also actuate the drum to compensate for the tilt of the drum during rotation. On the other hand, the beam adjustment module is responsible for maintaining the attitude of the exposure pattern projected onto the substrate to avoid the influence of the movement of the moving platform or the rotation of the drum. Therefore, the beam adjustment module is based on the measurement result of the beam measuring module. Compensating for the effect of the relative movement of the drum by the moving platform or the rotation of the drum itself on the pattern exposed to the substrate.

In summary, the optical lithography exposure system of the present invention and the exposure method thereof can utilize the optical lithography technology to fabricate a large-area sub-micron periodic structure on a drum provided with a substrate on the ring, and cooperate with a high-resolution optical path control device and The mobile platform and the roller control device produce very precise relative motion between the roller and the beam, which improves the reaction speed, positioning accuracy and anti-disturbance capability of the mobile platform, so that the structural pattern on the substrate can be seamless. Performance, which minimizes the distortion of the exposed stripe joints.

The above-described embodiments are merely illustrative of the principles, features, and effects of the present invention, and are not intended to limit the scope of the present invention. Any person skilled in the art can recite the above without departing from the spirit and scope of the present invention. The embodiment is modified and changed. Any equivalent changes and modifications made by the disclosure of the present invention should still be covered by the following claims. Therefore, the scope of protection of the present invention should be as set forth in the scope of the claims described below.

1. . . roller

10. . . Rotating shaft

11. . . Seat

12. . . Rotary motor

13. . . Substrate

2. . . Roller control equipment

twenty one. . . Roller measurement module

211. . . Vibration analyzer

212a, 212b. . . Displacement sensor

twenty two. . . Roller actuating device

twenty three. . . Master computer

231. . . Control host

232. . . Sensor controller

233. . . Piezo platform controller

3. . . Optical path control device

31. . . Optical component group

310, 330. . . Splitter

311, 312, 313, 314, 341, 342. . . Optical element

32. . . mobile platform

320. . . Linear motor

33. . . Beam measurement module

331a, 331b. . . Convex lens

332a, 332b. . . Light displacement sensor

34. . . Beam adjustment module

343, 344. . . Actuator

S31~S32. . . step

S321~S327. . . step

4. . . beam

41. . . Exposure beam

42. . . Measuring beam

1 is an application architecture diagram of an optical lithography exposure system of the present invention;

2 is a block diagram of signal transmission of the optical lithography exposure system of the present invention;

3A is a schematic view showing the measurement result of the attitude of the displacement sensor of the optical lithography exposure system of the present invention on the drum;

And 3B are schematic views of the posture of the adjusted drum of the optical lithography exposure system of the present invention;

4A is a flow chart of the optical lithography exposure method of the present invention;

Fig. 4B is a flow chart showing an embodiment of the optical lithography exposure method of the present invention.

1. . . roller

10. . . Rotating shaft

11. . . Seat

13. . . Substrate

2. . . Roller control equipment

twenty one. . . Roller measurement module

211. . . Vibration analyzer

212a, 212b. . . Displacement sensor

twenty two. . . Roller actuating device

3. . . Optical path control device

31. . . Optical component group

310, 330. . . Splitter

311, 312, 313, 314, 341, 342. . . Optical element

32. . . mobile platform

33. . . Beam measurement module

331a, 331b. . . Convex lens

332a, 332b. . . Light displacement sensor

34. . . Beam adjustment module

343, 344. . . Actuator

4. . . beam

41. . . Exposure beam

42. . . Measuring beam

Claims (16)

An optical lithography exposure system comprising: a drum having a rotating shaft and rotating around the rotating shaft; a substrate wound around an outer surface of the drum; and a drum operating device for measuring the drum and The drum is operated according to the measured result to compensate for the change of position and/or posture generated by the drum rotating around the rotating shaft. The drum operating device comprises: a drum measuring module, having a vibration analyzer and a For the displacement sensor, the vibration analyzer is configured to measure the displacement of the drum along the axis of the rotating shaft, and the pair of displacement sensors are disposed above the drum and spaced apart by a predetermined distance, and used to measure the displacement The posture of the drum is inclined during the rotation; and the drum actuating device is configured to actuate the drum according to the measurement result of the drum measuring module to compensate the posture tilt generated by the drum during the rotating process; And an optical path control device, comprising an optical component group and a mobile platform, wherein the optical component group is used to divide a light beam into an exposure beam and a measurement beam, and the mobile platform is used to carry The optical element group is linearly moved parallel to the axis of the rotation axis of the drum to cause a relative movement between the exposure beam and the roller to expose a pattern onto the substrate, wherein the mobile platform is multiplexed The change in the position and/or posture of the drum during the rotation of the drum is compensated for in accordance with the measurement result of the drum by the drum handling device. The optical lithography exposure system of claim 1, wherein the roller actuating device is a piezoelectric platform. The optical lithography exposure system of claim 1, wherein the moving platform linearly moves the roller according to the result measured by the roller measuring module to compensate the roller for rotating The position produced in the direction of the axis of the spindle changes during the process. The optical lithography exposure system of claim 1, wherein the moving platform is tilted according to a result measured by the roller measuring module on the roller to compensate for the roller being generated during the rotation process. The posture is tilted. The optical lithography exposure system of claim 1, wherein the optical path control device comprises a beam measuring module and a beam adjusting module, wherein the beam measuring module is used for the measuring beam Performing measurement for the beam adjustment module to adjust the beam according to the measurement result of the beam measurement module, and compensating for the influence of the moving platform on the pattern exposed to the substrate when the roller is relatively moved. . The optical lithography exposure system of claim 5, wherein the beam adjustment module is configured to adjust the light beam according to the measurement result of the beam measurement module to compensate the roller as the center of the rotation axis The effect of rotation on the pattern exposed to the substrate. The optical lithography exposure system of claim 5, wherein the beam measuring module comprises a beam splitter, two convex lenses and two light displacement sensors, wherein the beam splitter is used to The measuring beam is split into two beams to be focused by the two convex lenses and then projected to The two light displacement sensors calculate the displacement and angle change of the light beam by measuring the position of the light spot projected onto the light displacement sensor. The optical lithography exposure system of claim 5, wherein the beam adjustment module has a plurality of optical components and a plurality of actuators, wherein the beam adjustment module is configured to use the beam measurement module As a result of the measurement, the plurality of optical elements are controlled by the actuators to adjust the light beam. The optical lithography exposure system of claim 5, wherein the optical component group comprises a plurality of optical components and a plurality of actuators, the optical components being respectively controlled by the actuators to enable the After the beam is generated by the beam splitter and the measuring beam, the beam for exposure is projected onto the substrate, and the measuring beam is introduced into the beam measuring module. The optical lithography exposure system of claim 1, wherein the rotation of the drum is driven by a rotary motor for stepwise or continuous rotation. The optical lithography exposure system of claim 10, wherein an end of the roller adjacent to the rotary motor is mounted on a socket having a V-shaped groove or a U-shaped groove. The optical lithography exposure system of claim 1, wherein the light beam is an argon ion laser. An optical lithography exposure method comprises the following steps: (1) linearly moving a moving platform carrying an optical component group with a parallel outer surface around a shaft axis direction of a drum provided with a substrate, so that And causing a relative movement between the beam of light generated by the optical element group and the roller to expose the pattern onto the substrate; and (2) causing the roller handling device to measure the roller to cause the mobile platform Compensating for the change of the position and/or posture of the drum during the rotation according to the measurement result of the drum operating device; wherein the step (2) comprises: (2-1) a pair of displacement senses of the drum operating device The measuring device measures the tilt of the posture generated by the drum during the rotating process, and proceeds to the step (2-2) when the tilt of the posture generated by the drum during the rotating process is greater than or equal to the first predetermined value, and the drum rotates When the posture tilt generated in the process is less than the first predetermined value, the process proceeds to step (2-3); (2-2) the drum actuating device of the drum operating device compensates for the posture tilt generated by the drum during the rotation process. And returning to step (2-1); (2-3) causing the vibration analyzer of the drum operating device to measure the displacement of the drum along the axis of the rotating shaft, and the displacement of the drum along the axis of the rotating shaft When it is greater than or equal to the second predetermined value, proceed to step (2-4) Step (2-5) when the displacement of the drum along the axial direction of the rotating shaft is less than the second predetermined value; (2-4) causing the moving platform to compensate the roller along the axis of the rotating shaft during the rotating process The displacement of the direction is returned to the measurement procedure of step (2-3); and (2-5) the exposure beam is used to expose the pattern onto the substrate. The optical lithography exposure method of claim 13, wherein in step (2), the optical path control device is configured to pass the optical beam to the light beam. The measuring beam generated by the component group is measured. The optical lithography exposure method according to claim 14, wherein in the step (2), the optical path control device adjusts the light beam according to the measurement result to compensate the relative movement of the mobile platform to the roller. The effect on the pattern exposed to the substrate. The optical lithography exposure method of claim 14, wherein in the step (2), the optical path control device adjusts the light beam according to the measurement result to compensate the exposure of the roller to the rotation process. The effect of the pattern on the substrate.