TWI405709B - Fluidic chip and method for making the same - Google Patents

Abstract

The present invention relates to a fluidic chip and a method for making the same. The fluidic chip includes a bottom layer, an adhesive layer and a top layer. The adhesive layer is disposed on the bottom layer, and the material of the adhesive layer is a hydrophilic polymer. The top layer is disposed on the adhesive layer, the top layer has at least one fluid storage slot and at least one channel, and the fluid storage slot is communicated with the channel. Whereby, the adhesive layer of the fluidic chip combines the top layer and the bottom layer at a lower temperature, and the channel is highly hydrophilic without any surface treatment, so as to drive the fluid.

Description

Fluid wafer and method of manufacturing same

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a fluid wafer and a method of manufacturing the same, and more particularly to a fluid wafer for the purpose of low temperature bonding using a bonding layer and a method of fabricating the same.

The driving of the specimen is the most basic and important in the biomedical test wafer. It is difficult to drive with high viscosity fluid (whole blood). It is a common way to add micro-pull, but if it can be used The surface tension drives the high viscosity fluid, which will omit the fabrication and cost of the micro-pull, greatly reducing the process complexity of the wafer.

Among the fluid wafers driven by surface tension, the high hydrophilic property of the flow channel material is very important, and the high hydrophilicity will generate a large driving force for the purpose of transporting the fluid. Such fluid self-driving wafers are often made of water-repellent polymer materials (such as SU-8 photoresist or polydimethylsiloxane (PDMS)) to create such microchannels. The hydrophilic nature of the molecular material is generally treated by oxygen plasma or other surface modification. After treatment, the surface of the material will be changed from a water-repellent surface to a highly hydrophilic and wet surface to achieve fluid self-driving and transporting purposes. However, this surface treatment method Water recovery problems are often encountered. For example, for the way in which oxygen plasma and heat treatment improve the hydrophilicity of polydimethylsiloxane (PDMS), for example, [DTEddington, JPPuccinelli and DJ Beeebe, Sensors and Actuators B, 2006, 114, 170 ] revealed that when only oxygen plasma treatment, high hydrophilic Sex will disappear after tens of minutes. If it is combined with heat treatment, the high hydrophilicity can be extended to several days. If the oxygen plasma is modified, the polydimethylsiloxane (PDMS) is subjected to further chemical immersion treatment, for example, [JAVickers, MMCaulum, and CSHenry, Anal. Chem., 2006, 78, 7446], the hydrophilicity can be maintained for several days or ten days, but the problem of water repellency still exists.

In summary, although many surface treatment methods are now available to enhance the hydrophilicity of polymeric materials, none of the reforming methods with stable and permanent high hydrophilicity have been developed, so it would be important to invent a permanent hydrophilic self-driven fluid wafer. The solution to this problem will truly achieve the purpose of commercialization.

In addition to polymer materials such as polydimethylsiloxane (PDMS) and SU-8 photoresist (SU-8 photoresist), glass is also a commonly used material for fluid wafers, but the fabrication and bonding of conventional glass wafers exist. Complex process steps and high thermal bonding temperatures, such as the literature [A.Daridon, V.Fascio, J.Lichtenberg, RW Trich, H. Langen, E. Verpoorte and NF de Rooij, Fresenius J. Anal. Chem., 2001, 371, 261].

Therefore, it is necessary to provide an innovative and progressive fluid wafer and a method of manufacturing the same to solve the above problems.

The present invention provides a fluid wafer comprising a bottom layer, a bonding layer and a top layer. The bonding layer is located on the underlayer, and the material of the bonding layer is a hydrophilic polymer. The top layer is on the bonding layer, the top layer includes at least one a fluid storage tank and at least a flow channel that communicates with the flow channel.

The invention further provides a fluid wafer comprising a bottom layer, a bonding layer and a top layer. The bonding layer is on the bottom layer, and the bonding layer includes at least a first pass. The top layer is located on the bonding layer, the top layer including at least one fluid storage tank that communicates with the flow channel.

The invention further provides a method for manufacturing a fluid wafer, comprising the steps of: (a) providing a top layer, a bonding layer and a bottom layer, wherein the bonding layer is made of a hydrophilic polymer; and (b) forming at least the top layer. Consistently perforating and at least one groove, wherein the through hole extends through the top layer and communicates with the groove; and (c) thermally bonds the top layer, the bonding layer and the bottom layer, wherein the through hole forms a fluid storage tank, the groove The trough forms a first class road.

The invention further provides a method for manufacturing a fluid wafer, comprising the steps of: (a) providing a top layer, a bonding layer and a bottom layer; (b) forming at least a uniform via in the top layer, and forming at least one through-groove in the bonding layer, Wherein the through hole extends through the top layer, the through groove extends through the bonding layer; and (c) joins the top layer, the bonding layer and the bottom layer, wherein the through hole forms a fluid storage groove, and the through groove forms a channel.

The invention further provides a method for manufacturing a fluid wafer, comprising the steps of: (a) providing a top layer, a bonding layer and a bottom layer; (b) bonding the bonding layer and the bottom layer; (c) forming at least one of the bonding layer The through hole is formed in the bottom layer to form at least one groove, wherein the groove is through the joint layer, the groove is corresponding to the groove; (d) the top layer is formed with at least a uniform perforation, the through hole is through the top layer; (e) placing the top layer on the bonding layer; and (f) bonding the top layer and the bonding layer, wherein the through hole forms a fluid storage tank, the through groove And the groove forms a first-class track. Thereby, the bonding layer can bond the top layer and the bottom layer at a low temperature, and the flow path can drive a fluid without any surface processing, that is, having high hydrophilicity.

Referring to Figures 1 through 3, there are shown schematic views of a method of fabricating a first embodiment of a fluid wafer of the present invention. First, referring to FIG. 1, a top layer 11, a bonding layer 12 and a bottom layer 13 are provided, wherein the bonding layer 12 is made of a hydrophilic polymer. In the present invention, the hydrophilic material and the water repellent material are defined as follows, a water drop is placed on a solid surface, if the contact angle of the water droplet (the tangent of the liquid-vapor interface of the water droplet and the angle formed by the solid surface) The smaller the angle, the higher the hydrophilicity of the solid material; the larger the angle, the higher the water repellency of the solid material.

In this embodiment, the top layer 11 includes a first surface 111 and a second surface 112. The material of the top layer 11 and the bottom layer 13 is a hydrophilic material (for example, glass), and the material of the bonding layer 12 is a hydrophilic liquid crystal polymer (LCP), and the melting point of the bonding layer 12 is Lower than the bottom layer 13 and the top layer 11.

Next, referring to FIG. 2 , at least a uniform through hole 113 and at least one groove 114 are formed in the top layer 11 , wherein the through holes 113 penetrate the top layer 11 and communicate with the groove 114 . In the present embodiment, the through holes 113 are located at the ends of the trenches 114 , and the trenches 114 are formed on the second surface 112 of the top layer 11 . The through holes 113 of the top layer 11 and the grooves 114 are formed by laser processing.

Finally, referring to FIG. 3, the top layer 11, the bonding layer 12 and the bottom are thermally bonded. The layer 13 is such that the through holes 113 (Fig. 2) form a plurality of fluid storage slots 14, which form the channel 114 (Fig. 2). In the present embodiment, the second surface 112 of the top layer 11 is in contact with the bonding layer 12. In the present embodiment, the top layer 11, the bonding layer 12, and the bottom layer 13 are thermally bonded simultaneously. In other applications, however, the top layer 11 and the bonding layer 12 may be thermally bonded, and then the bonding layer 12 and the bottom layer 13 may be thermally bonded, or the bottom layer 13 and the bonding layer 12 may be thermally bonded first, and then thermally bonded. The bonding layer 12 and the top layer 11.

In the present invention, when the thermal bonding is performed, the temperature is controlled so that the underlayer 13 and the top layer 11 are in a solid state, and the bonding layer 12 is solid but viscous to facilitate bonding. In the present embodiment, thermal bonding can be performed at a temperature of about 300 ° C or lower, which can improve the problem that the conventional glass fluid wafer is too hot (about 680 ° C or higher) and the steps are cumbersome. In addition, since the top layer 11, the bonding layer 12 and the bottom layer 13 are both hydrophilic materials, a liquid is not required to be processed, and a fluid (not shown) is driven, so that the process is simplified. At the same time, it is possible to avoid the problem of recovering the water repellency after processing the surface of a water repellent material into a hydrophilic material.

Referring again to Figure 3, a cross-sectional view of a first embodiment of a fluid wafer of the present invention is shown. The fluid wafer 1 includes a bottom layer 13, a bonding layer 12, and a top layer 11. The bonding layer 12 is located on the underlayer 13. The material of the bonding layer 12 is a hydrophilic polymer. The top layer 11 is located on the bonding layer 12, and the top layer 11 includes at least one fluid storage tank 14 and at least a first-class channel 15 that communicates with the flow channel 15. In this embodiment, the material of the top layer 11 and the bottom layer 13 is a hydrophilic material (for example, glass). The bonding layer 12 has a lower melting point than the bottom layer 13 and the top layer 11. The bonding layer 12 is made of a pro A liquid crystal polymer material (LCP). In this embodiment, the top layer 11 further includes a first surface 111 and a second surface 112 , and the second surface 112 of the top layer 11 contacts the bonding layer 12 . The fluid storage tanks 14 extend through the top layer 11 and are located at the ends of the flow passages 15, as shown in FIG. In the present embodiment, the flow channel 15 is located on the second surface 112 of the top layer 11 and above the bonding layer 12.

Referring to Figure 5, there is shown a top plan view of a second embodiment of a fluid wafer of the present invention. The fluid wafer 2 of the present embodiment is substantially the same as the fluid wafer 1 of the first embodiment, wherein the same elements are given the same reference numerals. The difference between this embodiment and the first embodiment is that the flow path 15 includes a main flow path 151, a bifurcation point 152, and a plurality of secondary flow paths 153. The bifurcation point 152 is a communication hall main channel 151 and the The secondary flow path 153.

Referring to Figures 6 through 8, there are shown schematic views of a method of fabricating a third embodiment of a fluid wafer of the present invention. First, referring to FIG. 6, a top layer 31, a bonding layer 32, and a bottom layer 33 are provided. In this embodiment, the material of the top layer 31 and the bottom layer 33 is a hydrophilic material (for example, glass), and the material of the bonding layer 32 is a hydrophilic liquid crystal polymer (LCP), and the material The bonding layer 32 has a lower melting point than the bottom layer 33 and the top layer 31. In other applications, however, the bonding layer 32 can be a Twin Adhesive Tape.

Next, referring to FIG. 7 , at least one of the through holes 311 is formed in the top layer 31 , and at least one through hole 321 is formed in the bonding layer 32 , wherein the through holes 311 extend through the top layer 31 , and the through holes 321 extend through the bonding layer 32 . . In the embodiment, the through holes 311 of the top layer 31 and the through grooves 321 of the bonding layer 32 It is formed by laser processing.

Finally, referring to FIG. 8, the top layer 31, the bonding layer 32 and the bottom layer 33 are joined such that the through holes 311 (FIG. 7) form a plurality of fluid storage grooves 34, and the through grooves 321 (FIG. 7) form a first-class channel 35. . The fluid storage tank 34 is located at the end of the flow passage 35. In the present embodiment, the top layer 31, the bonding layer 32, and the bottom layer 33 are thermally bonded simultaneously. In other applications, however, the top layer 31 and the bonding layer 32 may be thermally bonded, the bonding layer 32 and the bottom layer 33 may be thermally bonded, or the bottom layer 33 and the bonding layer 32 may be thermally bonded first, and then thermally bonded. The bonding layer 32 and the top layer 31. Alternatively, when the bonding layer 32 is a double-adhesive tape, the top layer 31, the bonding layer 32, and the bottom layer 33 may be directly bonded.

Referring again to Figure 8, a cross-sectional view of a third embodiment of the fluid wafer of the present invention is shown. The fluid wafer 3 includes a bottom layer 33, a bonding layer 32, and a top layer 31. The bonding layer 32 is located on the bottom layer 33, and the bonding layer 32 includes at least the first pass 35. The top layer 31 is located on the bonding layer 32. The top layer 31 includes at least one fluid storage tank 34 that communicates with the flow channel 35. In this embodiment, the material of the top layer 31 and the bottom layer 33 is a hydrophilic material (for example, glass). The bonding layer 32 has a lower melting point than the underlayer 33 and the top layer 31. The bonding layer 32 is made of a hydrophilic liquid crystal polymer (LCP). In other applications, however, the bonding layer 32 can be a Twin Adhesive Tape. The fluid storage tanks 34 extend through the top layer 31 and are located at the ends of the flow passages 35. In the present embodiment, the flow path 35 extends through the bonding layer 32.

Referring to Figures 9 through 11, there is shown a fourth embodiment of the fluid wafer of the present invention. Schematic diagram of the manufacturing method. First, referring to FIG. 9, a top layer 41, a bonding layer 42, and a bottom layer 43 are provided. In the embodiment, the bottom layer 43 includes a first surface 431 and a second surface 432. In this embodiment, the material of the top layer 41 and the bottom layer 43 is a hydrophilic material (for example, glass), and the material of the bonding layer 42 is a hydrophilic liquid crystal polymer (LCP), and the material The bonding layer 42 has a lower melting point than the bottom layer 43 and the top layer 41. In other applications, however, the bonding layer 42 can be a Twin Adhesive Tape.

Next, referring to FIG. 10 , at least one of the through holes 411 is formed in the top layer 41 , and at least one through hole 421 is formed in the bonding layer 42 . The through holes 411 extend through the top layer 41 , and the through holes 421 extend through the bonding layer 42 . . In this embodiment, at least one groove 433 is formed on the first surface 431 of the bottom layer 43 , and the groove 433 is opposite to the groove 421 . In the present embodiment, the through holes 411 of the top layer 41, the through grooves 421 of the bonding layer 42, and the grooves 433 of the bottom layer 43 are formed by laser processing.

Finally, referring to FIG. 11, the top layer 41, the bonding layer 42 and the bottom layer 43 are joined such that the through holes 411 (FIG. 10) form a plurality of fluid storage grooves 44, the through grooves 421 (FIG. 10) and the grooves. 433 forms a superb road 45. The fluid storage tank 44 is located at the end of the flow passage 45. In the present embodiment, the first surface 431 of the bottom layer 43 contacts the bonding layer 42. In the present embodiment, the top layer 41, the bonding layer 42, and the bottom layer 43 are thermally bonded simultaneously. In other applications, however, the top layer 41 and the bonding layer 42 may be thermally bonded, the bonding layer 42 and the bottom layer 43 may be thermally bonded, or the bottom layer 43 and the bonding layer 42 may be thermally bonded first, and then thermally bonded. The bonding layer 42 and the top layer 41. Or, when the joint When the layer 42 is a double-adhesive tape, the top layer 41, the bonding layer 42, and the bottom layer 43 can be directly bonded.

Referring again to Figure 11, a cross-sectional view of a fourth embodiment of a fluid wafer of the present invention is shown. The fluid wafer 4 of the present embodiment is substantially the same as the fluid wafer 3 of the third embodiment. The difference between this embodiment and the third embodiment is that the bottom layer 43 includes at least one groove 433, a first surface 431 and a second surface 432. The groove 433 is located on the first surface 431. The track 45 extends to the recess 433, and the first surface 431 of the bottom layer 43 contacts the bonding layer 42.

Referring to Figures 12 through 16, there are shown schematic views of another method of fabricating a fourth embodiment of the fluid wafer of the present invention. First, referring to FIG. 12, a top layer 41, a bonding layer 42, and a bottom layer 43 are provided. In the embodiment, the bottom layer 43 includes a first surface 431 and a second surface 432. In this embodiment, the material of the top layer 41 and the bottom layer 43 is a hydrophilic material (for example, glass), and the material of the bonding layer 42 is a hydrophilic liquid crystal polymer (LCP), and the material The bonding layer 42 has a lower melting point than the bottom layer 43 and the top layer 41. In other applications, however, the bonding layer 42 can be a Twin Adhesive Tape.

Next, referring to FIG. 13, the bonding layer 42 and the underlayer 43 are bonded. In the present embodiment, the first surface 431 of the bottom layer 43 contacts the bonding layer 42.

Next, referring to FIG. 14, at least one through hole 421 is formed in the bonding layer 42, and at least one groove 433 is formed in the bottom layer 43, wherein the through hole 421 is penetrated through the bonding layer 42, and the groove 433 is correspondingly grooved. 421. In the embodiment, the groove 433 is formed on the first surface 431 of the bottom layer 43. The bonding layer 42 The groove 421 and the groove 433 of the bottom layer 43 are formed by laser processing.

Next, referring to FIG. 15, at least a uniform through hole 411 is formed in the top layer 41, and the through hole 411 is penetrated through the top layer 41. In the present embodiment, the through hole 411 of the top layer 41 is formed by laser processing. Next, the top layer 41 is placed on the bonding layer 42. Finally, referring to FIG. 16, the top layer 41 and the bonding layer 42 are joined, wherein the through hole 411 (FIG. 15) forms a fluid storage groove 44, and the groove 421 (FIG. 15) and the groove 433 form a channel 45. In the present embodiment, the fluid storage tank 44 is located at the end of the flow passage 45.

However, the above embodiments are merely illustrative of the principles and effects of the invention and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims.

1‧‧‧First Embodiment of the Fluid Wafer of the Invention

2‧‧‧Second embodiment of the fluid wafer of the invention

3‧‧‧ Third embodiment of the fluid wafer of the present invention

4‧‧‧Fourth embodiment of the fluid wafer of the present invention

11‧‧‧ top

12‧‧‧ joint layer

13‧‧‧ bottom layer

14‧‧‧ fluid storage tank

15‧‧‧ flow path

31‧‧‧ top

32‧‧‧ joint layer

33‧‧‧ bottom layer

34‧‧‧ fluid storage tank

35‧‧‧ flow path

41‧‧‧ top

42‧‧‧ joint layer

43‧‧‧ bottom layer

44‧‧‧ fluid storage tank

45‧‧‧ flow path

111‧‧‧ first surface

112‧‧‧ second surface

113‧‧‧through holes

114‧‧‧ trench

151‧‧‧mainstream

152‧‧‧ bifurcation point

153‧‧‧ secondary runner

311‧‧‧through holes

321‧‧‧through slot

411‧‧‧through holes

421‧‧‧through slot

431‧‧‧ first surface

432‧‧‧ second surface

433‧‧‧ Groove

1 to 3 are schematic views showing a manufacturing method of a first embodiment of a fluid wafer of the present invention; Fig. 4 is a top plan view showing a first embodiment of the fluid wafer of the present invention; and Fig. 5 is a view showing a second embodiment of the fluid wafer of the present invention. FIG. 6 to FIG. 8 are schematic views showing a manufacturing method of a third embodiment of the fluid wafer of the present invention; and FIGS. 9 to 11 are views showing a manufacturing method of a fourth embodiment of the fluid wafer of the present invention; and FIG. 12 to FIG. 16 is a schematic view showing another manufacturing method of the fourth embodiment of the fluid wafer of the present invention.

1‧‧‧First Embodiment of the Fluid Wafer of the Invention

11‧‧‧ top

12‧‧‧ joint layer

13‧‧‧ bottom layer

14‧‧‧ fluid storage tank

15‧‧‧ flow path

111‧‧‧ first surface

112‧‧‧ second surface

Claims (56)

A fluid wafer comprising: a bottom layer; a bonding layer on the bottom layer, the bonding layer is made of a hydrophilic polymer; and a top layer on the bonding layer, the top layer comprising at least one fluid storage tank and at least Preferably, the fluid storage tank is connected to the flow channel; wherein the fluid wafer is a hydrophilic self-driven fluid wafer. The fluid wafer of claim 1, wherein the material of the bottom layer and the top layer is a hydrophilic material. The fluid wafer of claim 1, wherein the material of the bottom layer and the top layer is glass. The fluid wafer of claim 1, wherein the material of the bonding layer is a hydrophilic liquid crystal polymer (LCP). The fluid wafer of claim 1, wherein the bonding layer has a melting point lower than the bottom layer and the top layer. The fluid wafer of claim 1, wherein the top layer further comprises a first surface and a second surface, the second surface of the top layer contacting the bonding layer, the fluid storage tank penetrating the top layer, the flow channel is located at the top layer The second surface. The fluid wafer of claim 1, wherein the fluid storage tank is located at an end of the flow channel. A fluid wafer according to claim 1, wherein the flow channel is located above the bonding layer. The fluid wafer of claim 1, wherein the flow path comprises a main flow path, a bifurcation point and a plurality of secondary flow paths, the bifurcation point connecting the main flow path and the secondary flow path. A fluid wafer comprising: a bottom layer; a bonding layer on the bottom layer, the bonding layer comprising at least a top pass; and a top layer on the bonding layer, the top layer comprising at least one fluid storage tank, the fluid storage tank The flow channel is connected; wherein the fluid wafer is a hydrophilic self-driving fluid wafer. The fluid wafer of claim 10, wherein the bottom layer comprises at least one groove, a first surface and a second surface, the groove being located on the first surface, the flow channel extending to the groove, the bottom layer The first surface contacts the bonding layer. The fluid wafer of claim 10, wherein the material of the bottom layer and the top layer is a hydrophilic material. The fluid wafer of claim 10, wherein the material of the bottom layer and the top layer is glass. The fluid wafer of claim 10, wherein the material of the bonding layer is a hydrophilic liquid crystal polymer (LCP). The fluid wafer of claim 10, wherein the bonding layer is a Twin Adhesive Tape. The fluid wafer of claim 10, wherein the bonding layer has a melting point lower than the bottom layer and the top layer. The fluid wafer of claim 10, wherein the flow path extends through the bonding layer. The fluid wafer of claim 10, wherein the flow path comprises a main flow path, a bifurcation point and a plurality of secondary flow paths, the bifurcation point connecting the main flow path and the secondary flow path. The fluid wafer of claim 10, wherein the fluid storage tank extends through the top layer. The fluid wafer of claim 10, wherein the fluid storage tank is located at an end of the flow channel. A method of manufacturing a fluid wafer, wherein the fluid wafer is a hydrophilic self-driven fluid wafer, the method comprising: (a) providing a top layer, a bonding layer and a bottom layer, wherein the bonding layer is made of a hydrophilic material And (b) forming at least a uniform perforation and at least one trench in the top layer, wherein the through hole extends through the top layer and communicates with the trench; and (c) thermally bonding the top layer, the bonding layer, and the underlayer, wherein The through hole forms a fluid storage tank that forms a channel. The manufacturing method of claim 21, wherein in the step (a), the material of the top layer and the bottom layer is a hydrophilic material. The manufacturing method of claim 21, wherein in the step (a), the material of the top layer and the bottom layer is glass. The manufacturing method of claim 21, wherein in the step (a), the material of the bonding layer is a hydrophilic liquid crystal polymer (LCP). The manufacturing method of claim 21, wherein in the step (a), the bonding layer The melting point is lower than the bottom layer and the top layer. The manufacturing method of claim 21, wherein in the step (a), the top layer comprises a first surface and a second surface, and in the step (b), the groove is formed on the second surface of the top layer, In step (c), the second surface of the top layer contacts the bonding layer. The manufacturing method of claim 21, wherein in the step (b), the through hole of the top layer and the groove are formed by laser processing. The manufacturing method of claim 21, wherein in the step (b), the through hole is located at an end of the groove. The manufacturing method of claim 21, wherein in the step (c), the flow channel comprises a main flow channel, a bifurcation point and a plurality of secondary flow paths, the bifurcation point connecting the main flow channel and the secondary flow channel . The manufacturing method of claim 21, wherein the step (c) comprises: (c1) placing the bonding layer on the underlayer and placing the top layer on the bonding layer; and (c2) simultaneously thermally bonding the top layer, The bonding layer and the bottom layer, wherein the through hole forms a fluid storage groove, and the groove forms a channel. The method of claim 21, wherein the step (c) comprises: (c1) placing the bonding layer on the underlayer; (c2) thermally bonding the bonding layer and the underlayer; (c3) placing the top layer on the And (c4) thermally bonding the top layer and the bonding layer, wherein the through hole forms a fluid storage groove, and the groove forms a channel. The manufacturing method of claim 21, wherein the step (c) comprises: (c1) placing the top layer on the bonding layer; (c2) thermally bonding the top layer and the bonding layer; (c3) placing the bonding layer on the bottom layer; and (c4) thermally bonding the bonding layer and the bottom layer Wherein the through hole forms a fluid storage tank, and the groove forms a channel. A method of manufacturing a fluid wafer, wherein the fluid wafer is a hydrophilic self-driven fluid wafer, the method comprising: (a) providing a top layer, a bonding layer and a bottom layer; and (b) forming at least a uniform perforation in the top layer, Forming at least one through groove in the bonding layer, wherein the through hole penetrates the top layer, the through hole penetrates the bonding layer; and (c) joins the top layer, the bonding layer and the bottom layer, wherein the through hole forms a fluid a storage tank that forms a first-class channel. The manufacturing method of claim 33, wherein in the step (a), the material of the top layer and the bottom layer is a hydrophilic material. The manufacturing method of claim 33, wherein in the step (a), the material of the top layer and the bottom layer is glass. The manufacturing method of claim 33, wherein in the step (a), the material of the bonding layer is a hydrophilic liquid crystal polymer (LCP). The manufacturing method of claim 33, wherein in the step (a), the bonding layer is a double-adhesive tape. The method of claim 33, wherein in the step (a), the bonding layer has a melting point lower than the underlayer and the top layer. The manufacturing method of claim 33, wherein in the step (a), the bottom layer comprises a first surface and a second surface, and in the step (b), the method further comprises forming at least one concave on the first surface of the bottom layer. a step of the groove, wherein the groove corresponds to the groove, and in the step (c), the first surface of the bottom layer contacts the bonding layer, and the groove and the groove form the flow channel. The manufacturing method of claim 39, wherein the groove of the bottom layer is formed by laser processing. The manufacturing method of claim 33, wherein in the step (b), the through hole of the top layer and the through groove of the bonding layer are formed by laser processing. The manufacturing method of claim 33, wherein in the step (c), the fluid storage tank is located at an end of the flow path. The manufacturing method of claim 33, wherein in the step (c), the flow channel comprises a main flow path, a bifurcation point and a plurality of secondary flow paths, the bifurcation point connecting the main flow channel and the secondary flow path . The manufacturing method of claim 33, wherein the step (c) comprises: (c1) placing the bonding layer on the underlayer, placing the top layer on the bonding layer; and (c2) simultaneously thermally bonding the top layer, the The bonding layer and the bottom layer form a fluid storage tank, and the through-groove forms a channel. The manufacturing method of claim 33, wherein the step (c) comprises: (c1) placing the bonding layer on the underlayer; (c2) thermally bonding the bonding layer and the underlayer; (c3) placing the top layer on the And (c4) thermally bonding the top layer and the bonding layer, the through hole forming a fluid reservoir The trough is formed to form a first-class track. The manufacturing method of claim 33, wherein the step (c) comprises: (c1) placing the top layer on the bonding layer; (c2) thermally bonding the top layer and the bonding layer; (c3) placing the bonding layer on And (c4) thermally bonding the bonding layer and the bottom layer, the through hole forming a fluid storage groove, the through groove forming a channel. A method of manufacturing a fluid wafer, wherein the fluid wafer is a hydrophilic self-driven fluid wafer, the method comprising: (a) providing a top layer, a bonding layer and a bottom layer; (b) bonding the bonding layer and the bottom layer; (c) forming at least one through groove in the bonding layer, forming at least one groove in the bottom layer, wherein the through groove extends through the bonding layer, the groove is corresponding to the groove; (d) the top layer is formed at least consistently a through hole extending through the top layer; (e) placing the top layer on the bonding layer; and (f) bonding the top layer and the bonding layer, wherein the through hole forms a fluid storage groove, the through hole and the The grooves form a superior path. The manufacturing method of claim 47, wherein in the step (a), the material of the top layer and the bottom layer is a hydrophilic material. The manufacturing method of claim 47, wherein in the step (a), the material of the top layer and the bottom layer is glass. The manufacturing method of claim 47, wherein in the step (a), the bonding layer The material is a hydrophilic liquid crystal polymer (LCP). The manufacturing method of claim 47, wherein in the step (a), the bonding layer is a double-adhesive tape. The method of claim 47, wherein in the step (a), the bonding layer has a melting point lower than the bottom layer and the top layer. The manufacturing method of claim 47, wherein in the step (a), the bottom layer comprises a first surface and a second surface, and in the step (b), the first surface of the bottom layer contacts the bonding layer, the step In (c), the recess is formed on the first surface of the bottom layer. The manufacturing method of claim 47, wherein in the step (c), the groove of the bonding layer and the groove of the bottom layer are formed by laser processing, and in the step (d), the through hole of the top layer It is formed by laser processing. The manufacturing method of claim 47, wherein in the step (f), the fluid storage tank is located at an end of the flow path. The manufacturing method of claim 47, wherein in the step (f), the flow channel comprises a main flow path, a bifurcation point and a plurality of secondary flow paths, the bifurcation point connecting the main flow channel and the secondary flow path .