TWI405375B - Electric connector - Google Patents
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- TWI405375B TWI405375B TW98138562A TW98138562A TWI405375B TW I405375 B TWI405375 B TW I405375B TW 98138562 A TW98138562 A TW 98138562A TW 98138562 A TW98138562 A TW 98138562A TW I405375 B TWI405375 B TW I405375B
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Abstract
Description
本發明是有關於一種導電連接裝置，且特別是有關於一種電連接器。This invention relates to an electrically conductive connection device, and more particularly to an electrical connector.
現今科技發達，已發展出可組裝在線路板上的電連接器。這種電連接器可供晶片(chip)所裝設，而晶片能經由此電連接器與線路板電性導通，讓晶片得以發揮功用。因此，電連接器乃是晶片與線路板之間的重要連接媒介。Nowadays, the technology is developed, and electrical connectors that can be assembled on the circuit board have been developed. The electrical connector can be mounted on a chip, and the wafer can be electrically connected to the circuit board via the electrical connector to allow the wafer to function. Therefore, the electrical connector is an important connection medium between the wafer and the circuit board.
一般而言，電連接器通常具有多根針狀接腳，而這些針狀接腳之間的間距，其數量級約在厘米的等級。目前很多公司及企業在研究電連接器的技術上，大多希望這些接腳的分布密度越高越好。因此，在現今電連接器的產業中，電連接器是朝向接腳分布越來越密集的趨勢而發展。In general, electrical connectors typically have a plurality of pin-shaped pins, and the spacing between the pin-shaped pins is on the order of a centimeter. At present, many companies and enterprises are studying the technology of electrical connectors, and most of them hope that the higher the distribution density of these pins, the better. Therefore, in the industry of today's electrical connectors, electrical connectors have evolved toward a trend toward increasingly dense pin distribution.
本發明提供一種電連接器，其能與線路板電性導通。The present invention provides an electrical connector that can be electrically connected to a circuit board.
本發明提出一種電連接器，其能組裝在一線路板上，並包括一線路載板與多根導電接腳。線路載板包括一線路層、一外層絕緣層與多根空心導電柱。外層絕緣層配置在線路層上，並具有一相對線路層的外表面。這些空心導電柱皆配置於外層絕緣層中，並連接線路層。各個空心導電柱具有一裸露於外表面的凹洞。各根導電接腳包括一柱體與一連接柱體的凸柱。各根柱體具有一側面，而這些凸柱凸出於這些側面。這些柱體分別配置在這些凹洞內，並連接這些空心導電柱，而這些凸柱接觸這些空心導電柱。The present invention provides an electrical connector that can be assembled on a circuit board and includes a line carrier and a plurality of conductive pins. The line carrier includes a circuit layer, an outer insulating layer and a plurality of hollow conductive columns. The outer insulating layer is disposed on the wiring layer and has an outer surface opposite to the wiring layer. These hollow conductive pillars are disposed in the outer insulating layer and connected to the circuit layer. Each of the hollow conductive posts has a recess exposed to the outer surface. Each of the conductive pins includes a post and a stud connecting the posts. Each of the cylinders has a side surface from which the protrusions protrude. The pillars are respectively disposed in the recesses and connect the hollow conductive pillars, and the pillars contact the hollow conductive pillars.
在本發明一實施例中，各個空心導電柱更具有一裸露於外表面的頂部，而各個凸柱具有一連接柱體的連接端以及一相對連接端的末端(external end)。這些末端接觸這些頂部。In an embodiment of the invention, each of the hollow conductive pillars further has a top exposed on the outer surface, and each of the pillars has a connecting end connecting the pillars and an opposite end of the opposite connecting end. These ends touch these tops.
在本發明一實施例中，各個柱體包括一第一桿件以及一連接第一桿件的第二桿件。第二桿件連接空心導電柱，而第一桿件朝向第二桿件彎曲。In an embodiment of the invention, each of the cylinders includes a first rod and a second rod that connects the first rod. The second member is coupled to the hollow conductive post and the first member is bent toward the second member.
在本發明一實施例中，在各根導電接腳中，凸柱位於第一桿件與第二桿件之間的相連處。In an embodiment of the invention, in each of the conductive pins, the stud is located at a junction between the first rod and the second rod.
在本發明一實施例中，各個柱體更包括一連接第一桿件的凸部。第一桿件具有一相對第二桿件的末端，而凸部位於末端。In an embodiment of the invention, each of the pillars further includes a convex portion connecting the first rod members. The first rod has an end opposite the second rod and the projection is at the end.
在本發明一實施例中，上述電連接器更包括多個分別配置於這些凹洞中的結合材料(bonding material)，而這些結合材料連接這些柱體以及這些空心導電柱。In an embodiment of the invention, the electrical connector further includes a plurality of bonding materials respectively disposed in the recesses, and the bonding materials connect the pillars and the hollow conductive pillars.
在本發明一實施例中，這些結合材料為錫膏或焊錫。In an embodiment of the invention, the bonding material is solder paste or solder.
在本發明一實施例中，上述線路載板更包括一內層基板。外層絕緣層配置於內層基板上，而線路層位於內層基板與外層絕緣層之間，並電性連接內層基板。In an embodiment of the invention, the line carrier further includes an inner substrate. The outer insulating layer is disposed on the inner substrate, and the circuit layer is located between the inner substrate and the outer insulating layer, and electrically connected to the inner substrate.
在本發明一實施例中，上述內層基板包括多根實心導電柱，而各個空心導電柱堆疊(stack)在其中一實心導電柱上。線路層包括多個接墊，而各個接墊連接於其中一空心導電柱以及與其相鄰的實心導電柱之間；或者，內層基板包括多根連接線路層的導電柱，而這些導電柱與這些空心導電柱錯開(stagger)。In an embodiment of the invention, the inner substrate includes a plurality of solid conductive pillars, and each of the hollow conductive pillars is stacked on one of the solid conductive pillars. The circuit layer includes a plurality of pads, and each of the pads is connected between one of the hollow conductive pillars and the solid conductive pillar adjacent thereto; or the inner substrate includes a plurality of conductive pillars connecting the circuit layers, and the conductive pillars These hollow conductive posts are staggered.
在本發明一實施例中，上述電連接器更包括一對配置於線路載板的固定元件，其中線路載板經由這些固定元件組裝在線路板上。In an embodiment of the invention, the electrical connector further includes a pair of fixing members disposed on the line carrier, wherein the line carrier is assembled on the circuit board via the fixing members.
透過這些導電接腳，本發明的電連接器得以與線路板電性連接，進而讓晶片或被動元件等電子元件與線路板電性導通。Through the conductive pins, the electrical connector of the present invention can be electrically connected to the circuit board, thereby electrically connecting the electronic components such as the chip or the passive component to the circuit board.
下文特舉實施例，並配合所附圖式，作詳細說明如下。The following specific embodiments are described in detail below with reference to the accompanying drawings.
圖1A繪示本發明一實施例的電連接器的剖面示意圖。請參閱圖1A，電連接器100能組裝在一線路板10上，而至少一個電子元件20可以組裝在電連接器100上，並經由電連接器100與線路板10電性導通。電子元件20例如是積體電路(Integrated Circuit，IC)或晶片等主動元件，或者是電容、電阻或電感等被動元件。1A is a cross-sectional view of an electrical connector in accordance with an embodiment of the present invention. Referring to FIG. 1A, the electrical connector 100 can be assembled on a circuit board 10, and at least one electronic component 20 can be assembled on the electrical connector 100 and electrically connected to the circuit board 10 via the electrical connector 100. The electronic component 20 is, for example, an active circuit such as an integrated circuit (IC) or a wafer, or a passive component such as a capacitor, a resistor, or an inductor.
晶片例如是切割晶圓(wafer)而成的晶粒(die，也可稱為裸晶)，而積體電路則是指封裝(package)之後的晶片。電子元件20能利用多個焊料塊S1而組裝在電連接器100上，其中這些焊料塊S1例如是焊球(solder ball)或導電凸塊(conductive bump)(未繪示)。The wafer is, for example, a wafer (die, which may also be referred to as a bare crystal), and the integrated circuit refers to a wafer after packaging. The electronic component 20 can be assembled on the electrical connector 100 using a plurality of solder bumps S1, such as solder balls or conductive bumps (not shown).
電連接器100包括一線路載板200以及多根導電接腳300，其中這些導電接腳300皆裝設在線路載板200上，並電性連接線路載板200。這些導電接腳300能分別與線路板10的多個接墊12接觸，讓電連接器100與線路板10電性連接。如此，電子元件20得以與線路板10電性導通。The electrical connector 100 includes a line carrier 200 and a plurality of conductive pins 300. The conductive pins 300 are mounted on the line carrier 200 and electrically connected to the line carrier 200. The conductive pins 300 can be respectively in contact with the plurality of pads 12 of the circuit board 10 to electrically connect the electrical connector 100 to the circuit board 10. As such, the electronic component 20 can be electrically connected to the circuit board 10.
線路載板200包括一線路層210、一外層絕緣層220與多根空心導電柱230。外層絕緣層220配置在線路層210上，並具有一相對線路層210的外表面222。這些空心導電柱230皆配置於外層絕緣層220中，並連接線路層210。各個空心導電柱230具有一裸露於外表面222的凹洞H1，而這些導電接腳300分別裝設在這些凹洞H1內。The line carrier 200 includes a circuit layer 210, an outer insulating layer 220 and a plurality of hollow conductive posts 230. The outer insulating layer 220 is disposed on the wiring layer 210 and has an outer surface 222 opposite to the wiring layer 210. The hollow conductive pillars 230 are disposed in the outer insulating layer 220 and connected to the circuit layer 210. Each of the hollow conductive posts 230 has a recess H1 exposed to the outer surface 222, and the conductive pins 300 are respectively disposed in the recesses H1.
承上述，外層絕緣層220可以是透過壓合膠片(prepreg)或塗佈樹脂材料(resin material)而形成，而這些空心導電柱230例如是經由有電電鍍(electroplating)與無電電鍍(electroless plating)而形成。線路層210可利用目前線路板製造技術來形成，例如線路層210是用加成法(additive)、減成法(subtractive)或半加成法(semi-additive)來形成。In the above, the outer insulating layer 220 may be formed by a prepreg or a resin material, and the hollow conductive pillars 230 are, for example, electroplated and electrolessly plated. And formed. The circuit layer 210 can be formed using current circuit board fabrication techniques, such as the circuit layer 210 being formed by additive, subtractive, or semi-additive.
線路載板200可以更包括一內層基板240。外層絕緣層220配置於內層基板240上，而線路層210位於內層基板240與外層絕緣層220之間，並電性連接內層基板240。詳細而言，內層基板240可包括多根實心導電柱242以及一線路層244，其中線路層244可以透過這些焊料塊S1來電性連接電子元件20。這些實心導電柱242連接線路層210、244。如此，線路層210得以電性連接內層基板240。The line carrier 200 can further include an inner substrate 240. The outer insulating layer 220 is disposed on the inner substrate 240, and the wiring layer 210 is disposed between the inner substrate 240 and the outer insulating layer 220, and electrically connected to the inner substrate 240. In detail, the inner substrate 240 may include a plurality of solid conductive pillars 242 and a wiring layer 244, wherein the wiring layer 244 may electrically connect the electronic components 20 through the solder bumps S1. These solid conductive posts 242 connect the circuit layers 210, 244. As such, the circuit layer 210 is electrically connected to the inner substrate 240.
由此可知，線路載板200包括二層線路層，即線路層210、244。不過，在其他未繪示的實施例中，線路載板200可以僅包括一層線路層，即線路層210。詳言之，線路載板200可不包括內層基板240，即內層基板240為線路載板200的選擇性元件，而非必要元件，且線路層210可直接連接這些焊料塊S1來電性連接電子元件20。It can be seen that the line carrier 200 includes two circuit layers, that is, circuit layers 210 and 244. However, in other embodiments not shown, the line carrier 200 may include only one layer of wiring, namely the wiring layer 210. In detail, the line carrier 200 may not include the inner substrate 240, that is, the inner substrate 240 is a selective component of the circuit carrier 200, and is not an essential component, and the circuit layer 210 may directly connect the solder bumps S1 to electrically connect the electrons. Element 20.
其次，在其他未繪示的實施例中，內層基板240不僅包括線路層244，更可以包括其他線路層，即內層基板240可以包括二層以上的線路層(包括線路層244)，且內層基板240的其中二層線路層可以經由一個或多個導電柱而彼此電性連接，其中此導電柱可以是空心或實心。因此，圖1A所示的內層基板240僅為舉例說明，並非限定本發明。Secondly, in other embodiments not shown, the inner substrate 240 includes not only the circuit layer 244 but also other circuit layers, that is, the inner substrate 240 may include more than two circuit layers (including the circuit layer 244), and Two of the wiring layers of the inner substrate 240 may be electrically connected to each other via one or more conductive pillars, wherein the conductive pillars may be hollow or solid. Therefore, the inner substrate 240 shown in FIG. 1A is merely illustrative and does not limit the invention.
在本實施例中，各個空心導電柱230堆疊在其中一實心導電柱242上，即這些空心導電柱230分別配置在這些實心導電柱242上。因此，這些空心導電柱230與這些實心導電柱242之間的配置會形成一種疊孔結構(stacked-via structure)。另外，線路層210可以包括多個接墊212，而各個接墊212連接於其中一空心導電柱230以及與其相鄰的實心導電柱242之間，如圖1A所示。In the present embodiment, each of the hollow conductive pillars 230 is stacked on one of the solid conductive pillars 242, that is, the hollow conductive pillars 230 are respectively disposed on the solid conductive pillars 242. Therefore, the arrangement between the hollow conductive pillars 230 and the solid conductive pillars 242 forms a stacked-via structure. In addition, the circuit layer 210 may include a plurality of pads 212, and each of the pads 212 is connected between one of the hollow conductive pillars 230 and the solid conductive pillars 242 adjacent thereto, as shown in FIG. 1A.
各根導電接腳300包括一柱體310以及一連接柱體310的凸柱320，其中這些柱體310分別配置在這些凹洞H1內，並連接這些空心導電柱230。各根柱體310具有一側面310a，而這些凸柱320凸出於這些側面310a，並且接觸這些空心導電柱230。此外，這些導電接腳300可以採用沖壓的方式來形成。Each of the conductive pins 300 includes a pillar 310 and a pillar 320 connecting the pillars 310. The pillars 310 are respectively disposed in the recesses H1 and connect the hollow conductive pillars 230. Each of the posts 310 has a side 310a that protrudes from the sides 310a and contacts the hollow conductive posts 230. In addition, these conductive pins 300 can be formed by stamping.
圖1B繪示圖1A中虛框的局部放大示意圖。請參閱圖1A與圖1B，在本實施例中，各個空心導電柱230更具有一頂部232，而頂部232裸露於外層絕緣層220的外表面222，其中這些導電接腳300的凸柱320接觸這些頂部232。詳細而言，各個凸柱320具有一連接柱體310的連接端324以及一相對連接端324的末端322，其中這些末端322接觸這些頂部232。FIG. 1B is a partially enlarged schematic view showing the dashed box of FIG. 1A. Referring to FIG. 1A and FIG. 1B , in the embodiment, each of the hollow conductive pillars 230 further has a top portion 232 , and the top portion 232 is exposed on the outer surface 222 of the outer layer insulating layer 220 , wherein the pillars 320 of the conductive pins 300 are in contact with each other. These tops are 232. In detail, each of the studs 320 has a connecting end 324 connecting the post 310 and an end 322 of the opposite connecting end 324, wherein the ends 322 contact the tops 232.
由於這些凸柱320的末端322接觸這些頂部232，因此凸柱320能支撐這些柱體310，讓柱體310不容易相對於外層絕緣層220傾斜。如此，當電連接器100組裝在線路板10上時，可以減少導電接腳300發生斷裂的情形。此外，在各根導電接腳300中，凸柱320可以位於第一桿件312與第二桿件314之間的相連處C1。Since the ends 322 of the studs 320 contact the tops 232, the studs 320 can support the posts 310, leaving the posts 310 less inclined relative to the outer insulating layer 220. As such, when the electrical connector 100 is assembled on the wiring board 10, the occurrence of breakage of the conductive pin 300 can be reduced. In addition, in each of the conductive pins 300, the studs 320 may be located at the junction C1 between the first rod 312 and the second rod 314.
就外觀而言，柱體310的形狀可以是彎折的柱狀體。詳細而言，各個柱體310可包括一第一桿件312以及一連接第一桿件312的第二桿件314，且第一桿件312朝向第二桿件314彎曲，如圖1A與圖1B所示。In terms of appearance, the shape of the cylinder 310 may be a bent columnar body. In detail, each of the cylinders 310 may include a first rod 312 and a second rod 314 connecting the first rod 312, and the first rod 312 is bent toward the second rod 314, as shown in FIG. 1A and FIG. 1B is shown.
承上述，這些第二桿件314連接這些空心導電柱230，且這些第二桿件314與這些空心導電柱230電性導通。第二桿件314連接空心導電柱230的方式有多種，例如第二桿件314可透過黏合(adhering)或鍵合(wire bonding)而連接空心導電柱230。In the above, the second rods 314 are connected to the hollow conductive posts 230, and the second rods 314 are electrically connected to the hollow conductive posts 230. The second rod 314 is connected to the hollow conductive post 230 in various ways. For example, the second rod 314 can be connected to the hollow conductive post 230 by means of adhesion or wire bonding.
在本實施例中，這些第二桿件314是透過結合材料110而連接這些空心導電柱230。詳細而言，電連接器100可以更包括多個結合材料110，而這些結合材料110分別配置於這些凹洞H1中，其中這些結合材料110連接這些柱體310以及這些空心導電柱230。In the present embodiment, the second rods 314 are connected to the hollow conductive posts 230 by the bonding material 110. In detail, the electrical connector 100 may further include a plurality of bonding materials 110, and the bonding materials 110 are respectively disposed in the recesses H1, wherein the bonding materials 110 connect the pillars 310 and the hollow conductive pillars 230.
承上述，這些結合材料110可以是錫膏或焊錫。當結合材料110為錫膏或焊錫時，結合材料110可以經過回焊流程(reflow process)而熔化，進而能連接第二桿件314與空心導電柱230。如此，這些導電接腳300得以裝設在線路載板200上。In view of the above, these bonding materials 110 may be solder paste or solder. When the bonding material 110 is solder paste or solder, the bonding material 110 may be melted through a reflow process to connect the second rod 314 and the hollow conductive post 230. As such, the conductive pins 300 are mounted on the line carrier 200.
另外，在本實施例中，各個柱體310可以更包括一連接第一桿件312的凸部316。詳細而言，在各個柱體310中，第一桿件312具有一末端312a，而末端312a相對於第二桿件314，其中凸部316可以位於末端312a，如圖1A、圖1B所示。In addition, in the embodiment, each of the pillars 310 may further include a convex portion 316 that connects the first rods 312. In detail, in each of the cylinders 310, the first rod 312 has a distal end 312a and the distal end 312a is opposite the second rod 314, wherein the convex portion 316 can be located at the end 312a as shown in FIGS. 1A and 1B.
值得一提的是，目前疊孔結構類型的線路板，其多根導電柱之間的間距，數量級可約在微米(μm)等級，而這些空心導電柱230之間的間距，數量級同樣可約在微米的等級。由於這些導電接腳300分別連接這些空心導電柱230，因此這些導電接腳300之間的間距P1相當於這些空心導電柱230之間的間距。換句話說，間距P1的數量級也是約在微米等級。It is worth mentioning that, at present, the spacing of the plurality of conductive columns of the circuit board of the stacked structure type can be on the order of micrometer (μm), and the spacing between the hollow conductive pillars 230 can also be of the order of magnitude. At the micron level. Since the conductive pins 300 are respectively connected to the hollow conductive pillars 230, the pitch P1 between the conductive pins 300 corresponds to the spacing between the hollow conductive pillars 230. In other words, the order of the pitch P1 is also on the order of microns.
圖2繪示本發明另一實施例的電連接器的剖面示意圖。請參閱圖2，電連接器400亦能組裝在線路板10上，且至少一個電子元件20也可以組裝在電連接器400上，其中電連接器400組裝在線路板10上的方式，以及電子元件20組裝在電連接器400上的方式皆與前述實施例相同，故不再重覆贅述。2 is a cross-sectional view showing an electrical connector according to another embodiment of the present invention. Referring to FIG. 2, the electrical connector 400 can also be assembled on the circuit board 10, and at least one electronic component 20 can also be assembled on the electrical connector 400, wherein the electrical connector 400 is assembled on the circuit board 10, and the electronic The manner in which the component 20 is assembled on the electrical connector 400 is the same as that of the previous embodiment, and therefore will not be repeated.
電連接器400除了包括線路載板500與這些固定元件410之外，也包括多根導電接腳300。這些導電接腳300的結構、裝設在線路載板500的方式以及製造方法都已在前述實施例中詳細揭露，故不再重複介紹。其次，線路載板500包括一線路層510、外層絕緣層220、多根空心導電柱230與一內層基板540，其中外層絕緣層220與這些空心導電柱230在結構及製造方法上的特徵都已在前述實施例中詳細揭露，所以也不再重複介紹。The electrical connector 400 includes a plurality of conductive pins 300 in addition to the line carrier 500 and the fixed components 410. The structure of these conductive pins 300, the manner in which the wiring carrier 500 is mounted, and the manufacturing method have been disclosed in detail in the foregoing embodiments, and therefore will not be repeatedly described. Next, the circuit carrier 500 includes a circuit layer 510, an outer insulating layer 220, a plurality of hollow conductive pillars 230 and an inner substrate 540, wherein the outer insulating layer 220 and the hollow conductive pillars 230 are characterized in structure and manufacturing method. It has been disclosed in detail in the foregoing embodiments, so the description will not be repeated.
由此可見，電連接器400與前述實施例的電連接器100相似，因此以下將主要介紹電連接器400與電連接器100二者的差異，其包括本實施例的內層基板540的結構。It can be seen that the electrical connector 400 is similar to the electrical connector 100 of the previous embodiment, so the difference between the electrical connector 400 and the electrical connector 100 will be mainly described below, including the structure of the inner substrate 540 of the present embodiment. .
詳細而言，內層基板540包括多根導電柱542，而線路層510位於這些導電柱542與這些空心導電柱230之間，其中線路層510連接這些導電柱542與這些空心導電柱230，且導電柱542可以是實心導電柱。In detail, the inner substrate 540 includes a plurality of conductive pillars 542, and the circuit layer 510 is located between the conductive pillars 542 and the hollow conductive pillars 230, wherein the wiring layer 510 connects the conductive pillars 542 and the hollow conductive pillars 230, and Conductive post 542 can be a solid conductive post.
有別於前述實施例中的內層基板240，在本實施例中，這些導電柱542與這些空心導電柱230錯開。因此，這些空心導電柱230與這些導電柱542之間的配置會形成一種交錯孔結構(staggered-via structure)。Different from the inner substrate 240 in the foregoing embodiment, in the present embodiment, the conductive posts 542 are staggered from the hollow conductive posts 230. Therefore, the arrangement between the hollow conductive pillars 230 and the conductive pillars 542 forms a staggered-via structure.
目前交錯孔結構類型的線路板，其多根導電柱之間的間距，數量級可約在微米(μm)等級，而這些空心導電柱230之間的間距，數量級同樣可約在微米等級。因此，圖2所示的這些導電接腳300之間的間距P2，其數量級也是約在微米等級。At present, the pitch of the staggered hole structure type, the spacing between the plurality of conductive pillars, can be on the order of micrometers (μm), and the spacing between the hollow conductive pillars 230 can also be on the order of micrometers. Therefore, the pitch P2 between the conductive pins 300 shown in FIG. 2 is also on the order of about micrometers.
除此之外，本實施例的電連接器400與前述實施例的電連接器100的差異還包括：電連接器400所包括的一對固定元件410。這些固定元件410配置於線路載板500，且線路載板500經由這些固定元件410組裝在線路板10上。In addition to this, the difference between the electrical connector 400 of the present embodiment and the electrical connector 100 of the foregoing embodiment further includes a pair of fixing members 410 included in the electrical connector 400. These fixing members 410 are disposed on the wiring carrier 500, and the wiring carrier 500 is assembled on the wiring board 10 via these fixing members 410.
詳細而言，固定元件410能固定在線路板10上，進而讓線路載板500得以與線路板10組裝，其中固定元件410可以透過螺絲鎖固、卡合以及緊配(fasten)等方式固定在線路板10上。由於以上螺絲鎖固、卡合以及緊配等方法為目前機械加工技術的常用手段，因此即使未繪示出這些固定元件410固定在線路板10上的方式，本發明所屬技術領域中的通常知識者仍可以經由以上文字敘述而能輕易地理解固定元件410如何固定在線路板10上。In detail, the fixing component 410 can be fixed on the circuit board 10, so that the circuit carrier 500 can be assembled with the circuit board 10, wherein the fixing component 410 can be fixed by screw locking, snapping and fasten. On the circuit board 10. Since the above methods of screw locking, snapping, and tight fitting are common means of current machining technology, even if the manner in which the fixing members 410 are fixed on the circuit board 10 is not illustrated, the general knowledge in the technical field to which the present invention pertains. It is still possible to easily understand how the fixing member 410 is fixed to the wiring board 10 by the above description.
綜上所述，由於這些導電接腳能接觸線路板的多個接墊，因此本發明的電連接器得以與線路板電性連接。如此，本發明的電連接器能使電子元件(例如主動元件或被動元件)與線路板電性導通，進而讓電子元件發揮功用。In summary, since the conductive pins can contact a plurality of pads of the circuit board, the electrical connector of the present invention can be electrically connected to the circuit board. Thus, the electrical connector of the present invention enables electrical components (such as active components or passive components) to be electrically connected to the circuit board, thereby allowing the electronic components to function.
其次，在本發明中，這些導電接腳之間的間距，數量級可約在微米等級，因此本發明的導電接腳的分布密度可高於習知針狀接腳的分布密度。由此可知，本發明的電連接器符合目前接腳分布越來越密集的發展趨勢。Secondly, in the present invention, the spacing between the conductive pins can be on the order of micrometers, so that the conductive pins of the present invention can be distributed at a higher density than conventional pin-shaped pins. It can be seen that the electrical connector of the present invention conforms to the trend that the current pin distribution is increasingly dense.
雖然本發明以前述實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，所作更動與潤飾之等效替換，仍為本發明之專利保護範圍內。While the present invention has been described above in the foregoing embodiments, it is not intended to limit the invention, and the equivalents of the modifications and retouchings are still in the present invention without departing from the spirit and scope of the invention. Within the scope of patent protection.
10．．．線路板10. . . circuit board
12、212．．．接墊12, 212. . . Pad
20．．．電子元件20. . . Electronic component
100、400．．．電連接器100, 400. . . Electrical connector
110．．．結合材料110. . . Bonding material
200、500．．．線路載板200, 500. . . Line carrier
210、244、510．．．線路層210, 244, 510. . . Circuit layer
220．．．外層絕緣層220. . . Outer insulation
222．．．外表面222. . . The outer surface
230．．．空心導電柱230. . . Hollow conductive column
232．．．頂部232. . . top
240、540．．．內層基板240, 540. . . Inner substrate
242．．．實心導電柱242. . . Solid conductive column
300．．．導電接腳300. . . Conductive pin
310．．．柱體310. . . Cylinder
310a．．．側面310a. . . side
312．．．第一桿件312. . . First rod
312a、322．．．末端312a, 322. . . End
314．．．第二桿件314. . . Second member
316．．．凸部316. . . Convex
320．．．凸柱320. . . Tab
324．．．連接端324. . . Connection end
410．．．固定元件410. . . Fixed component
542．．．導電柱542. . . Conductive column
C1．．．相連處C1. . . Connected
H1．．．凹洞H1. . . pit
P1、P2．．．間距P1, P2. . . spacing
S1．．．焊料塊S1. . . Solder block
圖1A繪示本發明一實施例的電連接器的剖面示意圖。1A is a cross-sectional view of an electrical connector in accordance with an embodiment of the present invention.
圖1B繪示圖1A中虛框的局部放大示意圖。FIG. 1B is a partially enlarged schematic view showing the dashed box of FIG. 1A.
圖2繪示本發明另一實施例的電連接器的剖面示意圖。2 is a cross-sectional view showing an electrical connector according to another embodiment of the present invention.
10．．．線路板10. . . circuit board
12、212．．．接墊12, 212. . . Pad
20．．．電子元件20. . . Electronic component
100．．．電連接器100. . . Electrical connector
110．．．結合材料110. . . Bonding material
200．．．線路載板200. . . Line carrier
210、244．．．線路層210, 244. . . Circuit layer
220．．．外層絕緣層220. . . Outer insulation
222．．．外表面222. . . The outer surface
230．．．空心導電柱230. . . Hollow conductive column
232．．．頂部232. . . top
240．．．內層基板240. . . Inner substrate
242．．．實心導電柱242. . . Solid conductive column
300．．．導電接腳300. . . Conductive pin
310．．．柱體310. . . Cylinder
310a．．．側面310a. . . side
312．．．第一桿件312. . . First rod
312a．．．末端312a. . . End
314．．．第二桿件314. . . Second member
316．．．凸部316. . . Convex
320．．．凸柱320. . . Tab
H1．．．凹洞H1. . . pit
P1．．．間距P1. . . spacing
S1．．．焊料塊S1. . . Solder block
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98138562A TWI405375B (en) | 2009-11-13 | 2009-11-13 | Electric connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98138562A TWI405375B (en) | 2009-11-13 | 2009-11-13 | Electric connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201117499A TW201117499A (en) | 2011-05-16 |
| TWI405375B true TWI405375B (en) | 2013-08-11 |
Family
ID=44935246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98138562A TWI405375B (en) | 2009-11-13 | 2009-11-13 | Electric connector |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI405375B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI560834B (en) * | 2015-05-29 | 2016-12-01 | Chipmos Technologies Inc | Flip chip package and chip |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW548756B (en) * | 1998-06-30 | 2003-08-21 | Formfactor Inc | Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
-
2009
- 2009-11-13 TW TW98138562A patent/TWI405375B/en active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW548756B (en) * | 1998-06-30 | 2003-08-21 | Formfactor Inc | Socket for mating with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201117499A (en) | 2011-05-16 |
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