TWI404581B - Manufacturing method of metal wire - Google Patents

Abstract

A manufacturing method of metal wire is presented, which includes: providing a wire material of high carbon steel; roughly drawing the wire material after the wire material goes through a surface treatment; smoothly drawing the wire material after a first annealing process; and, at last, excuting a copper plating process and then finely drawing the wire material after a second annealing process. Consequently, the presented method of the invention can improve the plasticity and toughness of the wire material to obtain a fine metal wire of high carbon steel with high strength. Besides, the diameter of the obtained metal wire is lower than 0.2 mm, which mainly aims at wafer-cutting to decrease the loss of wafer material in a cutting process.

Description

Metal wire manufacturing method

The invention relates to a method for manufacturing a metal wire, in particular to a method for manufacturing a high carbon steel wire for cutting a wafer rod and having a wire diameter of up to 0.2 mm or less.

Once the wafer rod has been sliced, ground and polished, it can be supplied to the semiconductor or solar cell industry.

With the increasing size and thinning of wafer sizes, higher requirements have been placed on the cutting technology of wafer rods. When the thickness of the wafer is thinner, the wire diameter of the wire used for wire cutting must also be finer. In other words, the finer the wire diameter of the metal wire used to cut the wafer rod, the smaller the cut. Therefore, how to cut a wafer of a certain length to the maximum number of wafers and minimize the cut loss, seeking a high-strength ultra-fine metal wire will be the key to improving the utilization rate of raw materials.

Carbon steel wire can be roughly classified into high, medium and low carbon steel wire according to the carbon content. Among them, carbon content is less than 0.6wt%, and low carbon steel wire is generally used for metal weaving or other purposes, and carbon content. The high carbon steel wire of 0.6wt% or more is subjected to a drawing process, so that the wire diameter of the wire can be reduced for wafer cutting.

Referring to FIG. 1 , the conventional method for manufacturing a metal wire includes: providing a wire having a wire diameter of about 5.5 mm; applying a surface treatment such as mechanical rust removal, electrolytic pickling, film coating, and drying to the wire. Waiting for the first drawing process, the wire diameter of the wire is reduced from about 5.5 mm to about 3.0 mm; the wire is annealed; and then the second drawing process is performed, the wire is The wire diameter is reduced from about 3.0 mm to about 1.0 mm; then the wire is subjected to electrolytic pickling. In this step, an electroplating or electroless copper plating step may be selected to form a conductive layer on the surface of the wire.

However, the minimum wire diameter of the metal wire that can be manufactured by the conventional method is still less than 1.0 mm, which has failed to meet the cutting technology requirements of the next-generation wafer industry. Moreover, when a thin wire having a relatively large wire diameter is used to cut a thin wafer, the damage of the wafer bar is large, resulting in high loss, resulting in low raw material utilization rate and cost increase, and must be strict in the cutting process. Controlling the load applied to the wafer rod and the cutting speed make it difficult to increase the yield.

At this time, another conventional method is to directly pass the third drawing process to reduce the wire diameter of the wire. However, this other conventional method often causes the wire to break, resulting in a low yield.

It is an object of the present invention to provide a method of manufacturing a metal wire for making a thin metal wire.

Another object of the present invention is to provide a method of manufacturing a metal wire for manufacturing a metal wire having high strength.

Still another object of the present invention is to provide a method for producing a high carbon steel wire which can produce a small diameter wire at a stable high yield.

In order to achieve the foregoing creative purposes, the technical means utilized by the present invention and the effects achievable by the technical means include: providing a wire; applying a surface treatment to the wire; the wire is subjected to a rough drawing process; Applying a first annealing process; the wire is subjected to a fine drawing process; the wire is subjected to a second annealing process; and the wire is subjected to a fine drawing process.

By applying an annealing process between the three drawing processes, the plasticity and toughness of the wire can be improved, and the wire can be further drawn into a very thin metal wire of 0.2 mm or less to meet the next-generation wafer industry. Cutting technology needs.

Furthermore, the wire diameter of the wire produced by the invention can be up to 0.2 mm or less, and can be applied to wafers having a thinner thickness and reducing the cut. Moreover, the present invention is particularly suitable for the manufacture of high carbon steel wires having a carbon content of between 0.6 and 1.4 wt%. Due to the high carbon steel material and high strength properties, the metal wires manufactured by the present invention are not made of high carbon steel. Since the wire diameter is reduced to affect its own strength, wafer loss due to wire breakage during cutting use can be avoided.

The above and other objects, features and advantages of the present invention will become more <RTIgt; The manufacturing method of the invention metal wire comprises: providing a wire material, preferably selected from the group consisting of high carbon steel materials having a carbon content of 0.6 to 1.4 wt%, and the wire diameter of the wire material is preferably selected to be 5.5 mm.

First, the wire is subjected to a surface treatment, and the surface treatment method may firstly perform mechanical rust removal and electrolytic pickling on the wire by using a rust removing device and an electrolytic pickling device, and then using a film coating device. And drying the device for coating and drying the wire.

After the wire is subjected to surface treatment, the rough drawing process can be performed, and preferably, a wire drawing device is selected to perform a rough drawing process on the wire. In this embodiment, the wire is selected from a high-hardness high-carbon steel material, so that a wire drawing device for arranging a diamond mold is preferably used to maintain the quality of the wire. Moreover, the rough drawing process can reduce the wire diameter of the wire to about 3.0 mm.

Since the wire is subjected to the cold drawing process of the aforementioned rough drawing, the wire is hardened and internal stress remains. Therefore, the wire is subjected to a first annealing process (such as lead bath annealing) to homogenize the grains while removing residual stress. The first annealing process sends the wire drawn through the rough drawing process to an annealing furnace which has been heated to between 1000 and 1100 ° C, and the wire is continuously heated for a suitable period of time, and then slowly cooled after annealing. Among them, the temperature of the annealing furnace is preferably maintained at 1030 ° C. In addition, the cooling environment is preferably cooled by a lead bath to prevent the wire from producing brittle carbon.

After the wire is subjected to the first annealing process, the fine drawing process can be further performed, and the wire drawing process can further reduce the wire diameter of the wire to about 1.0 mm.

The metal wire system manufactured by the invention is preferably selected from the high hardness high carbon steel material, and after the wire is subjected to a cold drawing process of further fine drawing, a second annealing process is applied to improve the plasticity of the wire and toughness. The first The two annealing process sends the wire to the annealing furnace which has been heated to 1000~1100 °C, preferably by heating to 1030 ° C, and continuously heating the wire for a suitable time, and then slowly cooling after annealing. Among them, the temperature of the annealing furnace is preferably maintained at 1030 ° C. In addition, the cooling environment is preferably selected to cool the lead bath to prevent the wire from producing brittle carbon.

After the wire is subjected to the second annealing process, the wire is subjected to borax pickling and rustproof treatment, and then the electroless copper plating process can be performed. Since the wire is subjected to the second annealing process, there is still an electroless copper plating process. Therefore, after the rust cleaning treatment by borax, the rust prevention and the better copper plating effect can be simultaneously considered. In addition, the electroless copper plating process is preferably selected by a pickling copper plating method to form a pure copper conductive layer on the surface of the wire.

After the above two annealing processes, the wire can achieve the expected physical properties in terms of ductility and elasticity. Therefore, when the wire is subjected to the fine drawing process, the wire diameter of the wire can be further drawn and reduced to 0.2 mm or less.

Finally, the completed metal wire is retracted by a retracting device.

Referring to Fig. 3, in another embodiment of the present invention, the borax pickling rustproofing treatment and the electroless copper plating process may be performed after the fine drawing process. At this time, it is preferable to directly plate a surface of the wire with a pure copper conductive layer.

As described above, the present invention preferably uses a high carbon steel wire having a carbon content of 0.6 to 1.4 wt%, and an annealing process is applied between the three drawing processes to improve the ductility and toughness of the wire. The high-hardness high-carbon steel wire can be drawn into a very thin metal wire with high strength. Therefore, the metal wire manufactured by the invention does not affect its own strength due to the reduction of the wire diameter, and is also difficult to be Breakage is produced, which improves process yield. Furthermore, the wire diameter of the wire produced by the invention can be up to 0.2 mm or less, and can be applied to wafer slices having a thinner thickness to reduce the cut.

While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.

Figure 1: Flow chart of a conventional manufacturing method.

Figure 2 is a flow chart showing a manufacturing method of a preferred embodiment of the present invention.

Figure 3 is a flow chart showing a manufacturing method of another embodiment of the present invention.

Claims (8)

A method for manufacturing a metal wire, comprising: providing a wire; applying a surface treatment to the wire; and performing a rough drawing process on the wire by a drawing device, wherein the wire drawing process reduces the wire diameter of the wire Up to about 3.0 mm; applying a first annealing process to the wire; performing a fine drawing process on the wire by the wire drawing device, and reducing the wire diameter of the wire to about 1.0 mm; applying the wire to the wire a second annealing process; and the wire drawing device is subjected to a precision drawing process, and the wire diameter of the wire is drawn and reduced to less than 0.2 mm; wherein the wire is selected from a carbon content of 0.6 to 1.4 wt% High carbon steel material. The method for manufacturing a metal wire according to claim 1, wherein the wire is subjected to surface copper plating after the wire is subjected to a second annealing process. The method for producing a metal wire according to claim 1, wherein the wire is subjected to surface copper plating after the wire is subjected to a fine drawing process. The method for manufacturing a metal wire according to claim 1, wherein the first annealing process and the second annealing process are performed by a lead bath annealing of 1000 to 1100 °C. a method of manufacturing a metal wire according to item 2 or 3 of the patent application scope, The surface copper plating method is pickling copper plating. The method for manufacturing a metal wire according to claim 1, wherein after the second annealing process, the wire is subjected to a borax pickling antirust treatment. The method for manufacturing a metal wire according to claim 1, wherein the wire is subjected to a borax pickling antirust treatment after the fine drawing process. The method for producing a metal wire according to claim 1, wherein the surface treatment comprises a mechanical rust removal, an electrolytic pickling, a film coating, and a drying process.