TWI402930B - - Google Patents
Info
- Publication number
- TWI402930B TWI402930B TW98133082A TW98133082A TWI402930B TW I402930 B TWI402930 B TW I402930B TW 98133082 A TW98133082 A TW 98133082A TW 98133082 A TW98133082 A TW 98133082A TW I402930 B TWI402930 B TW I402930B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98133082A TW201112343A (en) | 2009-09-30 | 2009-09-30 | Film cutting device of wafer film laminator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98133082A TW201112343A (en) | 2009-09-30 | 2009-09-30 | Film cutting device of wafer film laminator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201112343A TW201112343A (en) | 2011-04-01 |
| TWI402930B true TWI402930B (en) | 2013-07-21 |
Family
ID=44909237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98133082A TW201112343A (en) | 2009-09-30 | 2009-09-30 | Film cutting device of wafer film laminator |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201112343A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11312123B2 (en) | 2020-05-26 | 2022-04-26 | Eleadtk Co., Ltd. | Vacuum lamination system and vacuum lamination method |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107200301B (en) * | 2017-05-23 | 2019-02-12 | 中国科学院微电子研究所 | Pad pasting aligning device of MEMS wafer |
| CN108819210B (en) * | 2018-08-22 | 2024-04-12 | 苏州第一塑胶有限公司 | Automatic film sticking machine |
| CN111640695B (en) * | 2020-06-05 | 2023-04-11 | 深圳市长方集团股份有限公司 | Device and process for packaging UVC LED chip on wafer |
| CN116728761B (en) * | 2023-08-16 | 2023-10-20 | 江苏缪斯光电科技有限公司 | Film covering device of optical filter for infrared night vision telescope equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4687693A (en) * | 1985-06-13 | 1987-08-18 | Stauffer Chemical Company | Adhesively mountable die attach film |
| JP2002210825A (en) * | 2001-01-16 | 2002-07-31 | Taisei Laminator Co Ltd | Laminating apparatus and method therefor |
| TW200401391A (en) * | 2002-07-12 | 2004-01-16 | Samsung Electronics Co Ltd | Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit |
| TW200539331A (en) * | 2004-04-14 | 2005-12-01 | Lintec Corp | Wafer processing apparatus and wafer processing method |
| TW200931559A (en) * | 2008-01-15 | 2009-07-16 | C Sun Mfg Ltd | Film-slitting device of wafer |
-
2009
- 2009-09-30 TW TW98133082A patent/TW201112343A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4687693A (en) * | 1985-06-13 | 1987-08-18 | Stauffer Chemical Company | Adhesively mountable die attach film |
| JP2002210825A (en) * | 2001-01-16 | 2002-07-31 | Taisei Laminator Co Ltd | Laminating apparatus and method therefor |
| TW200401391A (en) * | 2002-07-12 | 2004-01-16 | Samsung Electronics Co Ltd | Dicing tape attaching unit that can attach pre-cut dicing tape and general dicing tape to wafer and in-line system having the dicing tape attaching unit |
| TW200539331A (en) * | 2004-04-14 | 2005-12-01 | Lintec Corp | Wafer processing apparatus and wafer processing method |
| TW200931559A (en) * | 2008-01-15 | 2009-07-16 | C Sun Mfg Ltd | Film-slitting device of wafer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11312123B2 (en) | 2020-05-26 | 2022-04-26 | Eleadtk Co., Ltd. | Vacuum lamination system and vacuum lamination method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201112343A (en) | 2011-04-01 |