TWI401598B - Projective-capacitive touch panel and fabrication method thereof - Google Patents

Description

Projected capacitive touch panel and method of manufacturing same

The present invention relates to a touch panel and a method of fabricating the same, and more particularly to a projected capacitive touch panel and a method of fabricating the same.

The projected capacitive touch panel (PROJECTIVE-CAPACITIVE TOUCH PANEL) is based on a conventional capacitive touch panel, and is further composed of two sets of transparent wires (X, Y) and driving wires which exist in different planes and are perpendicular to each other. .

Please refer to the first figure, which is a schematic diagram of the structure of a conventional projected capacitive touch panel. In the first figure, the projected capacitive touch panel 1 is mainly composed of a glass substrate 11 as a substrate, an X pattern layer 12 as a first pattern layer, an X pattern protection layer 13 as a first protective layer, and a metal. The wire layer 14, the metal wire protective layer 15 as the second protective layer, the Y pattern layer 16 as the second pattern layer, and the top coat layer 17 as the insulating layer are formed.

Please refer to the second figure, which is a manufacturing flow diagram corresponding to the projected capacitive touch panel of the first figure. The conventional process of the second figure will be described below with reference to the first figure.

(Step 21): putting a glass substrate 11 as a substrate;

(Step 22): depositing an indium tin oxide (ITO) layer on the glass substrate 11, and applying, exposing, developing, etching, and stripping the ITO layer using a photoresist (A) The X pattern layer 12 as the first pattern layer is formed on the glass substrate 11. It should be noted that the first mask was used in this step.

(Step 23): a process of coating, exposing, developing, etching, and stripping is performed on the X pattern layer 12 by using a photoresist (B) by forming an X pattern protective layer 13 as a first protective layer. It should be noted that a second mask is used in this step.

(Step 24): sputtering a metal layer on the X pattern protection layer 13, and coating, exposing, developing, etching, and stripping the metal layer by using a photoresist (B), thereby forming an X pattern. A metal wiring layer 14 is formed on the protective layer 13. It should be noted that a third mask is used in this step.

(Step 25): a process of coating, exposing, developing, etching, and stripping on the metal wiring layer 14 by using a photoresist (B) by forming a metal wiring protective layer 15 as a second protective layer. It should be noted that a fourth mask is used in this step.

(Step 26): depositing an indium tin oxide (ITO) layer on the metal wire protective layer 15 and applying, exposing, developing, etching, and stripping the ITO layer using a photoresist (A). The process is to form a Y pattern layer 16 as a second pattern layer on the metal wire protective layer 15. It should be noted that a fifth mask is used in this step.

(Step 27): Printing and ultraviolet (UV) curing are performed on the Y pattern layer 16 using a photosensitive resin material (ASAHIKSEI PHOTOSENSITIVE RESIN, APR) to form a TOP COATING (TC) layer 17 as an insulating layer.

(Subsequent steps): performing line detection, splitting, and the like on the formed projected capacitive touch panel 1 to form a finished product.

The conventional process of the above projected capacitive touch panel has the following disadvantages:

(1) Complex process: The total process requires a total of five mask programs and an APR program, making the process too complicated. In addition, the process of coating, exposing, developing, etching, and stripping is highly repetitive, which imposes an excessive burden on the device.

(2) Affecting the environment: Due to the increase in pickling engineering, it is easy to cause environmental pollution.

(3) Reducing performance: In order to prevent acid corrosion between the two pattern layers and the metal wiring layer, it is necessary to add a protective layer between the layers. Since the protective layer is slightly acidic, it is easy to affect the reliability of the line. In addition, the added protective layer also reduces the transmission of light to the panel.

Therefore, it is necessary to conceive a projected capacitive touch panel different from the above-mentioned conventional technology and a manufacturing method thereof, thereby simplifying the process, reducing the cost, and improving the performance of the finished product.

According to the above concept, the present invention provides a method for manufacturing a projected capacitive touch panel, comprising the steps of: providing a substrate; forming a metal on the substrate by a first exposure development process and an etching and stripping process; a wire layer; a first pattern layer is formed on the metal wire layer by a second exposure process, a first coating process and a first filming process; and an insulating layer is formed on the first pattern layer And forming a second pattern layer on the insulating layer by a third exposure process, a second coating process and a second filming process.

According to the above concept, another aspect of the present disclosure is to provide a projected capacitive touch panel comprising: a substrate; a metal layer on the substrate; a first pattern layer on the metal layer; and a top coating layer on the a first pattern layer; and a second pattern layer on the top coating layer.

According to the above concept, the present invention further proposes a projected capacitive touch panel which is manufactured by the above manufacturing method.

The above-described projected capacitive touch panel and the method of manufacturing the same can not only shorten the process and reduce the amount of use of the mask, but also reduce the manufacturing cost, improve the transmittance of the light to the panel, and reduce the environmental pollution of the process. .

This case can be further understood by the following diagrams and detailed explanations:

Please refer to the third figure, which is a flowchart of a method for manufacturing a projected capacitive touch panel proposed in the present application. The manufacturing method of the projected capacitive touch panel proposed in the present application will be described below with reference to the third figure.

(Step A): feeding a glass substrate as a substrate;

(Step B): A metal wire layer is formed on the glass substrate by a first exposure development process and an etching and stripping process. Wherein, a metal layer is first sputtered on the glass substrate, and then a photoresist (A) is coated on the metal layer, and the first exposure development process and the etching and stripping process are sequentially performed on the metal layer. The metal layer is made of the metal wiring layer. It should be noted that the first mask was used in this step.

(Step C): forming a first pattern layer on the metal wire layer by a second exposure process, a first coating process and a first filming process. Wherein, a photoresist (B) is coated on the metal wire layer, and the second exposure process is performed on the photoresist layer, and a first indium tin oxide (ITO) is formed by the first plating process. And finally, the first ITO layer is formed as an X-pattern layer of the first pattern layer by the first stripping process.

(Step D): Printing and ultraviolet (UV) curing are performed on the X pattern layer with a photosensitive resin material (ASAHIKSEI PHOTOSENSITIVE RESIN, APR) to form a TOP COATING (TC) layer as an insulating layer.

(Step E): forming a second pattern layer on the top coat layer by a third exposure process, a second coating process and a second filming process. Wherein, a photoresist (B) is coated on the top coat layer, and the third exposed light development process is performed on the photoresist layer, and a second indium tin oxide (ITO) is formed by the second plating process. And finally, the second ITO layer is formed as a Y pattern layer of the second pattern layer by the second stripping process.

(Next steps): Perform line detection, splitting, and the like on the formed projected capacitive touch panel to make a finished product.

Please refer to the fourth figure, which is a schematic diagram of the structure of the projected capacitive touch panel manufactured by the manufacturing method of the third figure. In the fourth figure, the projected capacitive touch panel 4 is mainly composed of a glass substrate 41 as a substrate, a metal wiring layer 42, an X pattern layer 43 as a first pattern layer, and a top coat layer 44 as an insulating layer. And a Y pattern layer 45 as a second pattern layer.

Please refer to the fifth (a) figure, which is a side view of the structure of the projected capacitive touch panel of the fourth figure. As shown in the fifth (a) diagram, the projected capacitive touch panel 5 includes a glass substrate 51, a metal wire 52, an X pattern layer 53, a top coat layer 54, and a Y pattern layer 55. In addition, please refer to FIG. 5(b), which is another side view of the structure of the projected capacitive touch panel of the fourth figure. As shown in the fifth (b), it can also be seen that the projected capacitive touch panel 5 includes the glass substrate 51, the metal wires 52, the X pattern layer 53, the top coat layer 54, and the Y pattern layer 55.

In summary, the present invention proposes a projected capacitive touch panel and a manufacturing method thereof, which reduces the usage of the photomask from the conventional five to three, which not only shortens the process, but also reduces the manufacturing cost while improving. Light can also reduce the environmental pollution caused by the process.

This case has been modified by people who are familiar with the art, but it is not intended to be protected by the scope of the patent application.

1. . . Projected capacitive touch panel

11. . . Glass substrate

12. . . X pattern layer

13. . . X pattern protection layer

14. . . Metal wire layer

15. . . Metal wire protection

16. . . Y pattern layer

17. . . Top coat

4. . . Projected capacitive touch panel

41. . . Glass substrate

42. . . Metal wire layer

43. . . X pattern layer

44. . . Top coat

45. . . Y pattern layer

First: Schematic diagram of the structure of a conventional projected capacitive touch panel.

Second figure: a manufacturing flow chart corresponding to the projected capacitive touch panel of the first figure.

Third: A flow chart of a method for manufacturing a projected capacitive touch panel proposed in the present application.

Fourth: Schematic diagram of the structure of a projected capacitive touch panel manufactured by the manufacturing method of the third figure.

Fifth (a): A side view of the structure of the projected capacitive touch panel of the fourth figure.

FIG. 5(b) is a side view showing the structure of the projected capacitive touch panel of the fourth figure.

4. . . Projected capacitive touch panel

41. . . Glass substrate

42. . . Metal wire layer

43. . . X pattern layer

44. . . Top coat

45. . . Y pattern layer

Claims (7)

A method for manufacturing a projected capacitive touch panel comprises the steps of: (A) providing a substrate; (B) forming a metal wire layer on the substrate by a first exposure development process and an etching and stripping process. (C) sequentially forming a first pattern layer on the metal wiring layer by a second exposure development process, a first coating process, and a first stripping process; (D) forming the first pattern layer; Forming an insulating layer; and (E) forming a second pattern layer on the insulating layer by a third exposure process, a second coating process, and a second filming process. The manufacturing method of claim 1, wherein the step (B) further comprises: (B1) sputtering a metal layer on the substrate; and (B2) coating a photoresist layer on the metal layer, and sequentially The metal layer is formed into the metal wiring layer by the first exposure development process and the etching and stripping process. The manufacturing method of claim 1, wherein the step (C) further comprises: (C1) coating a photoresist layer on the metal wiring layer, and performing the second exposure development process on the photoresist layer; C2) forming a first indium tin oxide (ITO) layer by the first plating process; and (C3) forming the first ITO layer into the first pattern layer by the first stripping process. The manufacturing method of claim 1, wherein the step (D) further comprises: (D1) forming a photosensitive resin material (ASAHKSEI PHOTOSENSITIVE RESIN, APR) layer on the first pattern layer; and (D2) ultraviolet light The APR layer is cured (UV) to make it into the insulating layer. The manufacturing method of claim 1, wherein the step (E) further comprises: (E1) coating a photoresist layer on the insulating layer, and performing the third exposure development process on the photoresist layer; (E2) Forming a second indium tin oxide (ITO) layer by the second plating process; and (E3) forming the second ITO layer into the second pattern layer by the second stripping process. The manufacturing method of claim 1, wherein the step (E) further comprises: (F) performing circuit detection on the projected capacitive touch panel; and (G) cutting the projected capacitive touch panel. A projected capacitive touch panel manufactured by the manufacturing method according to any one of claims 1 to 6.