TWI401005B - Electronic assembly with detachable components - Google Patents

Description

Electronic assembly with detachable components

The present invention is generally referred to as an electronic assembly, and the thin row uses a unidirectional conductive material as a combination between the components and a substrate with a mounting hole, or a fixture having a positioning device. An electronic assembly technique for the placement of components on a substrate.

Electronic assembly is typically assembled using Surface Mount Technology (SMT) or with newer techniques for soldering bare wafers directly onto a substrate (Chip on Board, COB). When using surface mount technology, the packaged electronic components are soldered to an electronic substrate such as a Printed Circuit Board (PCB); a thin layer of solder paste is printed thereon, and then passed through a The process of heating the reflow process solders the component to the substrate. When the COB technology of bonding a substrate with a bare wafer is used, a wiring device is formed by connecting or soldering a thin metal wire to a bare wafer on the substrate, and then a layer of resin is used to cover the surface of the connected component to protect the bareness. The connection will not be damaged during the assembly process.

One problem with surface mount technology or direct soldering of bare wafers is that soldered or wired components are difficult to remove or re-use once they are placed on the substrate. On a typical motherboard, a slot holder is used to install a Central Processing Unit (CPU) to simplify upgrades or replacements.

However, such a socket is relatively expensive, so an assembly technique is required to easily remove the component that has been mounted on the substrate, reuse it, or use it for a new one.

The present invention is an assembly technique invented for the above problems, which uses an anisotropic conducting material (ACM) layer to bond between components, and also uses a substrate that has been pre-engaged to mount a hole, or has The calibration function of the tool makes it easier to assemble the components on the substrate for electronic assembly. The hole function on the tool having the calibration function is included in a predetermined space area in the tool. Use pre-engraved mounting holes on the substrate or holes in the tooling because when an element is placed in a hole or hole, they can make a contact matrix of one element corresponding to a specific on the substrate Surface mode. The holes that are engraved on the substrate or the holes in the tool can be used to secure the components with the anisotropic conductive film (ACM) interface after being placed on the substrate. An anisotropic conductive film (ACM) is electrically conductive between the component and the substrate, which also allows the component to be removed and replaced at any time. An anisotropic conductive film (ACM) can be directly pressed over the surface of the component. Alternatively, an anisotropic conductive film (ACM) can also be placed on the surface of the substrate during assembly.

In an electronic assembly, a calibration link monitors the position and contact integrity of a set of components on a substrate. a conductive pad integrated in a predetermined area on the component as a calibration mark, and a conductive pad integrated as a reference mark on a predetermined area on the substrate, corresponding to the position of the calibration mark of the component to be placed on the substrate, thus forming a school Quasi-link. The calibration link consists of a calibration mark attached to a set of components and a corresponding reference mark on the substrate, from one element to the next via an anisotropic conductive film (ACM), thereby forming a set of monitored There are series and continuous conduction channels between the components. Depending on the complexity of the electronics assembly, the calibration link can be subdivided into multiple smaller calibration links that monitor their conduction status to detect the position and conduction integrity of the components in a group.

In a different embodiment of the invention, an electronic assembly may be able to stack multiple substrates into a more compact three-dimensional architecture. Interconnect components can be used to facilitate interconnectivity of adjacent substrates in a stacked architecture. The composition of such interconnecting members may consist of pre-conducting conductive channels or guiding paths on a planar structure. Or the package can be directly inserted into the hole of the tool, or the hole is pre-engraved on the substrate, and the adjacent substrate is connected to each other through an anisotropic conductive film (ACM). This interconnecting member with few positional restrictions on the substrate can be used to replace expensive slots, mechanical joints or flexible circuit boards, etc., to simplify the design of the electronic assembly.

The electronic assembly can also be packaged using a housing that holds the anisotropic conductive film (ACM) in a defined position, such as a plastic housing that encapsulates a flash memory. The inner skin of the outer casing can be cast to match the various height characteristics of the component. The case can also be designed like an openable dice to facilitate the removal of components, just like the heat sink used on the Memory Module. The housing can also be designed with contact points or openings to facilitate monitoring of the calibration link from the housing.

Here are some standard ways to use anisotropic conductive materials in electronic assembly. One standard approach is to use a substrate with holes in it for more efficient mounting of the components and the use of an anisotropic conductive film (ACM) layer on the engraved grain as the substrate for the interconnect layer between the components. This anisotropic conductive film (ACM) can also be directly bonded to the interconnect surface of the component to simplify the additional anisotropic conductive film (ACM) mounting process in electronic assembly fabrication. Another alternative standard approach is to use calibration tools on electronic assemblies. The calibration tool can be arranged on the substrate using a mounting device. If the tool also has interconnected wires, it can also be attached to the substrate using an anisotropic conductive adhesive or solder paste. In contrast, an anisotropic conductive film (ACM) layer can also be placed directly on the surface of the substrate before the tool is placed. The pre-engraved holes in the substrate and the holes in the fixture allow the components to be accurately fixed to the standard surface pattern on the substrate. Calibration marks or calibration mechanisms can also be used in the tool to align the reference marks or reference mechanisms on the substrate, which may also require optical pattern recognition techniques to align the tool onto the substrate.

The benefits of the present invention under standard practice include the use of an anisotropic conductive film (ACM) in place of solder paste or direct wiring in conventional component electronics assemblies. An anisotropic conductive film (ACM) is used as the interconnect layer between the components and the tool is used, or the holes are carved in the substrate, and the components can be removed from the electronic assembly or reinstalled at any time. For those components that are expensive or temporarily short, they can be easily removed or reused from different electronic assemblies at any time. Those damaged components can also be easily removed and rebuilt. Furthermore, the components can be in the system. A simple replacement in the upgrade. The use of an anisotropic conductive film (ACM) results in such a resilience that electronically assembled components can be easily removed and reloaded without the need to experience electrical welding that could damage the component or other electronic assembly or Cut off the way to connect.

Typical groups are detailed here. It should be understood that the invention can be incorporated into different body wraps. Therefore, the specific details disclosed herein should not be construed as having its limitations, but rather as a basis for this application, and to teach the professional to apply the body of the present invention to almost any appropriate detailed system, A representative basis within structure and form.

The example set is an electronic assembly consisting of a detachable component, mounted on a substrate by an anisotropic conductive material as an interconnect layer. This electronic assembly can include a calibration link to monitor the position and contact integrity of the component across the anisotropic conductive material interconnect layer on the substrate.

Electronic assemblies, such as Flash cards, Add-on boards, or Memory Modules, have components that are soldered directly or soldered to the substrate, making the components difficult to take. Under or reuse. An anisotropic conductive material that can replace solder paste or wire bonding in traditional electronic components. The anisotropic conductive material conducts electricity in a specific direction and is well suited as an interconnect layer between an element and a substrate. Two types of anisotropic conductive materials can be used for electronic assembly, one is an anisotropic conductive film (ACM), and the other is an anisotropic conductive adhesive (ACP). Anisotropy A conductive film that can be peeled off on the surface of the substrate. The anisotropic conductive film can also be directly attached to the component interface. Anisotropic conductive adhesives are typically paste-like and can be printed or dispensed onto opposing substrate surfaces. An anisotropic conductive adhesive is typically a material that includes a conductive filler and a binder. For example, the conductive filler is a gold plated resin ball and the binder is a diluted synthetic rubber. The adhesive is capable of combining two or more articles, and after the adhesive is cured, the anisotropic conductive adhesive is made into an interconnect material.

Preferably, the detachable components are combined into an electronic assembly. For example, expensive or in short supply components can be removed from an electronic assembly at any time and used in different electronic assemblies. Defective components can also be easily removed for reassembly. In addition, components can be removed at any time, replacing them with higher performance components when the system is upgraded. This flexibility stems from the anisotropic conductive film (ACM) layer, which eliminates the need to remove solder or remove wire bonds that can damage components or other parts of the electronics assembly when the component is removed.

In electronic assembly, it is also useful to have methods that can be used to position components or monitor component placement and contact integrity on the substrate. To achieve this, the electronics assembly can be configured with one or more calibration links. In the sample set, a calibration link is formed by including a set of alignment conductive pads, ie calibration marks, in the predetermined area of the component, and a set of reference reference conductive pads, ie reference marks, are included in the specified points on the substrate to detect The integrity of the component mounting on the substrate; during this time, the calibration mark of the component and the reference mark on the substrate are connected by a series of continuous conduction paths, interleaved between the component and the substrate, and through the anisotropic conductive film of each component on the substrate (ACM) Layer, connecting from one component to another element. Depending on the complexity of the electronics assembly, the calibration link can be divided into a number of small calibration links that detect the integrity of their position and contact by the conduction status of the various components in the test link.

Figure 1 shows a set of calibration mark elements, and a substrate with another set of reference marks, and an anisotropic conductive film layer (ACM) therebetween. The calibration mark is a conductive contact area or a conductive pad on the component that serves as a component to locate or monitor component position and contact integrity on the substrate. The calibration mark can be on the top or bottom of the component. The calibration mark on the top side is called the direct calibration mark, and the calibration mark name on the bottom side is the indirect calibration mark. Direct calibration marks can be directly contacted with the probe, while indirect calibration marks can be indirectly probed after the component is attached to the substrate. The direct alignment mark can be further connected to the underside of the component through a conductive via to contact the anisotropic conductive thin film (ACM) layer.

The indirect calibration mark directly contacts the anisotropic conductive film (ACM) layer. Indirect calibration marks that can be connected to other indirect calibration marks by conductive paths on the same component. The indirect path mark on the component can be connected to a probe point outside the surface element of the substrate via a separate conductive path through the anisotropic conductive film (ACM) layer. The component may be an integrated circuit, package component, stacked component, sensor, or electromechanical component. In the case of a package component, the calibration mark can be placed on the outer package without actually being connected to the circuit package. For example, a calibration mark for a bare wafer can be built into the wafer dicing line or wafer.

Wrapped in Figure 1, component 100 contains a direct calibration mark 110 and two indirect Calibration marks 120 and 130. In a typical assembly, the alignment mark 110 is directly calibrated to contact the anisotropic conductive film layer 140 through the conductive path 115 at the contact region 111. The two indirect alignment marks 120 and 130 that are in contact with the anisotropic conductive film layer 140 are joined by a conductive via 125. The conduction paths 115, 125 and calibration marks 110, 120, 130 of Figure 1 are merely exemplary and should not be considered as a possible exhaustive list of calibration marks and conductive paths.

FIG. 1 also illustrates the interconnection of component 100 and substrate 150 through anisotropic conductive film layer 140. Substrate surface 145 includes reference numerals 160, 170, and 180. The reference mark is a conductive pad or a contact area of the substrate surface 145 that is configured to fit the corresponding alignment mark of the component 100. In a typical assembly, a set of reference marks (e.g., 160, 170, and 180) relative to the substrate 150 to map the spatial position of the pattern, should be associated with a set of calibration marks (e.g., 110, 120, and 130) relative to element 100. The spatial position of the contact array is matched. As a result, the alignment marks (e.g., 110, 120, and 130) on the set of components are aligned with a set of reference marks (e.g., 110, 170, 180) on the substrate, and after the component 100 is mounted, the touch of the component 100 can be detected. Whether the dot array is accurately and properly placed on the substrate 150 lead pattern. In FIG. 1, reference numeral 160 is formed by aligning alignment marks 110, reference mark 170 is formed by aligning alignment marks 120, and reference mark 180 is formed by aligning alignment marks 130. The reference numerals illustrated in Figure 1 are merely examples and should not be considered as a possible exhaustive list of reference marks.

FIG. 2 shows an illustration of an electronic assembly 200 that includes a calibration link. Two elements 210 and 220, two anisotropic conductive film layers 230 and 240, are shown in the example. Substrate 250, and calibration link 245. Elements 210 and 220 are connected to substrate 250 via anisotropic conductive film layers 230 and 240, respectively. The two direct alignment marks 201 and 202 of element 210 are on the top side and are further by two conductive paths 203 and 204. The bottom of the contact element 210 contacts the anisotropic conductive film layer 230 on the pads 205 and 206. If the component 210 is properly aligned with the substrate 250, the alignment marks 201 and 202 can contact the reference marks 233 and 234 on the substrate surface 242 through the anisotropic conductive film layer 230. Conductive vias 203 and 204 allow configuration and contact conditions of component 210 on substrate 250 to be detected from component top surface 208. Conductive path 207 connects bottom contacts 205 and 206 with associated calibration marks 201 and 202 to form a portion of component 210 calibration link 245.

Element 220 has two indirect calibration marks 215 and 216 on the bottom surface. In a typical group, indirect calibration marks 215 and 216 are not accessible from the top of element 220. Conduction path 217 connects the two indirect calibration marks 215 and 216 as part of calibration link 245. In order to access the indirect alignment mark 216 through the anisotropic conductive film layer 240 at the component 220, the substrate 250 is bonded to the conductive via 238, one end is connected to the reference mark 237 on the substrate surface 242, and the other end is also connected to the substrate surface 242. Probe zone 239. In order to access the indirect calibration mark 215 through the anisotropic conductive film layer 240, the substrate 250 is bonded to the conductive via 235, one end is connected to the reference mark 236, and the other end is connected to the reference mark 234 to become part of the calibration link 245. Indirect calibration marks help to calibrate the formation of links.

The anisotropic conductive film layers 230 and 240 are configured to replace solder paste or wire bonds in the electronic assembly 200. The anisotropic conductive film layers 230 and 240 are on a specific side Conductive, here is vertical. The anisotropic conductive film layers 230 and 240 are electronically interconnected to the elements 210, 220 to the substrate 250, but do not conduct current to adjacent regions within the anisotropic conductive film layer. The anisotropic conductive film layer allows the component to be conveniently mounted or removed from the surface of the substrate.

Reference numerals 231, 233, 234, 236, 237, and 239 are prefabricated on the substrate surface 242 with reference numerals 233 and 234 being the placement elements 210, reference numerals 236 and 237 being the placement elements 220, and reference numerals 231 and 239 being To detect the integrity of the calibration link 245.

When elements 210 and 220 are indeed aligned with substrate 250 by anisotropic conductive film layers 230 and 240, successive alignment links 245 form a series of continuous conductive paths that straddle the anisotropic conductive film layers 230 and 240, interleaved with element 210, Between 220 and substrate 250. The calibration link 245 is sourced to a probe on the substrate 250 (e.g., reference numeral 231), the reference mark 233 is connected through the conductive via 232, and then across the anisotropic conductive thin film layer 230 to the corresponding bottom surface contact 205 of the component 210, and then Passing via 207 to different surface contacts 206 through component 210, and then returning over substrate 250 again across anisotropic conductive film layer 230, connecting reference mark 234, continuing through conductive via 235 to the second component 220 Reference mark 236 is then coupled across the anisotropic conductive film layer 240 to the indirect calibration link mark 215 at the element 220, and again through the indirect alignment mark 216 of the conductive element 217 on the same element 220 at the element 220, over the anisotropy. The conductive film layer 240 is again returned to the reference mark 237 on the substrate 250 where the probe 239 is coupled to the calibration chain by the conductive path 238 of the substrate 250. Connected to 245. Conductive vias 232, 235, and 238 can be embedded in substrate 250 or fabricated on substrate surface 242. If the components 210 and 220 are offset from the target position at the 250 substrate, or there is a poor contact between the components 210, 220 and the substrate 250, the alignment marks at the component 210 or 220 will no longer correspond to the corresponding reference marks on the substrate 250. Align or touch. The conduction state is not detected from the calibration link endpoint (such as 213 or 239).

Conductive paths 232 and 238, attached at the end of calibration link 245, provide access points 231 and 239 for testing the integrity of calibration link 245 in device 200. In each typical group, the calibration link 245 can be grounded or connected to a power source and divided into two separate short calibration links. Grounded or connected to the power supply, a new terminal with a split calibration link. The components of a device can also be divided into groups to form sets of calibration links. Multiple calibration links are more efficient in finding out the misalignment of the device, as a smaller calibration link may contain fewer components in the local range of the electronic assembly. A large calibration link can also be added to multiple test points along its conduction path or at its components to monitor the contact between any two test points.

Passive components, such as resistors, capacitors, inductors, and other small circuits, are typically low cost or small in size and can be embedded directly into the substrate 250 (eg, embedded capacitors and embedded resistors) during substrate fabrication, or The electronic assembly is soldered to the substrate surface 242 during manufacture.

In an electronic assembly, an outer box or protective structure, such as a plastic case or heat sink, can be used to secure the anisotropic conductive film interface component. When the device contains a calibration link, the components enclosed in the protective structure may not be easily accessible from the outside, its position and Contact status can be monitored and detected via a calibration link. In addition to directly measuring the conduction of the calibration link by applying power and ground to the calibration link terminal, there are several ways to monitor the integrity of the component on the calibration link. For example, if a sensing device is attached to a connection point of a calibration link, it can be placed on the surface of the substrate or incorporated into the component, then along a set of components that are calibrated, its position and integrity of the contact condition, and is easily monitored by the sensing Know the device. For example, the sensing device can be the last latch in the component to the calibration mark accessible to the component. The signal is applied from the calibration slot to the end point, and the condition of the component sensing device is monitored, including the calibration link of the sensing device, from one end to the component, the integrity of which can be determined at any time. By switching the signal applied to one end of the calibration link, along the component on the calibration link, its sensing device or latching device can be monitored to determine if it switches accordingly. If not, the electronic assembly has a bad contact or component misalignment along the calibration link and is therefore determined.

Figure 3 is made by way of illustration of an example of the invention including a solderless electronic assembly having a built-in calibration link in the outer casing. This example is illustrated in electronic assembly 300 with a set of elements 302, 304, and 306 within protective covers 316 and 318 that are connected to substrate 314 through anisotropic conductive film layers 308, 310, and 312. Openings 320 and 322 in top cover 316 can be used as calibration links 328 to access probes (such as calibration marks 324 and contacts 326) to view the position and contact integrity of elements 302, 304, and 306 to substrate 314. At calibration link 328 of device 300, calibration link 324 from element 302, zigzags through anisotropic conductive film layer 308, substrate 314, again passes through anisotropic conductive film layer 308 to element 302, and then through anisotropic conduction Film layer 308 Return to the substrate 314 again. The calibration link 328 continues through the anisotropic conductive film layer 310 to the component 304, through the component 304, and back to the substrate 314 through the anisotropic conductive film layer 310, and then through the anisotropic conductive film layer 312 to the component 306, The directional conductive film layer 312 is returned to the substrate 314 to finally contact 326. One of the endpoints of the calibration link 328 (e.g., contact 326) can be grounded, as indicated by the dashed lines, to simplify the diagnostic link. In this case, the top cover 316 opening 322 is not required. An opening in the corresponding other end of the top cover is sufficient. The opening of the top cover 316 is the terminal for accessing the calibration link 328. Instead, a conductive path built into the outer casing 316 can be used to ensure proper contact, such as by placing an anisotropic conductive film layer therebetween. Alternatively, the outer box does not need to be opened, if the electronic assembly external interface pad can be connected to the end of the calibration link (for example, the electronic assembly function pins and the alignment chain ends are multiplexed).

As can also be seen in Figure 3, the edges of the top cover 316 and the bottom cover 318 are provided with a corresponding set of cuts which can be secured when the lids 316 and 318 are clamped. The inner surface 330 of the top cover 316 can be embossed such that its height variations are formally variably corresponding to the device 300 elements 302, 304, and 306, and the components 302, 304, and 306 can be secured in place. The elasticity of the anisotropic conductive film layers 308, 310, and 312 provides contact pressure when the lids 316 and 318 are clamped. Although FIG. 3 only shows that the substrate 314 is provided with components 302, 304, and 306 on only one side, it is also suitable for electronic assembly.

In various embodiments of the present invention, in order to facilitate the placement of components on the substrate, and the fixing components are electronically assembled by using an anisotropic conductive film as an interconnect layer, the device may employ a positioning tool having prefabricated openings thereon. The mating should be placed on the outer contour of the components on the substrate. system There may be a set of calibration marks in the tool to match a set of reference marks on the substrate. If the calibration mark of the tool is correctly aligned with the reference mark of the substrate, the contact array of the element can be accurately aligned with the upper substrate. Guide pattern. As shown in the example, the tool can be attached, clamped, or glued to the surface of the substrate after the substrate is aligned.

According to another invention, the opening of a set of tools can be directly molded on the surface of the substrate during the manufacturing process of the substrate to form a set of indented grooves on the substrate. However, the adaptability of the insert tool is stronger than that of the embossed type. For example, many compatible memory chips, such as one billion bit memory (DRAM) or flash memory (Flash), have different profiles. It is caused by the difference in the manufacturing process of different semiconductor companies. More advanced processes can produce smaller package wafers. However, compatible wafers have mostly identical pin locations and spacings for contact arrays to ensure interchangeability at the time of manufacture. Plug-in tools are more versatile than embossed.

4 is a cross-sectional view illustrating an exemplary embodiment of the present invention in which an assembly 410 is used to assemble a set of components 402, 404, and 406 to a substrate 420 in an electronic assembly 400 enclosed in lids 450 and 455. Tool 410 includes openings 422, 424, and 426 that match the contours of elements 402, 404, and 406, respectively. The openings 422, 424, and 426 are prefabricated at specific locations such that the elements 402, 404, and 406, and the anisotropic conductive films 403, 405, and 407 as interconnect layers can be accurately placed on the substrate surface. Graphic type. The tool 410 is provided with a set of calibration marks 412 and 414 that are used to align the substrate 420 with reference marks 413 and 415 on the surface of the substrate. The tool 410 is aligned with the substrate 420 by adjusting the alignment marks 412 and 414 with corresponding reference marks 413 and 415. Element 402, 404 and 406 can then be placed in openings 422, 424 and 426. The positioned tool 410 can secure the components 402, 404, and 406 to accurately target the corresponding target profile on the substrate surface.

The tool 410 is sized to match the lowest component height. The inner walls of the lids 450 and 455 can be molded into a high and low profile that matches the height variations of the kit components 402, 404 and 406. Alternatively, a layer of thermally conductive films 440 and 445 can be interposed between the elements 402, 404 and 406 and the lids 450, 455. If the thermally conductive films 440 and 445 are thick enough, the anisotropic conductive film can be pressed as an interface. element. Thermally conductive films 440 and 445 can also transfer heat generated by elements 402, 404, and 406 to the cover.

Various methods can be used to align the implement 410 with the substrate 420. For example, the tool 410 can be mechanically aligned with the substrate 420, with a set of mounting holes as mechanical alignment marks on the tool 410, and a set of mounting posts as mechanical reference marks on the substrate 420, and vice versa: The mounting post is in the tooling 410, and the hole is mounted in the substrate 420. According to some embodiments, after the tool 410 is aligned with the substrate 420, the aligned tool 410 can be adhered to the substrate surface with a paste, glue, clip or screw. The final device is then sealed in a box of boxes 450 and 455. The lids 450 and 455 can include one or more contact holes 420 or contact pads for external use or for monitoring the contact condition of the calibration link 428.

In FIG. 4A, the top cuts 452 and 454 of the top cover 450 are mated to the bottom cover cuts 456 and 458 of the bottom cover 455, and after the lids 450 and 455 are pressed together, the electronic assembly 400 can be pressed. The top cuts 452, 454 and the bottom cuts 456, 456 may be two parallel slits at the edges of the lids 450 and 455. The shape of the cutout shown in Figure 4A is only Used for explanation purposes, it should not be considered as the only possible notch shape or the only feasible sealing method. For example, if there are no cuts or matching slits to secure the lids 450 and 455 together, the top cover 450 and the bottom cover 455 can also be sealed by ultrasonic welding techniques or sealed with a clamp. The assembly technician shown in FIG. 4A is suitable for different implementations of flash memory card, memory module assembly, and consumer electronics assembly.

FIG. 4B depicts a top view of the tooling 410 placed on the substrate 420. Another implementation of the present invention is to use an interconnect circuit in the tooling 410 such that the tool 410 not only serves as a location receptacle for the anisotropic conductive film interface component, but also includes an interconnect circuit for the electronic component. Passive components can also be prefabricated, contained, or embedded in the implement 410. 4B illustrates the embedded external access port as a tool 410 over typical interconnect lines 464 and 465, via 466 and conductive 467. In the interconnecting lines 464 and 465 of the tool 410 and the interconnecting lines on the substrate 420, a set of electronically assembled complete interconnect circuits are formed through the underlying anisotropic conductive film layer of the tool 410. The implement 410 can be a single layer or multi-layer tool, composed of more interconnect layers, for high density routing and better signal integrity.

A calibration link for an electronic assembly can be combined with the tool as part of the calibration link to incorporate conductive calibration marks and conductive paths to the tool. The markings and passages are connected to the calibration marks and the conductive paths of the components, and the reference marks and conductive paths are matched on the substrate to form a series of continuous conduction paths for detecting the position and contact condition of the components and the tool to the substrate. One or more endpoints of the calibration link can access from outside the overlay to detect the integrity of the calibration link.

During the assembly process, one of the following various techniques can be used to make the anisotropic conductive thin The film layer is attached to the component. For example, an anisotropic conductive film layer can be attached to the surface of a packaged device, an integrated circuit bare wafer, or a stacked device preset in a component device. In addition, the pre-etched anisotropic conductive film layer may be placed in or formed in the opening of the substrate surface before mounting the component. In another example, the anisotropic conductive film layer is placed on the surface of the substrate before the substrate is placed on the substrate, and then the device can be guided by the tool when the component is placed on the substrate.

When an anisotropic conductive adhesive is used in the manufacturing process, a thin layer of an anisotropic conductive adhesive is dispensed or brushed onto the surface of the substrate. Without the tool, the components are placed directly on the conductive pattern on the substrate surface. A plate or cover can be used to secure the aligned components, while a post-cure and hot press process secures the components to the substrate.

In another practical embodiment of the present invention, an anisotropic conductive film and an anisotropic conductive adhesive compounding technique can be used for electronic assembly, wherein an anisotropic conductive adhesive is used to bond the device to the substrate, and the anisotropic conductive A film is an interconnect layer used as an element. An element that uses an anisotropic conductive film as an interconnect layer has good contact. It can also be easily removed from the surface of the substrate and used again and again.

In the various exemplary assemblies of the present invention, electronic assembly can use two or more implements to make the assembly and rework process easier. For example, the first tool can be used to adjust and fix the first set of components, and the second tool can be used to adjust and fix the second set of components (such as the remaining components). In some demonstration groups, the electronic assembly contains components on both sides of the substrate. With such a group, one or more implements can be used to adjust and secure the component to the first side of the substrate, and one or more of the implements can be used to adjust and secure the component to the substrate On the second side. A variety of tools are available for a large electronic assembly to counteract possible thermal expansion deviations between the tool and the substrate for easy rework.

Figure 5 depicts an exemplary device of the present invention, such as a memory module or add-on boards, with a device 510 attached to the substrate 520 to secure the interface of the anisotropic conductive film. Elements 501, 502, 503, 504, 505, and 506, and its electronic assembly 500 has a protective outer casing, such as a double box 560 and 570. In a particular embodiment of the invention, the tool 510 can be stamped onto the surface of the substrate to form a plurality of indented openings in the substrate, or the tool 510 can be mated to the substrate 520 during assembly. The protective outer casing, for example, may be a heat sink consisting of two identical casings 560 and 570, and two identical clamps 561 and 562. Along the long sides of the casings 560 and 570, there are male grooves 563 and 573 and female grooves 564 and 574 which are bent at right angles to the inner surfaces of the casings 560 and 570. In another application, the clips 561 and 562, the male slots 563 and 573, and the female slots 564 and 574 need not be identical.

At the time of assembly, after the tool 510 is aligned and the substrate 520 is attached, the elements 501, 502, 503, 504, 505, and 506 can be placed in the openings 511, 512, 513, 514, 515, and 516 of the tool 510. The assembled substrate including the tool 510 and the components 501, 502, 503, 504, 505, and 506 is then placed on the inner surface of a casing (e.g., 560). The second cap (e.g., 570) is rotated 180 degrees to have a positive cut 573 and a negative cut 574 that can be implanted into the negative cut 564 and the positive cut 563 of the second case 560. Opening and closing the two boxes 560 and 570 allows the assembled substrate to be sandwiched between the inner walls of the caps 560 and 570. The clips 561 and 562 are attached to the top edges of the closed casings 560 and 570, and anisotropically conductive The film elements 501, 502, 503, 504, 505, and 506 can be secured to the tool openings 511, 512, 513, 514, 515, and 516 of the electronic assembly 500. The heat conductive films 565 and 575 are attached to the inner walls of the casings 560 and 570. The elasticity of the thermally conductive films 565 and 575 can force the components to make good contact with the substrate 520. The thermally conductive films 565 and 575 can accommodate small variations in height between the elements 501, 502, 503, 504, 505 and 506 on the substrate 520. The anisotropic conductive thin film interconnecting elements 501, 502, 503, 504, 505, and 506 on the substrate 520 in a closed assembly whose contact integrity can be monitored by one or more calibration links, linked to the serial components, and accessed The dots are taken from the surface of the casing 560 or 570, or connected to an external interface 530 or an exposed substrate surface.

Figure 6 depicts a top view of an exemplary memory module 600 comprised of a base member similar to that of Figure 5. The memory memory module 600 is located within the casing 630. The casing 630 can be used as a protection device for the components of the memory module 600, the component retention device and the heat dissipation device. In the diagram, the memory memory module 600 includes a tool 610 of a printed circuit board 620. One or more implements 610 can be attached to the surface of the printed circuit board substrate 620 to support assembly of single or double sided printed circuit boards. Memory elements or devices 601, 602, 603, 604, and 605 and ancillary logic devices 606, such as clock chips, accessor chips, scratchpad wafers, or an integrated logic function, using anisotropy on circuit board substrate 620 The conductive film is used as an interconnect layer and then placed around the openings 611, 612, 613, 614, 615 and 616 of the implement 610, and is retained by a set of boxes 630, and the top edge of the case 630 is clipped 632. And 634 clamped. The settings of the clips 632 and 634 are for the 630 The memory component is placed tightly within the casing 630. Although only one support for an attached logical device 606 is shown, the memory memory module may include more than one secondary logical device. In an example implementation, the memory component can include dynamic random access memory (DRAM), static random access memory (SRAM), flash memory (Flash), electronically programmable memory, programmable logic device, magnetic memory device Or any combination of the above.

In the exemplary illustration, calibration link 625 links the storage elements and the auxiliary logic to check the contact integrity of the components and logic of calibration link 625 on memory memory module 600. In one example, calibration link 625 has one end 626 grounded and the other end 627 accessible from the substrate surface. The end point 627 can further connect the pin 628 in the external interface area 630 (ie, the gold finger gold finger), and the mother board or the motherboard can be directly accessed after the memory memory module 600 is inserted into the motherboard socket. As another example, both ends 626 and 627 of the calibration link 625 can be connected to the pins of the external interface area 630 of the memory memory module 600 to reach the motherboard, or reconnected to other calibration links on the motherboard. . Sensing elements, such as latches, can be attached to the component along a calibration link to monitor the integrity of the calibration link. The calibration link 625 is an optional feature when the memory memory module 600 uses an anisotropic conductive film as the component interconnect layer.

Figure 7 depicts a flow chart of a method of assembling a typical electronic assembly into a box. This electronic assembly is similar to the simplified device 400 of Figure 4A. For example, in the example flow chart, the surface of the substrate is engraved with grooves to guide the component mounting without the use of a tool. this In addition, the anisotropic conductive film layer is laminated to the surface of the element instead of being placed between the element and the substrate with a separate layer of anisotropic conductive film. The groove on the surface of the substrate is accurate to match the manufacturing process of the printed circuit board between centromeres; centistoke is one thousandth of an inch. In addition, as shown in Fig. 7, only one side of the substrate is provided with components, although components can be mounted on both sides of the substrate. To improve manufacturing quality and productivity, assembly tools can be used in surface mount equipment (SMT) to facilitate the simultaneous assembly of multiple electronic assemblies.

Figure 7 begins with step 710 during which a lid (e.g., a bottom cover) is placed over the assembly tool. It should be noted that Figure 7 only discusses an electronic assembly. If more than one electronic assembly is assembled in parallel, the same program can be repeated multiple times.

After the bottom cover is placed on an assembly tool, step 720 can apply a thermally conductive film to the bottom cover. The thermally conductive film is an optional bill of materials, depending on the heat generated by the final electronics assembly and the required mechanical support. At step 730, the slotted substrate is placed over a bottom cover that includes a thermally conductive film. The anisotropic conductive adhesive face member can then be manually inserted into the scored opening in step 750, or in step 755 using the mounting apparatus, depending on the assembly method of step 740. After the component is mounted, the thermal film or the elastic layer may be placed on the assembled substrate in step 760 to improve heat dissipation and pressurization on the anisotropic conductive adhesive surface member. After the top cover is placed in step 770 and temporarily capped and assembled, The substrate is in good contact. Alternatively, the thermally conductive film and the elastomeric material may also be pre-embossed on the inside of the lid to eliminate steps 720 and 760 of the assembly method.

When the top cover is in place to temporarily cover the electronic assembly, a test is performed in accordance with step 780 to determine if the assembly is properly assembled. If it is determined in step 785 that it is improperly assembled, This is followed by a rework in step 790 to remove the top cover and diagnose misaligned components or poorly contacted components to solve the problem. Returning to step 780, the top cover is replayed and the assembly is retested. If the assembly passes the test, the box can be safely sealed, such as by ultrasonic welding to seal the top and bottom covers to form an electronic assembly.

Figure 8 is a flow chart depicting a typical method for assembling an electronic assembly using an anisotropic conductive adhesive and an anisotropic conductive film composite technique, wherein the anisotropic conductive adhesive is used to bond the tool (i. The composition is made to the surface of the substrate, and the anisotropic conductive film is used as an interconnection layer between the element and the substrate, so that the element can be inserted or detached from the surface of the substrate at any time without using the solder paste of the conventional device. The substrate is electronically coupled or connected to each other via an anisotropic conductive film layer and passed through the anisotropic conductive adhesive layer to the component tool. A tandem calibration link can be embedded in the device to monitor component position and contact integrity. Similar to the illustration of Figure 7, some electronic assemblies can be assembled in parallel under a pick-and-place surface mount device. To simplify the description, the method of Figure 8 only discusses one of the electronic assemblies.

At the beginning of assembly, the anisotropic conductive adhesive layer is dispensed or brushed onto the surface of the substrate, and its paste pattern is specifically provided for placing the component tool in step 810. Conductive lines can be fabricated on component devices and become part of the electronics assembly interconnect circuit.

In step 820, the component tool is calibrated and placed on the surface of the substrate, onto which a layer of anisotropic conductive adhesive is applied. The anisotropic conductive adhesive should be thick enough to constrain the component to a secure substrate surface to place a set of routes, either optically or electronically, to mark a set of index reference markers for the tool. In addition, a pair of machines can also be used. The mechanical structure mechanically adjusts the tool to the surface of the substrate, such as mounting holes in the tooling and mounting posts on the substrate, or vice versa.

In step 830, hot pressing and curing of the anisotropic conductive adhesive is performed to attach the substrate to the device. The hot pressing and curing of the anisotropic conductive adhesive also forms anisotropic conduction in the extrusion direction (i.e., from the tool to the substrate).

A test is performed in step 840 to determine if the tool is properly mounted on the substrate. If the tool is not properly assembled, at step 845, it is determined whether the tool needs to be discarded or modified, depending on whether the substrate or tool has considerable value, or how complex the modification is. If the dry tool passes the test (ie, it is accurately mounted on the substrate), the anisotropic conductive film layers and components remain at the target opening of the component tool until all components are placed in step 850. .

The opening of the tool not only allows the component to be accurately attached to the substrate, but also ensures that the array of contacts on the component package remains in contact with the component target pattern formed on the substrate if the component is properly pressed from above. The size of the opening of the tool should match the outline of the component, but still allow the component to be easily loaded and unloaded. The anisotropic conductive film layer is suitable for components in a Land Grid Array (LGA) package, with no solder balls attached to the package except for the exposed contact array.

After the component is placed in the opening of the device with the anisotropic conductive adhesive as the interconnect layer, in step 860, a cover having an elastic material (such as a heat conductive film) on the inner surface is placed on the device to fix the component. The hole is made. A test is performed at step 870 to check if the component is properly assembled. If the test fails, remove the top cover at step 885. The misplaced element is homed, or a bad anisotropic conductive film or a damaged anisotropic conductive film layer element is replaced. The program is repeated (ie, steps 860 through 885) until the test passes at step 880. At that time, step 890 will have an electronic assembly of the top and bottom covers to clamp, trim, snap or seal to safely accommodate all of the components within the electronics assembly.

If the component is to be placed on both sides of the substrate, then after the test in step 880 is passed, the single-sided assembled substrate and its bottom cover are turned over, and then steps 810 to 880 are repeated to install the second set of tools, The anisotropic conductive film layer and the component are applied to the surface of the second substrate, and the top-to-second surface component assembly is also fully tested.

In another manifestation of the invention, a second substrate can also be used to facilitate assembly of the double-sided component in an electronic assembly. After the substrate assembly test is passed, the first assembled substrate and the second assembled substrate can be placed back to back, and an anisotropic conductive film is used in the middle to make a double-sided electronic assembly. If no electrical conduction is required between the first and second substrates, a thermally conductive film, a hot paste or a hot glue may be used instead of the anisotropic conductive film.

In various embodiments of the present invention, a plurality of implements, a plurality of anisotropic conductive film, and a plurality of stackable three-dimensional (3D) structures to increase the integration density of the electronic assembly composed of the removable components, Its detachable components. A separate layer of anisotropic conductive film may be pressed on the interface, or a separate anisotropic conductive film layer may be interposed between the component and the interface of the lower substrate thereof. In combination with an anisotropic conductive film layer and a tool, a basic building member composed of an anisotropic conductive film or an interface element and a substrate at the opening of the device, that is, a basic film substrate A modular architecture to build a stacked electronic assembly, as shown in Figure 9. Anisotropic conductive film Layers 915, 925, and 935 may be replaced with a thermally conductive film, if in a stacked device, the thin film substrate substrate assembly has no conductive interface with other film fabrication substrate groups. In some demonstrations, the stacking device can be further packaged and sealed in a box.

The exemplary assembly of Figure 9 is a series of three layers of laminated film / implement / substrate set (MFS) 910, 920 and 930, wherein: 912, 922 and 932 are substrates, while 911, 921 And 931 is a tool. In this group, the laminated film/former/substrate group is back-to-back, leaving no gaps, so the components (913a, 913b, 923a, 923b, and 933a, 933b) are transferred to the anisotropic conductive film layer or the heat conductive film. There is no need to leave a gap. The voids shown in Figure 9 are only to more clearly distinguish the components and their discrete members. A set of mounting holes and mounting posts for calibrating and joining multiple stacks of film/forms/substrate sets.

Membrane--fixture-substrate (MFS), the top anisotropic conductive film layer can act as an interconnect on the adjacent film/forms/substrate group (MFS) Floor. To facilitate interconnection of adjacent films/forms/substrate groups (MFS), in various implementations of the invention, a set of interconnecting cells (941, 943) consisting of conductive vias or connecting lines can be prefabricated as wafers or planes. The member is connected to a film/manufacture/substrate group (MFS) to its adjacent film/clamp/substrate group (MFS) by inserting a tool opening. The interconnect element passes through the anisotropic conductive film layer as a connector that connects the substrates of two adjacent film/article/substrate groups (MFS). Interconnect units can replace expensive mechanical connectors (such as Mictor connectors) as well as flexible circuits that appear in electronic assemblies. Another advantage is the anisotropic conductive film layer. Can be used as an interconnection unit. The number and location of interconnecting units in the tooling can be freely chosen without the limitations of the size or position encountered by fixed mechanical connectors or flexible circuits. Since the substrate is double-sided, circuits can be fabricated to increase the wiring density, and the interconnect unit provides an interconnection path between adjacent substrates through the anisotropic conductive film layer. The passive components in the electronics assembly can be embedded in the fixture, embedded in the interconnect unit, or soldered to the substrate surface of the film/former/substrate assembly (MFS). Alternatively, the conductive vias 942 and the alignment marks penetrating up and down in the elements thereof may be placed in a multiple film/apparatus/substrate group (MFS) through the anisotropic conductive film layer. Similarly, the conductive vias 944 and their reference marks in the substrate can also be used as an adjacent film/clamp/substrate group (MFS) connection.

It is useful to use calibration links to diagnose structural complexity, such as laminated film/manufacture/substrate group (MFS), for component placement and contact conditions. The calibration link is a selective feature for simple electronic assembly, as the functional test may be able to determine if the component with the anisotropic conductive film is properly installed. However, in the case of complex electronic assembly, identifying the fault zone in an efficient manner is an important factor in reducing the cost of testing, picking errors or redoing. The calibration link is a solution for complex electronics assembly consisting of a large number of detachable components or multiple film/manufacture/substrate groups (MFS). A calibration link consists of a conductive alignment mark that connects a group of components and a conductive reference mark on the substrate to form a series of conductive paths, which can effectively detect the integrity of the components installed in the device. Multiple calibration links separate a complex electronic assembly component into a number of groups, with small calibration links attached The entry point is used to detect the positioning and contact condition of the anisotropic conductive film interface component, and the component is isolated in a small area of the electronic assembly.

The invention has been described in detail with reference to various example groups. It will be apparent to those skilled in the art that various modifications may be made without departing from the broad scope of the invention, or in the form of other compositions. For example, some electronic assemblies may include one or more calibration links, and one or more of the implements may be further constructed of multiple layers within various housings or enclosures. Thus, variations of such and other examples are also encompassed by the present invention.

100‧‧‧ components

110‧‧‧ calibration mark

111‧‧‧Contact area

115‧‧‧Transmission pathway

120‧‧‧ calibration mark

125‧‧‧Transmission pathway

130‧‧‧ calibration mark

140‧‧‧ anisotropic conductive film layer

145‧‧‧ substrate surface

150‧‧‧Substrate

160, 170, 180‧‧‧ reference mark

200‧‧‧Electronic assembly

210, 202‧‧‧ calibration mark

203, 204‧‧‧ conduction path

205, 206‧‧‧ bottom contact

207‧‧‧Transmission pathway

208‧‧‧Top surface of components

210, 220‧‧‧ components

215, 216‧‧‧ indirect calibration link mark

217‧‧‧Transmission pathway

230, 240‧‧‧ anisotropic conductive film layer

231, 233, 234, 236, 237, 239 ‧ ‧ reference marks

232, 235, 238‧‧ ‧ conduction path

242‧‧‧ substrate surface

245‧‧‧calibration link

250‧‧‧Substrate

300‧‧‧Electronic assembly

302, 304, 306‧‧‧ components

308, 310, 312‧‧‧ anisotropic conductive film layer

314‧‧‧Substrate

316, 318‧‧‧ lid

320, 322‧‧‧ openings

324, 328‧‧ ‧ calibration links

326‧‧‧Contacts

330‧‧‧ inner surface

400‧‧‧Electronic assembly

402, 404, 406‧‧‧ components

403, 405, 407‧‧‧ anisotropic conductive film

410‧‧‧Tools

412, 414‧‧‧ calibration mark

413, 415‧‧‧ reference mark

420‧‧‧Substrate

422, 424, 426‧‧ holes

428‧‧‧ Calibration link

440, 445‧‧‧ Thermal film

450, 455‧‧‧ lid

456, 458‧‧‧ bottom cover cut

464, 465‧‧‧ Typical interconnections

466, 467‧‧‧ Conductive

500‧‧‧Electronic assembly

501, 502, 503, 504, 505, 506‧‧‧ components

510‧‧‧Tools

511, 512, 513, 514, 515, 516‧‧

520‧‧‧Substrate

530‧‧‧ external interface

560, 570‧‧‧protection box

561, 562‧‧‧ clips

563, 573‧‧‧ positive slot

564, 574‧‧‧

565, 575‧‧‧ Thermal film

600‧‧‧ memory module

601, 602, 603, 604, 605‧‧‧ memory components or devices

606‧‧‧Subsidiary logic device

610‧‧‧Tools

611, 612, 613, 614, 615, 616‧‧

620‧‧‧Printed circuit board

625‧‧‧calibration link

626‧‧‧ Grounding Endpoint

627‧‧‧Endpoint

628‧‧‧ stitches

630‧‧‧External interface area

632, 634‧‧‧ clips

910, 920, 930‧‧‧ laminated film manufacturing substrate set

912, 922, 923‧‧‧ substrates

913a, 913b, 923a, 923b, 933a, 933b‧‧‧ components

915, 925, 935‧‧‧ anisotropic conductive film layer

942, 944‧‧‧ conductive path

Figure 1 illustrates an example of how an auxiliary conduction path can be used to connect a set of calibration marks on a component to a set of reference marks on a substrate; Figure 2 depicts an example in which an anisotropic conductive film is utilized using a calibration link ( ACM) as a bonding layer to bond two components on a substrate; FIG. 3 depicts a sealed electronic assembly assembled by a calibration link, which is an example of use in the present invention; FIG. 4A depicts a use of a tool Figure 4B is a top plan view of a standard tooling that is rejoined by an interconnecting circuit to a lower substrate; Figure 5 depicts an in-memory memory module (Memory) Module) is a standard electronic assembly that uses an anisotropic conductive film (ACM) attached to a substrate with a housing. The interface of the mutual interface is fixed; FIG. 6 is a plan view showing a memory module wrapped in two outer casings according to a standard example of the present invention, which comprises tools, components, chain links and contact with the outside world. Figure 7 is a flow chart depicting a standard example of a method for assembling an element covered with an anisotropic conductive film (ACM) onto a substrate with a pre-engraved hole and then sealing the case; Figure 8 is a description of the simultaneous use A flow chart of a standard example of an electronic assembly assembled to an anisotropic conductive paste (ACP) and an anisotropic conductive film (ACM) technique; and FIG. 9 depicts a multi-film/formation/ Standard stacking device for layer combination of Membrane-Fixture-Substrate (MFS).

100‧‧‧ components

110‧‧‧Direct calibration mark

111‧‧‧Contact area

115‧‧‧Transmission pathway

120‧‧‧Indirect calibration mark

125‧‧‧Transmission pathway

130‧‧‧ calibration mark

140‧‧‧ anisotropic conductive film layer

145‧‧‧ substrate surface

150‧‧‧Substrate

160,170,180‧‧‧ reference mark

Claims (51)

An electronic assembly comprising: an element comprising an array of external contacts, the element further comprising a set of conductive pads bonded to the array of contacts; a substrate comprising a set of conductive patterns to match the contact a dot array, the substrate further comprising a set of conductive pads bonded to the conductive pattern on the substrate; an anisotropic conductive film layer disposed for electronic connection of the device to the substrate; and a calibration link for transmitting anisotropy The conductive film layer joins the conductive pads of a group of components and the corresponding substrate conductive pads to form a series of continuous conductive paths connected to the power source. The electronic assembly of claim 1, wherein the conductive pad bond is an array of contacts, the conductive pads being connected to a conductive path to conduct signals from one surface area of the element to the other surface area. The electronic assembly of claim 2, wherein the conductive pad is a sensing device that more closely engages the component. The electronic assembly of claim 1, wherein the conductive pad of the substrate is a set of corresponding conductive pads of the bonding component to monitor the anisotropy of the component contact array on the substrate guiding pattern. What is the integrity of the conductive film layer, where the conductive pad on the component is a calibration mark and the conductive pad on the substrate is a reference mark. The electronic assembly of claim 1, wherein the contact array is a conductive pad on a set of components to serve as an external interface. The electronic assembly of claim 1, wherein the anisotropic conductive film layer is laminated on the component, the configuration being such that the component can be removed from the substrate. The electronic assembly of claim 1, wherein the anisotropic conductive film is laminated on a surface region of the substrate. The electronic assembly of claim 1, further comprising at least one thermally conductive film, the configuration of which provides for heat dissipation of the component. The electronic assembly of claim 1, wherein the set of components can be further divided into a plurality of small component groups to form a plurality of calibration links for the electronic assembly. The electronic assembly of claim 1, wherein the calibration link is configured to diagnose the position and conduction condition of the set of components on the substrate through the anisotropic conductive film layer. The electronic assembly as described in claim 1 of the patent application further includes a set of access areas to monitor the integrity of the calibration link. The electronic assembly according to claim 1, further comprising a protective structure for providing the fixing member on the substrate. The electronic assembly of claim 12, wherein the protective structure comprises one or more lids, the inner surface of which is disposed on the height profile of the mating component on the substrate. An electronic assembly as claimed in claim 12, wherein the protective knot The housing comprises a housing capable of fixing the component and the substrate, the housing comprises: a top cover comprising a set of top cuts; and a bottom cover comprising a set of bottom cuts, the bottom cut configuration being combined with the top cut And the fixed shell is together. The electronic assembly of claim 12, wherein the protective structure comprises a flip cover housing capable of fixing the component and the substrate, and the flip cover comprises: a top plate with a top cut; a bottom plate with a bottom cut The bottom, the bottom cut is configured to be combined with the top cut; and a clip is configured to apply the fixed top and bottom plates together. The electronic assembly of claim 1, further comprising at least one tool configured to facilitate placement of the component using an anisotropic conductive film as the interface layer. The electronic assembly of claim 16, wherein the tool comprises a plurality of openings corresponding to the shape of the component to be placed on the substrate. The electronic assembly of claim 16 wherein the article comprises one or more interconnect layers having interconnecting lines to facilitate routing of signals between the component and the substrate. The electronic assembly of claim 16, wherein the tool comprises a plurality of embedded passive components. For example, the electronic assembly described in claim 16 of the patent application, wherein the tool is pressed Patterned on the surface of the substrate. The electronic assembly of claim 16, wherein the tool is bonded to the surface of the substrate using an anisotropic conductive film. The electronic assembly of claim 16, wherein the tool is bonded and cured to the surface of the substrate using an anisotropic conductive adhesive. The electronic assembly of claim 16, wherein the tool is directly soldered to the surface of the substrate by solder paste. The electronic assembly of claim 16, wherein the tool is mechanically bonded to the substrate with a pre-aligned surface, and the set of mounting holes cooperate with a set of mounting jaws for securing the mounting to the substrate. The electronic assembly of claim 16, wherein the tool is mechanically bonded to a surface of the substrate for preliminary alignment, and the substrate is fixed on the substrate by using a groove on the surface of the substrate. The electronic assembly of claim 16, wherein the tool comprises a set of conductive pads for aligning a set of conductive pads on the substrate to detect integrity of the tool on the substrate. The electronic assembly of claim 26, further comprising a calibration link for bonding a conductive pad attached to the conductive path of the tool and a conductive pad connected to the conductive path of the substrate through an anisotropic conductive material . The electronic assembly of claim 1, wherein the electronic assembly is an internal memory module comprising: One or more memory devices are on the substrate, and the memory device receives the signal through a memory bus that can be connected to one or more memory devices; at least one tool (including a set of openings) is provided for one or A plurality of memory devices are positioned on the substrate, wherein an anisotropic conductive material is used as the interface layer; and a protective structure is used to fix one or more memory devices on the substrate. The electronic assembly of claim 28, further comprising one or more logic devices, receives the control signals via a memory bus that can be connected to one or more logic devices. The electronic assembly of claim 28, wherein the memory device is selected from the group consisting of: a dynamic random access memory device; a static random access memory device; a flash memory device; a power cancellation programmable memory device; Programming also includes devices; magnetic memory devices; and any combination of the above. The electronic assembly as described in claim 28, further comprising a calibration link to diagnose the placement integrity of the memory device. The electronic assembly of claim 1, wherein the component can be packaged Includes a single multi-element. The electronic assembly of claim 32, wherein each of the plurality of components is positionable on one or more surfaces of the substrate. The electronic assembly of claim 1, wherein the substrate can comprise a plurality of substrates. The electronic assembly of claim 1, wherein the anisotropic conductive film layer comprises an anisotropic conductive film. The electronic assembly of claim 1, wherein the anisotropic conductive film layer comprises an anisotropic conductive adhesive. A method of assembling an electronic assembly, comprising: bonding an anisotropic conductive thin film layer to a surface of a substrate; positioning the component on the anisotropic conductive thin film layer such that the contact array of the component is relatively adjusted with the conductive pattern of the substrate, thereby Forming an electronic assembly; and connecting a group of components and their corresponding substrates through the anisotropic conductive film layer to form a series of continuous conductive paths of ground or power. The method of claim 37, further comprising placing a thermally conductive film on top of the component to dissipate heat and providing mechanical support for the component on the substrate within a protective structure. The method of claim 37, further comprising assembling the electronic component within a protective structure. If the method described in claim 37 is applied, the electronic device is tested. Match to determine if the components and substrate are properly calibrated. The method of claim 40, further comprising repositioning the component when the component and substrate are not properly calibrated. The method of claim 37, further comprising calibrating and bonding the tool and the substrate. The method of claim 42, wherein the calibrating comprises adjusting between at least one calibration mark of the tool and at least one reference mark of the substrate. The method of claim 42, wherein the calibrating comprises adjusting the at least one mounting hole of the tool and the at least one mounting of the substrate. The method of claim 42, wherein the bonding comprises curing and hot pressing the substrate onto the substrate. The method of claim 37, wherein the locating the component comprises adjusting between at least one calibration mark of the component and at least one reference mark of the substrate. An electronic assembly comprising: an anisotropic conductive film layer bonded to a substrate surface; and various means for positioning the component on the anisotropic conductive film layer in the electronic assembly such that the contact array of the component and the substrate are guided The pattern is relatively adjusted, wherein the component further includes a set of conductive pads bonded to the contact array, the substrate further comprising the base a set of conductive pads bonded by a conductive pattern on the board; and a calibration link through the anisotropic conductive film layer, bonding the conductive pads of a group of components and the conductive pads of the corresponding substrate to form a series of grounding or power supply Columns are continuous conductive paths. A stacked electronic assembly comprising: a plurality of substrates, at least one of the substrates further comprising a set of conductive pads on the substrate; a plurality of devices comprising mounting openings; a plurality of anisotropic conductive films; and a plurality of anisotropic conductive film interconnecting elements In the mounting opening, the at least one component further comprises a set of conductive pads; and a calibration link, through at least one of the plurality of anisotropic conductive film layers, bonding the conductive pads of at least one of the plurality of components, at least one of the plurality of substrates corresponding thereto A conductive pad of a substrate that is grounded or connected to a series of continuous conductive paths of the power source. The electronic assembly of claim 48, comprising an anisotropic conductive film, a substrate, a tool, and an element having an anisotropic conductive film interconnection, disposed in the mounting opening of the tool, thereby forming a film tooling The substrate assembly constructs a substrate that is configured to allow a plurality of thin film fabrication substrate sets to be stacked in layers by interconnecting cells. The electronic assembly of claim 49, wherein the interconnection unit is a conductive path for connecting the top surface to the bottom surface of the element. An electronic assembly as described in claim 49, wherein the interconnection unit It is a planar passive component that contains a set of conductive pathways to connect the top surface of the passive component to its underside.