TWI400727B - A method for manufacturing a conductive needle for suppressing tin whisker - Google Patents

Description

Method for manufacturing capacitance guide pin capable of suppressing tin whisker

The invention mainly discloses a capacitor guide pin, in particular to a method for manufacturing a capacitor guide pin capable of suppressing tin whiskers.

Tin whisker is a single crystal structure, which is a metal protrusion on the electroplated layer. The solder joint portion of the capacitor is usually prone to whiskers due to long-term environmental factors and thermal stress release. When the tin whisker length exceeds 50 μm It is an abnormal phenomenon, which often causes a short circuit. Avoiding the whisker growth effect is a major issue for the major electronic and electrical equipment manufacturers. More importantly, understanding customers and building the right quality for their products can truly be invincible in the green trend.

Conventional capacitive guide pins can form an oxide layer of tin when the normal surface of the solder layer is in contact with air at normal temperature and pressure, and the tin oxide layer blocks the tin atoms and prevents the tin atoms from diffusing to the free surface. The internal compressive stress cannot be released, so that the compressive stress can only be broken from a weak point of the oxide layer to release the compressive stress, and the tin whisker emerges from the breakthrough point like a toothpaste, thereby causing a short circuit. As for the above problems, it is necessary to improve them. Therefore, we are committed to researching manufacturing methods that can prevent the growth of tin whiskers.

In view of the above-described deficiencies in the conventional structure, the inventors have invented a method of manufacturing a capacitor guide pin capable of suppressing tin whiskers, which overcomes all of the disadvantages of the above-described conventional structures.

The technical problem to be solved by the present invention is to provide a method for manufacturing a capacitive guide pin capable of suppressing tin whiskers in view of the above-mentioned deficiencies in the prior art.

To achieve the above object, the present invention includes the following steps:

Forming a glue layer by applying a body→coating the glue material on the free surface of the body solder layer→hardening the glue layer by bake hardening→ obtaining a capacitor guide pin capable of suppressing whiskers, the first layer of the glue layer covering the same The outer periphery of the head, the second side of the adhesive layer covering the outer edge of the solder layer adjacent to the solder layer to completely cover the solder layer and inhibit tin whisker growth.

The main purpose of the method for manufacturing a capacitor guide pin capable of suppressing tin whisker is that the adhesive layer is coated on the solder layer, so that the adhesive layer covers the solder layer, thereby suppressing the solder layer from growing tin whiskers.

Other objects, advantages and novel features of the invention will be apparent from the description and appended claims.

The technology, means and functions of the present invention are described in detail with reference to the accompanying drawings.

Referring to Figure 1, there is shown a manufacturing flow diagram of the present invention. The invention can suppress the manufacturing method of the capacitor guide pin of tin whisker, which comprises the steps of: preparing a body → coating the rubber material on the free surface of the body solder layer to form a glue layer → hardening the glue layer by bake hardening → obtaining It can suppress the capacitance guide pin of tin whisker. among them:

Referring to FIG. 2 to FIG. 4, in the step of coating the rubber material, the glue layer 40 is coated by a dropping method, and the glue liquid is quantitatively dropped on the welding layer 30 of the body 1 by using an injection mechanism 50, via the body 1 The glue liquid is uniformly applied to the solder layer 30 to form the glue layer 40 at a certain speed.

Referring to FIG. 5 to FIG. 7 , the capacitive probe body 1 of the present invention includes a head, a leg 20 , a solder layer 30 , and a glue layer 40 . The head 10 is made of aluminum, and the head 10 is cylindrical at one end. And forming a joint surface 11 and an outer circumference 12. The head 10 is connected to the capacitor 2 to produce a conductive effect.

The leg 20 is made of iron or copper and is tinned on the outer layer. The leg 20 has a cylindrical shape and has an outer periphery 21. One end of the leg 20 is connected to the center of the joint surface 11 of the head 10, so that the axis of the leg 20 is The axes of the heads 10 lie on the same line. The free end of the leg 20 is connected to a circuit board (not shown).

The solder layer 30 is soldered to the bonding surface 11 of the head 10 and the outer periphery 21 of the leg 20. The solder layer 30 forms a free surface 31. The free surface 31 is not in contact with the head 10, and the free The surface 31 is not in contact with the leg 20.

The adhesive layer 40 is formed by applying a glue liquid to the free surface 31 of the solder layer 30. The adhesive layer 40 has a first side 41 and a second side 42. The first side 41 covers the head 10 and abuts the bonding surface 11 The outer periphery 12, the second side 42 covers the outer edge 21 of the soldering layer 30, and the adhesive layer 40 is coated on the solder layer 30, and then hardened and baked to harden the adhesive layer 40 to suppress The solder layer 30 has the effect of growing tin whiskers and is effective in isolating moisture. The adhesive layer 40 is a non-conductive material, has adhesion and is resistant to moisture. In the embodiment, the adhesive layer 40 is implemented as an epoxy resin and is baked at 60 ° C for 4 hours.

The adhesive layer 40 of the present invention is applied to the solder layer 30, and the adhesive layer 40 is coated with the solder layer 30 so that the free surface 31 of the solder layer 30 does not generate an oxide layer of tin, so that the tin atoms can be free from the free surface 31. The diffusion releases the compressive stress inside the solder layer 30 to suppress the solder layer 30 from growing whiskers.

Referring to Figure 8, a schematic view of a glue application according to a second embodiment of the present invention is shown. This embodiment is substantially the same as the first embodiment described above, except that the glue layer 40 is applied by a spray method.

In the present embodiment, a mist-like glue liquid is sprayed using a nozzle 60 to adhere the glue liquid to the solder layer 30 of the body 1, and the glue liquid is uniformly applied to the solder layer at a constant speed rotation through the body 1. 30 is formed to form a glue layer 40.

Referring to Figures 9 and 10, there is shown a schematic view of a glue application according to a third embodiment of the present invention. This embodiment is substantially the same as the first embodiment described above, except that the glue layer 40 is coated using an adsorption method.

In the present embodiment, a fixed mold 70 is used to coat the adhesive material. The fixed mold 70 has a hole 71, and a tapered opening 72 is formed at one end of the hole 71. The opening 72 is provided with an adsorbing material around the circumference of the opening 72. The body 1 is inserted into the hole 71 of the fixing die 70 from one end of the wire leg 20. The diameter of the adsorbing material 73 is smaller than the wire diameter of the soldering layer 30, so that the adsorbing material 73 on the fixed film 70 will be a capillary phenomenon. The material liquid is applied to the solder layer 30 to form a glue layer 40.

Referring to Figure 11, a schematic view of a glue application according to a fourth embodiment of the present invention is shown. This embodiment is substantially the same as the first embodiment described above, except that the glue layer 40 is applied using a roller type method.

In the present embodiment, the rubber material is applied by using two rollers 80. The body 1 is disposed between the two rollers 80. The roller 80 has a slope 81 which can be attached to the solder layer 30 of the body 1. The inclined surfaces 81 of the two rollers 80 are respectively attached to the two sides of the welding layer 30 of the body 1. The inclined surface 81 is coated with the glue liquid, and then the two rollers 80 are rotated synchronously with the body 1 to transfer the glue liquid to the welding layer 30. A glue layer 40 is formed.

Referring to Figure 12, there is shown a schematic view of a glue application according to a fifth embodiment of the present invention. This embodiment is substantially the same as the first embodiment described above, except that the glue layer 40 is applied by a rolling method.

In this embodiment, a lead 90 is used to coat the adhesive material. The lead 90 is connected to the solder layer 30 of the body 1 so that the lead 90 can drive the body 1 to rotate synchronously. One end of the lead 90 is placed in the glue liquid for adsorption. The glue liquid, the lead 90 of the adsorbent liquid is redirected to the body 1 to uniformly apply the glue to the solder layer 30 to form the glue layer 40.

The invention provides a method for manufacturing a capacitor guide pin capable of suppressing whiskers, which is formed by preparing a body → coating a rubber material on a free surface of the body solder layer to form a glue layer → hardening the glue layer by bake hardening → Obtaining a capacitive guide pin capable of suppressing whiskers, the first side of the adhesive layer covering an outer circumference of the head, the second side of the adhesive layer covering the outer edge of the solder layer adjacent to the solder layer to completely cover the solder layer, Suppress tin whisker growth.

As far as the above is concerned, it can be concluded that the present invention has the following advantages:

1. The invention relates to a method for manufacturing a capacitor guide pin capable of suppressing whiskers, wherein the adhesive layer is coated on the solder layer, so that the adhesive layer covers the solder layer, thereby suppressing the solder layer from growing tin whiskers.

The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, so that the numerical value is changed or the equivalent element is replaced, or the equivalent of the scope of the patent application of the present invention. Changes and modifications are still within the scope of the invention patent.

1‧‧‧ Ontology

2‧‧‧ capacitor

10‧‧‧ head

11‧‧‧ joint surface

12‧‧‧ outer periphery

20‧‧‧ feet

21‧‧‧ outer periphery

30‧‧‧welding layer

31‧‧‧Free surface

40‧‧‧ glue layer

41‧‧‧ first side

42‧‧‧ second side

50‧‧‧Injection mechanism

60‧‧‧ nozzle

70‧‧‧Fixed mould

71‧‧‧ hole

72‧‧‧ openings

73‧‧‧Adsorbed materials

80‧‧‧Roller

81‧‧‧Bevel

90‧‧‧Lead

FIG. 1 is a manufacturing flow chart of a method for manufacturing a capacitor guide pin capable of suppressing tin whiskers according to the present invention.

Figure 2 is a schematic view of a capacitive guide pin of the uncoated adhesive material of the present invention.

Fig. 3 is a schematic view showing a first embodiment of a method for manufacturing a capacitor guide pin capable of suppressing tin whiskers according to the present invention.

Fig. 4 is a perspective view showing the finished product of the capacitor guide pin which can suppress tin whisker according to the present invention.

Fig. 5 is a schematic cross-sectional view showing the finished product of the capacitor guide pin which can suppress tin whisker according to the present invention.

Figure 6 is an enlarged view of a detail of the present invention taken from Figure 2.

Fig. 7 is a view showing the state of use of the capacitor guide pin capable of suppressing tin whiskers according to the present invention.

Fig. 8 is a schematic view showing a second embodiment of a method for manufacturing a capacitor guide pin capable of suppressing tin whiskers according to the present invention.

Figure 9 is a schematic view showing a third embodiment of a method for manufacturing a capacitor guide pin capable of suppressing tin whiskers according to the present invention.

Figure 10: For the continuation of Figure 9, the table is coated with a glue using an adsorption method.

11 is a schematic view showing a fourth embodiment of a method for manufacturing a capacitor guide pin capable of suppressing tin whiskers according to the present invention.

Fig. 12 is a schematic view showing a fifth embodiment of a method for manufacturing a capacitor guide pin capable of suppressing tin whiskers according to the present invention.

Claims (9)

A manufacturing method for suppressing a tin whisker of a tin whisker, comprising: preparing a body, the body comprising a head, a leg and a soldering layer, the soldering layer soldering the head and the leg, and the soldering The layer has a free surface; the glue is coated on the free surface of the body solder layer to form a glue layer, the glue layer has a first side and a second side, the first side covers the outer circumference of the head, and the second side The sheath is coated adjacent to the outer periphery of the solder layer; the adhesive layer is hardened by baking hardening at 60 ° C for 4 hours; and a capacitive guide pin capable of suppressing whiskers is obtained. The method for manufacturing a capacitor guide pin capable of suppressing whiskers according to claim 1, wherein in the step of coating the glue, an injection mechanism is used to quantitatively drop the glue liquid at the solder layer of the body, via the body The glue liquid is uniformly applied to the solder layer at a certain speed to form the glue layer. The method for manufacturing a capacitor guide pin capable of suppressing tin whisker according to claim 1, wherein in the step of coating the rubber material, a mist-like glue liquid is sprayed using a nozzle to adhere the glue liquid to the body. The layer is formed by uniformly applying a glue liquid to the solder layer by rotation at a constant speed through the body. The method for manufacturing a capacitor guide pin capable of suppressing whiskers according to claim 1, wherein in the step of coating the glue, a fixed mold is used to apply a capillary phenomenon to the solder layer of the body to form the glue. Floor. The method for manufacturing a capacitor guide pin capable of suppressing whiskers according to claim 4, wherein the fixed mold has a hole, and a tapered opening is formed at one end of the hole, and the periphery of the opening is provided with an adsorbing material. Pipe diameter of adsorbent Less than the wire diameter of the solder layer. The method for manufacturing a capacitor guide pin capable of suppressing whiskers according to claim 1, wherein in the step of coating the glue, the glue liquid is applied by using two rollers, and then transferred to the solder layer of the body to form the adhesive layer. The roller has a sloped surface that can be attached to the welding layer of the body, and the body is disposed between the two rollers. The method for manufacturing a capacitor guide pin capable of suppressing tin whisker according to claim 1, wherein in the step of coating the glue, a lead adsorption plastic solution is used, and the lead of the adsorption glue liquid is guided to the welding of the body. The layer forms the glue layer. The method for manufacturing a capacitor guide pin capable of suppressing whiskers according to claim 1, wherein the adhesive layer is a non-conductive material, has adhesion and is resistant to moisture. The method for manufacturing a capacitor guide pin capable of suppressing whiskers according to claim 1, wherein the adhesive layer is made of an epoxy resin.