TWI399752B - Motherboard having mixed-slots architecture - Google Patents
Motherboard having mixed-slots architecture Download PDFInfo
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- TWI399752B TWI399752B TW96138134A TW96138134A TWI399752B TW I399752 B TWI399752 B TW I399752B TW 96138134 A TW96138134 A TW 96138134A TW 96138134 A TW96138134 A TW 96138134A TW I399752 B TWI399752 B TW I399752B
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Description
本發明係關於一種電腦主機板,尤指一種可彈性支援雙倍資料速率2(Double Data Rate 2,簡稱DDR2)記憶體及雙倍資料速率3(Double Data Rate 3,簡稱DDR3)記憶體之主機板。 The invention relates to a computer motherboard, in particular to a host that can flexibly support Double Data Rate 2 (DDR2) memory and Double Data Rate 3 (DDR3) memory. board.
現在一般電腦主機板上,除了有中央處理器,控制晶片組及可供安裝外接卡之插槽外,更有複數用於安裝記憶體之插槽。用戶可以根據需要,安裝不同數量之記憶體。隨著記憶體製造技術之快速發展,DDR3記憶體由於功耗及速度方面更強之性能將成為未來記憶體之主流。惟,從目前普遍使用之DDR2記憶體轉換至DDR3記憶體仍需要一段過渡期。 Nowadays, on the general computer motherboard, in addition to the central processing unit, the control chip set and the slot for installing the external card, there are a plurality of slots for mounting the memory. Users can install different amounts of memory as needed. With the rapid development of memory manufacturing technology, DDR3 memory will become the mainstream of future memory due to its superior power consumption and speed. However, the transition from the currently widely used DDR2 memory to DDR3 memory still requires a transition period.
鑒於以上內容,有必要提供一種具混合式插槽架構之主機板,以彈性支援DDR2記憶體及DDR3記憶體。 In view of the above, it is necessary to provide a motherboard with a hybrid slot architecture to flexibly support DDR2 memory and DDR3 memory.
一種具混合式插槽架構之主機板,包括一北橋晶片、一用於插接第一記憶體之第一組插槽、一用於插接第二記憶體之第二組插槽及一電壓調節電路,該北橋晶片透過一第一通道連接該第一組插槽,並透過一第二通道連接該第二組插槽,該 電壓調節電路與該第一組插槽及該第二組插槽連接,當該第一記憶體或第二記憶體被安裝於與其對應之插槽時,該安裝有對應記憶體之插槽產生一電平訊號,該電壓調節電路根據該電平訊號判別被安裝之記憶體類型,並為該記憶體提供工作電壓,該電壓調節電路包括一控制器,一回饋偏壓電路及一濾波器,該濾波器之輸入端與該控制器連接,該控制器包括一回饋引腳,該回饋偏壓電路包括一第一場效應電晶體及一第二場效應電晶體,該第一及第二場效應電晶體之閘極分別與該等第一連接器及第二連接器之一接地引腳連接,該第一場效應電晶體之閘極更透過一第一電阻與一電源連接,該第一場效應電晶體之源極接地,該第一場效應電晶體之汲極與該第二場效應電晶體之閘極連接並透過一第二電阻與該電源連接,該第二場效應電晶體之源極接地,該第二場效應電晶體之汲極透過一第三電阻與該控制器之回饋引腳連接,該第二場效應電晶體之汲極更透過一第四電阻接地並透過一第五電阻分別與該濾波器之輸出端及該等第一及第二連接器相連。 A motherboard with a hybrid slot architecture includes a north bridge chip, a first set of slots for plugging the first memory, a second set of slots for plugging the second memory, and a voltage An adjustment circuit, the north bridge chip is connected to the first group of slots through a first channel, and the second group of slots is connected through a second channel, The voltage adjustment circuit is connected to the first group of slots and the second group of slots. When the first memory or the second memory is installed in the corresponding slot, the slot corresponding to the memory is generated. a level signal, the voltage adjustment circuit determines the type of the memory to be mounted according to the level signal, and provides an operating voltage for the memory, the voltage adjustment circuit includes a controller, a feedback bias circuit and a filter The input end of the filter is connected to the controller, the controller includes a feedback pin, the feedback bias circuit includes a first field effect transistor and a second field effect transistor, the first and the The gates of the two field effect transistors are respectively connected to the ground pins of the first connector and the second connector, and the gate of the first field effect transistor is further connected to a power source through a first resistor. a source of the first field effect transistor is grounded, and a drain of the first field effect transistor is connected to a gate of the second field effect transistor and connected to the power source through a second resistor, the second field effect electricity The source of the crystal is grounded, the first The drain of the field effect transistor is connected to the feedback pin of the controller through a third resistor, and the drain of the second field effect transistor is grounded through a fourth resistor and transmitted through a fifth resistor and the filter respectively. The output is connected to the first and second connectors.
相較習知技術,該具混合式插槽架構之主機板上之記憶體插槽採用雙通道混合式排列,對於佈線設計來說,該種記憶體插槽之排列方式可以降低在同一通道內混合式記憶體之佈線複雜度;對於訊號設計來說,混合式記憶體插槽排列可以單獨處理混合式記憶體之訊號完整性,簡化了訊號設計之困難度。 Compared with the prior art, the memory slot on the motherboard with the hybrid slot architecture adopts a two-channel hybrid arrangement. For the wiring design, the arrangement of the memory slots can be reduced in the same channel. Hybrid memory wiring complexity; for signal design, the hybrid memory slot arrangement can handle the signal integrity of the hybrid memory separately, simplifying the difficulty of signal design.
40‧‧‧北橋晶片 40‧‧‧ North Bridge Chip
50‧‧‧第一組插槽 50‧‧‧First set of slots
60‧‧‧第二組插槽 60‧‧‧Second set of slots
10‧‧‧電壓調節電路 10‧‧‧Voltage adjustment circuit
52‧‧‧第一連接器 52‧‧‧First connector
54‧‧‧終端電阻 54‧‧‧ terminating resistor
62‧‧‧第二連接器 62‧‧‧Second connector
12‧‧‧控制器 12‧‧‧ Controller
14‧‧‧濾波器 14‧‧‧ Filter
16‧‧‧線性穩壓器 16‧‧‧Linear regulator
18‧‧‧回饋偏壓電路 18‧‧‧Reward bias circuit
Q1、Q2‧‧‧場效應電晶體 Q1, Q2‧‧‧ field effect transistor
R1、R2、R3、R4、R5‧‧‧電阻 R1, R2, R3, R4, R5‧‧‧ resistors
圖1係本發明具混合式插槽架構之主機板之較佳實施方式之框圖。 1 is a block diagram of a preferred embodiment of a motherboard having a hybrid slot architecture of the present invention.
圖2係圖1之DDR2記憶體在有和無終端電阻時之定址訊號波形對比圖。 Figure 2 is a comparison of the address signal waveforms of the DDR2 memory of Figure 1 with and without termination resistors.
圖3係圖1之供電系統之電路圖。 Figure 3 is a circuit diagram of the power supply system of Figure 1.
請參閱圖1,本發明具混合式插槽架構之主機板之較佳實施方式包括一北橋晶片40、一第一組插槽50、一第二組插槽60及一電壓調節電路10。 Referring to FIG. 1, a preferred embodiment of a motherboard having a hybrid socket architecture includes a north bridge wafer 40, a first set of slots 50, a second set of slots 60, and a voltage regulating circuit 10.
該第一組插槽50包括兩第一連接器52及兩分別與該兩第一連接器52連接之終端電阻54,該等第一連接器52用於插接第一記憶體,本較佳實施方式中該等第一連接器52為DDR2連接器,第一記憶體為DDR2記憶體,該終端電阻54可以使第一記憶體52獲得品質較佳之訊號,但考慮節省成本與佈線面積,該終端電阻54可以移除,其移除後之定址訊號仍能滿足訊號設計要求。該第二組插槽60包括兩第二連接器62,用於插接第二記憶體,本較佳實施方式中該等第二連接器62為DDR3連接器,第二記憶體為DDR3記憶體。該北橋晶片40透過一第一通道A連接該第一組插槽50,透過一第二通道B連接該第二組插槽60。該等第一連接器52及第二連接器62均連接該電壓調節電路10,該電壓調節電路10為該等第一連接器52及第二連接器62提供工作電壓。本實施例係以最常見之每一通道連接兩 連接器舉例說明。該具混合式插槽架構之主機板採用混合式儲存器插槽排列方式亦可類推到每一通道連接多個連接器,如三個以上。 The first set of slots 50 includes two first connectors 52 and two terminal resistors 54 respectively connected to the two first connectors 52. The first connectors 52 are used for plugging in the first memory. In the embodiment, the first connector 52 is a DDR2 connector, and the first memory is a DDR2 memory. The termination resistor 54 can obtain a better quality signal for the first memory 52, but considering cost saving and wiring area, The terminating resistor 54 can be removed, and the address signal after the removal can still meet the signal design requirements. The second set of slots 60 includes two second connectors 62 for plugging in the second memory. In the preferred embodiment, the second connectors 62 are DDR3 connectors, and the second memory is DDR3 memory. . The north bridge chip 40 is connected to the first group of slots 50 through a first channel A, and the second group of slots 60 is connected through a second channel B. The first connector 52 and the second connector 62 are connected to the voltage regulating circuit 10, and the voltage regulating circuit 10 supplies operating voltages to the first connector 52 and the second connector 62. This embodiment connects two of the most common channels. Connector example. The motherboard with the hybrid slot architecture adopts a hybrid storage slot arrangement or analogous to each channel to connect multiple connectors, such as three or more.
請一併參閱圖2,為該具混合式插槽架構之主機板上DDR2記憶體有該終端電阻54和無該終端電阻54之定址訊號波形對比圖,其中曲線200為有該終端電阻54之定址訊號波形,曲線100為移除該終端電阻54後之定址訊號波形。根據電子元件工業聯合會(Joint Electron Device Engineering Council,JEDEC)訂立之內部記憶體之技術規範,記憶體訊號完整性之設計規範有下列幾項:過衝量(overshoot),下衝量(undershoot)等,其中DDR2記憶體之過衝量小於2.3V,下衝量大於-0.5V為符合規範要求,故圖2中之兩定址訊號波形曲線均符合規範。因此,不論主機板上有無該終端電阻54,DDR2記憶體之定址訊號皆能符合設計規範要求。 Please refer to FIG. 2 , which is a comparison diagram of the address signal waveforms of the DDR2 memory on the motherboard with the hybrid slot architecture, and the termination signal 54 without the termination resistor 54 , wherein the curve 200 has the termination resistor 54 The address signal waveform is set, and the curve 100 is the address signal waveform after the termination resistor 54 is removed. According to the technical specifications of internal memory established by the Joint Electron Device Engineering Council (JEDEC), the design specifications for memory signal integrity have the following items: overshoot, undershoot, etc. The overshoot of the DDR2 memory is less than 2.3V, and the undershoot is greater than -0.5V to meet the specification requirements. Therefore, the waveform waveforms of the two address signals in Figure 2 are in compliance with the specifications. Therefore, regardless of whether or not the terminating resistor 54 is present on the motherboard, the address signals of the DDR2 memory can meet the design specifications.
請參閱圖3,該電壓調節電路10包括一控制器12、一濾波器14、一線性穩壓器16及一回饋偏壓電路18。 Referring to FIG. 3, the voltage regulating circuit 10 includes a controller 12, a filter 14, a linear regulator 16, and a feedback bias circuit 18.
該回饋偏壓電路18包括兩場效應電晶體Q1和Q2及五個電阻R1~R5。該兩場效應電晶體Q1和Q2均為NMOS場效應電晶體,該兩場效應電晶體Q1及Q2之閘極分別與該等第一連接器52及第二連接器62之一接地引腳連接,該場效應電晶體Q1之閘極更透過該電阻R1與一5V電源連接,該場效應電晶體Q1之源極接地,該場效應電晶體Q1之汲極與該場效應電晶體Q2之閘極連接並透過該電阻R2與該5V電源連接,該場效應電晶體Q2之 源極接地,該場效應電晶體Q2之汲極透過該電阻R3與該控制器12之一回饋引腳連接,該回饋引腳透過該電阻R4接地並與該電阻R5之一端相連。 The feedback bias circuit 18 includes two field effect transistors Q1 and Q2 and five resistors R1 R R5. The two field effect transistors Q1 and Q2 are NMOS field effect transistors, and the gates of the two field effect transistors Q1 and Q2 are respectively connected to the ground pins of one of the first connector 52 and the second connector 62. The gate of the field effect transistor Q1 is further connected to a 5V power supply through the resistor R1. The source of the field effect transistor Q1 is grounded, and the gate of the field effect transistor Q1 and the gate of the field effect transistor Q2 are connected. The pole is connected and connected to the 5V power supply through the resistor R2, the field effect transistor Q2 The source is grounded, and the drain of the field effect transistor Q2 is connected to a feedback pin of the controller 12 through the resistor R3. The feedback pin is grounded through the resistor R4 and connected to one end of the resistor R5.
該控制器12之輸出端與該濾波器14之輸入端連接以傳輸一電壓訊號,該濾波器14之輸出端輸出一濾波後之電壓VDD,該濾波器14之輸出端與該回饋偏壓電路18之電阻R5之另一端連接以構成反饋回路,該濾波器14更將電壓VDD傳送給該線性穩壓器16,並經該線性穩壓器16轉換為電壓VTT分別提供給該等第一連接器52及第二連接器62。該濾波器14之輸出端更直接與該第一連接器52及第二連接器62連接向該等第一連接器52及第二連接器62輸出電壓VDD。 The output end of the controller 12 is connected to the input end of the filter 14 to transmit a voltage signal, the output end of the filter 14 outputs a filtered voltage VDD, and the output end of the filter 14 and the feedback bias voltage The other end of the resistor R5 of the circuit 18 is connected to form a feedback loop, and the filter 14 further transmits a voltage VDD to the linear regulator 16 and is converted into a voltage VTT via the linear regulator 16 to be supplied to the first The connector 52 and the second connector 62. The output end of the filter 14 is directly connected to the first connector 52 and the second connector 62 to output a voltage VDD to the first connector 52 and the second connector 62.
在本較佳實施方式中,該控制器12回饋引腳端之回饋電壓Vfb設定為0.78V,該等電阻R1~R5之電阻值分別為4.7千歐姆、4.7千歐姆、2.4千歐姆、1.2千歐姆及1.1千歐姆。 In the preferred embodiment, the feedback voltage Vfb of the controller 12 is set to 0.78V, and the resistance values of the resistors R1 R R5 are 4.7 kilo ohms, 4.7 kilo ohms, 2.4 kilo ohms, and 1.2 thousand, respectively. Ohm and 1.1 kilo ohms.
當在該等第一連接器52上安裝DDR2記憶體,該等第二連接器62空接,電腦系統開機時,該場效應電晶體Q1之閘極接收該等第一連接器52接地引腳產生之一低電平訊號,因此該場效應電晶體Q1截止而場效應電晶體Q2導通,因為回饋偏壓電路18必須將該控制器12回饋引腳端之回饋電壓Vfb調整至控制器12回饋引腳之設定值0.78V,根據回饋電壓Vfb與濾波器14之輸出電壓VDD之分壓公式VDD=Vfb*(R5+RX)/RX,其中RX=R3*R4/(R3+R4),計算得該輸出電壓VDD為1.8V,故控制器12將調整輸出電壓,使濾波器14之輸出電壓VDD為1.8V,該 輸出電壓VDD直接提供給該回饋偏壓電路18及安裝在第一連接器52上之DDR2記憶體,該輸出電壓VDD更透過線性穩壓器16轉換成一VTT電壓(0.9V)提供給DDR2記憶體。 When the DDR2 memory is mounted on the first connectors 52, the second connectors 62 are vacant. When the computer system is turned on, the gate of the field effect transistor Q1 receives the ground pins of the first connectors 52. A low level signal is generated, so the field effect transistor Q1 is turned off and the field effect transistor Q2 is turned on because the feedback bias circuit 18 must adjust the feedback voltage Vfb of the controller 12 to the pin terminal to the controller 12. The set value of the feedback pin is 0.78V, according to the voltage division formula VDD=Vfb*(R5+RX)/RX of the feedback voltage Vfb and the output voltage VDD of the filter 14, where RX=R3*R4/(R3+R4), The output voltage VDD is calculated to be 1.8V, so the controller 12 will adjust the output voltage so that the output voltage VDD of the filter 14 is 1.8V. The output voltage VDD is directly supplied to the feedback bias circuit 18 and the DDR2 memory mounted on the first connector 52. The output voltage VDD is further converted into a VTT voltage (0.9V) through the linear regulator 16 to provide DDR2 memory. body.
當在該等第二連接器62上安裝DDR3記憶體,該等第一連接器52空接,電腦系統開機時,該場效應電晶體Q2之閘極接收該等第二連接器62接地引腳產生之一低電平訊號,因此該場效應電晶體Q2截止,該電阻R3接入回饋電路,因為該回饋偏壓電路18必須將該控制器12回饋引腳端之回饋電壓Vfb調整至設定值0.78V,根據回饋電壓Vfb與濾波器14之輸出電壓VDD之分壓公式VDD=Vfb*(R5+R4)/R4,計算得輸出電壓VDD為1.5V,故控制器12將調整輸出電壓,使濾波器14之輸出電壓VDD為1.5V,該輸出電壓VDD直接提供給該回饋偏壓電路18及安裝在第二連接器62上之DDR3記憶體,該輸出電壓VDD又透過線性穩壓器16轉換成一VTT電壓(0.75V)提供給DDR3記憶體。同一時間在該主機板上只能選擇安裝一種類型之記憶體。 When the DDR3 memory is mounted on the second connectors 62, the first connectors 52 are vacant, and the gate of the field effect transistor Q2 receives the ground pins of the second connectors 62 when the computer system is turned on. A low level signal is generated, so the field effect transistor Q2 is turned off, and the resistor R3 is connected to the feedback circuit because the feedback bias circuit 18 must adjust the feedback voltage Vfb of the controller 12 to the pin terminal to be set to the setting. The value is 0.78V. According to the voltage division formula VDD=Vfb*(R5+R4)/R4 of the feedback voltage Vfb and the output voltage VDD of the filter 14, the output voltage VDD is calculated to be 1.5V, so the controller 12 will adjust the output voltage. The output voltage VDD of the filter 14 is 1.5V, and the output voltage VDD is directly supplied to the feedback bias circuit 18 and the DDR3 memory mounted on the second connector 62. The output voltage VDD is transmitted through the linear regulator. 16 is converted to a VTT voltage (0.75V) for DDR3 memory. Only one type of memory can be selected to be installed on the motherboard at the same time.
在該具混合式插槽架構之主機板上可選擇安裝不同類型之記憶體,該等記憶體插槽採用雙通道混合式排列,降低了混合式記憶體在同一通道內之佈線複雜度,可以單獨處理混合式記憶體之訊號完整性,簡化了訊號設計之困難度。可以選擇移除主機板上DDR2之終端電阻,降低了研發人員在佈線設計和訊號設計方面之困難度,亦節省了成本和空間。該支援混合式記憶體之主機板可自動偵測安裝在該主機板上之記憶體 類型,並透過電壓調節電路提供適合之電壓,使同一主機板可彈性支援不同類型之記憶體,滿足不同用戶之需求。在記憶體換代時,尤其在DDR2記憶體轉換至DDR3記憶體之過渡期內,提供使用者更大之應用彈性。 Different types of memory can be installed on the motherboard with the hybrid slot structure, and the memory slots are arranged in a two-channel hybrid arrangement, which reduces the wiring complexity of the hybrid memory in the same channel. Separate processing of the signal integrity of the hybrid memory simplifies the difficulty of signal design. You can choose to remove the DDR2 termination resistor on the motherboard, which reduces the difficulty for developers in wiring design and signal design, and saves cost and space. The motherboard supporting the hybrid memory can automatically detect the memory installed on the motherboard Type, and through the voltage regulation circuit to provide a suitable voltage, so that the same motherboard can flexibly support different types of memory to meet the needs of different users. In the memory replacement period, especially during the transition period of DDR2 memory to DDR3 memory, the user is provided with greater application flexibility.
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,在爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.
40‧‧‧北橋晶片 40‧‧‧ North Bridge Chip
50‧‧‧第一組插槽 50‧‧‧First set of slots
60‧‧‧第二組插槽 60‧‧‧Second set of slots
10‧‧‧電壓調節電路 10‧‧‧Voltage adjustment circuit
52‧‧‧第一連接器 52‧‧‧First connector
54‧‧‧終端電阻 54‧‧‧ terminating resistor
62‧‧‧第二連接器 62‧‧‧Second connector
Claims (8)
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TW96138134A TWI399752B (en) | 2007-10-12 | 2007-10-12 | Motherboard having mixed-slots architecture |
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TW96138134A TWI399752B (en) | 2007-10-12 | 2007-10-12 | Motherboard having mixed-slots architecture |
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TW200917581A TW200917581A (en) | 2009-04-16 |
TWI399752B true TWI399752B (en) | 2013-06-21 |
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TWI509386B (en) * | 2012-12-27 | 2015-11-21 | Celestica Technology Consultancy Shanghai Co Ltd | Main board and methods for disposing memory slots on the main board |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW473729B (en) * | 2000-01-04 | 2002-01-21 | Via Tech Inc | Motherboard for automatically outputting appropriate voltage source and the method thereof |
US6828822B1 (en) * | 2003-10-03 | 2004-12-07 | Altera Corporation | Apparatus and methods for shared memory interfaces in programmable logic devices |
TW200725622A (en) * | 2005-12-16 | 2007-07-01 | Hon Hai Prec Ind Co Ltd | Memory voltage generating circuit |
TW200725633A (en) * | 2005-12-19 | 2007-07-01 | Inventec Corp | Memory module installation configuration testing method and system |
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2007
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW473729B (en) * | 2000-01-04 | 2002-01-21 | Via Tech Inc | Motherboard for automatically outputting appropriate voltage source and the method thereof |
US6828822B1 (en) * | 2003-10-03 | 2004-12-07 | Altera Corporation | Apparatus and methods for shared memory interfaces in programmable logic devices |
TW200725622A (en) * | 2005-12-16 | 2007-07-01 | Hon Hai Prec Ind Co Ltd | Memory voltage generating circuit |
TW200725633A (en) * | 2005-12-19 | 2007-07-01 | Inventec Corp | Memory module installation configuration testing method and system |
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