TWI399546B - - Google Patents

Info

Publication number
TWI399546B
TWI399546B TW98123278A TW98123278A TWI399546B TW I399546 B TWI399546 B TW I399546B TW 98123278 A TW98123278 A TW 98123278A TW 98123278 A TW98123278 A TW 98123278A TW I399546 B TWI399546 B TW I399546B
Authority
TW
Taiwan
Application number
TW98123278A
Other languages
Chinese (zh)
Other versions
TW201102657A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98123278A priority Critical patent/TW201102657A/en
Publication of TW201102657A publication Critical patent/TW201102657A/en
Application granted granted Critical
Publication of TWI399546B publication Critical patent/TWI399546B/zh

Links

TW98123278A 2009-07-09 2009-07-09 A multi-set probe device TW201102657A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98123278A TW201102657A (en) 2009-07-09 2009-07-09 A multi-set probe device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98123278A TW201102657A (en) 2009-07-09 2009-07-09 A multi-set probe device

Publications (2)

Publication Number Publication Date
TW201102657A TW201102657A (en) 2011-01-16
TWI399546B true TWI399546B (en) 2013-06-21

Family

ID=44837523

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98123278A TW201102657A (en) 2009-07-09 2009-07-09 A multi-set probe device

Country Status (1)

Country Link
TW (1) TW201102657A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297887A (en) * 2002-04-01 2003-10-17 Hitachi Ltd Manufacturing method for semiconductor integrated circuit device and semiconductor inspection device
US20080030214A1 (en) * 2006-08-04 2008-02-07 Nguyen Vinh T Probe head assembly for use in testing multiple wafer die
TW200905201A (en) * 2007-07-31 2009-02-01 Contrel Technology Co Ltd Adjustable probe platform

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297887A (en) * 2002-04-01 2003-10-17 Hitachi Ltd Manufacturing method for semiconductor integrated circuit device and semiconductor inspection device
US20080030214A1 (en) * 2006-08-04 2008-02-07 Nguyen Vinh T Probe head assembly for use in testing multiple wafer die
TW200905201A (en) * 2007-07-31 2009-02-01 Contrel Technology Co Ltd Adjustable probe platform

Also Published As

Publication number Publication date
TW201102657A (en) 2011-01-16

Similar Documents

Publication Publication Date Title
BR112012012396A2 (en)
BR112012008267A2 (en)
BR112012008195A2 (en)
BRPI0925311A2 (en)
BRPI0924307A2 (en)
BR122021004633A2 (en)
BR112012003080A2 (en)
BR122017024704A2 (en)
BR112012012487A2 (en)
BR112012003853A2 (en)
BR112012009797A2 (en)
BR112012009446A2 (en)
BR112012009703A2 (en)
BR112012010357A2 (en)
BR112012007656A2 (en)
BR122019005883A2 (en)
BRPI0924534A2 (en)
BR112012014856A2 (en)
BR112012007654A2 (en)
BR112012007672A2 (en)
BR112012005951A2 (en)
BR122017013721A2 (en)
BR112012009404A2 (en)
BRPI0924617A2 (en)
BRPI0925022A2 (en)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees