TWI398635B - Detecting device - Google Patents

Detecting device Download PDF

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Publication number
TWI398635B
TWI398635B TW96104982A TW96104982A TWI398635B TW I398635 B TWI398635 B TW I398635B TW 96104982 A TW96104982 A TW 96104982A TW 96104982 A TW96104982 A TW 96104982A TW I398635 B TWI398635 B TW I398635B
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TW
Taiwan
Prior art keywords
circuit board
detecting device
hole
cantilever
spiral micrometer
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TW96104982A
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Chinese (zh)
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TW200834069A (en
Inventor
Lei Li
Ping Chen
Zhi Cheng
Hu Li
Dong Li
Yong-Zhi Tao
Lin-Sen Dong
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Fih Hong Kong Ltd
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Priority to TW96104982A priority Critical patent/TWI398635B/en
Publication of TW200834069A publication Critical patent/TW200834069A/en
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Publication of TWI398635B publication Critical patent/TWI398635B/en

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  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)

Description

檢測設備 Testing Equipment

本發明涉及一種檢測設備,尤其涉及一種測試電路板彎曲變形實驗之檢測設備。 The invention relates to a detecting device, in particular to a testing device for testing a bending deformation test of a circuit board.

大部分電路板(PCB,Printed Circuit Board)需藉由螺絲鎖緊安裝於機構件上。於組裝過程中,經常會遇到電路板被鎖緊後發生彎曲變形之情況。較為嚴重之彎曲變形可能會導致電路板上之佈線或電子元件損壞,以致影響到產品設計之品質及成品之質量。故,於產品設計時需對電路板進行彎曲變形之測試,以確定其所能承受之最大撓度值。 Most printed circuit boards (PCBs) need to be mounted on the machine components by screws. During the assembly process, it is often encountered that the board is bent and deformed after being locked. More severe bending deformation may cause damage to the wiring or electronic components on the board, which may affect the quality of the product design and the quality of the finished product. Therefore, in the product design, the board should be tested for bending deformation to determine the maximum deflection value it can withstand.

目前,類似電路板彎曲變形失效模式之分析及研究大多藉由投影儀量測系統或三次元檢測系統直接進行彎曲變形測試。然而,現有之投影儀量測系統或三次元檢測系統體積較為龐大,結構複雜,成本較高。 At present, most of the analysis and research on the failure mode of the bending deformation of the similar circuit board are directly subjected to the bending deformation test by the projector measuring system or the three-dimensional detecting system. However, the existing projector measuring system or the three-dimensional detecting system is bulky, complicated in structure, and high in cost.

有鑒於此,有必要提供一種結構簡單,成本較低之檢測設備。 In view of this, it is necessary to provide a detection device that is simple in structure and low in cost.

一種用於檢測電路板是否失效之檢測設備,其包括一測量裝置及一監控裝置,該測量裝置包括一基座、一定位元件、一螺旋測微計及一固持機構,該定位元件固定於所述基座,該螺旋測微計移動地連接於該定位元件上,用以抵持所述電路板之一端,該固持機構放置於所述基座,用以固定所述電路板之另一端,該監控裝置與所述電路板電連接,用以判斷所述電路板是否失效。 A detecting device for detecting whether a circuit board is ineffective, comprising a measuring device and a monitoring device, the measuring device comprising a base, a positioning component, a spiral micrometer and a holding mechanism, wherein the positioning component is fixed at the a susceptor, the spiral micrometer is movably connected to the positioning component for resisting one end of the circuit board, and the holding mechanism is placed on the pedestal for fixing the other end of the circuit board. The monitoring device is electrically connected to the circuit board for determining whether the circuit board is invalid.

相較習知技術,本發明提供之檢測設備藉由測量螺旋測微計之測量螺桿之位移量來測試出電路板彎曲變形損壞時之彎曲角度,使測量準確,且該檢測設備結構簡單,成本較低。 Compared with the prior art, the detecting device provided by the present invention measures the bending angle of the bending deformation of the circuit board by measuring the displacement amount of the measuring screw of the spiral micrometer, so that the measurement is accurate, and the detecting device has a simple structure and a cost. Lower.

100‧‧‧測量裝置 100‧‧‧Measurement device

120‧‧‧基座 120‧‧‧Base

140‧‧‧懸臂架 140‧‧‧cantilever

142‧‧‧立柱 142‧‧‧ column

144‧‧‧懸臂梁 144‧‧‧Cantilever beam

160‧‧‧螺旋測微計 160‧‧‧Spiral micrometer

161‧‧‧頂針頭 161‧‧‧Top needle

162‧‧‧測量螺桿 162‧‧‧ Measuring screw

163‧‧‧裝挾軸套 163‧‧‧Installation bushing

164‧‧‧刻度套筒 164‧‧‧Scale sleeve

165‧‧‧微分套筒 165‧‧‧Differential sleeve

166‧‧‧棘輪 166‧‧‧ratchet

170‧‧‧滑塊 170‧‧‧ Slider

172‧‧‧滑動部 172‧‧‧Sliding section

1722‧‧‧滑槽 1722‧‧‧Chute

174‧‧‧挾持部 174‧‧‧ Department of Maintenance

176‧‧‧螺栓 176‧‧‧Bolts

180‧‧‧支撐體 180‧‧‧Support

182‧‧‧固定部 182‧‧‧ fixed department

200‧‧‧監控裝置 200‧‧‧Monitor

300‧‧‧攝像頭 300‧‧‧Webcam

400‧‧‧訊號輸出元件 400‧‧‧Signal output components

600‧‧‧電路板 600‧‧‧ boards

606‧‧‧孔 606‧‧‧ hole

608‧‧‧孔 608‧‧‧ hole

900‧‧‧檢測設備 900‧‧‧Testing equipment

圖1係本發明固定有電路板之檢測設備之立體圖;圖2係本發明檢測設備之螺旋測微計之主視圖;圖3係本發明檢測設備測量電路板時之立體圖。 1 is a perspective view of a detecting device with a circuit board fixed thereto; FIG. 2 is a front view of a spiral micrometer of the detecting device of the present invention; and FIG. 3 is a perspective view of the detecting device of the present invention when measuring a circuit board.

本發明提供一種檢測設備,該檢測設備較佳實施方式可應用於電路板彎曲變形失效之測試中。 The invention provides a detecting device, and the preferred embodiment of the detecting device can be applied to the test of the bending deformation failure of the circuit board.

請參閱圖1,本發明用於測試電路板彎曲變形失效之檢測設備900包括一測量裝置100、一監控裝置200、一攝像頭300及一訊號輸出元件400。 Referring to FIG. 1 , the testing apparatus 900 for testing a bending deformation failure of a circuit board includes a measuring device 100 , a monitoring device 200 , a camera 300 , and a signal output component 400 .

所述測量裝置100包括一基座120、一懸臂架140、一螺旋測微計160、一滑塊170及一支撐體180。 The measuring device 100 includes a base 120, a cantilever frame 140, a spiral micrometer 160, a slider 170 and a support body 180.

該基座120為一板狀平臺,用於固設懸臂架140及支撐體180。 The base 120 is a plate-shaped platform for fixing the cantilever frame 140 and the support body 180.

所述懸臂架140包括一立柱142及一懸臂梁144,所述懸臂梁144係由所述立柱142之一端沿垂直于該立柱142之方向延伸而成,該懸臂梁144與基座120平行。立柱142及懸臂梁144之橫截面均為矩形,且立柱142之橫截面積大於懸臂梁144之橫截面積。 The cantilever frame 140 includes a column 142 and a cantilever beam 144. The cantilever beam 144 is formed by extending one end of the column 142 in a direction perpendicular to the column 142. The cantilever beam 144 is parallel to the base 120. The cross-section of the column 142 and the cantilever beam 144 are both rectangular, and the cross-sectional area of the column 142 is larger than the cross-sectional area of the cantilever beam 144.

該滑塊170包括一滑動部172及一挾持部174,所述滑動部172大致呈矩形,於其側面開設有矩形滑槽1722,滑塊170藉由該滑槽1722套設於懸臂架140之懸臂梁144上;挾持部174大致呈矩形,其固定於滑動部172之一側。該 挾持部174頂面中部開設有一圓形通孔(圖未示),所述螺旋測微計160可穿過該通孔,並藉由螺栓176固定於該通孔內。 The slider 170 includes a sliding portion 172 and a holding portion 174. The sliding portion 172 is substantially rectangular, and a rectangular sliding slot 1722 is defined on a side surface thereof. The slider 170 is sleeved on the cantilever frame 140 by the sliding slot 1722. The cantilever beam 144 has a substantially rectangular shape and is fixed to one side of the sliding portion 172. The A circular through hole (not shown) is defined in the middle of the top surface of the holding portion 174. The spiral micrometer 160 can pass through the through hole and is fixed in the through hole by a bolt 176.

該支撐體180為一圓柱體,其垂直固設於基座120上,該支撐體180一端面上同心設置有固定部182。該固定部182為一圓柱體,其直徑小於支撐體180之直徑,於該固定部182上設有一螺紋孔(圖未示),一螺釘可旋入該螺紋孔中。 The support body 180 is a cylinder that is vertically fixed to the base 120. A fixing portion 182 is concentrically disposed on one end surface of the support body 180. The fixing portion 182 is a cylinder having a diameter smaller than the diameter of the supporting body 180. The fixing portion 182 is provided with a threaded hole (not shown) into which a screw can be screwed.

請參閱圖2,該螺旋測微計160由一頂針頭161、一測量螺桿162、一裝挾軸套163、一刻度套筒164、一微分套筒165及一棘輪166依次相連而成。其中,所述頂針頭161藉由一螺釘固定於測量螺桿162之一端,藉由旋轉棘輪166,可使測量螺桿162帶動頂針頭161抵持於電路板600上,使該電路板600彎曲。 Referring to FIG. 2, the spiral micrometer 160 is formed by sequentially connecting a needle 161, a measuring screw 162, a mounting sleeve 163, a scale sleeve 164, a differential sleeve 165 and a ratchet 166. The thimble head 161 is fixed to one end of the measuring screw 162 by a screw. By rotating the ratchet 166, the measuring screw 162 can drive the thimble head 161 against the circuit board 600 to bend the circuit board 600.

所述監控裝置200為一電訊號監控裝置,本實施例中為一電腦,其與電路板600電連接,用於監控電路板600是否已經失效。 The monitoring device 200 is an electrical signal monitoring device. In this embodiment, a computer is electrically connected to the circuit board 600 for monitoring whether the circuit board 600 has failed.

該電路板600兩端處各開有一孔606、608,其中一孔606用於容置所述固定部182以固定該電路板600,頂針頭161將卡持於另一孔608之邊緣上,該孔608之直徑小於該頂針頭161之直徑。 A hole 606, 608 is defined in each of the two ends of the circuit board 600. A hole 606 is used for receiving the fixing portion 182 to fix the circuit board 600. The ejector pin 161 is clamped on the edge of the other hole 608. The diameter of the hole 608 is smaller than the diameter of the ejector pin 161.

所述攝像頭300及訊號輸出元件400設置於該電路板600上。該攝像頭300用於攝取影像,該訊號輸出元件400與監控裝置200電連接,以將攝像頭300攝取之影像訊號傳輸至該監控裝置200中。 The camera 300 and the signal output component 400 are disposed on the circuit board 600. The camera 300 is configured to capture images, and the signal output component 400 is electrically connected to the monitoring device 200 to transmit the image signals captured by the camera 300 to the monitoring device 200.

組裝時,將懸臂架140藉由其立柱142一自由端固設於基座120上,該立柱142另一端之懸臂梁144懸置於基座120之上方。滑動部172之矩形滑槽1722套設於懸臂架140之懸臂梁144上,滑塊170可以藉由其滑動部172沿著所述懸臂架140之懸臂梁144滑動。之後,將螺旋測微計160穿過所述滑塊170之 挾持部174上之通孔以將該螺旋測微計160設置於滑塊170上,並藉由一螺栓176將該螺旋測微計160挾緊。最後將支撐體180相對固定部182之一端固設於基座120上。所述懸臂架140之立柱142與所述支撐體180之距離可根據待測試之電路板大小來調整。電路板600藉由孔606套設於固定部182上,將一螺釘旋入固定部182之螺紋孔中,使該電路板600水平固定於固定部182上。最後,將監控裝置200藉由一數據線與訊號輸出元件400電連接。 When assembled, the cantilever frame 140 is fixed to the base 120 by a free end of the column 142. The cantilever beam 144 at the other end of the column 142 is suspended above the base 120. The rectangular sliding slot 1722 of the sliding portion 172 is sleeved on the cantilever beam 144 of the cantilever frame 140, and the slider 170 can slide along the cantilever beam 144 of the cantilever frame 140 by its sliding portion 172. Thereafter, the spiral micrometer 160 is passed through the slider 170 The through hole in the holding portion 174 is used to set the spiral micrometer 160 on the slider 170, and the spiral micrometer 160 is tightened by a bolt 176. Finally, one end of the support body 180 opposite to the fixing portion 182 is fixed on the base 120. The distance between the column 142 of the cantilever frame 140 and the support body 180 can be adjusted according to the size of the circuit board to be tested. The circuit board 600 is sleeved on the fixing portion 182 by a hole 606, and a screw is screwed into the screw hole of the fixing portion 182 to fix the circuit board 600 horizontally to the fixing portion 182. Finally, the monitoring device 200 is electrically coupled to the signal output component 400 via a data line.

測試時,藉由滑動部172調整螺旋測微計160之位置,使其頂針頭161與電路板600之孔608相對正,並旋轉螺旋測微計160之棘輪166,使頂針頭161接觸於該電路板600之孔608之孔壁上,並記錄此時該螺旋測微計160之數值。然後,旋轉螺旋測微計160之棘輪166,使頂針頭161抵持於電路板600上並向下繼續移動使該電路板600彎曲。在此過程中,攝像頭300攝取之影像傳輸至監控裝置200中,並顯示該影像。當該電路板600彎曲到一定程度時,其上之複數電子元件或該電路板600內部電路折斷,從而使攝像頭300攝取之影像訊號無法藉由訊號輸出元件400傳輸至監控裝置200,即該監控裝置200之影像消失,此時該電路板600失效,請參閱圖3。記錄此時該螺旋測微計160之數值,並計算兩次數值之差值,得出該測量螺桿162之位移量。再藉由測試得出之位移與角度值對照表對照即可得出該電路板600失效時之彎曲角度。 During the test, the position of the spiral micrometer 160 is adjusted by the sliding portion 172 so that the ejector pin 161 is opposite to the hole 608 of the circuit board 600, and the ratchet 166 of the spiral micrometer 160 is rotated to bring the ejector pin 161 into contact with the thimble 161. The hole 608 of the circuit board 600 is walled and the value of the spiral micrometer 160 is recorded. Then, the ratchet wheel 166 of the spiral micrometer 160 is rotated to cause the ejector pin 161 to abut against the circuit board 600 and continue to move downward to bend the circuit board 600. During this process, the image captured by the camera 300 is transmitted to the monitoring device 200 and displayed. When the circuit board 600 is bent to a certain extent, the plurality of electronic components or the internal circuit of the circuit board 600 are broken, so that the image signal captured by the camera 300 cannot be transmitted to the monitoring device 200 by the signal output component 400, that is, the monitoring The image of device 200 disappears and the board 600 fails, see Figure 3. The value of the spiral micrometer 160 is recorded at this time, and the difference between the two values is calculated to obtain the displacement amount of the measuring screw 162. Then, by comparing the displacement and the angle value obtained by the test, the bending angle of the board 600 when it fails can be obtained.

可以理解,該檢測設備900亦可省卻攝像頭300及訊號輸出元件400,則只需將監控裝置200之電腦更換為示波器等設備。該示波器接入電路板,測試該電路板之訊號波形,若顯示之波形與正常狀態下之波形不同或無波形顯示,則表明該電路板已損壞。 It can be understood that the detecting device 900 can also omit the camera 300 and the signal output component 400, and only need to replace the computer of the monitoring device 200 with an oscilloscope or the like. The oscilloscope is connected to the circuit board and tests the signal waveform of the circuit board. If the displayed waveform is different from the waveform under normal conditions or has no waveform display, the circuit board is damaged.

可以理解,該懸臂架140可用其他具有導向滑軌之定位元件所替代,以調整螺旋測微計160之固定位置。 It will be appreciated that the cantilever frame 140 can be replaced with other positioning elements having guide rails to adjust the fixed position of the helical micrometer 160.

可以理解,該支撐體180及固定部182可用一固持機構替代,用以將電路板600固定。 It can be understood that the support body 180 and the fixing portion 182 can be replaced by a holding mechanism for fixing the circuit board 600.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,本發明之範圍幷不以上述實施方式為限,舉凡熟習本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in accordance with the spirit of the present invention are It should be covered by the following patent application.

100‧‧‧測量裝置 100‧‧‧Measurement device

120‧‧‧基座 120‧‧‧Base

140‧‧‧懸臂架 140‧‧‧cantilever

142‧‧‧立柱 142‧‧‧ column

144‧‧‧懸臂梁 144‧‧‧Cantilever beam

160‧‧‧螺旋測微計 160‧‧‧Spiral micrometer

170‧‧‧滑塊 170‧‧‧ Slider

172‧‧‧滑動部 172‧‧‧Sliding section

1722‧‧‧滑槽 1722‧‧‧Chute

174‧‧‧挾持部 174‧‧‧ Department of Maintenance

176‧‧‧螺栓 176‧‧‧Bolts

180‧‧‧支撐體 180‧‧‧Support

182‧‧‧固定部 182‧‧‧ fixed department

200‧‧‧監控裝置 200‧‧‧Monitor

300‧‧‧攝像頭 300‧‧‧Webcam

400‧‧‧訊號輸出元件 400‧‧‧Signal output components

600‧‧‧電路板 600‧‧‧ boards

606‧‧‧孔 606‧‧‧ hole

608‧‧‧孔 608‧‧‧ hole

900‧‧‧檢測設備 900‧‧‧Testing equipment

Claims (7)

一種用於檢測電路板是否失效之檢測設備,其包括:一測量裝置,其包括一基座、一定位元件、一螺旋測微計及一固持機構,該定位元件固定於所述基座上,該定位元件具有一挾持部,所述挾持部表面開設有一通孔,該螺旋測微計移動地連接於該通孔內,所述螺旋測微計包括一頂針頭及一測量螺桿,所述頂針頭固定連接於測量螺桿之一端用以抵持所述電路板之一端,該固持機構置於所述基座,用以固持所述電路板之另一端;及一監控裝置,其與所述電路板電連接,用以判斷所述電路板是否失效。 A detecting device for detecting whether a circuit board is ineffective, comprising: a measuring device comprising a base, a positioning component, a spiral micrometer and a holding mechanism, wherein the positioning component is fixed on the base The positioning component has a holding portion, a through hole is formed in the surface of the holding portion, and the spiral micrometer is movably connected to the through hole. The spiral micrometer includes a top needle and a measuring screw, and the top a needle fixedly connected to one end of the measuring screw for resisting one end of the circuit board, the holding mechanism being disposed on the base for holding the other end of the circuit board; and a monitoring device and the circuit The board is electrically connected to determine whether the circuit board is invalid. 如申請專利範圍第1項所述之檢測設備,其中所述定位元件包括一懸臂架及一滑塊,該滑塊套設於該懸臂架上。 The detecting device of claim 1, wherein the positioning component comprises a cantilever frame and a slider, and the slider is sleeved on the cantilever frame. 如申請專利範圍第2項所述之檢測設備,其中所述懸臂架包括一立柱及一懸臂梁,該懸臂梁係由所述立柱之一端沿垂直于該立柱之方向延伸而成。 The detecting device of claim 2, wherein the cantilever frame comprises a column and a cantilever beam, and the cantilever beam is formed by extending one end of the column in a direction perpendicular to the column. 如申請專利範圍第3項所述之檢測設備,其中所述滑塊包括一滑動部,該滑動部套設於懸臂架之懸臂梁上,該挾持部固定於滑動部之一側。 The detecting device of claim 3, wherein the slider comprises a sliding portion that is sleeved on a cantilever beam of the cantilever frame, and the holding portion is fixed to one side of the sliding portion. 如申請專利範圍第1項所述之檢測設備,其中所述固持機構為一支撐體,其一端面上設置有一固定部,於該固定部上設有一螺紋孔,一螺釘旋入該螺紋孔中。 The detecting device of claim 1, wherein the holding mechanism is a supporting body, and a fixing portion is disposed on one end surface thereof, and a screw hole is arranged in the fixing portion, and a screw is screwed into the threaded hole. . 如申請專利範圍第1項所述之檢測設備,其中該檢測設備還包括一設置於所述電路板上之攝像頭及一訊號輸出元件,該攝像頭用以攝取一影像並藉由所述訊號輸出元件傳送至所述監控裝置。 The detecting device of claim 1, wherein the detecting device further comprises a camera disposed on the circuit board and a signal output component, wherein the camera is configured to capture an image and output the component by the signal Transfer to the monitoring device. 如申請專利範圍第6項所述之檢測設備,其中該監控裝置為一電腦或一示 波器。 The detecting device of claim 6, wherein the monitoring device is a computer or a display Waves.
TW96104982A 2007-02-12 2007-02-12 Detecting device TWI398635B (en)

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CN117782848B (en) * 2024-02-23 2024-05-14 梨树全创科技有限公司 Circuit board bending performance testing device and testing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542184A (en) * 1977-06-07 1979-01-09 Fujitsu Ltd Plane bending fatigue tester
JPH0886727A (en) * 1994-09-16 1996-04-02 Sumitomo Metal Ind Ltd Evaluating method for cold workability of zirconium pipe
JP2004325374A (en) * 2003-04-28 2004-11-18 Murata Mfg Co Ltd Connection strength evaluating method for component mounted on substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542184A (en) * 1977-06-07 1979-01-09 Fujitsu Ltd Plane bending fatigue tester
JPH0886727A (en) * 1994-09-16 1996-04-02 Sumitomo Metal Ind Ltd Evaluating method for cold workability of zirconium pipe
JP2004325374A (en) * 2003-04-28 2004-11-18 Murata Mfg Co Ltd Connection strength evaluating method for component mounted on substrate

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