TWI398445B - Raw material for forming a strontium-containing thinfilm and process for preparing the raw material - Google Patents
Raw material for forming a strontium-containing thinfilm and process for preparing the raw material Download PDFInfo
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本發明係有關於一種適合藉由化學氣相成長法(Chemical Vapor Deposition法;以下以CVD法來表示)或原子層堆積法(Atomic Layer Deposition法;以下以ALD法來表示)形成含有氧化鍶或硫化鍶的膜料之原料化合物及其製造方法,以及含有鍶的薄膜之形成方法。The present invention relates to a method suitable for forming cerium oxide by chemical vapor growth method (Chemical Vapor Deposition method; hereinafter referred to as CVD method) or atomic layer deposition method (Atomic Layer Deposition method; hereinafter referred to as ALD method) A raw material compound of a film of barium sulfide, a method for producing the same, and a method for forming a film containing barium.
利用CVD法或ALD法之高介電常數之SrTiO3 、SrBi2 Ta2 O9 、SrBi4 Ti4 O15 等膜料被期待作為高積體半導體裝置之介電體,且SrRuO3 膜被研討作為強介電體膜之電極。Film materials such as SrTiO 3 , SrBi 2 Ta 2 O 9 , and SrBi 4 Ti 4 O 15 having a high dielectric constant by CVD or ALD are expected to be dielectrics of high-integration semiconductor devices, and SrRuO 3 films have been studied. As an electrode of a ferroelectric film.
以往,藉由CVD法或ALD法形成該等含有鍶的膜料時之原料主要是研討出雙(二新戊醯甲烷)鍶(Sr(C11 H19 O2 )2 ;以下以Sr(dpm)2 來表示)。In the past, the raw materials for the formation of such ruthenium-containing film materials by CVD or ALD were mainly studied as bis(dipentamethylene methane) ruthenium (Sr(C 11 H 19 O 2 ) 2 ; the following is Sr (dpm) ) 2 to indicate).
然而,由於Sr(dpm)2 係締合成三聚物,因此蒸氣壓係0.1Torr/231℃而非常低,且具有供給上之問題。However, since Sr(dpm) 2 is a triad, the vapor pressure is very low at 0.1 Torr/231 ° C, and there is a problem in supply.
又,由於在構成230℃以上時會開始熱分解,因此,在藉由ALD法成膜時,不僅是所期望之自律速成長,且會具有同時產生難以控制之熱分解之問題。Further, since thermal decomposition starts when the temperature is 230 ° C or higher, when the film is formed by the ALD method, not only the desired autoradial growth but also the problem of simultaneous thermal decomposition which is difficult to control is caused.
故,必須要有一種蒸氣壓更高且與氧化劑之反應性高而熱安定性高之有機鍶化合物。Therefore, it is necessary to have an organic cerium compound having a higher vapor pressure and high reactivity with an oxidizing agent and high thermal stability.
舉例言之,其候補化合物可列舉如:為公知化合物之 雙(五甲環戊二烯)鍶(Sr〔C5 (CH3 )5 〕2 ;以下以SrCp* 2 來表示)。在此,SrCp* 2 並非二乙醚((C2 H5 )2 O;以下以Et2 O來表示)或四氫呋喃(C4 H8 O;以下以THF來表示)等業已配位之加成體。For example, examples of the candidate compound include bis(pentacyclopentadienyl)fluorene (Sr[C 5 (CH 3 ) 5 ] 2 ) which is a known compound; and SrCp * 2 hereinafter. Here, SrCp * 2 is not an already-added adduct such as diethyl ether ((C 2 H 5 ) 2 O; hereinafter referred to as Et 2 O) or tetrahydrofuran (C 4 H 8 O; hereinafter referred to as THF) .
前述加成體由於熱安定性低,且與加熱同時放出加成物並熱變質,因此無法構成安定之蒸氣壓,又,由於加成體中含有氧原子,因此可能會因自分解而供氧,不宜作為ALD法之原料。Since the above-mentioned adduct has low heat stability and emits an adduct at the same time as heating and is thermally degraded, it is impossible to form a stable vapor pressure, and since the adduct contains oxygen atoms, oxygen may be supplied by self-decomposition. It should not be used as a raw material for ALD.
相對於此,由於非加成體之SrCp* 2 為單體,因此在有機鍶化合物中為蒸氣壓最高者之一,且具有與氧化劑之水瞬間反應之適合作為ALD法之原料的性質,又,亦具有可利用五個甲基之影響而輕易地溶解於有機溶劑中的優點。On the other hand, since the SrCp * 2 of the non-additive is a monomer, it is one of the highest vapor pressures among the organic ruthenium compounds, and has a property of being instantaneously reacted with water of the oxidant, which is suitable as a raw material of the ALD method, and It also has the advantage of being easily dissolved in an organic solvent by the influence of five methyl groups.
故,發明人於日本特願2006-330359中揭示SrCp* 2 之製造方法。Therefore, the inventors disclosed the manufacturing method of SrCp * 2 in Japanese Patent Application No. 2006-330359.
然而,由於SrCp* 2 係熔點207℃,且於室溫下為固體,因此,於前述製造方法中,必須藉由昇華操作進行最後精製,又,由於乃藉由極微量之氧、水分變質之固體,因此處理時必須有高價之設備與細心之操作。However, since SrCp * 2 has a melting point of 207 ° C and is solid at room temperature, in the above production method, it is necessary to carry out final purification by sublimation operation, and since it is deteriorated by a very small amount of oxygen and moisture. Solid, so there must be expensive equipment and careful handling when handling.
故,為了能進行精製效率高之蒸餾精製並輕易地進行於惰性氣體環境下之處理,必須要有一種於室溫~50℃之溫度下為液體狀態之化合物。Therefore, in order to carry out distillation purification with high purification efficiency and easy treatment in an inert gas atmosphere, it is necessary to have a compound which is in a liquid state at a temperature of from room temperature to 50 °C.
即,必須要有一種液體化合物,該液體化合物係具有對氧及水分呈活性之環戊二烯基的鍶化合物,且未加成醚類,為單體且蒸氣壓高,並具有容易量產之基團。That is, it is necessary to have a liquid compound which is a cyclopentadienyl ruthenium compound which is active against oxygen and moisture, and which is not added with an ether, is a monomer and has a high vapor pressure, and is easily mass-produced. The group.
不過,前述Sr(dpm)2 等β-二酮系鍶錯合物係於原料中使用金屬Sr來合成,然而,於金屬Sr中含有數ppm之Na或K,且於粗製合成物中亦含有數ppm之Na及K。However, the β-diketone ruthenium complex such as Sr(dpm) 2 is synthesized by using a metal Sr in a raw material, but contains a few ppm of Na or K in the metal Sr, and is also contained in the crude composition. A few ppm of Na and K.
又,由於SrCp* 2 等環戊二烯系鍶化合物係原料使用NaC5 (CH3 )5 (以下以NaCp* 來表示)或KC5 (CH3 )5 (以下以KCp* 來表示)等鹼金屬化合物來合成,因此粗製合成物中含有大量的Na或K。Further, a raw material such as NaC 5 (CH 3 ) 5 (hereinafter referred to as NaCp * ) or KC 5 (CH 3 ) 5 (hereinafter referred to as KCp * ) is used as a raw material of a cyclopentadiene-based ruthenium compound such as SrCp * 2 . The metal compound is synthesized, so the crude composition contains a large amount of Na or K.
由於該等β-二酮系鍶錯合物及SrCp* 2 在接近室溫時之性狀為固體,因此利用蒸餾之精製困難,且難以有效地除去來自原料之Na或K。Since the β-diketone ruthenium complex and SrCp * 2 are solid at a temperature close to room temperature, purification by distillation is difficult, and it is difficult to effectively remove Na or K from the raw material.
故,以往在用以形成含有鍶的薄膜之原料中,要取得Na及K之各含量在50ppb以下是困難的,且並無可適用在CVD或ALD之Na及K的各含量為50ppb以下之用以形成含有鍶的薄膜之原料。Therefore, in the raw materials for forming a film containing ruthenium, it is difficult to obtain a content of Na and K of 50 ppb or less, and it is not applicable to the content of Na and K of CVD or ALD of 50 ppb or less. A material used to form a film containing ruthenium.
故,發明人認為,於市售環戊二烯化合物中,可使用結構與五甲環戊二烯類似之四甲(n-丙基)環戊二烯(C5 (CH3 )4 (C3 H7 )H)來合成的化合物之雙(丙四甲環戊二烯)鍶(Sr〔C5 (CH3 )4 (C3 H7 )〕2 Sr〔C5 (CH3 )4 (C3 H7 )〕2 ;以下以Sr(PrMe4 Cp)2 來表示)是較為理想的。Therefore, the inventors believe that in the commercially available cyclopentadiene compound, tetramethyl(n-propyl)cyclopentadiene (C 5 (CH 3 ) 4 (C) having a structure similar to pentacyclopentadiene can be used. 3 H 7 )H) The compound to be synthesized is bis(propenylcyclopentadiene) ruthenium (Sr[C 5 (CH 3 ) 4 (C 3 H 7 )) 2 Sr[C 5 (CH 3 ) 4 ( C 3 H 7 )] 2 ; the following is preferably represented by Sr(PrMe 4 Cp) 2 ).
Sr(PrMe4 Cp)2 係揭示於歐洲專利第1645656號說明書,且註冊為CAS No.882296-98-2之化合物。The Sr(PrMe 4 Cp) 2 line is disclosed in the specification of European Patent No. 1645656 and is registered as a compound of CAS No. 882296-98-2.
又,於“MOCVD & CVD Precursors”,Strem公司,1999年,CVD11/ 99,p.22中,揭示有一種於Sr(PrMe4 Cp)2 中加成1,2-二甲氧乙烷(CH3 OC2 H4 OCH3 ;以下以DME來表示)之化合物。Further, in "MOCVD & CVD Precursors", Strem, 1999, CVD 11/99, p. 22, there is disclosed an addition of 1,2-dimethoxyethane (Sr(PrMe 4 Cp) 2 ). 3 OC 2 H 4 OCH 3 ; the following compound represented by DME).
然而,於前述歐洲專利第1645656號說明書中,只不過是在第七實施例之表中揭示,藉由將三甲銦與單乙胂作為原料之MOCVD使InAs膜於600℃下成長時,以觸媒量(<0.25莫耳%)使Sr(PrMe4 Cp)2 共存,且Sr(PrMe4 Cp)2 係添加作為微量觸媒,實質上在膜中並未含有Sr,且完全未揭示有關Sr(PrMe4 Cp)2 之製法或物性。However, in the specification of the aforementioned European Patent No. 1645656, it is only disclosed in the table of the seventh embodiment that the InAs film is grown at 600 ° C by MOCVD using trimethyl indium and monoethyl hydrazine as a raw material. The amount of media (<0.25 mol%) makes Sr(PrMe 4 Cp) 2 coexist, and Sr(PrMe 4 Cp) 2 is added as a trace catalyst, which does not substantially contain Sr in the film, and does not reveal about Sr at all. (PrMe 4 Cp) 2 method or physical property.
又,於前述“MOCVD & CVD Precursors”,Strem公司,1999年,CVD11/99,p.22中,亦未揭示有未加成醚類之Sr(PrMe4 Cp)2 。Further, in the above-mentioned "MOCVD & CVD Precursors", Strem, 1999, CVD 11/99, p. 22, Sr(PrMe 4 Cp) 2 having no ether added is also not disclosed.
環戊二烯系鍶化合物係於合成為加成有醚類之化合物後除去醚類所取得之化合物,且未經由加成體來合成是困難的,又,要除去加成之醚類並不容易。The cyclopentadienyl hydrazine compound is a compound obtained by synthesizing a compound obtained by adding an ether, and then removing the ether, and it is difficult to synthesize it without using an adduct, and it is difficult to remove the added ether. easily.
因此,迄今並不清楚Sr(PrMe4 Cp)2 之製造方法或物性,且並未形成以此為原料而含有Sr作為主成分之薄膜,又,於Sr(PrMe4 Cp)2 之製造方法中,所使用之醚化合物種與除去醚類之方法變得重要。Therefore, the production method or physical properties of Sr(PrMe 4 Cp) 2 have not been known so far, and a film containing Sr as a main component as a raw material has not been formed, and in the production method of Sr(PrMe 4 Cp) 2 The type of ether compound used and the method of removing ethers become important.
又,於形成半導體薄膜之材料中,即便只有摻入些許Na,亦會產生半導體界面之電場不均或導體薄膜之腐蝕等大幅損害半導體特性之情形,因此必須使有機鍶錯合物中的Na濃度接近0,且K亦必須相同。Further, in the material for forming the semiconductor thin film, even if only a slight amount of Na is incorporated, the electric field unevenness at the semiconductor interface or the corrosion of the conductor film greatly impairs the semiconductor characteristics, and therefore it is necessary to make Na in the organic germanium complex. The concentration is close to 0 and K must be the same.
本發明乃有鑒於上述實情而完成者。目的係提供一種用以形成含有鍶的薄膜之原料,該用以形成含有鍶的薄膜之原料係於室溫~50℃下為液體且可蒸餾精製,為單體且蒸氣壓高,容易量產且利用環戊二烯系鍶化合物來達成。The present invention has been completed in view of the above circumstances. The object of the invention is to provide a raw material for forming a film containing ruthenium. The raw material for forming a film containing ruthenium is liquid at room temperature to 50 ° C and can be distilled and refined, is a monomer and has a high vapor pressure, and is easily mass-produced. It is also achieved by using a cyclopentadiene ruthenium compound.
又,本發明之目的係亦提供一種可減低Na及K之含量之含有鍶的薄膜。Further, it is an object of the present invention to provide a film containing ruthenium which can reduce the contents of Na and K.
又,本發明之目的係亦提供一種前述化合物之製造方法。Further, it is an object of the present invention to provide a process for producing the aforementioned compound.
有關本發明之用以形成含有鍶的薄膜之原料係Sr(PrMe4 Cp)2 。The raw material for forming a film containing ruthenium according to the present invention is Sr(PrMe 4 Cp) 2 .
於前述用以形成含有鍶的薄膜之原料中,較為理想的是K及Na之各含量為50ppb以下。In the above-mentioned raw material for forming a film containing ruthenium, it is preferred that the respective contents of K and Na are 50 ppb or less.
又,有關本發明之用以形成含有鍶的薄膜之原料之製造方法係經由以下程序取得Sr(PrMe4 Cp)2 者,即:使丙四甲環戊二烯鈉(以下以Na(PrMe4 Cp)來表示)或丙四甲環戊二烯鉀(以下以K(PrMe4 Cp)來表示)與碘化鍶(SrI2 )於THF中反應,並生成Sr(PrMe4 Cp)2 之THF加成體之程序;蒸餾除去THF,且藉由甲苯萃取而作成甲苯溶液之程序;蒸餾除去甲苯並進行減壓乾燥之程序;及於真空下加熱至100~160℃,並於解離除去THF後進行蒸餾之程序。Further, the method for producing a raw material for forming a film containing ruthenium according to the present invention is obtained by the following procedure: Sr(PrMe 4 Cp) 2 is obtained by using sodium perylenetetracyclopentadiene (hereinafter, Na(PrMe 4 ) Cp) or potassium tetramethylcyclopentadiene (hereinafter referred to as K(PrMe 4 Cp)) is reacted with cerium iodide (SrI 2 ) in THF to form THF of Sr(PrMe 4 Cp) 2 Procedure for addition; distillation to remove THF, and toluene solution by toluene extraction; distillation to remove toluene and drying under reduced pressure; and heating to 100-160 ° C under vacuum, and dissociation to remove THF The procedure for distillation is carried out.
屬本發明用以形成含有鍶的薄膜之原料之Sr(PrMe4 Cp)2 係適合量產之液體化合物,且可適當地藉由有關本發明之製造方法來取得。The Sr(PrMe 4 Cp) 2 which is a raw material for forming a film containing ruthenium according to the present invention is a liquid compound suitable for mass production, and can be suitably obtained by the production method of the present invention.
又,屬本發明形成含有鍶的薄膜之材料之Sr(PrMe4 Cp)2 係由於蒸氣壓高且於室溫下之性狀為液體,因此可進行蒸餾精製,且相較於公知形成含有鍶的薄膜之材料,可大幅地減低對於半導體特性造成大幅影響之Na及K之含量。Further, since Sr(PrMe 4 Cp) 2 which is a material for forming a film containing ruthenium according to the present invention has a high vapor pressure and a liquid at room temperature, it can be purified by distillation, and is formed to contain ruthenium. The material of the film can greatly reduce the content of Na and K which greatly affect the semiconductor characteristics.
因此,若使用藉由本發明所取得之Sr(PrMe4 Cp)2 ,則可藉由CVD法或ALD法將含有鍶的膜料量產,且可形成能減低Na及K含量之含有鍶的薄膜。Therefore, when Sr(PrMe 4 Cp) 2 obtained by the present invention is used, the film containing ruthenium can be mass-produced by CVD or ALD, and a film containing ruthenium capable of reducing Na and K contents can be formed. .
以下更詳細地說明本發明。The invention is explained in more detail below.
有關本發明之用以形成含有鍶的薄膜之原料係Sr(PrMe4 Cp)2 。The raw material for forming a film containing ruthenium according to the present invention is Sr(PrMe 4 Cp) 2 .
為該原料化合物之Sr(PrMe4 Cp)2 可適當地藉由有關本發明之製造方法來取得。Sr(PrMe 4 Cp) 2 which is the starting material compound can be suitably obtained by the production method of the present invention.
具體而言,經由以下程序,可取得Sr(PrMe4 Cp)2 ,即:使Na(PrMe4 Cp)或K(PrMe4 Cp)與SrI2 於THF中反應,並生成Sr(PrMe4 Cp)2 之THF加成體之程序;蒸餾除去THF,且藉由甲苯萃取而作成甲苯溶液之程序;蒸餾除去甲苯並進行減壓乾燥之程序;及於真空下加熱至100~160℃,並於解離除去THF後進行蒸餾之程序。Specifically, Sr(PrMe 4 Cp) 2 can be obtained by the following procedure, that is, Na(PrMe 4 Cp) or K(PrMe 4 Cp) is reacted with SrI 2 in THF, and Sr(PrMe 4 Cp) is produced. Procedure for THF addition of 2 ; distillation of THF and extraction with toluene to prepare a toluene solution; distillation to remove toluene and drying under reduced pressure; and heating to 100-160 ° C under vacuum, and dissociation The procedure for distillation after removal of THF.
以下依序地說明該製造程序。The manufacturing procedure will be described in order below.
首先,Na(PrMe4 Cp)可藉由下述方法等公知方法來取得,即:使市售之丙四甲環戊二烯(C5 (CH3 )4 (C3 H7 )H;別名:四甲(正丙基)環戊二烯) (Strem公司製造,Alfa Aesar公司製造等)於液體NH3 中與NaNH2 反應之方法;或於THF或DME中與NaH反應之方法。First, Na(PrMe 4 Cp) can be obtained by a known method such as the following method, that is, commercially available propenylcyclopentadiene (C 5 (CH 3 ) 4 (C 3 H 7 )H; : tetramethyl (n-propyl) cyclopentadiene) (manufactured by Strem Corporation, manufactured by Alfa Aesar Co., Ltd.), a method of reacting with NaNH 2 in liquid NH 3 ; or a method of reacting with NaH in THF or DME.
K(PrMe4 Cp)亦可藉由相同之方法取得。K (PrMe 4 Cp) can also be obtained by the same method.
其次,將藉由前述所取得之Na(PrMe4 Cp)或K(PrMe4 Cp)及無水SrI2 溶解於Sr(PrMe4 Cp)2 之合成反應溶劑的THF中,合成反應會輕易地進行,並生成Sr(PrMe4 Cp)2 (THF)加成體。Next, the Na(PrMe 4 Cp) or K(PrMe 4 Cp) and the anhydrous SrI 2 obtained in the above are dissolved in THF of a synthesis reaction solvent of Sr(PrMe 4 Cp) 2 , and the synthesis reaction proceeds easily. And Sr(PrMe 4 Cp) 2 (THF) adduct was produced.
另,合成反應溶劑使用DME時,雖然可輕易地生成Sr(PrMe4 Cp)2 (DME)加成體,然而,如下述第一比較例所示,由於之後無法輕易地除去DME,因此DME並不適合。Further, when DME is used as the synthesis reaction solvent, the Sr(PrMe 4 Cp) 2 (DME) adduct can be easily formed. However, as shown in the first comparative example below, DME cannot be easily removed afterwards, so DME is Not suitable.
又,溶劑使用二乙醚時,由於反應原料之溶解度小且反應速度低而容積效率差,因此二乙醚亦不適合。Further, when diethyl ether is used as the solvent, the solubility of the reaction raw material is small, the reaction rate is low, and the volumetric efficiency is poor, so diethyl ether is also unsuitable.
在結束合成反應後,蒸餾除去THF溶劑,並藉由甲苯萃取Sr(PrMe4 Cp)2 (THF)加成體,由於甲苯可充分地溶解該加成體,然而副生成物之碘化鈉或碘化鉀卻完全不會溶解,因此萃取容易。After the completion of the synthesis reaction, the THF solvent is distilled off, and the Sr(PrMe 4 Cp) 2 (THF) adduct is extracted by toluene, and the adduct is sufficiently dissolved by toluene, whereas the by-product sodium iodide or Potassium iodide does not dissolve at all, so extraction is easy.
自萃取後之甲苯溶液蒸餾除去甲苯並進行減壓乾燥,藉此,可取得Sr(PrMe4 Cp)2 (THF)加成體,該THF加成體之熔點約130℃。The toluene solution was distilled off from the extracted toluene solution and dried under reduced pressure to obtain an Sr(PrMe 4 Cp) 2 (THF) adduct having a melting point of about 130 ° C.
若將該加成體於0.001~0.1Torr之真空下加熱至100~160℃,則釜內會構成熔液狀態,且業已解離之THF會積存於深冷之分離器,若分離器內之 積存停止增加,則藉由在160~180℃/0.01~0.1Torr下的蒸餾操作,蒸餾出Sr(PrMe4 Cp)2 。If the adduct is heated to 100-160 ° C under a vacuum of 0.001 to 0.1 Torr, the melt state will be formed in the autoclave, and the dissociated THF will accumulate in the cryogenic separator, if accumulated in the separator. When the increase is stopped, Sr(PrMe 4 Cp) 2 is distilled off by a distillation operation at 160 to 180 ° C / 0.01 to 0.1 Torr.
依此所取得之Sr(PrMe4 Cp)2 係室溫下不會固化之黏性液體。The Sr(PrMe 4 Cp) 2 obtained in this way is a viscous liquid which does not solidify at room temperature.
若使用藉由前述方法所取得之Sr(PrMe4 Cp)2 作為原料,則可利用CVD法或ALD法安定地形成含有鍶的氧化物膜、硫化物膜等。When Sr(PrMe 4 Cp) 2 obtained by the above method is used as a raw material, an oxide film containing a ruthenium, a sulfide film, or the like can be stably formed by a CVD method or an ALD method.
又,若藉由前述有關本發明之製造方法,則可取得K及Na之各含量為50ppb以下之Sr(PrMe4 Cp)2 。Further, according to the above-described production method of the present invention, Sr(PrMe 4 Cp) 2 having a K and Na content of 50 ppb or less can be obtained.
因此,若使用藉由本發明製造方法所取得之K及Na含量少的Sr(PrMe4 Cp)2 作為原料,並形成SrTiO3 膜、(Ba,Sr)TiO3 膜、SrRuO3 膜等含有鍶的薄膜,則可比以往更減低薄膜中K及Na之各含量。Therefore, when Sr(PrMe 4 Cp) 2 having a small K and Na content obtained by the production method of the present invention is used as a raw material, a SrTiO 3 film, a (Ba, Sr)TiO 3 film, or a SrRuO 3 film containing ruthenium is formed. The film can reduce the content of K and Na in the film more than ever.
膜料形成時之Sr(PrMe4 Cp)2 之供給方法可使用以下方法,即:將Sr(PrMe4 Cp)2 加熱至130~350℃而作成具有流動性之液體,並藉由將載體氣體起泡而使其氣化之方法;或將Sr(PrMe4 Cp)2 溶解於惰性之碳氫化合物溶劑並藉由液體質量流量計進行供給,且利用130~350℃之氣化器使其全量氣化之方法等。The method of supplying Sr(PrMe 4 Cp) 2 at the time of film formation can be carried out by heating Sr(PrMe 4 Cp) 2 to 130 to 350 ° C to form a liquid having fluidity, and by using a carrier gas a method of foaming and vaporizing it; or dissolving Sr(PrMe 4 Cp) 2 in an inert hydrocarbon solvent and supplying it by a liquid mass flow meter, and using a gasifier of 130 to 350 ° C to make it full Gasification method, etc.
藉由起泡法供給Sr(PrMe4 Cp)2 時,其汽缸溫度並不限於下述實施例之溫度,可於130~350℃間設定,此時之載體氣體只要是惰性氣體即可,且除了A r以外可使用N2 、He。又,其流量過少時亦無法運送蒸氣,而若過多,則由於汽缸內壓會上升並妨礙原料之蒸發,因此宜為30~500sccm。When the Sr(PrMe 4 Cp) 2 is supplied by the foaming method, the cylinder temperature is not limited to the temperature of the following examples, and can be set between 130 and 350 ° C. The carrier gas at this time is only an inert gas, and N 2 and He can be used in addition to A r . Further, when the flow rate is too small, the vapor cannot be transported. If the flow rate is too large, the internal pressure of the cylinder rises and the evaporation of the raw material is hindered. Therefore, it is preferably 30 to 500 sccm.
又,將Sr(PrMe4 Cp)2 溶解於溶劑中而降低黏度並於氣化器進行液體運送而氣化時,其黏度並不限於下述實施例之溫度,只要是50cP以下即可,若為此種範圍之黏度,則可降低於配管及氣化器內阻塞之危險性。Further, when Sr(PrMe 4 Cp) 2 is dissolved in a solvent to lower the viscosity and is vaporized by liquid transport in a vaporizer, the viscosity is not limited to the temperature of the following examples, and may be 50 cP or less. For this range of viscosity, the risk of blockage in the piping and gasifier can be reduced.
又,溶劑宜使用溶解度最高之甲苯,然而,在藉由低濃度溶液即可時,則不限於甲苯,亦可使用溶解性較優異之己烷或辛烷。Further, the solvent is preferably a toluene having the highest solubility. However, when it is a solvent having a low concentration, it is not limited to toluene, and hexane or octane having excellent solubility can also be used.
若使用藉由前述方法氣化之Sr(PrMe4 Cp)2 之蒸氣與Ti(OiPr)4 、Ti(OtBu)4 、Ti(NMe2 )4 、Ti(NEtMe)4 、Ti(NEt2 )4 等鈦化合物之蒸氣及氧、臭氧、水等作為氧化劑,則可利用CVD法或ALD法製造SrTiO3 膜。If the vapor of Sr(PrMe 4 Cp) 2 vaporized by the aforementioned method is used, Ti(OiPr) 4 , Ti(OtBu) 4 , Ti(NMe 2 ) 4 , Ti(NEtMe) 4 , Ti(NEt 2 ) 4 When a vapor of a titanium compound, oxygen, ozone, water or the like is used as an oxidizing agent, a SrTiO 3 film can be produced by a CVD method or an ALD method.
又,若於Sr(PrMe4 Cp)2 蒸氣中加入Ba(PrMe4 Cp)2 蒸氣,並使用Ti(OiPr)4 、Ti(OtBu)4 、Ti(NMe2 )4 、Ti(NEtMe)4 、Ti(NEt2 )4 等鈦化合物之蒸氣與氧、臭氧、水等作為氧化劑,則可利用CVD法或ALD法製造(Ba,Sr)TiO3 膜。Further, when in Sr (PrMe 4 Cp) was added Ba (PrMe 4 Cp) 2 vapor 2 vapor, and the use of Ti (OiPr) 4, Ti ( OtBu) 4, Ti (NMe 2) 4, Ti (NEtMe) 4, When a vapor of a titanium compound such as Ti(NEt 2 ) 4 and oxygen, ozone, water or the like is used as an oxidizing agent, a (Ba, Sr)TiO 3 film can be produced by a CVD method or an ALD method.
再者,若使用Sr(PrMe4 Cp)2 蒸氣與Ru(EtCp)2 等釕化合物之蒸氣及氧、臭氧、水等作為氧化劑,則可利用CVD法或ALD法製造SrRuO3 膜。Further, when Sr(PrMe 4 Cp) 2 vapor and a vapor of a ruthenium compound such as Ru(EtCp) 2 and oxygen, ozone, water or the like are used as the oxidizing agent, the SrRuO 3 film can be produced by a CVD method or an ALD method.
以下依據實施例更具體說明本發明,然而本發明並不限於下述實施例。Hereinafter, the present invention will be more specifically described based on examples, but the present invention is not limited to the following examples.
於具有溫度計、攪拌子、投入口、回流器之1L三口燒瓶中,在真空氬取代後注入脫水脫氧之THF600ml與Na(PrMe4 Cp)75g(0.40莫耳)並溶解,且將燒瓶進行水冷並加入SrI2 粉末72g(0.21莫耳),且以40℃攪拌八小時。In a 1 L three-necked flask equipped with a thermometer, a stirrer, an inlet, and a reflux, after dehydration of vacuum argon, 600 ml of dehydrated deoxidized THF and 75 g of Na(PrMe 4 Cp) (0.40 mol) were injected and dissolved, and the flask was water-cooled. 72 g (0.21 mol) of SrI 2 powder was added, and stirred at 40 ° C for eight hours.
其次,於減壓下進行去溶劑,乾燥後加入脫水脫氧之甲苯600ml,並進行利用加熱攪拌之萃取操作,靜置後進行過濾並取得透明濾液,且自濾液將甲苯進行減壓蒸餾除去,並以100℃進行減壓乾燥,取得熔點約130℃之淡黃色固體(減壓乾燥品)89g。Next, the solvent is removed under reduced pressure, and after drying, 600 ml of dehydrated deoxidized toluene is added, and extraction operation by heating and stirring is carried out, and after standing, filtration is carried out to obtain a transparent filtrate, and toluene is distilled off from the filtrate under reduced pressure, and The mixture was dried under reduced pressure at 100 ° C to obtain 89 g of pale yellow solid (dry-dried product) having a melting point of about 130 °C.
將該固體注入高真空蒸餾裝置中,並於110~160℃/0.1~0.01Torr下保持一小時之際,THF加成體之THF會慢慢地脫離,並積存於深冷分離器中8.1g。在慢慢地升溫並除去微量之初餾結晶後,於170~180℃/0.1~0.01Torr下取得主餾之淡黃色黏性液體61g。The solid was poured into a high-vacuum distillation apparatus and maintained at 110-160 ° C / 0.1-0.01 Torr for one hour. The THF of the THF adduct slowly separated and accumulated in the cryogenic separator 8.1 g. . After slowly raising the temperature and removing a trace amount of the preliminary distillation crystal, 61 g of a pale yellow viscous liquid which was subjected to main distillation was obtained at 170 to 180 ° C / 0.1 to 0.01 Torr.
將該黏性液體再度地注入高真空蒸餾裝置中,並於100~160℃/0.1~0.01Torr下保持約一小時,且除去微量之殘留THF,並於170~180℃/0.01~0.1Torr下取得主餾之淡黃色黏性液體(二次蒸餾品)56g。The viscous liquid is again injected into the high vacuum distillation apparatus, and kept at 100-160 ° C / 0.1 ~ 0.01 Torr for about one hour, and a trace amount of residual THF is removed, and at 170 ~ 180 ° C / 0.01 ~ 0.1 Torr A pale yellow viscous liquid (secondary distillate) of main distillation was obtained in an amount of 56 g.
該二次蒸餾品在下述分析之結果中鑑定為Sr(PrMe4 Cp)2 (0.136莫耳),其收率相對於Na(P rMe4 Cp)為68%。This secondary distillate was identified as Sr(PrMe 4 Cp) 2 (0.136 mol) in the results of the analysis described below, and its yield was 68% with respect to Na (P rMe 4 Cp).
以下說明二次蒸餾品之鑑定分析及物性評價之方法及結果。The methods and results of the identification analysis and physical property evaluation of the secondary distillation product are described below.
(一)組成分析 進行濕式分解所取得之液體之ICP發光分光分析之結果,Sr含量為20.7%(理論值21.15%)。(1) Composition analysis As a result of ICP emission spectroscopic analysis of the liquid obtained by wet decomposition, the Sr content was 20.7% (theoretical value: 21.15%).
又,雜質方面,Ca=1900,Mg<50,Ba=10000,Na<50,K<50,Cr<50,Fe<50,Cu<50,Ni<50(單位:ppb),確認為高純度。Further, in terms of impurities, Ca = 1900, Mg < 50, Ba = 10000, Na < 50, K < 50, Cr < 50, Fe < 50, Cu < 50, and Ni < 50 (unit: ppb), which is confirmed to be high purity. .
(二)1 H-NMR(1 H-核磁共振) 測定條件(裝置:JNM-ECA400(400MHz),溶劑:C6 D6 ,方法:1D)(2) 1 H-NMR ( 1 H-nuclear magnetic resonance) measurement conditions (device: JNM-ECA400 (400 MHz), solvent: C 6 D 6 , method: 1D)
第一圖係顯示二次蒸餾品之測定結果,為了加以比較,第二圖係顯示減壓乾燥品之結果。The first graph shows the results of the measurement of the secondary distillate. For comparison, the second graph shows the results of the reduced-pressure dried product.
考慮第一圖、第二圖之測定光譜中各信號之位置與H之個數、Sr(PrMe4 Cp)2 與THF之H個數之比率,針對δH(ppm)如下述般進行歸屬。Considering the ratio of the position of each signal in the measurement spectrum of the first graph and the second graph to the number of H, the ratio of the number of H of Sr(PrMe 4 Cp) 2 and THF, the δH (ppm) is assigned as follows.
2.01(s),1.97(s)12H:離開C5 (CH 3 )4 之-C3 H7 之CH3 兩個與接近之CH3 兩個2.39(t)2H:CH 2 CH2 CH3 1.36(m)2H:CH2 CH 2 CH3 0.92(t)3H:CH2 CH2 CH 3 3.14(t),1.21(m):THF之-OCH 2 CH 2 CH 2 CH 2 -2.01 (s), 1.97 (s ) 12H: leaving the C 5 (C H 3) 4 of the -C 3 H 7 CH 3 CH 3 near to two two 2.39 (t) 2H: C H 2 CH 2 CH 3 1.36(m)2H:CH 2 C H 2 CH 3 0.92(t)3H:CH 2 CH 2 C H 3 3.14(t), 1.21(m): THF-OC H 2 C H 2 C H 2 C H 2 -
依據第一圖所示之測定光譜,二次蒸餾品係加成於Sr1莫耳之THF之莫耳數為(0.348+0.437)/(23.562+4.131+4.136+6)×38/8=0.09,平均化學式構成Sr(PrMe4 Cp)2 (THF)0.09 ,雖然THF稍微配位,然而,實質上可視為Sr(PrMe4 Cp)2 。According to the measured spectrum shown in the first figure, the number of moles of the THF added to the Sr1 molar of the secondary distillation product is (0.348+0.437)/(23.562+4.131+4.136+6)×38/8=0.09, The average chemical formula constitutes Sr(PrMe 4 Cp) 2 (THF) 0.09 , and although THF is slightly coordinated, it can be regarded as substantially Sr(PrMe 4 Cp) 2 .
另,依據第二圖所示之測定光譜,減壓乾燥品係加成於Sr1莫耳之THF莫耳數為(2.076+2.046)/(11.296+1.981+1.890+3)×38/8=1.08,平均化學式構成Sr(PrMe4 Cp)2 (THF)1.08 。In addition, according to the measured spectrum shown in the second figure, the THF molar amount of the reduced-pressure dried strain added to Sr1 molar is (2.076+2.046)/(11.296+1.981+1.890+3)×38/8=1.08 The average chemical formula constitutes Sr(PrMe 4 Cp) 2 (THF) 1.08 .
又,相對於Sr(PrMe4 Cp)2 (THF)1 之Sr含量理論值為18.02%,減壓乾燥品之Sr含量分析值為18.1%。Further, the theoretical value of the Sr content of Sr(PrMe 4 Cp) 2 (THF) 1 was 18.02%, and the analysis value of the Sr content of the reduced-pressure dried product was 18.1%.
依此,推定減壓乾燥品係加成約一個THF之Sr(PrMe4 Cp)2 。Accordingly, it is estimated that the reduced-pressure dried product is added with about one THF of Sr(PrMe 4 Cp) 2 .
(三)性狀與熔點 二次蒸餾品係微淡黃色,且為室溫下黏性非常強之液體,黏度約1000P。(3) traits and melting point The secondary distillation product is slightly yellowish and is a highly viscous liquid at room temperature with a viscosity of about 1000P.
(四)熱重/熱差分析(TG-DTA) 測定條件(試料重量:14.40mg,氣體環境:Ar一大氣壓,升溫速度:10.0deg/min)(4) Thermogravimetry/thermal differential analysis (TG-DTA) Measurement conditions (sample weight: 14.40 mg, gas atmosphere: Ar at a gas pressure, temperature increase rate: 10.0 deg/min)
第三圖係顯示二次蒸餾品之測定結果,為了加以比較,第四圖係顯示減壓乾燥品之結果。The third graph shows the results of the measurement of the secondary distillate. For comparison, the fourth graph shows the results of the reduced-pressure dried product.
依據第三圖、第四圖所示之TG-DTA曲線,二次 蒸餾品至160℃附近無減量,推定除去之THF並不存在。According to the TG-DTA curve shown in the third and fourth figures, twice There was no reduction in the distillate to around 160 ° C, and it was presumed that the removed THF did not exist.
又,由於到300℃為止會蒸發97%,因此在分等級之短時間內於300℃以下不會熱劣化,可確認具有ALD法或CVD法之原料所要求之熱安定性。In addition, since it evaporates by 97% at 300 ° C, it is not thermally deteriorated at 300 ° C or less in a short time, and the thermal stability required for the raw material having the ALD method or the CVD method can be confirmed.
(五)蒸氣壓 氣體飽和法測定之結果為0.1Torr/170℃。(5) Vapor pressure The result of the gas saturation method was 0.1 Torr / 170 °C.
(六)密度 密度係1.2g/cm3 (30℃)。(6) The density density is 1.2 g/cm 3 (30 ° C).
(七)溶解度 相對於1L之各溶劑於室溫下之溶解度係相對於甲苯為350g,相對於THF為280g,相對於己烷為70g,相對於辛烷為70g。(7) Solubility The solubility at room temperature with respect to 1 L of each solvent was 350 g with respect to toluene, 280 g with respect to THF, 70 g with respect to hexane, and 70 g with respect to octane.
依此,確認可非常充分地溶解於甲苯中,且在辛烷等中亦可較充分地溶解。Accordingly, it was confirmed that it was sufficiently dissolved in toluene, and it was also sufficiently dissolved in octane or the like.
於具有溫度計、攪拌子、投入口、回流器之300ml三口燒瓶中,在真空氬取代後注入脫水脫氧之THF160ml與Na(PrMe4 Cp)16g(0.086莫耳)並溶解,且將燒瓶進行水冷並加入SrI2 粉末15.5g(0.045莫耳),且於回流下攪拌八小時。In a 300 ml three-necked flask equipped with a thermometer, a stirrer, an inlet, and a reflux, after dehydration with vacuum argon, 160 ml of dehydrated deoxidized THF and 16 g of Na(PrMe 4 Cp) (0.086 mol) were injected and dissolved, and the flask was water-cooled. 15.5 g (0.045 mol) of SrI 2 powder was added and stirred under reflux for eight hours.
其次,於減壓下進行去溶劑,乾燥後加入脫水脫氧之甲苯200ml,並進行利用加熱攪拌之萃取操作,靜置後進行過濾並取得透明濾液,且自濾液將甲苯進行減壓蒸 餾除去,並以100℃進行減壓乾燥時,起初雖為淡黃色之黏液,但一日後可取得熔點約100℃之固體18.5g。Next, the solvent was removed under reduced pressure, and after drying, 200 ml of dehydrated deoxidized toluene was added, and extraction operation by heating and stirring was carried out, and after standing, filtration was carried out to obtain a transparent filtrate, and toluene was distilled off from the filtrate. When it was distilled off and dried under reduced pressure at 100 ° C, it was initially a pale yellow mucus, but 18.5 g of a solid having a melting point of about 100 ° C was obtained after one day.
將該固體注入高真空蒸餾裝置中,並於110~160℃/0.1~0.01Torr下保持一小時,此時DME加成體之DME會慢慢地脫離,並積存於深冷分離器中1.2g。在慢慢地升溫並除去極微量之初餾後,於170~175℃/0.1~0.01Torr下,主餾係取得以液體蒸餾出且於室溫下固化之淡黃色固體(熔點約50~80℃)(一次蒸餾品)14.7g。The solid is injected into a high vacuum distillation apparatus and maintained at 110-160 ° C / 0.1 ~ 0.01 Torr for one hour, at which time the DME of the DME adduct will slowly detach and accumulate in the cryogenic separator 1.2 g . After slowly raising the temperature and removing a very small amount of preliminary distillation, the main distillation system obtains a pale yellow solid which is liquid distilled and solidified at room temperature (melting point about 50-80) at 170-175 ° C / 0.1-0.01 Torr. °C) (primary distillation) 14.7g.
將該固體再度地注入高真空蒸餾裝置中,並於100~160℃/0.1~0.01Torr下保持一小時後升溫,又,於170~175℃/0.01~0.1Torr下,主餾係取得以液體蒸餾出且於室溫下固化之淡黃色固體(熔點約50~80℃)(二次蒸餾品)12.8g。The solid is again injected into the high vacuum distillation apparatus, and is heated at 100 to 160 ° C / 0.1 to 0.01 Torr for one hour, and then heated at 170 to 175 ° C / 0.01 to 0.1 Torr. The pale yellow solid (melting point about 50 to 80 ° C) (secondary distillation) which was distilled off and solidified at room temperature was 12.8 g.
該二次蒸餾品係與第一實施例相同地進行1 H-NMR及TG-DTA之測定。This secondary distillation product was subjected to measurement of 1 H-NMR and TG-DTA in the same manner as in the first example.
(一)1 H-NMR 第五圖係顯示二次蒸餾品之測定結果。(1) 1 H-NMR The fifth graph shows the measurement results of the secondary distillate.
考慮第五圖之測定光譜中各信號之位置與H之個數、Sr(PrMe4 Cp)2 與DME之H個數之比率,針對δH(ppm)如下述般進行歸屬。Consider the ratio of the position of each signal in the measurement spectrum of the fifth graph to the number of H, the number of H of Sr(PrMe 4 Cp) 2 and DME, and the δH (ppm) is assigned as follows.
2.15(s),2.12(s)12H:離開C5 (CH 3 )4 之-C3 H7 之CH3 兩個與接近之CH3 兩個2.47(t)2H:CH 2 CH2 CH3 1.63(m)2H:CH2 CH 2 CH3 1.08(t)3H:CH2 CH2 CH 3 2.69(t),2.59(m):DME之CH 3 OCH 2 CH 2 OCH 3 2.15 (s), 2.12 (s ) 12H: leaving the C 5 (C H 3) 4 of the -C 3 H 7 CH 3 CH 3 near to two two 2.47 (t) 2H: C H 2 CH 2 CH 3 1.63(m)2H:CH 2 C H 2 CH 3 1.08(t)3H:CH 2 CH 2 C H 3 2.69(t), 2.59(m): C H 3 OC H 2 C H 2 OC H of DME 3
依據第五圖所示之測定光譜,二次蒸餾品係加成於Sr1莫耳之DME之莫耳數為(2.921+1.961)/(11.726+1.945+1.901+3)×38/10=1.00,平均化學式構成Sr(PrMe4 Cp)2 (DME)1.00 。According to the measured spectrum shown in the fifth figure, the molar number of the DME of the secondary distillation product added to the Sr1 molar is (2.921 + 1.961) / (11.726 + 1.945 + 1.901 + 3) × 38/10 = 1.00, The average chemical formula constitutes Sr(PrMe 4 Cp) 2 (DME) 1.00 .
又,可看見因許多雜質所造成之信號,並推測於加熱蒸餾中產生加成體之熱分解等。Further, a signal due to a large amount of impurities can be seen, and it is presumed that thermal decomposition or the like of the adduct is generated in the heating distillation.
又,相對於Sr(PrMe4 Cp)2 (DME)1 之Sr含量理論值為17.37%,二次蒸餾品之Sr含量分析值為18.2%。Further, the theoretical value of the Sr content of Sr(PrMe 4 Cp) 2 (DME) 1 was 17.37%, and the analysis value of the Sr content of the secondary distillate was 18.2%.
依此,於真空加熱蒸餾操作中,確認DME難以脫離DME加成體。Accordingly, in the vacuum heating distillation operation, it was confirmed that DME was difficult to separate from the DME adduct.
(二)TG-DTA 第六圖係顯示二次蒸餾品之測定結果。(2) TG-DTA The sixth graph shows the measurement results of the secondary distillate.
依據第六圖所示之TG-DTA曲線,並未發現DME脫離之舉動,推定大部分是以DME加成體之狀態直接蒸發。According to the TG-DTA curve shown in the sixth figure, the behavior of DME detachment was not found, and it was presumed that most of the evaporation was directly in the state of the DME adduct.
由前述1 H-NMR及TG-DTA之測定結果可確認,二次蒸餾品係即使進行加熱,DME亦不會脫離,大部分是作成DME加成體而氣化。From the measurement results of the above 1 H-NMR and TG-DTA, it was confirmed that even if the secondary distillation product was heated, DME did not desorb, and most of the DME was formed into a DME adduct and vaporized.
即,若為溶劑使用DME且經由DME加成體之方 法,則無法取得純Sr(PrMe4 Cp)2 。That is, if DME is used as a solvent and a method of adding a DME is used, pure Sr(PrMe 4 Cp) 2 cannot be obtained.
依此,要自市售之Sr(PrMe4 Cp)2 (DME)製造純Sr(PrMe4 Cp)2 是困難的。Accordingly, it is difficult to produce pure Sr(PrMe 4 Cp) 2 from commercially available Sr(PrMe 4 Cp) 2 (DME).
於具有溫度計、攪拌子、投入口、氣體出口之1L三口燒瓶中,在真空氬取代後注入脫水脫氧之THF750ml與NaCp* 79g(0.50莫耳)並溶解,且將燒瓶進行水冷並加入SrI2 粉末90g(0.246莫耳),且以25~40℃攪拌二十四小時。In a 1 L three-necked flask equipped with a thermometer, a stirrer, an inlet, and a gas outlet, 750 ml of dehydrated deoxidized THF and NaCp * 79 g (0.50 mol) were injected and dissolved in a vacuum argon, and the flask was water-cooled and added with SrI 2 powder. 90 g (0.246 mol) and stirred at 25-40 ° C for twenty-four hours.
其次,於減壓下進行去溶劑,乾燥後加入脫水脫氧之甲苯900ml,並進行利用加熱攪拌之萃取操作,靜置後進行過濾並取得透明濾液,且自濾液將甲苯進行減壓蒸餾除去,並以100℃進行減壓乾燥,若於套手工作箱中取出固體成分並輕輕地進行粉碎,則可取得淡黃色之鬆散粉末98g。Next, the solvent is removed under reduced pressure, and after drying, 900 ml of dehydrated deoxidized toluene is added, and extraction operation by heating and stirring is carried out, and after standing, filtration is carried out to obtain a transparent filtrate, and toluene is distilled off from the filtrate under reduced pressure, and The mixture was dried under reduced pressure at 100 ° C. When the solid component was taken out in a handle box and gently pulverized, 98 g of a pale yellow loose powder was obtained.
將該粉末注入昇華器,並於140~180℃/0.1Torr下進行第一次之昇華,並取得一次昇華品65g。The powder was injected into a sublimator, and the first sublimation was carried out at 140-180 ° C / 0.1 Torr, and a sublimation product of 65 g was obtained.
其次,將該一次昇華品注入昇華器,並於140~180℃/0.1Torr下進行第二次之昇華,並取得純白之二次昇華品62g。Next, the sublimation product was injected into the sublimator, and the second sublimation was carried out at 140-180 ° C / 0.1 Torr, and 62 g of pure white sublimation product was obtained.
該二次昇華品之結晶在下述分析之結果中鑑定為SrCp* 2 (0.162莫耳),其收率相對於NaCp* 為69%。The crystal of the secondary sublimate product was identified as SrCp * 2 (0.162 mol) in the results of the analysis described below, and the yield thereof was 69% with respect to NaCp * .
針對各程序中所取得之固體,與第一實施例相同地進行利用ICP發光分光分析之組成分析及1 H-NMR之測定。The composition analysis by ICP emission spectrometry and the measurement of 1 H-NMR were carried out in the same manner as in the first example, for the solids obtained in each procedure.
其結果,依據Sr含量分析值(理論值24.47%)與1 H-NMR之全SrCp* 2 信號之H個數及THF信號之H個數之比率,平均化學式可推定如下。As a result, the average chemical formula can be estimated as follows based on the ratio of the Sr content analysis value (theoretical value: 24.47%) to the H number of the total SrCp * 2 signal of 1 H-NMR and the H number of the THF signal.
減壓乾燥品:Sr含量19.7% SrCp* 2 (THF)1.5 Dry decompression product: Sr content 19.7% SrCp * 2 (THF) 1.5
一次昇華品:Sr含量22.1% SrCp* 2 (THF)0.5 Sublimation product: Sr content 22.1% SrCp * 2 (THF) 0.5
二次昇華品:Sr含量25.3% SrCp* 2 Secondary sublimation: Sr content 25.3% SrCp * 2
又,二次昇華品依據ICP發光分光分析之結果,雜質係Ca=2800,Mg<50,Ba=29000,Na=940,K<50,Cr<50,Fe<50,Cu<50,Ni<50(單位:ppb),相較於第一實施例,Na含量大幅地變多。Moreover, according to the results of ICP emission spectroscopic analysis, the impurity of the second sublimation product is Ca=2800, Mg<50, Ba=29000, Na=940, K<50, Cr<50, Fe<50, Cu<50, Ni< 50 (unit: ppb), the Na content greatly increased as compared with the first embodiment.
使用KCp* 以取代NaCp* ,除此以外則藉由與第二比較例相同之方法,使用相同莫耳量之原料進行合成。The synthesis was carried out using the same molar amount of the starting material by the same method as the second comparative example except that KCp * was used instead of NaCp * .
SrCp* 2 之收率相對於KCp* 為65%。The yield of SrCp * 2 was 65% relative to KCp * .
與第一實施例相同,針對二次昇華品進行利用ICP發光分光分析之組成及雜質分析。As in the first embodiment, the composition and impurity analysis by ICP emission spectroscopic analysis were performed on the secondary sublimation product.
其結果,Sr含量分析值為25.0%(理論值24.47%),雜質係Ca=3000,Mg<50,Ba=3 1000,Na<50,K=1100,Cr<50,Fe<50,Cu<50,Ni<50(單位:ppb),相較於第一實施例,K含量大幅地變多。As a result, the Sr content analysis value was 25.0% (theoretical value 24.47%), the impurity system Ca=3000, Mg<50, Ba=3. 1000, Na<50, K=1100, Cr<50, Fe<50, Cu<50, Ni<50 (unit: ppb), the K content greatly increased compared to the first embodiment.
於具有溫度計、攪拌葉輪、回流器之500ml四口燒瓶中,在真空氬取代後注入甲苯350ml,其次,注入二新戊醯甲烷(dpmH)65.6g(356m毫莫耳)、金屬Sr7.8g(89m毫莫耳)並進行加熱攪拌,於回流下使其反應二十四小時此時金屬片會消失。In a 500 ml four-necked flask equipped with a thermometer, a stirring impeller, and a refluxing device, 350 ml of toluene was injected after vacuum argon substitution, and secondly, 65.6 g (356 m millimolar) of dipentahyl methane (dpmH) and 7.8 g of metal were injected. 89 m millimolar) was stirred with heating and allowed to react under reflux for twenty-four hours at which time the metal piece disappeared.
其次,於減壓下蒸餾除去溶劑及未反應之dpmH類,再於130℃、0.05Torr下蒸餾除去溶存之微量dpmH。Next, the solvent and the unreacted dpmH were distilled off under reduced pressure, and the dissolved trace amount of dpmH was distilled off at 130 ° C and 0.05 Torr.
於殘留物中將34g注入高真空蒸餾裝置,且於230℃/0.02Torr下進行蒸餾,並取得Sr(dpm)2 30g。34 g of the residue was poured into a high vacuum distillation apparatus, and distillation was carried out at 230 ° C / 0.02 Torr, and Sr(dpm) 2 30 g was obtained.
與第一實施例相同,針對其進行利用ICP發光分光分析之雜質分析的結果,Na=920,K=890(單位:ppb),相較於第一實施例,Na及K含量大幅地變多。As in the first embodiment, as a result of performing impurity analysis by ICP emission spectrometry, Na = 920, K = 890 (unit: ppb), the contents of Na and K were greatly increased as compared with the first embodiment. .
於170℃下以氬(Ar)氣100sccm將填充有藉由第一實施例所取得之Sr(PrMe4 Cp)2 的汽缸(A)起泡,且於40℃下以氬(Ar)氣100sccm將填充有Ti(OiPr)4 的汽缸(B)起泡,並 於20℃下以氬(Ar)氣50sccm將填充有水的汽缸(C)起泡,沖洗氣係使Ar200sccm流動,並以各脈動一秒、沖洗三秒進行ALD操作。The cylinder (A) filled with Sr(PrMe 4 Cp) 2 obtained by the first embodiment was foamed at 170 ° C with an argon (Ar) gas of 100 sccm, and argon (Ar) gas was 100 sccm at 40 ° C. The cylinder (B) filled with Ti(OiPr) 4 was foamed, and the cylinder (C) filled with water was bubbled with argon (Ar) gas at 50 sccm at 20 ° C, and the flushing system was allowed to flow Ar 200 sccm, and each was Pulse for one second and rinse for three seconds for ALD operation.
將基板溫度300℃之Si基板放置於壓力約5Torr之ALD室,且將利用(A脈動-沖洗-C脈動-沖洗)之Sr周期及利用(B脈動-沖洗-C脈動-沖洗)之Ti周期交互地進行各100周期,並取得厚度10nm之SrTiO3 膜。Place the Si substrate with a substrate temperature of 300 ° C in an ALD chamber with a pressure of about 5 Torr, and use the Sr cycle of (A pulsation-flush-C pulsation-flush) and the Ti cycle using (B pulsation-flush-C pulsation-flush) Each 100 cycles were performed alternately, and a SrTiO 3 film having a thickness of 10 nm was obtained.
藉由具有包含氣體導入口之腔室壁、晶圓加熱用電阻加熱載物加熱器、晶圓設置用升降機構之成膜室進行成膜,且該成膜室係透過壓力調整閥與排氣泵連接,並藉由被嵌入腔室壁之插裝加熱器將室內保持於160℃,又,載物加熱器係設定為320℃,以於約0.3Torr下使晶圓溫度構成290℃。The film formation is performed by a film chamber having a chamber wall including a gas introduction port, a resistance heating heater heater for wafer heating, and a lifting mechanism for wafer installation, and the film forming chamber is transmitted through a pressure regulating valve and an exhaust gas. The pump was connected and maintained at 160 ° C by an intervening heater embedded in the chamber wall, and the carrier heater was set at 320 ° C to set the wafer temperature to 290 ° C at about 0.3 Torr.
使用運送臂,將直徑300mm之Si晶圓自運送系統導入成膜室並移載至載物加熱器,然後,使氬(Ar)氣500sccm流通,並藉由壓力調整閥將室內壓力保持在1Torr而使晶圓溫度升溫。Using a transfer arm, a 300 mm diameter Si wafer was introduced from the transport system into the film forming chamber and transferred to the load heater, and then argon (Ar) gas was passed through 500 sccm, and the pressure in the chamber was maintained at 1 Torr by a pressure regulating valve. And the temperature of the wafer is raised.
將藉由第一實施例所取得之Sr(PrMe4 Cp)2 100g填充於起泡用汽缸(A)並保持於165℃,且載體氣體係使氬(Ar)氣50sccm流通並起泡,同時取得Sr(PrMe4 Cp)2 蒸氣。又,將填充有Ti(OiPr)4 的汽缸(B)保持於45℃,且使氬(Ar)氣200sccm流通並起泡,同時取得Ti(Oi Pr)4 蒸氣。又,將填充有水作為氧化劑的汽缸保持於80℃,且於出口側設置高溫質量流量計並使H2 O氣體流動200sccm(C),再者,沖洗氣係使用Ar200sccm。The Sr(PrMe 4 Cp) 2 100 g obtained in the first embodiment was filled in the foaming cylinder (A) and maintained at 165 ° C, and the carrier gas system circulated and foamed argon (Ar) gas at 50 sccm while Sr(PrMe 4 Cp) 2 vapor was obtained. Further, the cylinder (B) filled with Ti(OiPr) 4 was kept at 45 ° C, and argon (Ar) gas was passed through 200 sccm to foam, and Ti (Oi Pr) 4 vapor was obtained. Further, a cylinder filled with water as an oxidizing agent was kept at 80 ° C, and a high-temperature mass flowmeter was placed on the outlet side to flow H 2 O gas at 200 sccm (C), and further, Ar200 sccm was used for the flushing gas system.
將該等原料或氧化劑之供給(以下稱作脈動)及沖洗以各脈動五秒、沖洗十秒進行下述ALD操作,由於在脈動或沖洗時腔室之壓力控制閥會打開,因此,室內之壓力係依據室內之氣體流量構成脈動A:0.3Torr,脈動B:0.4Torr,脈動C:0.5Torr,沖洗:0.2Torr。於該等ALD操作期間晶圓係保持在約290℃。The supply of these raw materials or oxidants (hereinafter referred to as pulsation) and rinsing are pulsating for five seconds and rinsing for ten seconds to perform the following ALD operation. Since the pressure control valve of the chamber is opened during pulsation or flushing, the indoor The pressure system constituted a pulsation A according to the gas flow rate in the room: 0.3 Torr, pulsation B: 0.4 Torr, pulsation C: 0.5 Torr, and rinsing: 0.2 Torr. The wafer system was maintained at about 290 °C during these ALD operations.
將利用(A脈動-沖洗-C脈動-沖洗)之SrO形成周期及利用(B脈動-沖洗-C脈動-沖洗)之TiO2 形成周期合計進行77周期,且構成SrO/TiO2 周期比=1.3,具體而言,將(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期、(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)1周期之一連串程序設為一次,並將其反覆十一次而形成厚度5nm之SrTiO3 膜。The SrO formation cycle using (A pulsation-flush-C pulsation-rinsing) and the TiO 2 formation cycle by (B pulsation-rinsing-C pulsation-rinsing) were performed for 77 cycles in total, and the SrO/TiO 2 cycle ratio was constituted = 1.3. Specifically, (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) 2 cycles, (A pulsation-flush-C pulsation-flush) 2 cycles, (B The pulsation-flush-C pulsation-flushing one of the 1 cycles was set once, and it was repeated ten times to form a SrTiO 3 film having a thickness of 5 nm.
藉由XRF(螢光X射線分析)法調查所形成之膜料組成時,Sr/Ti=1.4。When the formed film composition was investigated by XRF (fluorescence X-ray analysis), Sr/Ti = 1.4.
又,在Sr(PrMe4 Cp)2 之開始使用及使用90g之時間點進行二十五片之運轉成膜時,其平均膜厚為53.5與50.3,面內膜厚分布之標準偏差為1.6%與1.3%,二十五片之面間膜厚分布之標準偏差為2.8%與3.3%,在Sr(PrMe4 Cp)2 之開始 使用及大致結束使用之使用90g之時間點幾乎沒有成膜特性之差異。In addition, when the film was formed at the beginning of Sr(PrMe 4 Cp) 2 and 25 sheets were used, the average film thickness was 53.5. With 50.3 The standard deviation of the in-plane thickness distribution is 1.6% and 1.3%, and the standard deviation of the film thickness distribution between the two sheets is 2.8% and 3.3%. It is used at the beginning of Sr(PrMe 4 Cp) 2 and ends roughly. There was almost no difference in film formation characteristics at the time of use of 90 g.
使用SrCp* 2 以取代Sr(PrMe4 Cp)2 ,除此以外則與第三實施例相同地進行成膜。Film formation was carried out in the same manner as in the third example except that SrCp * 2 was used instead of Sr(PrMe 4 Cp) 2 .
在SrCp* 2 100g之開始使用及使用90g之時間點進行二十五片之運轉成膜時,其平均膜厚為55.2與43.2,膜料之Sr/Ti比亦相對於開始使用為1.4而使用90g之時間點為0.8,SrCp* 2 之供給量明顯降低。When the film was formed at the beginning of SrCp * 2 100g and 25 sheets were used, the average film thickness was 55.2. With 43.2 The Sr/Ti ratio of the film material was also 0.8 with respect to the initial use of 1.4 and 90 g, and the supply amount of SrCp * 2 was remarkably lowered.
依據第三實施例與第五比較例,由於Sr(PrMe4 Cp)2 於起泡溫度下為液體,因此自填充量100g之開始使用至結束可安定地供給蒸氣。According to the third embodiment and the fifth comparative example, since Sr(PrMe 4 Cp) 2 is a liquid at the foaming temperature, the vapor can be stably supplied from the start to the end of the filling amount of 100 g.
另一方面,由於SrCp* 2 於進行起泡之溫度下為固體,因此於填充量100g之開始使用至結束,會因粉體凝結所造成之蒸發表面積之減少、原料於汽缸或配管之冷點凝結所造成之傳熱不足等,而有成膜原料之供給量降低之傾向,藉此,會造成於相同成膜條件下之膜厚的減少或Sr/Ti比之降低。On the other hand, since SrCp * 2 is solid at the temperature at which foaming is carried out, the use of the filling amount of 100 g is completed until the end of the filling, and the evaporation surface area due to the condensation of the powder is reduced, and the raw material is cooled to the cylinder or the piping. The heat transfer due to condensation is insufficient, and the supply amount of the film-forming raw material tends to decrease, whereby the film thickness under the same film formation conditions is reduced or the Sr/Ti ratio is lowered.
成膜室係作成與第三實施例相同之條件設定。The film forming chamber was set to the same conditions as in the third embodiment.
將藉由第一實施例所取得之Sr(PrMe4 Cp)2 填充於起泡用汽缸(A)並保持於155℃,且載體氣體 係使氬(Ar)氣50sccm流通並起泡,同時取得Sr(PrMe4 Cp)2 蒸氣。又,將填充有Ti(OiPr)4 的汽缸(B)保持於55℃,且使氬(Ar)氣200sccm流通並起泡,同時取得Ti(OiPr)4 蒸氣。又,氧化劑係使O2 /N2 =500/0.5sccm混合氣通往臭氧發生器而取得180g/m3 濃度之O3 氣體(C),再者,沖洗氣係使用Ar200sccm。The Sr(PrMe 4 Cp) 2 obtained in the first embodiment was filled in the foaming cylinder (A) and maintained at 155 ° C, and the carrier gas system circulated and foamed argon (Ar) gas at 50 sccm while obtaining Sr(PrMe 4 Cp) 2 vapor. Further, the cylinder (B) filled with Ti(OiPr) 4 was held at 55 ° C, and argon (Ar) gas was passed through 200 sccm to foam, and Ti (OiPr) 4 vapor was obtained. Further, the oxidizing agent was passed through a mixed gas of O 2 /N 2 =500/0.5 sccm to an ozone generator to obtain an O 3 gas (C) having a concentration of 180 g/m 3 , and further, Ar200 sccm was used for the flushing gas system.
將該等脈動及沖洗以A、B脈動十秒、C脈動兩秒、沖洗十秒進行下述ALD操作。The pulsation and rinsing were performed by pulsing A and B for ten seconds, C pulsing for two seconds, and rinsing for ten seconds to perform the following ALD operation.
將利用(A脈動-沖洗-C脈動-沖洗)之SrO形成周期及利用(B脈動-沖洗-C脈動-沖洗)之TiO2 形成周期合計進行77周期,且構成SrO/TiO2 周期比=1.2,具體而言,將(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期、(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期、(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)1周期之一連串程序設為一次,並將其反覆七次而形成厚度5nm之SrTiO3 膜。The SrO formation cycle using (A pulse-flush-C pulsation-flush) and the TiO 2 formation cycle by (B-pulse-flush-C pulsation-flush) were performed for 77 cycles in total, and the SrO/TiO 2 cycle ratio was set to 1.2. Specifically, (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) 2 cycles, (A pulsation-flush-C pulsation-flush) 2 cycles, (B Pulsation-flush-C pulsation-flush) 2 cycles, (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) One cycle of one cycle is set once and repeated A 5 nm thick SrTiO 3 film was formed seven times.
藉由XRF法調查所形成之膜料組成時,Sr/Ti=1.25。When the composition of the formed film was investigated by the XRF method, Sr/Ti = 1.25.
〔第五實施例〕使用Sr(PrMe4 Cp)2 且利用ALD法之SrTiO3 膜之形成(4)[Fifth Embodiment] Formation of Sr(RrMe 3 Cp) 2 and SrTiO 3 film by ALD method (4)
成膜室係作成與第三實施例相同之條件設定。The film forming chamber was set to the same conditions as in the third embodiment.
將藉由第一實施例所取得之Sr(PrMe4 Cp)2 溶解於甲苯中,並作成0.4莫耳/l溶液,其黏度為4 0cP。Sr(PrMe 4 Cp) 2 obtained by the first example was dissolved in toluene, and a 0.4 mol/l solution having a viscosity of 40 cP was prepared.
使用液體供給系統將該溶液引導至業已加熱至200℃之氣化器,且將氬(Ar)氣200sccm作為載體氣體,並以0.3g/min之流量藉由液體流量計一面控制一面使其氣化,同時取得Sr(PrMe4 Cp)2 氣體(A)。又,使用液體供給系統將Ti(OiPr)4 引導至業已加熱至100℃之氣化器,且將氬(Ar)氣200sccm作為載體氣體,並以0.1g/min之流量藉由液體流量計一面控制一面使其氣化,同時取得Ti(OiPr)4 蒸氣。又,氧化劑係使O2 /N2 =500/0.5sccm混合氣通往臭氧發生器而取得180g/m3 濃度之O3 氣體(C),再者,沖洗氣係使用Ar200sccm。The solution was guided to a gasifier which had been heated to 200 ° C using a liquid supply system, and 200 sccm of argon (Ar) gas was used as a carrier gas, and the gas flow meter was controlled at one side with a flow rate of 0.3 g/min. Simultaneously, Sr(PrMe 4 Cp) 2 gas (A) was obtained. Further, a liquid supply system was used to guide Ti(OiPr) 4 to a gasifier which had been heated to 100 ° C, and argon (Ar) gas was 200 sccm as a carrier gas, and a flow rate of 0.1 g/min was used by a liquid flow meter. The control side is vaporized while obtaining Ti(OiPr) 4 vapor. Further, the oxidizing agent was passed through a mixed gas of O 2 /N 2 =500/0.5 sccm to an ozone generator to obtain an O 3 gas (C) having a concentration of 180 g/m 3 , and further, Ar200 sccm was used for the flushing gas system.
將該等脈動及沖洗以A、B脈動兩秒、C脈動兩秒、沖洗五秒進行下述ALD操作。The pulsation and rinsing were performed by pulsing A and B for two seconds, C pulsing for two seconds, and rinsing for five seconds to perform the following ALD operation.
將利用(A脈動-沖洗-C脈動-沖洗)之SrO形成周期及利用(B脈動-沖洗-C脈動-沖洗)之TiO2 形成周期合計進行99周期,且構成SrO/TiO2 周期比=1.2,具體而言,將(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期、(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期、(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)1周期之一連串程序設為一次,並將其反覆九次而形成厚度6.4nm之SrTiO3 膜。The SrO formation cycle using (A pulsation-flush-C pulsation-rinsing) and the TiO 2 formation cycle by (B pulsation-rinsing-C pulverization-rinsing) were performed for 99 cycles in total, and the SrO/TiO 2 cycle ratio was set to 1.2. Specifically, (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) 2 cycles, (A pulsation-flush-C pulsation-flush) 2 cycles, (B Pulsation-flush-C pulsation-flush) 2 cycles, (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) One cycle of one cycle is set once and repeated A SrTiO 3 film having a thickness of 6.4 nm was formed nine times.
使用該SrTiO3 膜,並將上.下部電極同時作成 Ru而製作MIM(金屬-絕緣體-金屬,Metal Insulator Metal)結構,並以600℃之熱處理使SrTiO3 結晶化時,氧化膜換算膜厚為0.7nm,且施加電壓1V時之漏電流為3.5×10-7 A/cm2 。Use the SrTiO 3 film and put it on. When the lower electrode is simultaneously made of Ru to form a MIM (Metal Insulator Metal) structure, and the SrTiO 3 is crystallized by heat treatment at 600 ° C, the film thickness of the oxide film is 0.7 nm, and the voltage is 1 V when the voltage is applied. The current is 3.5 x 10 -7 A/cm 2 .
使用SrCp* 2 0.2莫耳/l甲苯溶液以取代Sr(PrMe4 Cp)2 0.4莫耳/l甲苯溶液,除此以外則與第五實施例相同地進行成膜。Film formation was carried out in the same manner as in the fifth example except that a SrCp * 2 0.2 mol/l toluene solution was used instead of the Sr(PrMe 4 Cp) 2 0.4 mol/l toluene solution.
將利用(A脈動-沖洗-C脈動-沖洗)之SrO形成周期及利用(B脈動-沖洗-C脈動-沖洗)之TiO2 形成周期合計進行99周期,且構成SrO/TiO2 周期比=1.2,具體而言,將(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期、(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期、(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)1周期之一連串程序設為一次,並將其反覆九次而形成厚度8.2nm之SrTiO3 膜。The SrO formation cycle using (A pulsation-flush-C pulsation-rinsing) and the TiO 2 formation cycle by (B pulsation-rinsing-C pulverization-rinsing) were performed for 99 cycles in total, and the SrO/TiO 2 cycle ratio was set to 1.2. Specifically, (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) 2 cycles, (A pulsation-flush-C pulsation-flush) 2 cycles, (B Pulsation-flush-C pulsation-flush) 2 cycles, (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) One cycle of one cycle is set once and repeated A SrTiO 3 film having a thickness of 8.2 nm was formed nine times.
使用該SrTiO3 膜,並將上.下部電極同時作成Ru而製作MIM結構,並以600℃之熱處理使SrTiO3 結晶化時,氧化膜換算膜厚為0.9nm,且施加電壓1V時之漏電流為2.4×10-3 A/cm2 。When the SrTiO 3 film was used and the upper and lower electrodes were simultaneously formed into Ru to form an MIM structure, and the SrTiO 3 was crystallized by heat treatment at 600 ° C, the film thickness of the oxide film was 0.9 nm, and the leakage current at a voltage of 1 V was applied. It is 2.4 × 10 -3 A/cm 2 .
相較於第五實施例之SrTiO3 膜,雖然該SrTiO3 膜之物理膜厚、氧化膜換算膜厚皆厚,但漏電流卻 大。Compared with the SrTiO 3 film of the fifth embodiment, the SrTiO 3 film has a large physical thickness and an oxide film thickness, but the leakage current is large.
將第五實施例及第六比較例之SrTiO3 膜分別以膜厚5nm成膜於Si基板上,並藉由TXRF(全反射螢光X射線)分析比較Na含量時,第六比較例為第五實施例之2倍。The SrTiO 3 films of the fifth embodiment and the sixth comparative example were each formed on a Si substrate at a film thickness of 5 nm, and when the Na content was compared by TXRF (total reflection fluorescent X-ray) analysis, the sixth comparative example was Two times the five embodiments.
由此可知,相較於Sr(PrMe4 Cp)2 ,由於SrCp* 2之Na等雜質多,因此會使電特性惡化。From this, it is understood that compared with Sr(PrMe 4 Cp) 2 , since there are many impurities such as Na of SrCp * 2, electrical characteristics are deteriorated.
〔第六實施例〕使用Sr(PrMe4 Cp)2 且利用ALD法之SrRuO3 膜之形成[Sixth embodiment] Formation of SrRuO 3 film using Sr(PrMe 4 Cp) 2 and using ALD method
成膜室係將載物加熱器之設定作成350℃,以於0.3Torr下使晶圓溫度構成330℃,除此以外則作成與第三實施例相同之條件設定。In the film forming chamber, the setting of the load heater was set to 350 ° C to set the wafer temperature to 330 ° C at 0.3 Torr, and otherwise the same conditions as those in the third embodiment were set.
將藉由第一實施例所取得之Sr(PrMe4 Cp)2 溶解於甲苯中,並作成0.4莫耳/l溶液。使用液體供給系統將該溶液引導至業已加熱至200℃之氣化器,且將氬(Ar)氣200sccm作為載體氣體,並以0.3g/min之流量藉由液體流量計一面控制一面使其氣化,同時取得Sr(PrMe4 Cp)2 氣體(A)。又,使用液體供給系統將Ru(EtCp)2 引導至業已加熱至120℃之氣化器,且將氬(Ar)氣200sccm作為載體氣體,並以0.1g/min之流量藉由液體流量計一面控制一面使其氣化,同時取得Ru(EtCp)2 蒸氣。又,氧化劑係使O2 /N2 =500/0.5sccm混合氣通往臭氧發生器而取得100g/m3 濃度之O3 氣體(C),再者,沖洗氣係使用Ar200sccm。Sr(PrMe 4 Cp) 2 obtained by the first example was dissolved in toluene to prepare a 0.4 mol/l solution. The solution was guided to a gasifier which had been heated to 200 ° C using a liquid supply system, and 200 sccm of argon (Ar) gas was used as a carrier gas, and the gas flow meter was controlled at one side with a flow rate of 0.3 g/min. Simultaneously, Sr(PrMe 4 Cp) 2 gas (A) was obtained. Further, Ru(EtCp) 2 was guided to a gasifier which had been heated to 120 ° C using a liquid supply system, and 200 sccm of argon (Ar) gas was used as a carrier gas, and a flow rate of 0.1 g/min was used by a liquid flow meter. The control side is vaporized while obtaining Ru(EtCp) 2 vapor. Further, the oxidizing agent was passed through a mixed gas of O 2 /N 2 =500/0.5 sccm to an ozone generator to obtain an O 3 gas (C) having a concentration of 100 g/m 3 , and further, Ar200 sccm was used for the flushing gas system.
將該等脈動及沖洗以A、B脈動一秒、C脈動一秒、 沖洗兩秒進行下述ALD操作。The pulsation and flushing are pulsed by A and B for one second, and C is pulsed for one second. Rinse for two seconds for the ALD operation described below.
將利用(A脈動-沖洗-C脈動-沖洗)之SrO形成周期及利用(B脈動-沖洗-C脈動-沖洗)之RuO2 形成周期合計進行240周期,且構成SrO/RuO2 周期比=1,具體而言,將(A脈動-沖洗-C脈動-沖洗)2周期、(B脈動-沖洗-C脈動-沖洗)2周期之一連串程序設為一次,並將其反覆六十次而形成厚度18nm之SrRuO3 膜。The SrO formation cycle using (A pulsation-flush-C pulsation-flush) and the RuO 2 formation cycle by (B pulsation-flush-C pulsation-rinsing) were performed for 240 cycles in total, and the SrO/RuO 2 cycle ratio was constituted. Specifically, one cycle of (A pulsation-flush-C pulsation-flush) 2 cycles, (B pulsation-flush-C pulsation-flush) 2 cycles is set once, and it is repeated for 60 times to form a thickness. 18 nm SrRuO 3 film.
於160℃、內壓約5Torr下以氬氣50sccm將填充有藉由第一實施例所取得之Sr(PrMe4 Cp)2 的汽缸起泡,並將Sr(PrMe4 Cp)2 蒸氣送到CVD室。The cylinder filled with Sr(PrMe 4 Cp) 2 obtained by the first embodiment was bubbled with argon gas at 50 sccm at 160 ° C and an internal pressure of about 5 Torr, and Sr (PrMe 4 Cp) 2 vapor was sent to the CVD. room.
同時於30℃、內壓約5Torr下以氬氣50sccm將填充有Ti(NMe2 )4 的汽缸起泡,並將Ti(NMe2 )4 蒸氣送到CVD室。At the same time, a cylinder filled with Ti(NMe 2 ) 4 was bubbled with argon gas at 50 sccm at 30 ° C and an internal pressure of about 5 Torr, and Ti(NMe 2 ) 4 vapor was sent to the CVD chamber.
又,將氧氣100sccm送到CVD室。Further, 100 sccm of oxygen was sent to the CVD chamber.
於CVD室入口混合該等氣體並導入保持在2Torr、350℃之Si(100)基板上時,可於三十分鐘生成厚度60nm之SrTiO3 膜。When these gases were mixed at the inlet of the CVD chamber and introduced into a Si (100) substrate maintained at 2 Torr and 350 ° C, a SrTiO 3 film having a thickness of 60 nm was formed in thirty minutes.
於160℃、內壓約7Torr下以氬氣50sccm將填充有藉由第一實施例所取得之Sr(PrMe4 C p)2 的汽缸起泡,並將Sr(PrMe4 Cp)2 蒸氣送到CVD室。The cylinder filled with Sr(PrMe 4 C p) 2 obtained by the first embodiment was bubbled with argon gas at 50 sccm at 160 ° C and an internal pressure of about 7 Torr, and Sr (PrMe 4 Cp) 2 vapor was sent. CVD chamber.
同時於30℃、內壓約7Torr下以氬氣50sccm將填充有Ru(EtCp)2 的汽缸起泡,並將Ru(EtCp)2 蒸氣送到CVD室。At the same time, a cylinder filled with Ru(EtCp) 2 was bubbled with argon gas at 50 sccm at 30 ° C and an internal pressure of about 7 Torr, and Ru(EtCp) 2 vapor was sent to the CVD chamber.
於CVD室入口混合該等氣體並導入保持在5Torr、700℃之SrTiO3 (100)基板上時,可於三十分鐘生成厚度80nm之SrRuO3 膜。When these gases were mixed at the inlet of the CVD chamber and introduced into a SrTiO 3 (100) substrate maintained at 5 Torr and 700 ° C, a SrRuO 3 film having a thickness of 80 nm was formed in thirty minutes.
惟,以上所述,僅為本發明最佳之一的具體實施例之詳細說明與圖式,惟本發明之特徵並不侷限於此,並非用以限制本發明,本發明之所有範圍應以下述之申請專利範圍為準,凡合於本發明申請專利範圍之精神與其類似變化之實施例,皆應包含於本發明之範疇中,任何熟悉該項技藝者在本發明之領域內,可輕易思及之變化或修飾皆可涵蓋在以下本案之專利範圍。However, the above description is only a detailed description of the preferred embodiments of the present invention, and the present invention is not limited thereto, and is not intended to limit the present invention. The scope of the patent application is subject to the scope of the present invention, and any one skilled in the art can easily include it in the field of the present invention. Any changes or modifications considered may be covered by the patents in this case below.
第一圖係顯示有關第一實施例之二次蒸餾品之1 H-NMR之測定光譜圖;第二圖係顯示有關第一實施例之減壓乾燥品之1 H-NMR之測定光譜圖;第三圖係顯示有關第一實施例之二次蒸餾品於1大氣壓下之TG-DTA測定結果圖;第四圖係顯示有關第一實施例之減壓乾燥品於1大氣壓下之TG-DTA測定結果圖;第五圖係顯示有關第一比較例之二次蒸餾品之1 H-NM R之測定光譜圖;及第六圖係顯示有關第一比較例之二次蒸餾品於1大氣壓下之TG-DTA測定結果圖。FIG lines showed about a first measurement of a secondary distillation product H-NMR spectrum of a first embodiment of the embodiment; FIG second measurement system of the first embodiment about the reduced pressure of the dried product 1 H-NMR spectrum of the display; The third graph shows the results of the TG-DTA measurement of the second distillation product of the first embodiment at 1 atm; the fourth graph shows the TG-DTA of the vacuum-dried product of the first embodiment at 1 atm. The measurement result chart; the fifth chart shows the measured spectrum of 1 H-NM R of the second distillation product of the first comparative example; and the sixth figure shows the secondary distillation product of the first comparative example at 1 atm. TG-DTA measurement results.
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