TWI398341B - - Google Patents

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Publication number
TWI398341B
TWI398341B TW99138521A TW99138521A TWI398341B TW I398341 B TWI398341 B TW I398341B TW 99138521 A TW99138521 A TW 99138521A TW 99138521 A TW99138521 A TW 99138521A TW I398341 B TWI398341 B TW I398341B
Authority
TW
Taiwan
Application number
TW99138521A
Other languages
Chinese (zh)
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TW201219187A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW99138521A priority Critical patent/TW201219187A/zh
Publication of TW201219187A publication Critical patent/TW201219187A/zh
Application granted granted Critical
Publication of TWI398341B publication Critical patent/TWI398341B/zh

Links

TW99138521A 2010-11-09 2010-11-09 uses a pretreatment work on a first mold to form a forming layer and obtains a metal plated film containing a conductive material through an electroforming process TW201219187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99138521A TW201219187A (en) 2010-11-09 2010-11-09 uses a pretreatment work on a first mold to form a forming layer and obtains a metal plated film containing a conductive material through an electroforming process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99138521A TW201219187A (en) 2010-11-09 2010-11-09 uses a pretreatment work on a first mold to form a forming layer and obtains a metal plated film containing a conductive material through an electroforming process

Publications (2)

Publication Number Publication Date
TW201219187A TW201219187A (en) 2012-05-16
TWI398341B true TWI398341B (enrdf_load_stackoverflow) 2013-06-11

Family

ID=46552767

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99138521A TW201219187A (en) 2010-11-09 2010-11-09 uses a pretreatment work on a first mold to form a forming layer and obtains a metal plated film containing a conductive material through an electroforming process

Country Status (1)

Country Link
TW (1) TW201219187A (enrdf_load_stackoverflow)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846533A (en) * 1972-07-11 1974-11-05 J D Carrier Shoe Co Ltd Improvements in the manufacture of molds for footwear
JPS5896889A (ja) * 1981-12-04 1983-06-09 Ikegami Kaken Kogyo Kk 電鋳加工による成形型の製造方法
US5260014A (en) * 1991-06-13 1993-11-09 Automotive Plastic Technologies Method of making a multilayer injection mold
TW565496B (en) * 2002-03-15 2003-12-11 Yun-Yao Chiu Method and structure for forming a quick mold
TW201028502A (en) * 2009-01-16 2010-08-01 Liga Prec Technology Co Ltd Electromolding method of metal mold

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3846533A (en) * 1972-07-11 1974-11-05 J D Carrier Shoe Co Ltd Improvements in the manufacture of molds for footwear
JPS5896889A (ja) * 1981-12-04 1983-06-09 Ikegami Kaken Kogyo Kk 電鋳加工による成形型の製造方法
US5260014A (en) * 1991-06-13 1993-11-09 Automotive Plastic Technologies Method of making a multilayer injection mold
TW565496B (en) * 2002-03-15 2003-12-11 Yun-Yao Chiu Method and structure for forming a quick mold
TW201028502A (en) * 2009-01-16 2010-08-01 Liga Prec Technology Co Ltd Electromolding method of metal mold

Also Published As

Publication number Publication date
TW201219187A (en) 2012-05-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees