TWI395528B - An electronic component, a circuit board and a circuit device - Google Patents

Description

Electronic parts, circuit boards and circuit devices

The present invention relates to electronic components, circuit boards, and circuit devices. More specifically, there is a joint structure between an electronic component and a circuit board.

In recent years, small electronic devices such as mobile phones and portable music players have rapidly become popular. In the manufacture of the small-sized electronic device, when a small electronic component such as a filter is mounted on a circuit board, problems such as securing the mounting area, improving the positional accuracy, improving the connection strength, and preventing the short circuit are exemplified.

In this regard, for example, Patent Document 1 discloses a method of assembling an electronic component in which a wide conductive paste layer having a large number of irregularities is formed on a surface of a mounting electrode of a circuit board, thereby assembling an electronic component. According to this method, by making the conductive paste layer wider, the tolerance of the positional deviation of the electronic component can be improved, and the joint strength can be improved by the unevenness, and since the sliding of the electronic component can be suppressed, it is obtained. Prevent the effects of poor contact.

However, in this assembly method, it is necessary to provide a wide conductive paste layer on the circuit substrate, so that a certain degree of assembly area is required, and it is not suitable for assembly of small electronic parts. Further, in consideration of the necessity of matching the width of the conductive paste layer, a larger amount of solder than the usual amount is used, which will cause a so-called "welding bridge" (hereinafter referred to as bridge) with other conductive portions, and there is The danger of short circuit.

[Patent is 1] Unexamined Japanese Patent Publication No. 2002-261407

It is an object of the present invention to provide an electronic component suitable for assembly in a narrow range, a circuit substrate suitable for mounting the electronic component, and a circuit device including the same.

1. First embodiment of an electronic component related to the present invention

In order to solve the above problems, an electronic component related to the present invention includes at least one component side electrode. The part side electrode is projecting and arranged to protrude from a predetermined side.

The electronic component according to the present invention is configured such that the component side electrode is fitted to the fitting hole formed on the surface of the circuit board, and is connected to the substrate side electrode provided at the bottom of the fitting hole, and the predetermined The one side is aligned on the board surface and mounted on the circuit board. According to this configuration, the following effects can be obtained.

First, since the component side electrode of the electronic component according to the present invention has a projecting shape, it can be formed into a slender rod shape. Therefore, the electronic component according to the present invention can be easily assembled even in a narrow mounting region as long as it has a fitting hole and a substrate-side electrode on the mounted circuit board.

According to a second aspect of the present invention, in the electronic component according to the present invention, the protrusion-shaped component side electrode is fitted into the fitting hole of the circuit board, and the surface on which the component side electrode is provided is aligned with the board surface of the circuit board. It is assembled in the state, so the joint strength between the two is high. Therefore, the electronic component related to the present invention does not easily detach from the circuit substrate even if it is subjected to shock or vibration.

Thirdly, the component side electrode of the electronic component according to the present invention is connected to the substrate side electrode provided at the bottom of the fitting hole of the circuit board, so that the volume of the component side electrode can be set to be larger than the volume of the fitting hole. When it is assembled, the solder applied to the substrate-side electrode does not overflow and can be accommodated in the fitting hole. Therefore, the bridge between the component side electrode and other conductive portions can be suppressed, and the risk of short circuit can be reduced.

According to the fourth aspect of the invention, in the electronic component according to the present invention, the protruding component side electrode is fitted to the fitting hole of the circuit board, and the assembly position is easily located. Further, if the shape of the component side electrode and the fitting hole is, for example, an equilateral triangular prism shape, the assembly direction of the electronic component is restricted to a predetermined one direction, and assembly errors can be prevented. In the case where a combination of a plurality of component side electrodes and fitting holes is provided, this effect can also be obtained by carefully designing such configurations. Therefore, the assembly position accuracy of the electronic component related to the present invention is high.

2. First embodiment of a circuit board according to the present invention

In order to solve the above problems, a circuit board according to the present invention includes at least one fitting hole and at least one substrate side electrode. The fitting hole is formed on the plate surface. Further, the substrate-side electrode is provided at the bottom of the fitting hole.

The circuit board according to the present invention is configured such that a protruding-shaped component side electrode that is provided to protrude from a predetermined surface of the electronic component is fitted to the fitting hole, and the substrate-side electrode is connected to the component-side electrode, and The electronic component is assembled in a state in which the predetermined side is aligned with the board surface.

As described above, since the circuit board according to the present invention is equipped with the electronic component of the first embodiment described above, the same operational effects can be obtained. Further, it is a matter of course that the circuit device in which the electronic component of the first embodiment described above is mounted on the circuit board according to the present invention can enjoy the same operational effects as described above.

3. A second embodiment of an electronic component related to the present invention

In order to solve the above problems, an electronic component according to the present invention includes at least one fitting hole and at least one component side electrode. The fitting hole is formed on a predetermined one side. Further, the component side electrode is provided at the bottom of the fitting hole.

In the electronic component according to the present invention, the protruding substrate side electrode which is provided to protrude from the board surface of the circuit board is fitted to the fitting hole, and the component side electrode is connected to the substrate side electrode, and The predetermined side is aligned on the board surface and mounted on the circuit board. According to this configuration, the following effects can be obtained.

According to the first aspect, the fitting hole of the electronic component according to the present invention corresponds to the protruding substrate-side electrode provided on the circuit board, and therefore, it can be formed into a long and thin rod shape. Further, since the component side electrode is provided at the bottom of the fitting hole, it can be formed to be small with the fitting hole. Therefore, the electronic component according to the present invention can be easily assembled even in a narrow mounting region as long as it has a projecting substrate-side electrode on the mounted circuit board.

According to a second aspect of the present invention, in the electronic component according to the present invention, the projection-shaped substrate-side electrode is fitted into the fitting hole, and one of the fitting holes is formed to be aligned with the plate surface of the circuit board. It is assembled so that the joint strength between the two can be improved. Therefore, the electronic component related to the present invention does not easily be detached from the circuit substrate even if it is subjected to shock or vibration.

Thirdly, the component side electrode of the electronic component according to the present invention is provided at the bottom of the fitting hole and connected to the protruding substrate side electrode, so that the volume of the substrate side electrode can be set to be larger than the volume of the fitting hole. It is sufficiently large that it can be accommodated in the fitting hole without overflowing the solder applied to the substrate-side electrode during assembly. Therefore, the bridge between the component side electrode and other conductive portions can be suppressed, and the risk of short circuit can be reduced.

Fourthly, in the electronic component according to the present invention, since the projecting substrate-side electrode is fitted to the fitting hole and assembled, it is easy to position the mounting position. Further, when the shape of the substrate-side electrode and the fitting hole is, for example, an equilateral triangular prism shape, the assembly direction of the electronic component is restricted to a predetermined one direction, and assembly errors can be prevented. In the case where a combination of a plurality of substrate-side electrodes and fitting holes is provided, this effect can be obtained in terms of coping with such arrangements. Therefore, the assembly position accuracy of the electronic component related to the present invention is high.

4. Second embodiment of a circuit board according to the present invention

In order to solve the above problems, a circuit board according to the present invention includes at least one substrate side electrode. The substrate-side electrode is formed in a protruding shape and is provided to protrude from the plate surface.

The circuit board according to the present invention is configured such that the substrate-side electrode is fitted to a fitting hole formed on a predetermined surface of the electronic component, and is connected to the component-side electrode provided at the bottom of the fitting hole, and The electronic component is assembled in a state in which the predetermined side is aligned with the board surface.

As described above, since the circuit board according to the present invention is equipped with the electronic component of the second embodiment described above, the same operational effects can be obtained. Further, it is a matter of course that the circuit device in which the electronic component of the second embodiment described above is mounted on the circuit board according to the present invention can enjoy the same operational effects as described above.

As described above, according to the present invention, there is provided an electronic component suitable for assembly in a narrow range, a circuit substrate suitable for mounting the electronic component, and a circuit device including the same.

1. First embodiment of an electronic component and a circuit board according to the present invention

Fig. 1 is a perspective view of the electronic component according to the present invention as viewed from the bottom. Fig. 2 is a perspective view of a circuit board according to the present invention. 3 is a cross-sectional view taken along line III-III of the electronic component and the circuit board shown in FIGS. 1 and 2, and FIG. 4 is a view showing a state in which the electronic component is mounted on the circuit board in the state of FIG. 3.

First, an electronic component related to the present invention will be described. The electronic component related to the present invention is, for example, a small electronic component such as a filter used in a mobile phone.

The electronic component 1 includes a body 13, a component side electrode 11, and a component side plate electrode 12. The main body 13 is a laminated body of a dielectric substrate having a rectangular parallelepiped shape, and in order to exhibit a predetermined function of the electronic component 1, a circuit component required for a capacitor, an inductor, and the like, and wiring required therein are formed.

The part side electrode 11 is formed in a protruding shape and is provided to protrude from the bottom surface. Further, the component side plate electrode 12 is provided on the bottom surface of the electronic component 1 so as to surround the periphery of the component side electrode 11.

Specifically, the component side electrode 11 has a cylindrical shape and is formed at the center of the bottom surface. The component side plate electrode 12 is provided in a portion other than the region 15 which is formed concentrically with the end surface of the component side electrode 11 in the bottom surface of the electronic component 1. This area 15 is made to have an area which ensures a sufficient distance so that the part side electrode 11 and the part side plate electrode 12 are not bridged during assembly. Further, the component side electrode 11 and the component side plate electrode 12 can be formed by a film forming technique such as sputtering or vapor deposition, printing, plating, or a combination thereof.

This electronic component 1 is mounted on a circuit board related to the present invention. In other words, as shown in FIG. 4, the component side electrode 11 is fitted to the fitting hole 21 formed on the surface of the circuit board 2, and is also connected to the substrate side electrode 22 provided at the bottom of the fitting hole 21. The surface is mounted on the circuit board 2 in a state in which the bottom surface is aligned on the board surface of the circuit board 2. At this time, the component side plate electrode 12 is attached to the board surface of the circuit board 2, and is connected to the board side plate electrode 23 provided around the periphery of the fitting hole 21.

Next, a circuit board related to the present invention will be described. The circuit board 2 relating to the present invention is for assembling an electronic component related to the present invention, and also includes a connection/intermediary (adapter or spacer) for use as an electronic component and other circuit substrate related to the present invention. Pieces).

The circuit board 2 includes a board body 24, a fitting hole 21, a board side electrode 22, and a board side plate electrode 23. The substrate body 24 is a laminated substrate composed of the first layer 241 and the second layer 242 (see FIG. 3). The substrate body 24 is provided with a desired electrode, wiring, or the like in order to be able to mount various electronic components and the like. Further, the fitting hole 21 is formed on the plate surface, and the substrate side electrode 22 is provided at the bottom of the fitting hole 21. The substrate-side flat plate electrode 23 is provided on the plate surface so as to surround the periphery of the fitting hole 21.

Specifically, the fitting hole 21 is formed in a cylindrical shape so as to be engageable with the component side electrode 11 of the electronic component 1 . The depth of the fitting hole 21 is such that a gap is formed between the front end surface of the component side electrode 11 and the bottom surface of the fitting hole 21 in order to fit the depth of the front end surface of the component side electrode 11 in order to fit the component side electrode 11. A little deeper. Further, the fitting hole 21 can be obtained as a through hole penetrating the first layer 241.

The substrate-side electrode 22 is formed in a flat shape and is provided on the upper portion of the second layer 242. The substrate-side electrode 22 is located directly under the fitting hole 21, and the central portion serves as a bottom surface of the fitting hole 21 and is exposed to the outside.

Further, the substrate-side flat plate electrode 23 is formed on the upper portion of the first layer 241, and is formed in accordance with the shape and position of the component-side plate electrode 12 of the electronic component 1. Further, the substrate-side electrode 22 and the substrate-side plate electrode 23 can be formed by a film forming technique such as sputtering or vapor deposition, printing, plating, or a combination thereof.

This circuit board 2 is used to assemble electronic parts related to the present invention. In other words, as shown in Fig. 4, the circuit board 2 is fitted with the protruding component side electrode 11 which is provided to protrude from the bottom surface of the electronic component 1 and the fitting hole 21, and the substrate side electrode 22 and the component side electrode are simultaneously provided. 11 is connected, and the electronic component 1 is assembled with the bottom surface of the electronic component 1 aligned with the board surface. At this time, the substrate-side flat plate electrode 23 is connected to the component-side flat plate electrode 12 provided around the component-side electrode 11 on the bottom surface of the electronic component 1.

In the process of mounting the electronic component 1 on the circuit board 2, as shown in FIG. 3, an appropriate amount of solder pastes 31, 32 are applied to the surfaces of the substrate side electrode 22 and the substrate side plate electrode 23.

The solder paste 31 is diffused into the gap P1 inside the component side plate electrode 12 at the time of assembly shown in Fig. 4 . Therefore, the solder paste 31 connects the substrate-side flat plate electrode 23 and the component-side flat plate electrode 12 without entering the fitting hole 21. Here, the gap P1 is formed between the bottom surface of the electronic component 1 and the board surface of the circuit board 2 depending on the thickness of the component side plate electrode 12, but may be reversed depending on the thickness of the substrate side plate electrode 23 or both. A gap P1 is generated in the thickness.

Further, in the assembly shown in FIG. 4, the solder paste 32 is mostly accommodated in a gap between the front end surface of the component side electrode 11 and the substrate side electrode 22, and a small portion is diffused on the side surface of the component side electrode 11 and fitted. A gap between the inner walls of the holes 21. Therefore, the solder paste 32 connects the substrate side electrode 22 and the component side electrode 11 without overflowing from the fitting hole 21. Therefore, the solder paste 31 and the solder paste 32 are not in contact, so that the electrodes 11, 22 and the plate electrodes 12, 23 are not bridged.

According to the electronic component 1 described above, the following effects can be obtained. Since the component-side electrode 11 of the first and the electronic component 1 has a projection shape, it can be formed into a long and thin rod shape. Therefore, the electronic component 1 is provided with the fitting hole 21 and the substrate-side electrode 22 on the circuit board 2 to which it is mounted, and can be easily assembled even in a narrow mounting area.

In the second and the electronic component 1, the protruding component side electrode 11 is fitted into the fitting hole 21 of the circuit board 2, and one surface of the component side electrode 11 (the bottom surface in the present embodiment) is aligned with the circuit. Since the board 2 is assembled in the state of the board surface, the joint strength between the two is high. In the present embodiment, since the substrate-side plate electrode 23 is connected to the component-side plate electrode 12 around the component-side electrode 11, the bonding strength between the two can be further improved. Therefore, the electronic component 1 relating to the present invention is not easily detached from the circuit substrate 2 even if it is subjected to shock or vibration.

Third, since the component side electrode 11 of the electronic component 1 is connected to the substrate side electrode 22 provided at the bottom of the fitting hole 21 of the circuit board 2, the volume of the electrode 11 can be set to be sufficiently smaller than the volume of the fitting hole 21. Therefore, at the time of assembly, the solder 32 applied to the substrate-side electrode 22 can be accommodated in the fitting hole 21 without overflowing. Therefore, bridging of the component side electrode 11 and other conductive portions can be suppressed, and the risk of short circuit can be reduced.

In the fourth electronic component 1, the protruding component side electrode 11 is fitted to the fitting hole 21 of the circuit board 2, and the mounting position is easily positioned. Further, if the shape of the component side electrode 11 and the fitting hole 21 is, for example, an equilateral triangular prism shape, since the assembly direction of the electronic component 1 is restricted to a predetermined one direction, assembly errors can be prevented. This effect is obtained by providing a plurality of component side electrodes 11 and a fitting hole 21 in combination, and can also be obtained by carefully designing the arrangement. Therefore, the electronic component 1 has a high assembly position accuracy.

On the other hand, the circuit board 2 is used to mount the electronic component 1, so that the same operational effects can be obtained. Further, it is a matter of course that the circuit device in which the electronic component 1 is mounted on the circuit board 2 can enjoy the same operational effects.

2. Second embodiment of an electronic component and a circuit board according to the present invention

Fig. 5 is a perspective view of the electronic component related to the present invention as seen from the bottom. Fig. 6 is a perspective view of a circuit board according to the present invention. In addition, Fig. 7 is a cross-sectional view taken along line VII-VII of the electronic component and the circuit board shown in Figs. 5 and 6, and Fig. 8 is a view showing a state in which the electronic component is mounted on the circuit board in the state of Fig. 7.

First, an electronic component related to the present invention will be described. The electronic component 4 includes a main body 44, a fitting hole 41, a component side electrode 45, and a component side flat electrode 42.

The main body 44 has a rectangular parallelepiped shape and is a laminated body of a dielectric substrate composed of the lowermost layer 442 and the other laminated portion 441 (see FIG. 7). In order to exhibit the predetermined function of the electronic component 4, the main body 44 is internally provided with circuit elements, capacitors, and the like required for capacitors, inductors, and the like. The fitting hole 41 is formed on the bottom surface of the electronic component 4, and the component side electrode 45 is provided on the bottom of the fitting hole 41. The component side plate electrode 42 is provided on the bottom surface of the electronic component 4 so as to surround the periphery of the fitting hole 41.

Specifically, the fitting hole 41 has a cylindrical shape and is formed at the center of the bottom surface. Further, the fitting hole 41 can be obtained as a through hole penetrating the lowermost layer 442.

The component side electrode 45 is formed in a flat shape and is provided in a lower portion of the other laminated portion 441. The component side electrode 45 is located directly above the fitting hole 41, and the central portion serves as the bottom surface of the fitting hole 41 and is exposed to the outside.

Further, the component side plate electrode 42 is provided on a bottom surface of the electronic component 4 in a portion other than the region 43 of the bottom surface of the electronic component 4 and the opening surface of the fitting hole 41 which is formed concentrically. This area 43 is made to have an area which ensures a sufficient distance so that the substrate-side electrode 51 of the circuit substrate 5 and the part-side plate electrode 42 are not bridged during assembly. Further, the component side electrode 45 and the component side plate electrode 42 can be formed by a film forming technique such as sputtering or vapor deposition, printing, plating, or a combination thereof.

This electronic component 4 is mounted on a circuit board related to the present invention. In other words, as shown in FIG. 8, the electronic component 4 is fitted to the fitting hole 41 in the fitting hole 41 so as to be protruded from the plate surface of the circuit board 5, and the component is fitted at the same time. The side electrode 45 is connected to the substrate-side electrode 51, and the electronic component 4 is mounted on the circuit board 5 in a state where the bottom surface of the electronic component 4 is aligned on the board surface. At this time, the component side plate electrode 42 is connected to the substrate side plate electrode 52 which is provided on the board surface of the circuit board 5 so as to surround the periphery of the substrate side electrode 51.

Next, a circuit board related to the present invention will be described. The circuit board 5 includes a board body 54 , a board side electrode 51 , and a board side plate electrode 53 .

The substrate main body 54 is a laminated substrate, and is provided with various electrodes, wiring, and the like in order to be able to mount various electronic components and the like. Further, the substrate-side electrode 51 is formed in a projecting shape and is provided to protrude from the plate surface. The substrate-side flat plate electrode 53 is provided to surround the periphery of the substrate-side electrode 51.

Specifically, the substrate-side electrode 51 is formed in a cylindrical shape so as to be fitted into the fitting hole 41 of the electronic component 4. The length of the substrate-side electrode 51 is set to be slightly shorter than the length of the fitting hole 41 so that a gap can be formed between the front end surface of the substrate-side electrode 51 and the bottom surface of the fitting hole 41 at the time of fitting.

Further, the substrate-side flat plate electrode 53 is formed on the upper portion of the substrate main body 54, and is formed in accordance with the shape and position of the component-side flat plate electrode 42 of the electronic component 4. Further, the substrate-side electrode 51 and the substrate-side plate electrode 53 can be formed by a film forming technique such as sputtering or vapor deposition, printing, plating, or a combination thereof.

This circuit board 5 is equipped with electronic parts related to the present invention. In other words, as shown in Fig. 8, the substrate-side electrode 51 is fitted into the fitting hole 41 formed in the bottom surface of the electronic component 4, and is connected to the component-side electrode 45 provided at the bottom of the fitting hole 41, and The electronic component 4 is mounted on the circuit board 5 in a state where the bottom surface of the electronic component 4 is aligned on the board surface. At this time, the plate electrode 53 is connected to the component side plate electrode 42 which is provided on the bottom surface of the electronic component 4 so as to surround the periphery of the fitting hole 41.

In the process of mounting the electronic component 4 on the circuit board 5, as shown in Fig. 7, an appropriate amount of solder pastes 61, 62 are applied to the surfaces of the substrate side electrode 51 and the substrate side plate electrode 53.

The solder paste 61 is diffused into the gap P2 inside the component side plate electrode 42 at the time of assembly shown in Fig. 8. Therefore, the solder paste 61 connects the substrate-side flat plate electrode 53 and the component-side flat plate electrode 42 without entering the fitting hole 41. Here, the gap P2 is formed between the bottom surface of the electronic component 4 and the board surface of the circuit board 5 depending on the thickness of the component side plate electrode 42, but may be reversed depending on the thickness of the substrate side plate electrode 53 or both. A gap P2 is generated in the thickness.

Further, in the assembly shown in Fig. 8, most of the solder paste 62 is housed in the gap between the front end surface of the substrate-side electrode 51 and the surface of the component-side electrode 45, and a small portion is diffused on the side of the substrate-side electrode 51. In the gap with the inner wall of the fitting hole 41. At this time, the solder paste 62 does not hang down on the surface of the circuit board 5 due to the adhesive force, the surface of the component side electrode 51, and the surface of the inner wall of the fitting hole 41. Therefore, the solder paste 62 does not overflow from the fitting hole 41, and the substrate-side electrode 51 and the component-side electrode 45 can be connected. Thereby, the solder paste 61 and the solder paste 62 are not in contact with each other, so that the electrodes 51, 45 and the plate electrodes 53, 42 are not bridged.

According to the electronic component 4 described above, the following effects can be obtained. The fitting holes 41 of the first and second electronic components 4 correspond to the projecting substrate-side electrodes 51 provided on the circuit board 5, so that they can be formed into a long and thin rod shape. Further, since the component side electrode 45 of the electronic component 4 is provided at the bottom of the fitting hole 41, it can be formed to be small with the fitting hole 41. Therefore, if the substrate-side electrode 51 having the protrusion shape is provided on the mounted circuit board 5, the electronic component 4 can be easily mounted even in a narrow mounting area.

In the second electronic component 4, the protruding substrate-side electrode 51 is fitted into the fitting hole 41, and one surface (the bottom surface in the present embodiment) on which the fitting hole 41 is formed is aligned with the circuit substrate 5. The surface of the board is assembled, so the joint strength between the two is high. In the present embodiment, since the substrate-side plate electrode 53 is connected to the component-side plate electrode 42 around the electrode 51, the bonding strength between the two can be further improved. Therefore, the electronic component 4 is not easily detached from the circuit board 5 even if it is subjected to an impact or vibration.

Third, the component side electrode 45 of the electronic component 4 is provided at the bottom of the fitting hole 41 and is connected to the protruding substrate side electrode 51. Therefore, the volume of the substrate side electrode 51 can be set to be larger than that of the fitting hole 41. The volume is sufficiently large, so that it can be accommodated in the fitting hole 41 without overflowing the solder paste 62 applied to the substrate-side electrode 51 at the time of assembly. Therefore, bridging of the component side electrode 45 and other conductive portions can be suppressed, and the risk of short circuit can be reduced.

In the fourth electronic component 4, since the projecting substrate-side electrode 51 is fitted to the fitting hole 41 and assembled, it is easy to position the mounting position. Further, when the shapes of the substrate-side electrode 51 and the fitting hole 41 are, for example, equilateral triangular prisms, since the assembly direction of the electronic component 4 is restricted to a predetermined one direction, assembly errors can be prevented. This effect is obtained by combining a plurality of substrate-side electrodes 51 and the fitting holes 41, and can also be obtained by carefully designing the arrangement. Therefore, the electronic component 4 has a high assembly position accuracy.

On the other hand, the circuit board 5 is used to mount the electronic component 4, so that the same operational effects can be obtained. Further, it is a matter of course that the circuit device in which the electronic component 4 is mounted on the circuit board 5 can enjoy the same operational effects.

3. Variations of electronic components and circuit boards related to the present invention

The electronic component and the circuit board according to the present invention have not been limited to the above-described embodiments. Fig. 9 shows another embodiment of the electronic component shown in Fig. 1, and Fig. 10 shows another embodiment of the circuit board shown in Fig. 2. In the electronic component and the circuit board according to the first embodiment described above, the component side electrode 11, the substrate side electrode 22, and the fitting hole 21 are each provided in three.

The component side electrodes 11a to 11c, the substrate side electrodes 22a to 22c, and the fitting holes 21a to 21c are arranged to form the apexes of the equilateral triangles. Here, the component side electrode 11a corresponds to the fitting hole 21a and the substrate side electrode 22a, the component side electrode 11b corresponds to the fitting hole 21b and the substrate side electrode 22b, and the component side electrode 11c corresponds to the fitting hole 21c and the substrate side electrode 22c. . Therefore, as described above, since the assembly direction of the electronic component 1 is restricted to a predetermined one direction, assembly errors can be prevented. In addition, since the fitting is performed in three places, the connection strength can be improved. Further, similarly, the same effect can be obtained by arranging a plurality of electrodes asymmetrically with the fitting holes. As described above, the embodiment in which a plurality of electrodes and fitting holes are provided can of course be applied to the electronic component and the circuit board according to the second embodiment described above.

Next, Fig. 11 shows still another embodiment of the electronic component shown in Fig. 1, and Fig. 12 shows still another embodiment of the circuit board shown in Fig. 2. In the electronic component and the circuit board according to the first embodiment described above, the annular member 14 is provided around the component side electrode 11, and the fitting hole 21 is also formed in the ring. The step member 25 corresponds to the step portion 25. The annular member 14 is formed with a perforated cylindrical insulator formed in the center of the end surface, and the member is provided on the bottom surface of the electronic component 1 by penetrating the component side electrode 11.

According to this embodiment, even when a larger amount of the solder paste 31 (see FIGS. 3 and 4) is applied to the substrate-side plate electrode 23 than the correct amount, the component-side electrode 11 is attached to the electronic component 1. The root end is covered by the annular member 14, so that the component side electrode 11 and the plate electrodes 12, 23 are still not bridged. Further, even when the solder paste 31 flows into the fitting hole 21, since the solder paste 31 is accumulated in the gap between the annular member 14 and the step portion 25, it does not come into contact with the solder paste 32 applied to the substrate side electrode 22. The electrodes 11, 22 and the plate electrodes 12, 23 do not bridge. Further, according to this embodiment, the effect of improving the joint strength can be obtained by the annular member 14 and the step portion 25. As described above, the embodiment in which the annular member 14 and the step portion 25 are provided can of course be applied to the electronic component and the circuit board according to the second embodiment described above.

Further, in the above-described embodiment, the inner side surface electrode connected to the electrodes 22, 45 is formed on the inner wall of the fitting hole 21, 41 by means of sputtering or the like, and the entire inner portion of the hole may be used as the inner side of the hole. Connection surface. Therefore, the connectivity of the electrodes 22, 45 to the electrodes 11, 51 corresponding thereto can be improved.

Further, in the above-described embodiment, instead of the electrodes 11, 51, a projecting insulator having a flat-plate-shaped front end electrode may be used. According to this configuration, even when a solder paste 31 (see FIGS. 3 and 4) having a larger amount than the correct amount is applied to the substrate-side flat plate electrode 23 during assembly of the electronic component, the solder paste 31 is difficult to reach. The electrode portion at the front end is protruded, so that an effect of preventing bridging can be obtained.

As described above, according to the present invention, there is provided an electronic component suitable for assembly in a narrow range, a circuit substrate suitable for mounting the electronic component, and a circuit device including the same.

Further, in the embodiment described above, the use of each of the electrodes 11, 51, 22, 45 and the respective plate electrodes 12, 23, 42, 53 (that is, the distribution of electric signals or the like) may be suitably designed. It is determined that it is preferable to distribute the ground electrode (GND electrode) to each of the plate electrodes 12, 23, 42, and 53. This is because the connection areas of the plate electrodes 12, 23, 42, and 53 are large and surround the respective electrodes 11, 51, 22, and 45, so that it is possible to obtain a signal for reducing the signal distributed to the electrodes 11, 51, 22, and 45. The beneficial effects of the news.

Although the content of the present invention has been specifically described above with reference to the preferred embodiments, the basic technical idea and teachings of the present invention are naturally understood by those skilled in the art.

1,4. . . Electronic parts

2,5. . . Circuit substrate

11,45. . . Part side electrode

51,22. . . Substrate side electrode

12,42. . . Part side plate electrode

23,53. . . Substrate side plate electrode

21,41. . . Fitted hole

Fig. 1 is a perspective view of the electronic component (first embodiment) of the present invention as seen from the bottom.

Fig. 2 is a perspective view of a circuit board (first embodiment) according to the present invention.

Fig. 3 is a cross-sectional view taken along line III-III of the electronic component and the circuit board shown in Figs. 1 and 2;

Fig. 4 is a view showing a state in which an electronic component is mounted on a circuit board in the state of Fig. 3.

Fig. 5 is a perspective view of the electronic component (second embodiment) of the present invention as seen from the bottom.

Fig. 6 is a perspective view showing a circuit board (second embodiment) according to the present invention.

Fig. 7 is a cross-sectional view taken along the line VII-VII of the electronic component and the circuit board shown in Figs. 5 and 6.

Fig. 8 is a view showing a state in which an electronic component is mounted on a circuit board in the state of Fig. 7.

Fig. 9 is a schematic view showing another embodiment of the electronic component shown in Fig. 1.

Fig. 10 is a schematic view showing another embodiment of the circuit board shown in Fig. 2.

Fig. 11 is a schematic view showing still another embodiment of the electronic component shown in Fig. 1.

Fig. 12 is a schematic view showing still another embodiment of the circuit board shown in Fig. 2.

1. . . Electronic parts

2. . . Circuit substrate

11. . . Part side electrode

12. . . Part side plate electrode

13. . . Ontology

twenty one. . . Fitted hole

twenty two. . . Substrate side electrode

twenty three. . . Substrate side plate electrode

twenty four. . . Substrate body

31. . . Solder paste

32. . . Solder paste

241. . . Tier 1

242. . . Level 2

P1. . . gap

Claims (17)

A circuit board comprising at least one fitting hole, at least one substrate side electrode, and a substrate side plate electrode, and an electronic component is mounted, wherein the fitting hole is formed on a plate surface; and the substrate side electrode is provided in the foregoing a bottom surface of the fitting hole; the substrate-side flat plate electrode is provided on the plate surface so as to surround the fitting hole; the electronic component includes at least one protruding component side electrode and a component side plate electrode; and the component side electrode system The component-side flat plate electrode is provided on the predetermined one side around the component side electrode so as to form a concave region around the component side electrode; the component side electrode is fitted to the embedded surface. a hole is formed, and the substrate-side electrode is connected to the component-side electrode; the substrate-side plate electrode is connected to the component-side plate electrode; and the plate surface and the predetermined one surface are opposed to each other with the concave region interposed therebetween The aforementioned electronic parts. The circuit board of claim 1, wherein the part-side flat plate electrode surrounds the part-side electrode without a gap. The circuit board of claim 1, wherein the substrate-side flat plate electrode surrounds the fitting hole without a gap. The circuit board of claim 2, wherein the substrate-side flat plate electrode surrounds the fitting hole without a gap. The circuit board according to claim 1, wherein the predetermined one surface is provided with three of the component side electrodes, and the like is arranged to constitute each vertex of the isosceles triangle; the plate surface is attached to the three aforementioned component sides Three aforementioned fitting holes are provided at positions corresponding to the electrodes. The circuit board of claim 2, wherein the predetermined one surface is provided with three of the component side electrodes, and the like is configured to constitute each vertex of the isosceles triangle; the plate surface is attached to the three aforementioned component sides Three aforementioned fitting holes are provided at positions corresponding to the electrodes. The circuit board of claim 3, wherein the predetermined one surface is provided with three of the component side electrodes, and the like is configured to constitute each vertex of the isosceles triangle; the plate surface is attached to the three aforementioned component sides Three aforementioned fitting holes are provided at positions corresponding to the electrodes. The circuit board of claim 4, wherein the predetermined one surface is provided with three of the component side electrodes, and the like is configured to constitute each vertex of the isosceles triangle; the plate surface is attached to the three aforementioned component sides Corresponding electrodes Three aforementioned fitting holes are provided at the position. The circuit board according to claim 1, wherein the component side electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. The circuit board of claim 2, wherein the component side electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. The circuit board of claim 3, wherein the component side electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. The circuit board of claim 4, wherein the component side electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. The circuit board of claim 5, wherein the component side electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. The circuit board of claim 6, wherein the component side electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. The circuit board of claim 7, wherein the component side electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. Such as the circuit board of claim 8 of the patent scope, wherein the aforementioned part side is electrically The electrode has an insulator and a flat electrode portion provided on a front end surface of the insulator. The circuit board according to any one of claims 1 to 16, wherein the substrate side plate electrode and the component side plate electrode are ground electrodes.