TWI395451B - Housing assembly and portable electronic device using same - Google Patents

Description

Housing assembly and portable electronic device having the same

The present invention relates to a housing assembly, and more particularly to a housing assembly for a portable electronic device and a portable electronic device having the same.

With the rapid development of economy and technology and the improvement of people's quality of life, the use of various portable electronic devices such as mobile phones and personal digital assistants (PDAs) has become more and more popular. Consumers are no longer just satisfied with the simple answering phone function of portable electronic devices, they have begun to put forward higher requirements for the personalized and multifunctional needs of portable electronic devices.

In order to enable the portable electronic device to have more and more personalized functions to meet the needs of different consumers, it is necessary to install functional modules and electronic components that meet different functions in the portable electronic device, so that the portable electronic device is It must have a space for accommodating these functional modules and electronic components.

Referring to FIG. 1 and FIG. 2 , a housing assembly 20 of a portable electronic device includes a housing 21 and a circuit board 23 . The housing 21 is substantially rectangular and is made of a plastic material, and is provided with a subscriber identification module card (hereinafter referred to as a SIM card) mounting portion 211. The SIM card mounting portion 211 is a substantially rectangular recess-shaped receiving space, and includes a SIM card supporting portion 214, a SIM card sliding out slope 215, and a SIM card connector mounting hole 216. The SIM card support portion 214 is recessed on the housing 21 and parallel to the surface of the housing 21; the SIM card slide-out ramp 215 connects the SIM card support portion 214 and the housing 21 body and supports the SIM card. The portion 214 is disposed at an oblique angle; The SIM card connector mounting hole 216 is disposed through the housing 21 and adjacent to the SIM card support portion 214. The circuit board 23 has a substantially rectangular plate shape and is mounted on the casing 21. The circuit board 23 is provided with a SIM card connector 232 corresponding to the SIM card connector mounting hole 216 of the SIM card mounting portion 211 on the housing 21. When the housing 21 and the circuit board 23 are assembled to each other, the SIM card support portion 214 is abutted against the circuit board 23. Since the housing 21 is made of a plastic material, the thickness of the SIM card support portion 214 of the housing 21 is relatively large to ensure the structural strength of the SIM card support portion 214, thereby facilitating the entire portable electronic device. The internal space occupies a large space, so that the space between the SIM card support portion 214 and the circuit board 23 is insufficient to accommodate or dispose the electronic component or the functional module.

In view of the above, it is necessary to provide a housing assembly for use in a portable electronic device, such that the housing assembly can free up more of the functional modules and electronic components for carrying in the portable electronic device. space.

It is also necessary to provide a portable electronic device having the housing assembly such that the portable electronic device has a housing space for mounting more functional modules and electronic components.

A housing assembly includes a housing and a shielding cover, the housing is provided with a card receiving through hole for receiving a wafer card, and the shielding cover is mounted together with the housing; The body assembly further includes a metal member integrally formed with the housing by a buried incidence molding method; the metal member includes a first folded edge and a second folded edge disposed adjacent to the card The shielding cover includes a supporting portion, and the supporting cover is disposed corresponding to the card receiving through hole to support the mounting in the card receiving through hole. The support card, the first hem, the second hem, and the card accommodating hole respectively define a first accommodating space for mounting the chip card, and a lower portion of the support portion is formed for The second accommodating space of the electronic component is accommodated.

A portable electronic device includes a housing assembly and a circuit board. The housing assembly includes a housing and a shielding cover. The housing defines a through hole for receiving a chip. a card, the housing and the circuit board are assembled with each other; the shielding cover includes a cover body disposed on the circuit board; the housing assembly further includes a metal member, and the housing is embedded with the housing The injection molding method is integrally formed; the metal member includes a first flange and a second flange, which are disposed on the hole wall of the card receiving through hole; the shield includes a support portion Corresponding to the card receiving through hole to support the wafer card installed in the card receiving through hole, the supporting portion, the first folded edge, the second folded edge and the card receiving through hole common A first accommodating space for mounting the chip card is formed, and a second accommodating space for accommodating the electronic component is formed under the supporting portion.

Compared with the prior art, the housing assembly of the portable electronic device of the present invention replaces the card supporting portion of the card receiving through hole of the conventional portable electronic device with the thinner metal sheet of the card sliding out slope And replacing the card supporting portion of the card-receiving through hole of the portable electronic device with a shielding cover, so as to free one under the card supporting portion of the card receiving through hole of the portable electronic device It is used to install the housing space of each electronic component and each functional module, effectively improving the space utilization of the entire portable electronic device.

Referring to FIG. 3 and FIG. 4, the portable electronic device of the present invention includes an action. A telephone, a personal digital assistant (PDA), etc., includes a housing assembly 50. The housing assembly 50 of the portable electronic device of the present invention includes a housing 51, a metal member 52, a circuit board 53 and a shield cover 55.

The housing 51 is a substantially rectangular plastic case that includes a card receiving through hole 511. The card accommodating hole 511 has a substantially rectangular shape and is opened through the casing 51 for mounting a wafer card applied to the portable electronic device, such as a subscriber identification module card. Hereinafter referred to as SIM card, flash memory card (SanDisk card, SD card) and other card media.

The metal member 52 is made of a thin metal sheet and includes a first flange 523 and a second flange 525. The metal piece 52 and the casing 51 are integrally molded in a mold by a immersion forming method, so that the metal member 52 is formed on the hole wall of the card accommodating through hole 511 of the casing 51. A folded edge 523 and a second folded edge 525. The first flange 523 is at an oblique angle with the hole of the card receiving through hole 511 of the housing 51 for stopping the wafer card installed in the card receiving through hole 511, and is also convenient. The wafer card is loaded and unloaded out of the card receiving through hole 511. The second flange 525 is formed by bending a wall of the card receiving through hole 511 of the casing 51 adjacent to the first flange 523 perpendicularly to the surface of the casing 51, and the second folding The edge 525 is used to restrict the wafer from being caught in the card receiving through hole 511.

The circuit board 53 has a substantially rectangular plate shape and is mounted on the housing 51. A chip card connector 532, a first routing area 535 and a second routing area 537 are disposed on the circuit board 53. The chip card connector 532 and the first routing area 535 are disposed adjacent to the circuit board 53. The second cloth The region 537 is disposed adjacent to the first routing region 535 to form a substantially "T" shape. The first routing area 535 and the second routing area 537 are both used for the electronic components and functional modules required for the portable electronic device. When the circuit board 53 is assembled with the housing 51, the wafer card connector 532 and the first routing area 535 are exposed on the card receiving through hole 511 of the housing 51. The wafer card connector 532 is disposed away from the first flange 523, and the first routing region 535 is disposed adjacent to the first flange 523.

The shield cover 55 is a sheet metal member having a "T" shape and is interposed between the housing 51 and the circuit board 53. The shield cover 55 includes a cover 551 and a flange 553 that is bent perpendicularly toward the circuit board 53 along the circumference of the cover 551. The shape and size of the cover 551 correspond to the shape and size of the combination of the first layout area 535 and the second layout area 537 of the circuit board 53. The shield cover 55 is mounted on the circuit board 53 by its folded edge 553 for covering the electronic components and functional modules on the circuit board 53 to reduce electromagnetic interference. The cover 551 of the shield cover 55 is recessed from the surface facing the housing 51 toward the surface facing the circuit board 53 so as to form a rectangular support portion 555 on the surface facing the housing 51. The thickness of the support portion 555 is equivalent to the height at which the wafer card connector 532 is mounted on the circuit board 53. The peripheral contour of the supporting portion 555 is equivalent to the outer contour of the first receiving edge 523 of the card receiving through hole 511 of the housing 51, so that when the shielding cover 55 and the housing 51 are assembled together, the supporting portion 555 and The card receiving through hole 511 of the housing 51, the first flange 523 of the metal member 52, and the second flange 525 collectively define an accommodation space for mounting the chip card. The support portion 555 corresponds to the first routing region 535 of the circuit board 53 for covering the first routing region 535 on the circuit board 53.

It can be understood that the shield cover 55 is not limited to the "T" shape described above, and may be other shapes, and the shape and the arrangement path of the electronic components and the functional modules disposed on the circuit board 53 and The location is adapted.

It can be understood that the support portion 555 of the shield cover 55 is not limited to being recessed by the surface of the cover body 551 of the shield cover 55 facing the housing 51 toward the surface facing the circuit board 53. The support portion 555 of the shield cover 55 may also be a portion of the cover 551 of the shield cover 55, and the height thereof may be the same as the cover 551.

When assembling the housing assembly 50 of the portable electronic device of the present invention, first, the shield cover 55 is mounted on the circuit board 53 so as to be disposed on the first layout area 535 and the second of the circuit board 53. a layout area 537, the support portion 555 covers the first layout area 535 of the circuit board 53 and is flush with the wafer card connector 532 disposed on the circuit board 53; next, the housing 51 and the shield are mounted The circuit board 53 of the cover 55 is assembled such that the wafer card connector 532 on the circuit board 53 and the support portion 555 of the shield case 55 are exposed by the card receiving through hole 511 of the casing 51 of the casing 51.

Referring to FIG. 5 , the card housing through hole 511 of the housing 51 , the first flange 523 of the metal member 52 , the second flange 525 , the support portion 555 of the shield cover 55 , and the wafer card of the circuit board 53 . The connectors 532 collectively enclose an accommodation space 510 that houses the wafer card. An accommodating space 550 for mounting the electronic components and the functional modules is formed between the supporting portion 555 of the shielding cover 55 and the circuit board 53 , thereby effectively improving the space utilization ratio of the entire portable electronic device.

It can be understood that the metal member 52 of the housing assembly 50 and the housing 51 are also It can be integrally formed without using a buried incidence molding method, and the metal member 52 can also be integrally formed with the shield cover 55. The shield cover 55 has a first flange 523, a second flange 525, and a support portion 555. The shield cover 55 is disposed under the card receiving through hole 511 of the housing 51. The first folded edge 523, the second folded edge 525, and the supporting portion 555 and the card receiving through hole 511 together form a wafer card accommodating space for accommodating the wafer card; a lower portion of the supporting portion 555 forms a space for receiving Place the housing space of the electronic components.

It can be understood that the metal member 52 and the shield cover 55 can also be integrally formed with the housing 51 by a burying and injection molding method. A support space for accommodating electronic components is formed under the support portion 555 and the circuit board 53.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and equivalent modifications or variations made by those skilled in the art in accordance with the spirit of the present invention are It should be covered by the following patent application.

(Chinese):

20‧‧‧Shell components

21‧‧‧ housing

211‧‧‧SIM card installation department

214‧‧‧SIM card support

215‧‧‧ SIM card slides out of the slope

216‧‧‧SIM card connector mounting hole

23‧‧‧ Circuit board

232‧‧‧SIM card connector

(this invention):

50‧‧‧Shell assembly

51‧‧‧Shell

510‧‧‧ accommodating space

511‧‧‧Carbon through hole

52‧‧‧Metal parts

523‧‧‧First Folding

525‧‧‧second hem

53‧‧‧Circuit board

532‧‧‧wafer card connector

535‧‧‧First deployment area

537‧‧‧Second layout area

55‧‧‧Shield

550‧‧‧ accommodating space

551‧‧‧ Cover

553‧‧‧Folding

555‧‧‧Support

1 is a perspective view of a housing assembly of a conventional portable electronic device; FIG. 2 is a partial cross-sectional view of the housing assembly of FIG. 1 taken along the II-II direction; FIG. 3 is a perspective view of a housing assembly of the portable electronic device of the present invention; 3 is a schematic perspective view of the housing assembly shown in FIG. 3; and FIG. 5 is a partial cross-sectional view of the housing assembly shown in FIG. 3 in the VV direction.

50‧‧‧Shell assembly

51‧‧‧Shell

52‧‧‧Metal parts

523‧‧‧First Folding

525‧‧‧second hem

532‧‧‧wafer card connector

555‧‧‧Support

Claims (14)

A housing assembly includes a housing and a shielding cover, the housing is provided with a card receiving through hole for receiving a wafer card, and the shielding cover is mounted together with the housing; The housing assembly further includes a metal member integrally formed with the housing by a buried incidence molding method; the metal member includes a first flange and a second flange, and the sticker is disposed adjacent to the housing The shield cover includes a support portion corresponding to the card receiving through hole to support a wafer card mounted in the card receiving through hole, the support The first hem, the second hem, and the card accommodating hole respectively define a first accommodating space for mounting the chip card, and a portion for accommodating the electronic component is formed under the supporting portion Two accommodation spaces. The housing assembly of claim 1, wherein the shield and the housing are integrally formed by a buried incidence molding method. The casing assembly of claim 1 or 2, wherein the second flange is a vertical casing of the hole wall adjacent to the first flange by the card receiving through hole The surface is stretched and bent. A housing assembly includes a housing and a shielding cover, the housing is provided with a card receiving through hole for receiving a wafer card, and the shielding cover is mounted together with the housing; The improvement is that the shielding cover has a first folded edge, a second folded edge and a supporting portion, and the shielding cover is disposed under the card receiving through hole, and the first folded edge and the second folded edge are The supporting portion and the card receiving through hole form a first accommodating space for accommodating the chip card; and a second accommodating space for accommodating the electronic component is formed under the supporting portion. The housing assembly of claim 4, wherein the second hem is disposed adjacent to the first hem. A portable electronic device includes a housing assembly and a circuit board. The housing assembly includes a housing and a shielding cover. The housing defines a through hole for receiving a chip. a card, the housing and the circuit board are assembled with each other; the shielding cover includes a cover that is disposed on the circuit board; and the improvement is that the housing assembly further includes a metal member and the case The body is integrally formed by a burying and forming method; the metal member includes a first hem and a second hem which are disposed on the hole wall of the card accommodating through hole; the shield a support portion is disposed corresponding to the card receiving through hole to support a wafer card mounted in the card receiving through hole, the support portion, the first flange, the second flange, and the card capacitor The through holes are formed together to form a first accommodating space for mounting the chip card, and a second accommodating space for accommodating the electronic components is formed under the supporting portion. The portable electronic device of claim 6, wherein the shield and the housing are integrally formed by a buried incident molding method. The portable electronic device of claim 6 or 7, wherein the second hem is extended by a circumferentially perpendicular housing surface of the card accommodating through hole adjacent to the first hem. Bent out. The portable electronic device of claim 8, wherein the circuit board is provided with a chip card connector and a first layout area, and the chip card connector and the first layout area are corresponding to the card accommodation. The through hole is disposed and the wafer card connector is disposed away from the first hemming edge, and the first routing area is disposed adjacent to the first hemming edge and is covered by the supporting portion of the shielding cover. The portable electronic device of claim 9, wherein the peripheral contour of the support portion of the shield and the card-receiving through hole of the housing are adjacent to the first flange wall. Similarly, an installation of the electronic component and the functional module is formed between the support portion of the shield and the circuit board. space. A portable electronic device includes a housing assembly and a circuit board; the housing assembly includes a housing and a shield, the housing includes a card receiving through hole, and the housing and the circuit board are mutually Assembled together, the shield includes a cover that is disposed on the circuit board; the improvement is that the shield has a first flange, a second flange, and a support portion, the shield The first folded edge and the second folded edge together with the support portion and the card receiving through hole form a receiving space for accommodating the chip card; the lower portion of the supporting portion is formed for use. The accommodating space for the electronic component is accommodated. The portable electronic device of claim 11, wherein the second hem is disposed adjacent to the first hem and encloses a card accommodating space with the support portion. The portable electronic device of claim 12, wherein the circuit board is provided with a chip card connector and a first layout area, and the chip card connector and the first layout area are corresponding to the card accommodation. The through hole is disposed and the wafer card connector is disposed away from the first hemming edge, and the first routing area is disposed adjacent to the first hemming edge and is covered by the supporting portion of the shielding cover. The portable electronic device of claim 13, wherein a peripheral contour of the support portion of the shield is equal to a contour of the housing that forms the card receiving through hole adjacent to the wall of the first flange. The support portion cooperates with the wall of the housing that forms the card receiving through hole adjacent to the first flange hole wall.