TWI394244B - Chip package module - Google Patents

Description

Chip package module

The invention relates to a chip package module, in particular to an improved structure of a sealing layer of a chip package module, which aims to provide a completely covered, thereby preventing oxidation, and ensuring that the stability of the chip package is not interfered by external forces. And the structure of the broken conductive layer.

In recent years, due to the requirements of lightweight and miniaturization of electronic products, the assembly and assembly technology of electronic components has gradually evolved toward light, thin, short, and small targets. Generally, single-chip or multi-chip electronic components are capable of transmission. The ability of the I/O signal and current, as well as the function of dissipating heat and protecting the photosensitive wafer, must be constructed into an integrated chip package module through a packaging process.

As an example of the image sensor shown in the first figure, it can be regarded as one of the typical modular chip package components. A similar image sensor includes a photosensitive wafer 11, a circuit structure, and a housing. And all the photosensitive wafers 11 for light sensing are arranged on a substrate 12 disposed inside the casing, and the external contacts 111 of the photosensitive wafer 11 are disposed on the substrate 12.

Further, under the substrate 12, a substrate 13, an insulating layer 14, a conductive layer 15, and an outermost solder mask 16 and circuit pins 17 are sequentially constructed; in the entire circuit structure, each circuit pin 17 passes through The solder mask 16 is in contact with the conductive layer 15 , and the electrical connection between the substrate 12 and the circuit pin 17 is formed by the conductive layer 15 bypassing the insulating layer 14 and the substrate 13 , and a transparent layer is disposed above the photosensitive wafer 11 . Cover plate 18, transparent cover 18 and sense The optical wafers 11 are separated by a wall 19 .

Moreover, the conventional method for manufacturing a chip package module uses a processing mode in which a plurality of chip package modules are simultaneously disposed on the same substrate 13 as shown in the second figure, and finally the packaged wafer is completed. The package module units are cut one by one to obtain a complete chip package module unit; in the existing technical field, it is necessary to open a layer between the chip package module units before constructing the insulation layer, as shown in the third figure. The groove A is shown, and then the insulating layer, the conductive layer and the solder mask are disposed on the chip package module unit, and finally the transparent cover 18 is cut along the groove A, and each chip package module unit Can be divided one by one.

However, such a conductive layer structure design, and a manufacturing method will cause the conductive layer to be exposed at the cutting portion (as shown in the first figure), so that the phenomenon of oxidative corrosion of the conductive layer is liable to occur, and the manufacturing method is formed. The conductive layer, which is in contact with the external contact 111, forms a T-shaped contact. As shown in the first figure, the structure is relatively unstable and easily detached, and the T-character is easily caused by external force interference. The type of contact produces a break.

In view of the above, the main object of the present invention is to provide a conductive layer structure and related manufacturing method capable of solving the problem that the conductive layer of the chip package module is easily oxidized, and ensuring that the stability of the wafer package is not broken by external force interference.

An embodiment of a chip package module of the present invention includes: at least one wafer disposed on a substrate; a cover plate covering the wafer; and a wall for separating the cover plate and the wafer; a through hole that passes through the substrate; An insulating layer is disposed in the through hole; a second insulating layer covers the substrate; and a conductive layer is disposed in the through hole and surrounded by the first insulating layer and extends to the second insulating layer On the floor.

The features of the present invention can be clearly understood by referring to the drawings and the detailed description of the embodiments.

The present invention mainly solves the problem that the conductive layer of the chip package module is easily oxidized and corroded, and the structure is unstable. For example, the fourth embodiment shows a cross-sectional view of the structure of the chip package module according to a preferred embodiment of the present invention, and the present invention is applied. The chip package module also includes a portion of the photosensitive wafer 21, the circuit structure, and the casing; wherein all the photosensitive wafers 21 for light sensing are arranged on a substrate 22 disposed inside the casing, the substrate 22 It may be 矽, and the substrate 22 is provided with an external contact 211 of the photosensitive wafer 21.

Wherein, the underlying substrate 22 is sequentially constructed with an insulating layer 23, a conductive layer 24, and the outermost solder mask 25 and circuit pins 26; in the entire circuit architecture, each circuit pin 26 passes through the solder mask 25 is in contact with the conductive layer 24, and the conductive layer 24 is electrically connected between the photosensitive wafer 21 and the circuit pin 26. The transparent wafer 27 is disposed above the photosensitive wafer 21, and the transparent cover 27 and the photosensitive wafer 21 are disposed. It is separated by a wall 28.

The focus is that the bottom of the insulating layer 23 of the entire chip package module is provided with at least one through hole 29 penetrating to the top surface of the substrate 22, and the through hole 29 is adjacent to the external contact 211 and penetrates therethrough. The inner wall of the hole 29 is constructed with an insulating material 291, so that the conductive layer 24, which is subsequently constructed on the periphery of the insulating layer 23, extends over the substrate 22 through the through hole 29, and is subsequently constructed. The solder mask 25 and the circuit pins 26 completely shield the conductive layer 24 at the bottom of the chip package module, and form the substrate 22 and the circuit pins 26 through the conductive layer 24 through the insulating layer 23 and the substrate 22. Electrical connection between.

Therefore, the structure of the conductive layer 24 which can be completely covered can not only solve the problem of external oxidation of the conductive layer 24, but also the conductive layer 24 extending upward through the base of the chip package module can be coated on the insulating layer 23 and The structure of the substrate 22 is in the middle; and the contact surface of the conductive layer 24 and the external contact 211 is a flat surface instead of a T CONTACT type contact, and the structure is more stable and difficult to be detached, and no breakage occurs due to external force interference.

In a specific implementation, the chip package module of the present invention can also adopt a processing mode in which a plurality of chip package modules are simultaneously arranged on the same wafer; and the processing and manufacturing method of the whole chip package module includes the following Step: a. Constructing a plurality of photosensitive wafers on the substrate 22, and providing a transparent cover 27 separated by a wall above the photosensitive wafer, as shown in FIG. 5; b, forming an etching on the substrate 22. Forming at least one through hole 29 penetrating to the top surface of the substrate 22 at a suitable position of the substrate 22 by separating the first groove B of each packaged package module unit, and the through hole 29 The depth of the first groove B is preferably deeper than the transparent cover plate 27, and the first groove B is preferably perpendicular to the substrate 22, so that the chip package module unit is formed slightly. The appearance structure of the rectangle is as shown in the fourth figure; c. The insulating layer 23 is formed on the periphery of the wafer, and the insulating layer 23 is preferably filled with the first groove B, and is simultaneously penetrated through the hole 29. Built on the inner wall The insulating material 291 is formed on the periphery of the insulating layer 23, and the conductive layer 24 is extended to the top surface of the substrate 22 via the through hole 29 and connected to the external contact 211; e. at the periphery of the conductive layer 24. Constructing the solder mask 25, and immersing the original material of the solder mask 25 into the first trench B; f, constructing the circuit pin 26; g, and finally cutting the substrate along the first trench B to each A chip package module unit is cut one by one.

The conductive layer structure design of the chip package module and the implementation of the manufacturing method can not only solve the problem that the conductive layer of the chip package module is easily oxidized and corrosion, but also ensure the stability of the chip package and avoid T CONTACT. Contact makes the structure more stable and will not break due to external interference.

The technical content and technical features of the present invention are disclosed above, but those skilled in the art can still make various substitutions and modifications without departing from the spirit of the present invention based on the disclosure of the present invention. Therefore, the scope of the present invention should be construed as being limited by the scope of the appended claims

A‧‧‧ groove

11‧‧‧Photosensitive wafer

111‧‧‧External contacts

12‧‧‧Substrate

13‧‧‧Substrate

14‧‧‧Insulation

15‧‧‧ Conductive layer

16‧‧‧welding mask

17‧‧‧Circuit pins

18‧‧‧Transparent cover

19‧‧‧堰 wall

21‧‧‧Photosensitive wafer

211‧‧‧ External contacts

22‧‧‧Substrate

23‧‧‧Insulation

24‧‧‧ Conductive layer

25‧‧‧ welding mask

26‧‧‧Circuit pins

27‧‧‧Transparent cover

28‧‧‧堰Wall

29‧‧‧through hole

291‧‧‧Insulation materials

The first figure is a cross-sectional view of a chip package module with an image sensor.

The second figure is a cross-sectional view of a semi-finished product that has not been cut by the chip package module of the image sensor.

The third figure is a cross-sectional view of the semi-finished structure before the wafer package module of the image sensor has not been constructed with an insulating layer.

FIG. 4 is a cross-sectional view showing the structure of a chip package module according to a preferred embodiment of the present invention.

The fifth figure is a cross-sectional view of a semi-finished product of a wafer package module that has not been cut according to a preferred embodiment of the present invention.

21‧‧‧Photosensitive wafer

211‧‧‧ External contacts

22‧‧‧Substrate

23‧‧‧Insulation

24‧‧‧ Conductive layer

25‧‧‧ welding mask

26‧‧‧Circuit pins

27‧‧‧Transparent cover

28‧‧‧堰Wall

29‧‧‧through hole

291‧‧‧Insulation materials

Claims (12)

A chip package module comprising: at least one wafer disposed on a substrate; a cover plate covering the wafer; a wall for separating the cover plate and the wafer; a penetration hole located at Under the crucible wall, through the substrate; a first insulating layer is located in the through hole; a second insulating layer covers the underside of the substrate; and a conductive layer is located in the through hole and is completely The first insulating layer surrounds and extends onto the second insulating layer. The chip package module of claim 1, further comprising a solder mask covering the second insulating layer and the conductive layer; thereby oxidizing the conductive layer from exposure. The chip package module of claim 1, further comprising an external contact, the conductive layer being electrically coupled to the through hole. The chip package module of claim 3, further comprising a circuit pin electrically coupled to the circuit pin and the external contact. The chip package module of claim 4, wherein the bottom and sides of the substrate are at right angles. The chip package module of claim 4, wherein the second insulating layer is adjacent to a side of the substrate. The chip package module of claim 4, wherein The second insulating layer is located at the bottom of the substrate and adjacent to the side of the substrate. The chip package module of claim 2, wherein the sidewall is connected to the solder mask. The chip package module of claim 2, wherein the sidewall is connected to the second insulating layer and the solder mask. The chip package module of claim 1, wherein the cover plate is made of a light transmissive material. The chip package module of claim 1, wherein the substrate is made of a tantalum material. The chip package module according to any one of claims 1 to 11, wherein the penetration hole has a depth equal to a thickness of the substrate adjacent to the penetration hole.