TWI394035B - Heat dissipation device with tilted dual fans - Google Patents

Description

Heat sink with tilting double fan

The invention relates to a heat sink, and more particularly to a heat sink having a tilted dual fan design.

With the rapid development of technology, computers or their display cards have widely used high-performance integrated circuits, such as Central Processing Unit (CPU) or Graphic Processing Unit (GPU), but the product When the body circuit performs various operations, a large amount of thermal energy is generated, and therefore, an auxiliary heat sink is required to dissipate the integrated circuit.

Most of these heat sinks are currently designed with dual fans, such as Taiwan 587769, 200644780, 545104, 577582, 200410626, 592347, and M245506. Among them, the heat sink disclosed in the 592347 and M245506 patents also mentions that one or both of the two fans are arranged to be inclined.

The fourth figure shows the basic structure of a heat sink with a down-blowing dual fan. Although the heat sink is also designed with a dual fan, the structure is obviously different from the heat sink described in the previous paragraph, and is often used for a computer. The GPU 9a on the display card 9 performs heat dissipation.

The heat sink with the down-blowing dual fan is basically composed of a windshield 90, two fans 91, and a heat sink 92. When the two fans 91 are simultaneously operated, the wind generated by the two fans 91 is substantially blown toward the heat sink 92 as indicated by an arrow in the figure, and is blown to both sides of the heat sink 92. A problem with such a heat sink is that when the winds of the two fans 91 are equivalent, the middle portion of the heat sink 92 forms a stagnant zone with only a small amount of wind passing through, or even no wind. As a result, the middle portion of the heat sink 92 cannot effectively perform the heat dissipation function, which affects the overall heat dissipation efficiency.

The invention provides a heat dissipating device with a tilting double fan, which comprises a heat sink, a first fan and a second fan. The heat sink includes a plurality of fins spaced side by side. The first and second fans are respectively located on the heat sink and used to blow the heat sink. The point is that the first and second fans are arranged in an inclined arrangement, and their inclination directions are the same. In this way, the wind blown from the first fan necessarily has some intermediate portion flowing through the heat sink for dissipating heat to the intermediate portion, thereby solving the heat dissipation of the conventional heat sink having the down-draw type dual fan. The problem of poor heat dissipation in the middle of the device.

Preferably, the bottom of the heat sink is further formed with a wind deflecting surface facing the first fan, and the inclined direction is opposite to the first fan. In this way, the first fan can be guided by the inclined surface of the wind guide so that more of the wind blown by the wind will flow through the middle portion of the heat sink.

Preferably, each of the heat sinks further has a first inclined side and a second inclined side, the first oblique side is opposite to the first fan, and the inclined direction is the same as the first fan; The second bevel is opposite the second fan and is inclined to be the same as the second fan. In this way, the gap between the first fan and the heat sink can maintain a uniform width, and the gap between the second fan and the heat sink can maintain a uniform width. This has a positive impact on the overall heat dissipation efficiency of the heat sink of the present invention.

Further invention and its effects will be disclosed in the following description.

The first and second figures show a preferred example of a heat sink 1 of the present invention. As shown in the first figure, the heat dissipating device 1 is mounted on a circuit board 6, and includes a windshield 2, a heat sink 3, a first fan 4 and a second fan 5, wherein: the windshield 2 A first through hole 222 and a second through hole 224 are longitudinally spaced apart.

The heat sink 3 is disposed in the windshield 2 and includes a plurality of fins 30 spaced laterally apart.

The first fan 4 is disposed on the hood 2 and located in the first through hole 222 of the hood 2 . The second fan 5 is disposed on the hood 2 and located in the second pass of the hood 2 . Inside the hole 224. The wind generated by the first fan 4 and the second fan 5 is blown toward the heat sink 3.

The hood 2 is mainly used for fixing the first and second fans 4 and 5. In practical applications, the first and second fans 4 and 5 can be fixed in the heat dissipation by means of bracket suspension. On the 3rd.

As shown in the second figure, the bottom of the heat sink 3 has a heat source contact surface 31 for abutting against a heat conducting plate 60 (for example, a copper base plate), and the heat conducting plate 60 is placed against the heat source plate 60. A heat source 61 on the circuit board 6 is such that the heat energy of the heat source 61 is quickly conducted to the heat sink 3. In this example, the circuit board 6 is a computer display card, and the heat source 61 refers to a GPU located on the computer display card. Furthermore, the heat source contact surface 31 of the heat sink 3 can also directly abut the heat source 61.

In particular, it can be clearly seen in the second figure that the first fan 4 and the second fan 5 are arranged in an inclined manner such that they are inclined with respect to the heat source contact surface 31 of the heat sink 3 And their tilt directions are also the same. Thus, the wind force of the first fan 4 blowing toward the intermediate portion 7 is greater than the wind force of the second fan 5 blowing toward the intermediate portion 7, eliminating the stagnant zone that is known in the prior art. This means that the wind blown from the first fan 4 necessarily has some intermediate portion 7 flowing through the heat sink 3 for dissipating heat to the intermediate portion 7, so that the heat dissipation efficiency of the middle portion of the heat sink is poor. The problem. At this time, when the first fan 4 and the second fan 5 are simultaneously driven to rotate, the wind flow generated by them is substantially flowing toward the side of the radiator 3 as indicated by the arrow in the second figure. . This means that the wind blown from the first fan 4 necessarily has some intermediate portion 7 flowing through the heat sink 3 for dissipating heat to the intermediate portion 7, so that the heat dissipation efficiency of the middle portion of the heat sink is poor. The problem.

In this example, the inclination angles R1, R2 of the first fan 4 and the second fan 5 are the same, however, it is also possible to select them to have different inclination angles, but still maintain the same inclination direction. The greater the inclination angle of the first fan 4, the more wind is blown through the intermediate portion 7 of the heat sink 3. Generally, it is preferable to select an inclination angle of 5 to 45 degrees.

In addition, the bottom of the heat sink 3 has a wind deflecting surface 32 in addition to the heat source contact surface 31. The wind guiding inclined surface 32 faces the first fan 4, and its inclination direction is opposite to the first fan 4. As can be seen from the second figure, the longer the wind deflecting surface 32 and/or the larger the tilt angle S (the maximum cannot exceed 90 degrees), the more wind the first fan 4 produces is blown. The intermediate portion 7 of the heat sink 3 passes through, thereby further improving the heat dissipation efficiency of the heat sink 3. Generally, it is preferable to select an inclination angle of 5 to 45 degrees.

Please refer to the third figure, which mainly shows the bottom of the heat sink 3, thereby indicating that the heat sink 3 is laterally connected by the heat sinks 30, each heat sink 30 includes a substrate 301, and respectively The substrate 301 extends all the way to the sheet 302 and an oblique sheet 303. The straight pieces 302 of the heat sinks 30 together constitute the heat source contact surface 31, and the diagonal pieces 303 of the heat sinks 30 together constitute the wind deflecting surface 32. In any case, this is only one of the preferred embodiments of the heat sink 3. In fact, the heat sink 3 can be manufactured in an aluminum extrusion mode.

Referring to the second and third figures, each of the heat sinks 30 in this example further has a first inclined side 304 and a second inclined side 305. The first oblique side 304 is adjacent to and facing the first fan 4, and its inclined direction is the same as the first fan 4. The second oblique side 305 is adjacent to and facing the second fan 5, and the inclined direction thereof is the same as the second fan 5. Thus, the gap between the first fan 4 and the heat sink 3 can maintain a uniform width, and the gap between the second fan 5 and the heat sink 3 can also maintain a uniform width. This has a positive impact on the overall heat dissipation efficiency of the heat sink of the present invention.

1‧‧‧heating device

2, 90‧‧‧ windshield

20‧‧‧ both sides

22‧‧‧ top board

222‧‧‧ first through hole

224‧‧‧second through hole

3, 92‧‧‧ radiator

30‧‧‧ Heat sink

301‧‧‧Substrate

302‧‧‧Direct film

303‧‧‧ diagonal film

304‧‧‧First inclined side

305‧‧‧Second inclined side

31‧‧‧heat source contact surface

4‧‧‧First fan

5‧‧‧second fan

6‧‧‧Circuit board

60‧‧‧heat conducting plate

61, 9a‧‧‧ heat source

7‧‧‧ middle part

9‧‧‧Computer display card

91‧‧‧fan

R1, R2, S‧‧‧ tilt angle

32‧‧‧ Wind deflecting surface

The first and second figures show a preferred embodiment of the invention.

The third figure shows the heat sink in the preferred embodiment.

The fourth figure shows the basic architecture of a conventional heat sink having a down-blowing dual fan.

1. . . Heat sink

2. . . wind cover

20. . . Side plates

twenty two. . . roof

222. . . First through hole

224. . . Second through hole

3. . . heat sink

30. . . heat sink

4. . . First fan

5. . . Second fan

6. . . Circuit board

Claims (4)

A heat dissipating device includes: a heat sink comprising a plurality of laterally spaced heat sinks, and a heat source contact surface at the bottom for abutting against a heat source; a first fan located on the heat sink and opposite to the heat sink The heat source contact surface of the device is inclined; and a second fan is located on the heat sink and is inclined with respect to the heat source contact surface of the heat sink, and the second fan is inclined to be the same as the first fan. The heat dissipating device of claim 1, wherein the bottom of the heat sink further has a wind deflecting surface facing the first fan, and the inclined direction is opposite to the first fan. The heat dissipating device of claim 2, wherein each of the fins further has a first inclined side and a second inclined side, the first oblique side being adjacent to and facing the first fan, and inclined The direction is the same as the first fan; the second bevel is immediately adjacent to and facing the second fan, and the inclined direction is the same as the second fan. The heat dissipating device of claim 3, further comprising a windshield covering the heat sink and including a top plate defining a first through hole and a second through hole vertically spaced apart The first fan and the second fan are respectively disposed on the hood and are located in the first through hole and the second through hole.