TWI391608B - Illuminating apparatus - Google Patents

Illuminating apparatus Download PDF

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TWI391608B
TWI391608B TW97121118A TW97121118A TWI391608B TW I391608 B TWI391608 B TW I391608B TW 97121118 A TW97121118 A TW 97121118A TW 97121118 A TW97121118 A TW 97121118A TW I391608 B TWI391608 B TW I391608B
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Taiwan
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cover plate
holes
light emitting
heat dissipation
illuminating
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TW97121118A
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Chinese (zh)
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TW200951358A (en
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I Thun Lin
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Hon Hai Prec Ind Co Ltd
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Description

照明裝置 Lighting device

本發明涉及一種照明裝置。 The invention relates to a lighting device.

目前,發光二極體(Light Emitting Diode,LED)已被廣泛應用到很多領域,尤其係路燈領域。具體可參見Daniel A.Steigerwald等人於文獻IEEE Journal on Selected Topics in Quantum Electronics,Vol.8,No.2,March/April 2002中之Illumination With Solid State Lighting Technology一文。 At present, Light Emitting Diode (LED) has been widely used in many fields, especially in the field of street lamps. See, for example, Daniel A. Steigerwald et al., IEEE Journal on Selected Topics in Quantum Electronics, Vol. 8, No. 2, March/April 2002, Illumination With Solid State Lighting Technology.

發光二極體一般用於發出特定波長之光,例如可見光,但是發光二極體所接收之能量,其中大約80~90%被轉換為熱量,其餘之能量才被真正轉換為光能。由於發光二極體於發光時,其自身之溫度也會逐漸升高,當溫度達到一定程度時,其工作電壓、發光波長以及光輸出強度等都會受到較大之影響。因此,發光二極體發光所產生之熱量必須被疏散掉以保證發光二極體之正常運作。 Light-emitting diodes are generally used to emit light of a specific wavelength, such as visible light, but the energy received by the light-emitting diodes, about 80-90% of which is converted into heat, and the rest of the energy is actually converted into light energy. Since the temperature of the light-emitting diode is gradually increased when the light-emitting diode is illuminated, when the temperature reaches a certain level, the working voltage, the wavelength of the light, and the intensity of the light output are greatly affected. Therefore, the heat generated by the illuminating diode must be evacuated to ensure the normal operation of the illuminating diode.

下面將以實施例說明一種具較高散熱效率之照明裝置。 A lighting device with higher heat dissipation efficiency will be described below by way of example.

一種照明裝置,其包括:一個發光模組、蓋板及殼體。該發光模組具有一個發光面。該蓋板上包括一個第一表面以及一個與該第一表面相對之第二表面,該蓋板上具有複數個貫穿該第一表面與該第二表面之散熱通孔,及複數個設置於該蓋板之第二表面上之擋牆,每個擋牆對 應一個該散熱通孔,且該擋牆圍繞與其對應之該散熱通孔於該第二表面上形成之開口,該蓋板設置於該發光模組之遠離該發光面之一側,且該蓋板之第一表面與該發光模組相對。該殼體包括頂板及與該頂板相連之側壁,該頂板與該側壁圍合成一個腔體,該殼體之頂板上具有複數個通風通孔,該蓋板收容於該腔體內,且該蓋板之第二表面與該頂板相對,該蓋板上之複數個散熱通孔與該頂板上之複數個通風通孔交錯分佈,該發光模組位於該殼體之遠離該頂板之一側,且該發光模組與該側壁相連接。 A lighting device includes: a lighting module, a cover plate and a casing. The light emitting module has a light emitting surface. The cover plate includes a first surface and a second surface opposite to the first surface, the cover plate has a plurality of heat dissipation through holes penetrating the first surface and the second surface, and a plurality of Retaining wall on the second surface of the cover, each retaining wall pair One of the heat dissipation through holes is disposed, and the cover wall surrounds an opening formed on the second surface of the heat dissipation through hole corresponding thereto, and the cover plate is disposed on a side of the light emitting module away from the light emitting surface, and the cover The first surface of the board is opposite the light emitting module. The cover includes a top plate and a side wall connected to the top plate, the top plate and the side wall enclose a cavity, the top plate of the case has a plurality of ventilation through holes, the cover plate is received in the cavity, and the cover plate The second surface is opposite to the top plate, and the plurality of heat dissipation through holes on the cover plate are alternately distributed with the plurality of ventilation through holes on the top plate, wherein the light emitting module is located on a side of the housing away from the top plate, and the The light emitting module is connected to the sidewall.

相對於先前技術,該照明裝置之發光模組產生之熱量藉由該散熱通孔與該通風通孔能快速傳送到外界,與外界空氣進行熱交換,能有效之對該發光模組進行散熱。同時,該散熱通孔與該通風通孔相互錯開設置,且每個散熱通孔具有擋牆,外界之灰塵、雨滴或其他雜質藉由該通風通孔落到該蓋板之第二表面,而不至於藉由該散熱通孔到達該發光模組,而影響該發光模組之正常工作。 Compared with the prior art, the heat generated by the illumination module of the illumination device can be quickly transmitted to the outside through the heat dissipation through hole and the ventilation through hole, and exchange heat with the outside air, thereby effectively dissipating heat from the illumination module. At the same time, the heat dissipation through hole and the ventilation through hole are mutually offset, and each of the heat dissipation through holes has a retaining wall, and external dust, raindrops or other impurities fall to the second surface of the cover through the ventilation through hole, and The heat dissipation through hole does not reach the light emitting module, thereby affecting the normal operation of the light emitting module.

下面將結合附圖對本發明實施方式作進一步之詳細說明。 The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

請參見圖1,本發明實施方式提供之一種照明裝置100,其包括:一個發光模組10、一個蓋板20與一個殼體30。 Referring to FIG. 1 , an illumination device 100 according to an embodiment of the present invention includes a light emitting module 10 , a cover 20 , and a housing 30 .

請參見圖2,該發光模組10包括一個基板101、複數個發光單元102。該基板101具有一個第一表面1011及一個與該第一表面1011相對之第二表面1012,該複數個發光單 元102設置於該第一表面1011上,該複數個發光單元102發出之光由該第一表面1011並沿遠離該第二表面1012之方向出射。該複數個發光單元102可為發光二極體晶片、發光二極體模組,或者為其他固態發光元件。 Referring to FIG. 2 , the light emitting module 10 includes a substrate 101 and a plurality of light emitting units 102 . The substrate 101 has a first surface 1011 and a second surface 1012 opposite to the first surface 1011. The plurality of light emitting sheets The element 102 is disposed on the first surface 1011, and the light emitted by the plurality of light emitting units 102 is emitted from the first surface 1011 and away from the second surface 1012. The plurality of light emitting units 102 can be a light emitting diode chip, a light emitting diode module, or other solid state light emitting elements.

請參見圖2與圖3,該蓋板20包括一個第一表面201以及一個與該第一表面201相對之第二表面202。該第一表面201為一個平面,該第二表面202為一個柱狀凸曲面。該蓋板20上設置有複數個成矩陣排列且貫穿該第一表面201與該第二表面202之圓柱形散熱通孔203,該每個散熱通孔203於該第二表面202上形成一個開口。於該蓋板20之第二表面202上設置有複數個擋牆204,每個該擋牆204對應一個散熱通孔203,且該擋牆204圍繞與其對應之散熱通孔203於該第二表面202上形成之開口。該蓋板20可由導熱材料製成,能增強熱傳遞。 Referring to FIGS. 2 and 3, the cover 20 includes a first surface 201 and a second surface 202 opposite the first surface 201. The first surface 201 is a plane, and the second surface 202 is a columnar convex curved surface. The cover plate 20 is provided with a plurality of cylindrical heat dissipation through holes 203 arranged in a matrix and extending through the first surface 201 and the second surface 202. The heat dissipation through holes 203 form an opening on the second surface 202. . A plurality of retaining walls 204 are disposed on the second surface 202 of the cover plate 20, and each of the retaining walls 204 corresponds to a heat dissipation through hole 203, and the retaining wall 204 surrounds the corresponding heat radiating through hole 203 on the second surface. An opening formed in 202. The cover plate 20 can be made of a thermally conductive material to enhance heat transfer.

為了增強散熱效果,於該蓋板20上設置複數個散熱鰭片205,該複數個散熱鰭片205之沿第一方向A沿伸,且每個該散熱鰭片205之長度L1小於該蓋板20之寬度L2。 In order to enhance the heat dissipation effect, a plurality of heat dissipation fins 205 are disposed on the cover plate 20, and the plurality of heat dissipation fins 205 extend along the first direction A, and the length L1 of each of the heat dissipation fins 205 is smaller than the cover plate. 20 width L2.

可理解的是,當該蓋板20之第二表面202為一個凸球面時,設置於該蓋板20上之複數個散熱鰭片205,不只限於上述沿伸方向,而可沿其他方向沿伸。因此,設置於該蓋板20上之複數個散熱鰭片205之沿伸方向根據該蓋板20之第二表面202之曲面結構而改變,只需滿足每個該散熱鰭片205之長度L1小於該蓋板20之寬度L2。該殼體30包括頂板301與複數個與該頂板301相連之側壁302,該頂板301與該複數個側壁302圍合成一個腔體303。該頂板301 上設置有複數個圓柱形通風通孔304,該複數個通風通孔304成矩陣排列。該複數個側壁302上設置有複數個長方形側通孔305。 It can be understood that when the second surface 202 of the cover plate 20 is a convex spherical surface, the plurality of heat dissipation fins 205 disposed on the cover plate 20 are not limited to the above-mentioned extending direction, but can extend along other directions. . Therefore, the extending direction of the plurality of heat dissipating fins 205 disposed on the cover plate 20 is changed according to the curved surface structure of the second surface 202 of the cover plate 20, and only the length L1 of each of the heat dissipating fins 205 is required to be smaller than The cover 20 has a width L2. The housing 30 includes a top plate 301 and a plurality of side walls 302 connected to the top plate 301. The top plate 301 and the plurality of side walls 302 define a cavity 303. The top plate 301 A plurality of cylindrical ventilation through holes 304 are provided, and the plurality of ventilation through holes 304 are arranged in a matrix. A plurality of rectangular side through holes 305 are disposed on the plurality of side walls 302.

該蓋板20收容於該腔體303內,該蓋板20之第二表面202與該頂板301相對設置。該蓋板20之第一表面201與該基板101之第二表面1012相對,且該基板101之第二表面1012與該側壁302相連接。 The cover plate 20 is received in the cavity 303, and the second surface 202 of the cover plate 20 is disposed opposite to the top plate 301. The first surface 201 of the cover plate 20 is opposite to the second surface 1012 of the substrate 101, and the second surface 1012 of the substrate 101 is connected to the sidewall 302.

該複數個通風通孔304與該複數個散熱通孔203交錯分佈。具體地,該複數個通風通孔304於該蓋板20上之投影與該複數個散熱通孔203於該蓋板20上之投影不相交。該每個側通孔305與該蓋板20之第二表面202相連接。 The plurality of ventilation through holes 304 are alternately distributed with the plurality of heat dissipation through holes 203. Specifically, the projection of the plurality of ventilation through holes 304 on the cover plate 20 does not intersect the projection of the plurality of heat dissipation through holes 203 on the cover plate 20. Each of the side through holes 305 is connected to the second surface 202 of the cover plate 20.

該發光模組10於工作時產生之熱量傳送到該蓋板20之第一表面201,外界之冷空氣藉由該複數個通風通孔304到達該蓋板20之第二表面202,冷熱空氣藉由該複數個散熱通孔203進行熱交換,以達到對該發光模組10進行散熱之目之。且設置於該蓋板20之第二表面202上之該複數個散熱鰭片205能加速空氣之流動,使聚積於蓋板20上之熱量迅速之藉由該複數個散熱通孔203傳送到外界,以增強該發光模組10之散熱效果。 The heat generated by the light-emitting module 10 during operation is transmitted to the first surface 201 of the cover plate 20. The cold air of the outside reaches the second surface 202 of the cover plate 20 through the plurality of ventilation through holes 304, and the hot and cold air is borrowed. Heat exchange is performed by the plurality of heat dissipation through holes 203 to achieve heat dissipation of the light emitting module 10. The plurality of heat dissipation fins 205 disposed on the second surface 202 of the cover plate 20 can accelerate the flow of air, so that the heat accumulated on the cover plate 20 is quickly transmitted to the outside through the plurality of heat dissipation through holes 203. To enhance the heat dissipation effect of the light emitting module 10.

該發光模組10於工作時,外界之灰塵、雨滴或其他雜質藉由該複數個通風通孔304到達該蓋板20之第二表面202,但由於該通風通孔304與該複數個散熱通孔203分別錯開設置,每個該散熱通孔203具有與之相對應之擋牆204,因此,外界之灰塵、雨滴或其他雜質不會藉由該複數 個散熱通孔203到達該發光模組10。 When the light-emitting module 10 is in operation, external dust, raindrops or other impurities reach the second surface 202 of the cover plate 20 through the plurality of ventilation through holes 304, but the plurality of heat dissipation holes are communicated with the plurality of heat dissipation holes 304 The holes 203 are respectively arranged in a staggered manner, and each of the heat dissipation through holes 203 has a corresponding retaining wall 204, so that dust, raindrops or other impurities from the outside are not caused by the plural The heat dissipation through holes 203 reach the light emitting module 10.

同時,由於該蓋板20之第二表面202為一凸曲面,且該第二表面202與該複數個側通孔305相連接,因此,藉由該通風通孔304進入且落到該蓋板20第二表面202之灰塵、雨滴或其他雜質順著雨水等液體沿凸曲面向周邊流動至該蓋板20之邊緣處,並藉由該複數個側通孔305及時排出,而不至於聚積於該蓋板20第二表面202並藉由該散熱通孔203到達該發光模組10,從而有效之保護了該發光模組10。 At the same time, since the second surface 202 of the cover plate 20 is a convex curved surface, and the second surface 202 is connected to the plurality of side through holes 305, the ventilation through hole 304 enters and falls to the cover plate. The dust, raindrops or other impurities of the second surface 202 flow along the convex curved surface toward the periphery of the cover plate 20 along the convex surface, and are discharged in time through the plurality of side through holes 305 without accumulating in the surface. The second surface 202 of the cover 20 reaches the light emitting module 10 through the heat dissipation through hole 203, thereby effectively protecting the light emitting module 10.

可理解的是,於本實施例中,該複數個散熱通孔203、該複數個通風通孔304以及該複數個側通孔305也可為其他形狀及/或其他排列形式,具體可視情況而定。 It can be understood that, in this embodiment, the plurality of heat dissipation through holes 203, the plurality of ventilation through holes 304, and the plurality of side through holes 305 may be other shapes and/or other arrangements, as the case may be. set.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100‧‧‧照明裝置 100‧‧‧Lighting device

10‧‧‧發光模組 10‧‧‧Lighting module

20‧‧‧蓋板 20‧‧‧ Cover

30‧‧‧殼體 30‧‧‧Shell

101‧‧‧基板 101‧‧‧Substrate

102‧‧‧發光單元 102‧‧‧Lighting unit

1011、201‧‧‧第一表面 1011, 201‧‧‧ first surface

1012、202‧‧‧第二表面 1012, 202‧‧‧ second surface

203‧‧‧散熱通孔 203‧‧‧Solution through hole

204‧‧‧擋牆 204‧‧‧Retaining wall

205‧‧‧散熱鰭片 205‧‧‧heat fins

301‧‧‧頂板 301‧‧‧ top board

302‧‧‧側壁 302‧‧‧ side wall

303‧‧‧腔體 303‧‧‧ cavity

304‧‧‧通風通孔 304‧‧‧Ventilation through hole

305‧‧‧側通孔 305‧‧‧ side through hole

圖1係本發明實施例提供之照明裝置之立體示意圖。 FIG. 1 is a schematic perspective view of a lighting device according to an embodiment of the invention.

圖2係圖1中照明裝置之結構分解圖。 2 is an exploded view of the lighting device of FIG. 1.

圖3係圖1中沿III-III線之剖面示意圖。 Figure 3 is a schematic cross-sectional view taken along line III-III of Figure 1.

100‧‧‧照明裝置 100‧‧‧Lighting device

10‧‧‧發光模組 10‧‧‧Lighting module

20‧‧‧蓋板 20‧‧‧ Cover

30‧‧‧殼體 30‧‧‧Shell

101‧‧‧基板 101‧‧‧Substrate

102‧‧‧發光單元 102‧‧‧Lighting unit

1011、201‧‧‧第一表面 1011, 201‧‧‧ first surface

1012、202‧‧‧第二表面 1012, 202‧‧‧ second surface

204‧‧‧擋牆 204‧‧‧Retaining wall

205‧‧‧散熱鰭片 205‧‧‧heat fins

301‧‧‧頂板 301‧‧‧ top board

302‧‧‧側壁 302‧‧‧ side wall

304‧‧‧通風通孔 304‧‧‧Ventilation through hole

305‧‧‧側通孔 305‧‧‧ side through hole

Claims (9)

一種照明裝置,其包括:一個發光模組,該發光模組具有一個發光面;一個蓋板,該蓋板上包括一個第一表面以及一個與該第一表面相對之第二表面,該蓋板上具有複數個貫穿該第一表面與該第二表面之散熱通孔,及複數個設置於該蓋板之第二表面上之擋牆,每個擋牆對應一個該散熱通孔,且該擋牆圍繞與其對應之該散熱通孔於該第二表面上形成之開口,該蓋板設置於該發光模組之遠離該發光面之一側,且該蓋板之第一表面與該發光模組相對;一個殼體,包括一頂板及與該頂板相連之側壁,該頂板與該側壁圍合成一個腔體,該頂板上具有複數個通風通孔,該蓋板收容於該腔體內,且該蓋板之第二表面與該頂板相對,該蓋板上之複數個散熱通孔與該頂板上之複數個通風通孔交錯分佈,該發光模組位於該殼體之遠離該頂板之一側,且該發光模組與該側壁相連接。 A lighting device includes: a light emitting module having a light emitting surface; a cover plate including a first surface and a second surface opposite the first surface, the cover plate The upper surface has a plurality of heat dissipation through holes penetrating the first surface and the second surface, and a plurality of retaining walls disposed on the second surface of the cover plate, each of the retaining walls corresponding to the heat dissipation through hole, and the block An opening formed on the second surface of the heat dissipation through hole corresponding to the wall, the cover plate is disposed on a side of the light emitting module away from the light emitting surface, and the first surface of the cover plate and the light emitting module a casing comprising a top plate and a side wall connected to the top plate, the top plate and the side wall surrounding a cavity, the top plate having a plurality of ventilation through holes, the cover plate being received in the cavity, and the cover The second surface of the plate is opposite to the top plate, and the plurality of heat dissipation through holes on the cover plate are alternately distributed with the plurality of ventilation through holes on the top plate, wherein the light emitting module is located on a side of the case away from the top plate, and The light emitting module and the side Connected. 如申請專利範圍第1項所述之照明裝置,其中,該蓋板之第二表面為一個凸曲面。 The illuminating device of claim 1, wherein the second surface of the cover is a convex curved surface. 如申請專利範圍第1項所述之照明裝置,其中,該蓋板由導熱材料製成。 The lighting device of claim 1, wherein the cover plate is made of a heat conductive material. 如申請專利範圍第1項所述之照明裝置,其中,該複數個散熱通孔成矩陣排列。 The lighting device of claim 1, wherein the plurality of heat dissipation through holes are arranged in a matrix. 如申請專利範圍第1項所述之照明裝置,其中,該複數個通風通孔成矩陣排列。 The lighting device of claim 1, wherein the plurality of ventilation through holes are arranged in a matrix. 如申請專利範圍第1項所述之照明裝置,其中,該殼體之 側壁上具有複數個側通孔,每個側通孔與該蓋板之第二表面相連接,用以將聚積於該蓋板第二表面上之液體排出。 The lighting device of claim 1, wherein the housing The side wall has a plurality of side through holes, and each of the side through holes is connected to the second surface of the cover plate for discharging the liquid accumulated on the second surface of the cover plate. 如申請專利範圍第1項所述之照明裝置,其中,該發光模組包括一個基板與至少一個設置於該基板上之發光單元,該基板上設置有該至少一個發光單元之表面為發光面。 The illuminating device of claim 1, wherein the illuminating module comprises a substrate and at least one illuminating unit disposed on the substrate, and the surface of the at least one illuminating unit disposed on the substrate is a illuminating surface. 如申請專利範圍第7項所述之照明裝置,其中,該發光單元為複數個發光二極體。 The illuminating device of claim 7, wherein the illuminating unit is a plurality of illuminating diodes. 如申請專利範圍第1項所述之照明裝置,其中,該蓋板之第二表面上設置有鰭片。 The illuminating device of claim 1, wherein the second surface of the cover is provided with fins.
TW97121118A 2008-06-06 2008-06-06 Illuminating apparatus TWI391608B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI252898B (en) * 2004-11-26 2006-04-11 Moduled Inc Light-emitting diode vehicle light
TWM310299U (en) * 2006-09-12 2007-04-21 Chin-Wen Wang Lamp structure capable of adjusting projection angles
CN2924304Y (en) * 2006-04-14 2007-07-18 东南大学 High-brightness light-emitting diode lighting lamp with lattice layout
CN101173742A (en) * 2007-11-22 2008-05-07 祝子荣 LED road lamp with large illumination range

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI252898B (en) * 2004-11-26 2006-04-11 Moduled Inc Light-emitting diode vehicle light
CN2924304Y (en) * 2006-04-14 2007-07-18 东南大学 High-brightness light-emitting diode lighting lamp with lattice layout
TWM310299U (en) * 2006-09-12 2007-04-21 Chin-Wen Wang Lamp structure capable of adjusting projection angles
CN101173742A (en) * 2007-11-22 2008-05-07 祝子荣 LED road lamp with large illumination range

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