TWI386514B - Apparatus for manufacturing carbon nanotubes - Google Patents

Apparatus for manufacturing carbon nanotubes Download PDF

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TWI386514B
TWI386514B TW94139770A TW94139770A TWI386514B TW I386514 B TWI386514 B TW I386514B TW 94139770 A TW94139770 A TW 94139770A TW 94139770 A TW94139770 A TW 94139770A TW I386514 B TWI386514 B TW I386514B
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reaction chamber
cooling
carbon nanotube
gas
nanotube preparation
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TW94139770A
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TW200718801A (en
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Tsai Shih Tung
Hsin Ho Lee
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Hon Hai Prec Ind Co Ltd
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Description

奈米碳管製備裝置 Nano carbon tube preparation device

本發明涉及一種奈米碳管製備裝置。 The invention relates to a carbon nanotube preparation device.

自從日本研究人員飯島先生於1991年在電弧放電產物中首次發現奈米碳管以來,因其在機械、電子、物理、化學等方面具有優異之性能,如獨特之金屬或半導體導電性、極高之機械強度、高容量儲氫能力及吸附能力、場致電子發射性能、定向導熱性能以及較強之寬帶電磁波吸收特性等,使得奈米碳管受到物理、化學及材料科學等領域以及高新技術產業部門之極大重視,同時促進奈米碳管之廣泛研究與實際應用。目前,奈米碳管可用作複合材料之增強材料、場致電子發射材料、超級電容器電極材料、氣體吸附材料、催化材料、熱傳導材料以及傳感材料等方面。 Since the Japanese researcher Mr. Iijima first discovered the carbon nanotubes in arc discharge products in 1991, he has excellent performance in mechanical, electronic, physical, chemical, etc., such as unique metal or semiconductor conductivity, extremely high. The mechanical strength, high-capacity hydrogen storage capacity and adsorption capacity, field-induced electron emission performance, directional thermal conductivity and strong broadband electromagnetic wave absorption characteristics make the carbon nanotubes subject to physical, chemical and materials science and high-tech industries. The department attaches great importance to it and promotes the extensive research and practical application of carbon nanotubes. At present, carbon nanotubes can be used as reinforcing materials for composite materials, field electron emission materials, supercapacitor electrode materials, gas adsorbing materials, catalytic materials, heat conducting materials, and sensing materials.

製備奈米碳管之方法有電弧放電法(Arc Discharge)、雷射消熔法(Laser Ablation)、化學氣相沈積法(Chemical Vapor Deposition,CVD)等,其中CVD法成長奈米碳管具有設備簡單、低成本及可大型化之優點。 The method for preparing the carbon nanotubes includes an arc discharge method (Arc Discharge), a laser ablation method (Laser Ablation), a chemical vapor deposition method (CVD), and the like, wherein the CVD method has a device for growing carbon nanotubes. Simple, low cost and large size.

典型之CVD生長奈米碳管裝置包括一高溫加熱爐、一石英爐管、一設置於石英爐管內之載舟及一設置於載舟內之基板。製備奈米碳管時,首先於基板上沈積一催化劑層,然後加熱石英爐管,通入碳源氣體,在高溫狀態下碳源氣體在催化劑層上進行反應,從而生長出奈米碳管。 為提高奈米碳管生長速度,人們開始使用低壓CVD方法生長奈米碳管,該方法係在低壓狀況下生長奈米碳管,其使用之裝置為在上述典型之CVD生長奈米碳管裝置基礎上進一步包括一抽低壓裝置,該抽低壓裝置與石英爐管之出氣口相通,用於控制反應時石英爐管內之氣壓。此種裝置於低壓下高溫熱分解碳源氣之方式成長碳管,其反應溫度範圍為500-1000℃,這導致反應過程中不斷有高溫殘留氣體流向抽低壓裝置,從而嚴重影響抽低壓裝置之使用壽命。 A typical CVD growth carbon nanotube device includes a high temperature heating furnace, a quartz furnace tube, a carrier boat disposed in the quartz furnace tube, and a substrate disposed in the carrier. When preparing the carbon nanotubes, a catalyst layer is first deposited on the substrate, then the quartz furnace tube is heated, a carbon source gas is introduced, and the carbon source gas is reacted on the catalyst layer at a high temperature to grow a carbon nanotube. In order to increase the growth rate of carbon nanotubes, people began to use low-pressure CVD method to grow carbon nanotubes. The method is to grow carbon nanotubes under low pressure conditions. The device used is the above-mentioned typical CVD growth carbon nanotube device. Further comprising a pumping low-pressure device, the pumping low-pressure device is in communication with the gas outlet of the quartz furnace tube for controlling the gas pressure in the quartz furnace tube during the reaction. The device grows carbon tubes in a manner of high-temperature thermal decomposition of carbon source gas at a low pressure, and the reaction temperature ranges from 500 to 1000 ° C, which causes continuous high-temperature residual gas flow to the pumping low-pressure device during the reaction, thereby seriously affecting the pumping low-voltage device. The service life.

有鑒於此,有必要提供一種可降低排出氣體溫度之奈米碳管製備裝置。 In view of the above, it is necessary to provide a carbon nanotube preparation apparatus which can reduce the temperature of the exhaust gas.

一種奈米碳管製備裝置,其包括:一反應室,其具有一出氣口;一反應室冷卻裝置,其設於所述反應室內或反應室外,以在反應室內之反應結束後對所述反應室進行冷卻;一抽低壓裝置,與所述反應室出氣口相通,用於降低反應室內之氣壓;一氣體冷卻裝置,設於所述反應室與所述抽低壓裝置之間,用於冷卻反應室排出之氣體。 A carbon nanotube preparation apparatus comprising: a reaction chamber having an air outlet; a reaction chamber cooling device disposed in the reaction chamber or outside the reaction chamber to react to the reaction after the reaction in the reaction chamber is completed The chamber is cooled; a pumping low-pressure device is connected to the gas outlet of the reaction chamber for reducing the gas pressure in the reaction chamber; a gas cooling device is disposed between the reaction chamber and the pumping low-pressure device for cooling reaction The gas discharged from the chamber.

相對於先前技術,所述奈米碳管製備裝置在所述反應室與所述抽低壓裝置之間設置有一氣體冷卻裝置,用於冷卻反應室排出之氣體,從而降低進入抽低壓裝置中之氣體之溫度,避免抽低壓裝置與高溫氣體接觸,可增長抽低壓裝置之使用壽命。 In contrast to the prior art, the carbon nanotube preparation apparatus is provided with a gas cooling device between the reaction chamber and the pumping unit for cooling the gas discharged from the reaction chamber, thereby reducing the gas entering the pumping unit. The temperature, avoiding the contact of the low-pressure device with the high-temperature gas, can increase the service life of the pumping device.

下面結合附圖對本發明作進一步詳細說明。 The invention will be further described in detail below with reference to the accompanying drawings.

請參閱第一圖,本發明之第一實施例提供之奈米碳管製備裝置100包括一反應室10、一設置於反應室內之載舟30、一置於載舟30內之基板40、一用於加熱反應室10之加熱部20、一氣體冷卻裝置50及一抽低壓裝置60。 Referring to the first embodiment, a carbon nanotube preparation apparatus 100 according to a first embodiment of the present invention includes a reaction chamber 10, a boat 30 disposed in the reaction chamber, and a substrate 40 disposed in the boat 30. The heating unit 20 for heating the reaction chamber 10, a gas cooling device 50, and a vacuuming device 60 are provided.

所述反應室10由化學性能穩定、耐高溫之材質形成之可密封之腔體即可,材質優選石英,其兩端分別設有一進氣口101及一出氣口102;該基板40可以為多孔矽基板或矽基板,耐高溫並與後續步驟中催化劑不發生化學反應或原子滲透等現象之材料均可,要求其表面清潔,不破壞後續反應條件。所述加熱部20用於對反應室10加熱,優選地,加熱部20緊密圍繞於反應室10外以達到均勻之加熱效果,所述加熱部20具體可為一加熱爐。 The reaction chamber 10 may be a sealable cavity formed by a material having stable chemical properties and high temperature resistance. The material is preferably quartz, and an air inlet 101 and an air outlet 102 are respectively disposed at two ends thereof; the substrate 40 may be porous. The ruthenium substrate or the ruthenium substrate may be a material which is resistant to high temperature and does not undergo chemical reaction or atomic penetration with the catalyst in the subsequent step, and the surface thereof is required to be clean without destroying the subsequent reaction conditions. The heating portion 20 is used to heat the reaction chamber 10. Preferably, the heating portion 20 is closely surrounding the reaction chamber 10 to achieve a uniform heating effect. The heating portion 20 may specifically be a heating furnace.

所述抽低壓裝置60與反應室10之出氣口102相通,用於控制反應室10內之氣壓,以使反應室10在奈米碳管生長過程中內部氣壓低於環境氣壓。本實施例中,所述抽低壓裝置60與反應室10之出氣口102通過一連接管70相連。所述抽低壓裝置60採用抽氣泵。 The low pressure device 60 communicates with the gas outlet 102 of the reaction chamber 10 for controlling the gas pressure in the reaction chamber 10 so that the internal pressure of the reaction chamber 10 during the growth of the carbon nanotubes is lower than the ambient pressure. In this embodiment, the pumping low pressure device 60 is connected to the air outlet 102 of the reaction chamber 10 through a connecting pipe 70. The pumping unit 60 uses an air pump.

所述氣體冷卻裝置50設置於所述反應室10與所述抽低壓裝置60之間,用於冷卻反應室10排出之氣體。所述氣體冷卻裝置50可為鰭片式冷卻裝置,亦可為液冷式冷卻裝置,優選地所述氣體冷卻裝置50為液冷式冷卻裝置。本實施例中,所述氣體冷卻裝置50包括一可供連接管70穿設之冷卻室501,該冷卻室501中容納有冷卻工作物質。 該冷卻工作物質可採用水、甲醇、乙醇、丙酮、己烷、液氨、液氮之一種或幾種之混合。由於所述冷卻工作物質吸熱會汽化,在保證安全之情況下,為利於所述氣體冷卻裝置50長時間連續使用,可於所述冷卻室501之殼壁上設置一氣壓閥502,當冷卻室501內氣壓達到一定值時,氣壓閥502則會開啟,以降低冷卻室501內之氣壓。優選地,所述連接管70蛇形穿設於所述冷卻室501中。當使用水等不易揮發且價格較便宜之物質做冷卻工作物質時,所述氣體冷卻裝置50可使用一水槽。 The gas cooling device 50 is disposed between the reaction chamber 10 and the vacuuming device 60 for cooling the gas discharged from the reaction chamber 10. The gas cooling device 50 may be a fin-type cooling device or a liquid-cooled cooling device. Preferably, the gas cooling device 50 is a liquid-cooled cooling device. In the present embodiment, the gas cooling device 50 includes a cooling chamber 501 through which the connecting pipe 70 can be bored, and the cooling chamber 501 houses a cooling working substance. The cooling working substance may be a mixture of one or more of water, methanol, ethanol, acetone, hexane, liquid ammonia, and liquid nitrogen. Since the heat of the cooling working material is vaporized, in order to facilitate the long-term continuous use of the gas cooling device 50, a pneumatic valve 502 may be disposed on the wall of the cooling chamber 501 when the cooling chamber is secured. When the air pressure in 501 reaches a certain value, the air pressure valve 502 is opened to lower the air pressure in the cooling chamber 501. Preferably, the connecting tube 70 is serpentinely inserted into the cooling chamber 501. The gas cooling device 50 can use a water tank when a material that is less volatile and less expensive, such as water, is used as the cooling working substance.

所述反應室10一般使用石英管,當用於做為反應室10之石英管較長時,其伸出加熱部20之部分較長,可用於設置氣體冷卻裝置50,此時所述抽低壓裝置60可與反應室10之出氣口102直接相連。 The reaction chamber 10 generally uses a quartz tube. When the quartz tube used as the reaction chamber 10 is long, the portion extending from the heating portion 20 is long, and can be used to set the gas cooling device 50. The device 60 can be directly connected to the gas outlet 102 of the reaction chamber 10.

所述奈米碳管製備裝置100還可進一步包括一反應室冷卻裝置80,其設於所述反應室10內或反應室10外,用於在反應室10內之反應結束後,加快反應室10之冷卻,以縮短反應室10降溫時間,從而增加奈米碳管批次製程之效率。如第二圖所示,當所述反應室冷卻裝置80設於反應室10內時,所述反應室冷卻裝置80可包括一設置於所述反應室10內之內管803,本實施例中所述內管803與反應室10平行且同軸。所述內管803之管壁與該反應室10之管壁形成一管腔801,該管腔801中包含冷卻工作物質,此時載舟30與基板40設於所述內管803內。該冷卻工作物質可採用水、甲醇、乙醇、丙酮、己烷、液氨、液氮之一種或幾種之混合。如第三圖所示,所述反應室冷卻裝置 80亦可包括至少一個反應室冷卻管802,該反應室冷卻管802中包含冷卻工作物質,所述冷卻工作物質可採用水、甲醇、乙醇、丙酮、己烷、液氨、液氮之一種或幾種之混合。由於氣體冷凝後密度變大,在反應室10中,冷氣體會下沉,熱氣體會上升,因此反應室10內頂部之氣體溫度較高,為提高冷卻效率,可使所述反應室冷卻管802貼著反應室10之內壁或外壁分佈於反應室10之頂部及底部,且反應室10內頂部之反應室冷卻管802分佈密度大於該反應室10底部之反應室冷卻管802分佈密度。為降低製造成本,還可將所述反應室冷卻管802繞設於所述反應室10外。 The carbon nanotube preparation apparatus 100 may further include a reaction chamber cooling device 80 disposed in the reaction chamber 10 or outside the reaction chamber 10 for accelerating the reaction chamber after the reaction in the reaction chamber 10 is completed. Cooling of 10 to shorten the cooling time of the reaction chamber 10, thereby increasing the efficiency of the carbon nanotube batch process. As shown in the second figure, when the reaction chamber cooling device 80 is disposed in the reaction chamber 10, the reaction chamber cooling device 80 may include an inner tube 803 disposed in the reaction chamber 10, in this embodiment. The inner tube 803 is parallel and coaxial with the reaction chamber 10. The wall of the inner tube 803 and the wall of the reaction chamber 10 form a lumen 801. The lumen 801 contains a cooling working substance, and the carrier 30 and the substrate 40 are disposed in the inner tube 803. The cooling working substance may be a mixture of one or more of water, methanol, ethanol, acetone, hexane, liquid ammonia, and liquid nitrogen. As shown in the third figure, the reaction chamber cooling device The 80 may also include at least one reaction chamber cooling tube 802. The reaction chamber cooling tube 802 includes a cooling working substance, and the cooling working material may be one of water, methanol, ethanol, acetone, hexane, liquid ammonia, liquid nitrogen or A mixture of several. Since the density of the gas is increased after condensation, the cold gas will sink and the hot gas will rise in the reaction chamber 10. Therefore, the temperature of the gas at the top of the reaction chamber 10 is high. To improve the cooling efficiency, the reaction chamber cooling tube 802 can be attached. The inner or outer wall of the reaction chamber 10 is distributed at the top and bottom of the reaction chamber 10, and the reaction chamber cooling tube 802 at the top of the reaction chamber 10 has a distribution density greater than the distribution density of the reaction chamber cooling tubes 802 at the bottom of the reaction chamber 10. In order to reduce the manufacturing cost, the reaction chamber cooling tube 802 may also be disposed outside the reaction chamber 10.

所述反應室冷卻裝置80使用時有別於所述氣體冷卻裝置50,所述氣體冷卻裝置50係在反應室10反應時開放,用於冷卻反應室10排出之高溫氣體,再使冷卻後之氣體通過抽低壓裝置60排出。所述反應室冷卻裝置80係在反應結束後開放,以盡快降低反應室10內部之溫度,快速取出樣品。 The reaction chamber cooling device 80 is different from the gas cooling device 50 when it is used. The gas cooling device 50 is opened when the reaction chamber 10 reacts, and is used to cool the high temperature gas discharged from the reaction chamber 10, and then cooled. The gas is discharged through the pumping unit 60. The reaction chamber cooling device 80 is opened after the reaction is completed to lower the temperature inside the reaction chamber 10 as quickly as possible, and the sample is quickly taken out.

請參閱第四圖,為本發明之第二實施例提供之奈米碳管製備裝置100’,所述奈米碳管製備裝置100’與第一實施例中之奈米碳管製備裝置100不同之處在於氣體冷卻裝置50’,該氣體冷卻裝置50’包括至少一個設於連接管70內壁或外壁之氣體冷卻管503,該氣體冷卻管503中包含冷卻工作物質。優選地,所述氣體冷卻管503繞設於連接管70外。所述氣體冷卻管503還可如第五圖所示設於連接管70之內壁。 Referring to FIG. 4, a carbon nanotube preparation apparatus 100' according to a second embodiment of the present invention, the carbon nanotube preparation apparatus 100' is different from the carbon nanotube preparation apparatus 100 of the first embodiment. The gas cooling device 50' includes at least one gas cooling pipe 503 disposed on the inner wall or the outer wall of the connecting pipe 70, and the gas cooling pipe 503 contains a cooling working substance. Preferably, the gas cooling tube 503 is disposed outside the connecting tube 70. The gas cooling pipe 503 may also be provided on the inner wall of the connecting pipe 70 as shown in FIG.

相對於先前技術,所述奈米碳管製備裝置在所述反應室與所述抽低壓裝置之間設置有一氣體冷卻裝置,用於冷卻反應室排出之氣體,從而降低進入抽低壓裝置中之氣體之溫度,避免抽低壓裝置與高溫氣體接觸,可增長抽低壓裝置之使用壽命。且奈米碳管製備裝置通過一反應室冷卻裝置快速冷卻反應後之反應室,以縮短反應室降溫時間,從而增加奈米碳管批次製程之效率。 In contrast to the prior art, the carbon nanotube preparation apparatus is provided with a gas cooling device between the reaction chamber and the pumping unit for cooling the gas discharged from the reaction chamber, thereby reducing the gas entering the pumping unit. The temperature, avoiding the contact of the low-pressure device with the high-temperature gas, can increase the service life of the pumping device. And the carbon nanotube preparation device rapidly cools the reaction chamber after the reaction through a reaction chamber cooling device to shorten the reaction chamber cooling time, thereby increasing the efficiency of the carbon nanotube batch process.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧反應室 10‧‧‧Reaction room

20‧‧‧加熱部 20‧‧‧heating department

30‧‧‧載舟 30‧‧‧Scatter

40‧‧‧基板 40‧‧‧Substrate

50,50’‧‧‧氣體冷卻裝置 50,50’‧‧‧ gas cooling unit

60‧‧‧抽低壓裝置 60‧‧‧Pumping device

70‧‧‧連接管 70‧‧‧Connecting tube

80‧‧‧反應室冷卻裝置 80‧‧‧Reaction chamber cooling unit

100,100’‧‧‧奈米碳管製備裝置 100,100'‧‧‧Nano carbon tube preparation device

101‧‧‧進氣口 101‧‧‧air inlet

102‧‧‧出氣口 102‧‧‧ outlet

501‧‧‧冷卻室 501‧‧‧ Cooling room

502‧‧‧氣壓閥 502‧‧‧Pneumatic valve

503‧‧‧氣體冷卻管 503‧‧‧ gas cooling tube

801‧‧‧管腔 801‧‧‧ lumen

802‧‧‧反應室冷卻管 802‧‧‧reaction chamber cooling tube

803‧‧‧內管 803‧‧‧ inner tube

第一圖係本發明第一實施例奈米碳管製備裝置剖面示意圖;第二圖係第一種反應室冷卻裝置截面示意圖;第三圖係第二種反應室冷卻裝置截面示意圖;第四圖係本發明第二實施例奈米碳管製備裝置剖面示意圖;第五圖係氣體冷卻管設於連接管內壁示意圖。 1 is a schematic cross-sectional view of a carbon nanotube preparation apparatus according to a first embodiment of the present invention; the second diagram is a schematic cross-sectional view of a first reaction chamber cooling device; and the third diagram is a schematic cross-sectional view of a second reaction chamber cooling device; A schematic cross-sectional view of a carbon nanotube preparation apparatus according to a second embodiment of the present invention; and a fifth diagram showing a gas cooling tube disposed on an inner wall of the connecting pipe.

100‧‧‧奈米碳管製備裝置 100‧‧‧Nano carbon tube preparation device

10‧‧‧反應室 10‧‧‧Reaction room

20‧‧‧加熱部 20‧‧‧heating department

30‧‧‧載舟 30‧‧‧Scatter

40‧‧‧基板 40‧‧‧Substrate

50‧‧‧氣體冷卻裝置 50‧‧‧ gas cooling device

60‧‧‧抽低壓裝置 60‧‧‧Pumping device

70‧‧‧連接管 70‧‧‧Connecting tube

80‧‧‧反應室冷卻裝置 80‧‧‧Reaction chamber cooling unit

101‧‧‧進氣口 101‧‧‧air inlet

102‧‧‧出氣口 102‧‧‧ outlet

501‧‧‧冷卻室 501‧‧‧ Cooling room

502‧‧‧氣壓閥 502‧‧‧Pneumatic valve

Claims (12)

一種奈米碳管製備裝置,其包括:一反應室,其具有一出氣口;一反應室冷卻裝置,其設於所述反應室內或反應室外,以在反應室內之反應結束後對所述反應室進行冷卻;一抽低壓裝置,與所述反應室出氣口相通,用於降低反應室內之氣壓;其改進在於所述反應室與所述抽低壓裝置之間設置有一氣體冷卻裝置,用於冷卻反應室排出之氣體。 A carbon nanotube preparation apparatus comprising: a reaction chamber having an air outlet; a reaction chamber cooling device disposed in the reaction chamber or outside the reaction chamber to react to the reaction after the reaction in the reaction chamber is completed The chamber is cooled; a pumping low-pressure device is connected to the outlet of the reaction chamber for reducing the pressure in the reaction chamber; and the improvement is that a gas cooling device is disposed between the reaction chamber and the pumping unit for cooling The gas discharged from the reaction chamber. 如申請專利範圍第1項所述之奈米碳管製備裝置,其中,所述奈米碳管製備裝置包括一連接管,該連接管連接反應室出氣口與抽低壓裝置。 The carbon nanotube preparation device according to claim 1, wherein the carbon nanotube preparation device comprises a connection pipe connecting the reaction chamber outlet port and the pumping device. 如申請專利範圍第2項所述之奈米碳管製備裝置,其中,所述氣體冷卻裝置為液冷式冷卻裝置。 The carbon nanotube preparation apparatus according to claim 2, wherein the gas cooling device is a liquid cooling type cooling device. 如申請專利範圍第3項所述之奈米碳管製備裝置,其中,所述氣體冷卻裝置包括一可供所述連接管穿設之冷卻室,該冷卻室中包含冷卻工作物質。 The carbon nanotube preparation apparatus according to claim 3, wherein the gas cooling device comprises a cooling chamber through which the connecting pipe is bored, the cooling chamber containing a cooling working substance. 如申請專利範圍第4項所述之奈米碳管製備裝置,其中,所述連接管蛇形穿設於所述冷卻室中。 The carbon nanotube preparation apparatus according to claim 4, wherein the connecting tube is serpentinely passed through the cooling chamber. 如申請專利範圍第3項所述之奈米碳管製備裝置,其中,所述氣體冷卻裝置包括至少一個設於所述連接管內壁或外壁之氣體冷卻管,該氣體冷卻管中包含冷卻工作物質。 The carbon nanotube preparation apparatus according to claim 3, wherein the gas cooling device comprises at least one gas cooling pipe provided on an inner wall or an outer wall of the connecting pipe, and the gas cooling pipe includes cooling work. substance. 如申請專利範圍第6項所述之奈米碳管製備裝置,其中,所述氣體冷卻管繞設於連接管外。 The carbon nanotube preparation apparatus according to claim 6, wherein the gas cooling pipe is disposed outside the connection pipe. 如申請專利範圍第4項或第6項所述之奈米碳管製備裝置, 其中,所述冷卻工作物質採用水、甲醇、乙醇、丙酮、己烷、液氨、液氮中之一種或幾種之混合。 Such as the carbon nanotube preparation device described in claim 4 or 6, Wherein, the cooling working substance is a mixture of one or more of water, methanol, ethanol, acetone, hexane, liquid ammonia, and liquid nitrogen. 如申請專利範圍第1項所述之奈米碳管製備裝置,其中,所述反應室冷卻裝置包括一設置於所述反應室內之內管,該內管之外壁與該反應室之內壁形成一管腔,該管腔中包含冷卻工作物質。 The carbon nanotube preparation apparatus according to claim 1, wherein the reaction chamber cooling device comprises an inner tube disposed in the reaction chamber, and an outer wall of the inner tube and an inner wall of the reaction chamber are formed. A lumen containing a cooling working substance. 如申請專利範圍第1項所述之奈米碳管製備裝置,其中,所述反應室冷卻裝置包括複數反應室冷卻管,該反應室冷卻管中包含冷卻工作物質。 The carbon nanotube preparation apparatus according to claim 1, wherein the reaction chamber cooling device comprises a plurality of reaction chamber cooling tubes, wherein the reaction chamber cooling tubes contain a cooling working substance. 如申請專利範圍第10項所述之奈米碳管製備裝置,其中,所述反應室冷卻管繞設於所述反應室外。 The carbon nanotube preparation apparatus according to claim 10, wherein the reaction chamber cooling tube is disposed around the reaction chamber. 如申請專利範圍第10項所述之奈米碳管製備裝置,其中,所述反應室冷卻管分佈於反應室內之頂部及底部,且反應室內頂部之反應室冷卻管分佈密度大於該反應室內底部之反應室冷卻管分佈密度。 The carbon nanotube preparation device according to claim 10, wherein the reaction chamber cooling tubes are distributed at the top and bottom of the reaction chamber, and the reaction chamber cooling tubes at the top of the reaction chamber have a distribution density greater than the bottom of the reaction chamber. The reaction chamber cooling tube distribution density.
TW94139770A 2005-11-11 2005-11-11 Apparatus for manufacturing carbon nanotubes TWI386514B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237064B (en) * 2002-03-25 2005-08-01 Ind Tech Res Inst Supported metal catalyst for synthesizing carbon nanotubes by low-temperature thermal chemical vapor deposition and method of synthesizing nanotubes using the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI237064B (en) * 2002-03-25 2005-08-01 Ind Tech Res Inst Supported metal catalyst for synthesizing carbon nanotubes by low-temperature thermal chemical vapor deposition and method of synthesizing nanotubes using the same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
梁閔升, 李嘉平, "探討於二階段化學氣相沉積銅膜之第一階段所沉積氧化銅膜的還原過程", 國立台灣科技大學, 化學工程系, 94.7.9, 全文。 *

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