TWI385504B - Cooling device - Google Patents

Description

Heat sink

The invention relates to a heat dissipating device, in particular to a heat dissipating device for a heat generating electronic component.

With the rapid development of the computer industry, heat generated by heat-generating electronic components such as micro-processed wafers is increasing. As shown in FIG. 1 , in order to effectively dissipate the excess heat, a method of attaching a heat sink 11 to the surface of the heat-generating electronic component 14 is performed to dissipate the heat generated by the heat-generating electronic component 14 and use the spring screw 12 to dissipate the heat generated by the heat-generating electronic component 14 . The heat sink 11 is fixed to the circuit board 13, and the spring screw 12 is a component formed by the spring 120 being sleeved on the screw 121. A plurality of through holes 110 are provided in the heat sink 11. The outer diameter of the spring 120 is larger than the diameter of the through hole 110, and the diameter of the thread 123 is smaller than the diameter of the through hole 110. Therefore, the thread 123 passes through the through hole 110 and is screwed with the threaded hole 130 of the circuit board 13. For ease of transportation, the spring screw 12 and the heat sink 11 are often pre-assembled by the buckle 122 so as not to disengage from the heat sink 11 during transportation. When the heat sink 11 is mounted on the circuit board 13, the buckle 122 does not have any function. The buckle 122 can be an O-ring or an E-ring.

Since the buckle 122 does not perform any function after the installation of the heat sink 11, the material cost and the manufacturing cost are increased, and the buckle 122 may not be tightly fastened due to improper assembly, especially when the buckle 122 is made of metal. If it falls off, it will cause a short circuit on the board.

In view of this, it is necessary to provide a heat sink that can be easily implemented in a pre-assembled manner and at a low cost.

A heat dissipating device includes a base and at least one spring fastener, the spring fastener is sleeved with a spring, and the base is provided with a through hole for the spring fastener to pass through, the base is in the through hole or near the through hole A buckle is provided, and the buckle clamps at least one spring ring of the spring between the base and the buckle.

Compared with the prior art, when the spring fastener is pre-assembled to the base, the spring fastener is lightly pressed, the spring ring slides down the buckle, and is radially pressed, and the radial elastic deformation occurs and retracts when the spring coil is completely After passing through the buckle, the pressing force is eliminated, the radial direction of the spring ring is restored to the original shape, and the buckle clamps the spring ring between the base and the buckle, thereby firmly fixing the spring fastener to the base. Compared with the prior art, the present invention replaces the buckle by the buckle structure on the base, which reduces the assembly and material cost of the buckle, and eliminates the risk of the circuit board being short-circuited due to the buckle falling off.

The heat sink will be further described below with reference to the drawings. As shown in FIGS. 2, 3 and 4, the heat sink 2 includes a heat sink 21, a plurality of spring fasteners 22, a circuit board 23, and a heat generating electronic component 24 mounted on the circuit board 23.

The spring fastener 22 includes a fastener 221 and a spring 222. The spring 222 is sleeved on the fastener 221. In the embodiment, the spring fastener 22 is a spring screw, and the bottom end is provided with a thread 223. The fastener 221 is threadedly connected to the threaded hole 230 of the circuit board 23. In order to firmly fit the spring 222 on the fastener 221, an annular protrusion 2212 is formed on the outer surface of the top end of the fastener 221, and a groove 2211 is formed between the top end of the fastener 221 and the annular protrusion 2212. The top ring 2221 is sleeved in the groove 2211. When the spring fastener 22 is installed, due to the elastic deformation of the spring 222, there is a certain pressure between the heat sink 21 and the heat-generating electronic component 24, so that the two are more closely attached. Tight, better heat dissipation. There are many types of spring fasteners 22, which are not described here. The spring-loaded fasteners are all within the scope of this patent application.

The heat sink 21 includes a base 211 and a plurality of fins 212 extending vertically upward from the base 211. The bottom surface of the base 211 is in close contact with the heat generating electronic component 24. The base 211 is a rectangular parallelepiped structure, and a through hole 213 is defined at each of the four corners. The through hole 213 is a stepped hole, and includes a large hole 216 and a small hole 217. A step 218 is formed between the large hole 216 and the small hole 217. The diameter of the spring 222 is between the diameter of the large hole 216 and the diameter of the small hole 217. between. The inner wall of the large hole 216 is convexly formed with buckles 214 and 215. The distance between the buckle 214 and the step 218 is not less than the pitch of the spring 222. The buckle 214 is formed with a slope 214a for guiding the downward movement of the spring 222. Similarly, the buckle 215 also has a slope 215a for guiding the downward movement of the spring 222.

When installed, the threaded portion 223 of the spring fastener 22 passes through the through hole 213, but the spring 222 cannot directly pass through the through hole 213 due to the blocking of the buckles 214, 215, pressing the top end of the spring fastener 22, so that the spring 222 The bottom ring 2222 is pressed by the slopes 214a, 215a of the buckles 214, 215, and is decomposed into a radial component and an axial component. Under the action of the radial component force, the bottom ring 2222 of the spring 222 is radially reduced, and the bottom ring 2222 Moving downward along the slopes 214a, 215a, the bottom ring 2222 completely passes through the slopes 214a, 215a, no longer subjected to radial component forces, and the bottom ring 2222 returns to its original shape, so that the snaps 214, 215 clamp the spring 222 to the buckle. Between 214, 215 and step 218. When the distance between the buckle 214 and the step 218 is equal to the pitch of the spring 222, the bottom ring 2222 of the spring 222 is caught by the buckles 214, 215 and the step 218. When the distance between the buckle 214 and the step 218 is greater than the pitch of the spring 222, the spring fastener 22 is continuously pressed, and the other spring coils of the spring 222 can also pass as described above. The bevels 214a, 215a, at least one of the springs 222 are clamped between the buckles 214, 215 and the step 218.

The present invention does not limit the number of through holes and buckles, and is not limited to the fact that the buckles must be symmetrically distributed. As long as one or more buckles are provided in the through holes 213, the technical effects of the present invention are achieved. The snap structure is provided in each of the through holes 213, and will not be described in detail.

5 and 6 show a further preferred embodiment of the present invention. The diameter of the spring 322 is larger than the diameter of the through hole 313, and the buckles 314 and 315 having the same structure are disposed on the upper surface of the base 311 of the heat sink along the through hole 313. The central axis is symmetrically distributed around the through hole 313. The buckles 314, 315 can be integrally formed with the base 311 of the heat sink, or can be stamped from the base 311 of the heat sink. The buckles 314, 315 and the upper surface of the base 311 clamp the bottom ring 3222 of the spring 322 to the base 311 of the heat sink. The ends of the buckles 314, 315 can also be respectively provided with a slope 314a, 315a for guiding the downward movement of the spring 322. With this configuration, the installation process can be simplified, and only the top of the spring fastener 32 is pressed, and the bottom ring 3222 of the spring 322 moves downward along the slope 314a of the buckle 314 and the slope 315a of the buckle 315, and is subjected to the slope 314a, The 315a is squeezed and radially contracted. When the bottom ring 3222 completely passes through the slopes 314a, 315a, the original shape is restored, so that the buckles 314, 315 clamp the bottom ring 3222 of the spring 322 to the buckles 314, 315 and the base 311. Between the upper surfaces, the spring 322 is pre-fixed to the base 311 of the heat sink. The buckles 314, 315 and the upper surface of the base 311 can also clamp a plurality of spring coils of the spring 322 to the base 311.

The buckles 314, 315 are not limited to the structure, and may also be in an inverted "L" shape (ie, first extending vertically from the base 311 and then extending toward the through hole 313). The slanting block or the arc block formed by the upper surface of the base 311 as long as it can be engaged with the upper surface of the base 311 to at least one spring ring of the spring is clamped on the base 311. Within the scope of this patent application. The present invention does not limit the number of buckles, and is not limited to the fact that the buckles must be symmetrically distributed. The technical effect of the present invention can be achieved by providing more than one buckle around the through holes 313.

The invention is also applicable to a heat dissipation module. As shown in FIG. 7, the heat dissipation module 6 includes a base 61, a heat pipe 62, a heat sink group 64, a heat dissipation fan 65, and a spring fastener 66. One end of the heat pipe 62 is laid on the upper surface of the base 61, and the other end is inserted through the heat sink group 64. . The cooling fan 65 is a centrifugal fan, and the heat sink group 64 is located at the air outlet of the cooling fan 65. The base 61 absorbs heat generated by a heat-generating electronic component (not shown), and the heat pipe 62 transfers heat to the heat sink group 64 to be radiated into the air, and generates heat by the heat-dissipating fan 65 to dissipate heat. A through hole is formed at four corners of the base 61. The buckles 214 and 215 of the first embodiment can be disposed in the through hole to pre-assemble the spring onto the base 61, or the upper surface of the base 61 is disposed as described above. The buckles 314, 315 of the second embodiment are used to pre-assemble the spring onto the base 61 in the same manner as the previous embodiment.

In summary, the present invention conforms to the requirements of the invention patent, and proposes a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

<知知>

11‧‧‧ radiator

110‧‧‧through hole

12‧‧‧Spring Screws

120‧‧‧ Spring

121‧‧‧ screws

122‧‧‧ buckle

123‧‧‧ thread

13‧‧‧Circuit board

130‧‧‧Threaded holes

14‧‧‧Fever electronic components

2‧‧‧heating device

211, 311, 61‧‧‧ base

21‧‧‧ radiator

212‧‧‧ Heat sink

213, 313‧‧‧through holes

216‧‧‧ big hole

217‧‧‧ hole

218‧‧‧ steps

214, 215, 314, 315 ‧ ‧ buckles

214a, 215a, 314a, 315a‧‧‧ bevel

22, 32, 66‧‧‧ spring fasteners

221‧‧‧fasteners

2211‧‧‧ Groove

2212‧‧‧ annular protrusion

222, 322‧ ‧ spring

2221‧‧‧ top circle

2222, 3222‧‧‧ bottom circle

223‧‧‧ thread

23‧‧‧ Circuit board

230‧‧‧Threaded holes

24‧‧‧Fever electronic components

6‧‧‧ Thermal Module

62‧‧‧heat pipe

64‧‧‧Heat plate group

65‧‧‧ cooling fan

1 is an exploded perspective view of a conventional heat sink.

2 is an exploded perspective view of a heat sink device in accordance with a preferred embodiment of the present invention.

Figure 3 is a perspective view, partly in section, of Figure 2 taken along line III-III.

4 is a plan cross-sectional view of the spring fastener assembled to the heat sink.

FIG. 5 is an assembled perspective view of a buckle and a spring fastener according to still another preferred embodiment of the present invention.

Figure 6 is a perspective view of the buckle of Figure 5.

FIG. 7 is an assembled, isometric view of a heat sink according to still another preferred embodiment of the present invention.

2211‧‧‧ Groove

2212‧‧‧ annular protrusion

2221‧‧‧ top circle

2222‧‧‧ bottom circle

214, 215‧‧‧ buckles

214a, 215a‧‧‧ bevel

216‧‧‧ big hole

217‧‧‧ hole

218‧‧‧ steps

223‧‧‧ thread

Claims (10)

A heat dissipating device includes a base and at least one spring fastener, the spring fastener is sleeved with a spring, and the base is provided with a through hole through which the spring fastener passes, and the improvement is: the through hole or the a buckle is disposed in the vicinity of the through hole, and the buckle is at least two protrusions spaced apart from each other, and the at least two protrusions press against at least one spring ring of the spring toward the base direction, so that at least one spring ring of the spring is clamped to Between the base and at least two bumps. The heat dissipation device of claim 1, wherein the through hole is a stepped hole, and includes a large hole and a small hole, and a step is formed between the large hole and the small hole, and the buckle is located at the large In the hole, the inner wall of the large hole is convexly formed and spaced apart from the step, and at least one spring ring of the spring is clamped between the step and the buckle. The heat sink according to claim 2, wherein the buckle is formed with a slope on which the guide spring moves downward. The heat dissipating device of claim 1, wherein the buckle is disposed on the upper surface of the base and distributed around the through hole, and at least one spring ring of the spring is clamped on the buckle and the base Between the upper surfaces. The heat dissipating device according to claim 4, wherein the buckle has one of an inverted "L" shape, an arc shape, or a diagonal shape. The heat dissipating device of claim 1, wherein the base is provided with a plurality of buckles, and the plurality of buckles are symmetrically distributed around the through holes. The heat sink according to claim 1, wherein the base is provided with a plurality of heat sinks. The heat dissipating device of claim 1, further comprising a heat pipe and a heat sink group, wherein one end of the heat pipe is connected to the heat sink group, and One end is attached to the base. The heat dissipating device of claim 1, wherein the spring fastener protrudes from the outer surface of the top end to form an annular protrusion, and a tip is formed between the top end of the spring fastener and the annular protrusion. The top ring of the spring is sleeved in the groove. The heat dissipating device according to claim 1, wherein the spring fastener is a spring screw, and the bottom end is provided with a thread.