TWI384932B - Housing for electronic product and method of making the same - Google Patents

Housing for electronic product and method of making the same Download PDF

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Publication number
TWI384932B
TWI384932B TW96120772A TW96120772A TWI384932B TW I384932 B TWI384932 B TW I384932B TW 96120772 A TW96120772 A TW 96120772A TW 96120772 A TW96120772 A TW 96120772A TW I384932 B TWI384932 B TW I384932B
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electronic product
manufacturing
casing
holes
hole
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TW96120772A
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Chinese (zh)
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TW200850117A (en
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Chun-Bao Wang
Jie Tang
Jin-Lin Qiu
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Fih Hong Kong Ltd
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Publication of TWI384932B publication Critical patent/TWI384932B/en

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Description

電子產品之殼體及其製造方法 Housing of electronic product and manufacturing method thereof

本發明涉及一種電子產品之殼體及其製造方法。 The invention relates to a housing for an electronic product and a method of manufacturing the same.

隨著資訊技術之迅猛發展,攜帶型電子產品如行動電話、PDA(Personal Digital Assistant,個人數位助理)及筆記本電腦等應用日益普遍,這些電子產品外殼之美觀程度及手感也愈來愈受到人們之關注與重視。一習知行動電話殼體,應用噴塗烤漆等方法對其表面進行裝飾雖然可加強該殼體外觀美感,然藉由噴塗烤漆等方法形成之殼體表面極易磨損且其表面塗覆之烤漆易剝落,從而影響產品外觀。 With the rapid development of information technology, portable electronic products such as mobile phones, PDAs (Personal Digital Assistants) and notebook computers are becoming more and more popular. The aesthetics and feel of these electronic products are getting more and more popular. Attention and attention. A conventional mobile phone casing, which is decorated with a paint varnish or the like, can enhance the aesthetic appearance of the casing, but the surface of the casing formed by spraying paint and the like is extremely easy to wear and the surface is coated with the paint. Peel off, which affects the appearance of the product.

有鑒於此,有必要提供一種外表美觀、不易磨損之電子產品之殼體。 In view of this, it is necessary to provide a housing for an electronic product that is aesthetically pleasing and less prone to wear.

另外也有必要提供一種製造所述殼體之方法。 There is also a need to provide a method of making the housing.

本發明提供一種電子產品之殼體,其包括一不透明基體,所述基體上開設複數盲孔,至少部分盲孔底部開設有通孔,且該至少部分盲孔與通孔連通。 The invention provides a housing for an electronic product, comprising an opaque substrate, wherein a plurality of blind holes are formed in the base body, at least a portion of the blind holes are provided with a through hole at the bottom, and the at least part of the blind holes communicate with the through hole.

一種電子產品之殼體之製造方法,其包括以下步驟:成型一基體;於所述基體上加工複數盲孔;於部分盲孔底部加工通孔,且該部分盲孔與通孔連通。 A manufacturing method of a casing for an electronic product, comprising the steps of: forming a base body; processing a plurality of blind holes on the base body; processing a through hole at a bottom portion of the blind hole, and the portion of the blind holes is in communication with the through hole.

與習知技術相比,本發明藉由所述製造方法製作之殼體,其基體表面之部分盲孔底部開設有通孔,當行動電話被操作或有來電時,其內部發出之光線藉由所述通孔中射出,從而形成具有特定亮光圖案之行動電話,使應用該殼體之電子產品更加美觀。且,該殼體表面沒有被噴塗烤漆,故不會發生漆皮磨損脫落之現象。 Compared with the prior art, the housing made by the manufacturing method of the present invention has a through hole at the bottom of a part of the blind hole of the surface of the base body. When the mobile phone is operated or has an incoming call, the light emitted inside is emitted by the mobile phone. The through hole is ejected to form a mobile phone having a specific bright light pattern, so that the electronic product to which the casing is applied is more beautiful. Moreover, the surface of the casing is not sprayed with paint, so that the paint skin does not wear off.

本發明提供一種電子產品殼體,所述殼體較佳實施方式以應用於行動電話上為例加以說明。 The present invention provides an electronic product housing, which is described by way of example for application to a mobile phone.

請一併參閱圖1及圖2,本發明第一較佳實施方式之殼體10呈平板狀,其包括一基體102,該基體102不透明,其由金屬材料製成,該基體102包括一第一表面1022。複數盲孔1024開設於所述第一表面1022上,所述盲孔1024為一圓形盲孔,其直徑為0.3 mm,深度為0.1 mm~0.2 mm。於部分盲孔1024之底部開設有通孔1026,所述複數通孔1026為圓形通孔,其直徑為0.2 mm。所述複數通孔1026之排佈形成一特定圖案。所述複數通孔1026中填充有透明填充物104,以防止灰塵或水汽進入殼體10內。由於所述複數通孔1026直径很小且開設于複數盲孔1024底部,故由基體102之第一表面1022方向觀察,不易發現基體102上開設有複數通孔1026。而當行動電話被操作或有來電時,其內部會發出光線,該光線從所述複數通孔1026中經透明填充物104射出,從而形成具有特定亮光圖案之行動電話。 Referring to FIG. 1 and FIG. 2 together, the housing 10 of the first preferred embodiment of the present invention has a flat shape and includes a base 102. The base 102 is opaque and made of a metal material. The base 102 includes a first A surface 1022. A plurality of blind holes 1024 are formed on the first surface 1022. The blind holes 1024 are a circular blind hole having a diameter of 0.3 mm and a depth of 0.1 mm to 0.2 mm. A through hole 1026 is formed in the bottom of the partial blind hole 1024, and the plurality of through holes 1026 are circular through holes having a diameter of 0.2 mm. The arrangement of the plurality of through holes 1026 forms a specific pattern. The plurality of through holes 1026 are filled with a transparent filler 104 to prevent dust or moisture from entering the casing 10. Since the plurality of through holes 1026 are small in diameter and open at the bottom of the plurality of blind holes 1024, it is difficult to find that the plurality of through holes 1026 are formed in the base 102 when viewed from the first surface 1022 of the base 102. When the mobile phone is operated or has an incoming call, light is emitted from the inside, and the light is emitted from the plurality of through holes 1026 through the transparent filler 104, thereby forming a mobile phone having a specific bright light pattern.

請參閱圖3,本發明第二較佳實施方式之殼體20包括一基 體202,該基體202包括一主體2022及分別由主體2022垂直延伸之二側壁2027、2028。所述主體2022及二側壁2027、2028共同形成一外表面2029,複數盲孔2024開設於所述外表面2029上。所述盲孔2024為圓形盲孔,於對應該基體202之主體2022及二側壁2027、2028之區域之部分盲孔2024之底部開設複數圓形通孔2026,所述複數通孔2026排佈形成特定之圖案。透明填充物204形成於所述複數通孔2026中,以防止灰塵或水汽進入殼體20內。 Referring to FIG. 3, the housing 20 of the second preferred embodiment of the present invention includes a base. The body 202 includes a body 2022 and two side walls 2027, 2028 extending perpendicularly from the body 2022, respectively. The main body 2022 and the two side walls 2027, 2028 together form an outer surface 2029, and a plurality of blind holes 2024 are formed on the outer surface 2029. The blind hole 2024 is a circular blind hole, and a plurality of circular through holes 2026 are defined in the bottom of the partial blind hole 2024 corresponding to the main body 2022 of the base body 202 and the two side walls 2027, 2028, and the plurality of through holes 2026 are arranged. Form a specific pattern. A transparent filler 204 is formed in the plurality of through holes 2026 to prevent dust or moisture from entering the housing 20.

以第一較佳實施方式之殼體為例,其製造方法包括以下步驟:首先,用衝壓機床對金屬板材進行衝壓,形成一基體102,該基體102之厚度約為0.5mm,本實施例中,該基體102為一矩形殼體。 Taking the housing of the first preferred embodiment as an example, the manufacturing method includes the following steps: First, the metal plate is stamped by a punching machine to form a base 102 having a thickness of about 0.5 mm, in this embodiment. The base 102 is a rectangular housing.

之後應用鐳射雕刻技術首先於基體102之第一表面1022加工出複數盲孔1024,所述複數盲孔1024依次排列於該基體102之第一表面1022上,所述複數盲孔1024之直徑為0.3 mm,其深度為0.1mm-0.2 mm之間。再應用鐳射雕刻技術於所述部分盲孔1024之底部加工出直徑為0.2 mm之複數通孔1026,由所述複數通孔1026形成一特定之圖案形狀。 Then, a plurality of blind vias 1024 are first formed on the first surface 1022 of the substrate 102 by using a laser engraving technique. The plurality of blind vias 1024 are sequentially arranged on the first surface 1022 of the substrate 102. The diameter of the plurality of blind vias 1024 is 0.3. Mm, the depth is between 0.1mm-0.2mm. A plurality of through holes 1026 having a diameter of 0.2 mm are formed by the laser engraving technique at the bottom of the partial blind holes 1024, and the plurality of through holes 1026 form a specific pattern shape.

再對該基體102進行抛光處理,其過程係於抛光布輪上塗抹潤滑劑後,再將該基體102之第一表面1022經過與高速旋轉之抛光布輪摩擦,以去除其表面之劃痕紋路,提高 該第一表面1022之平整與光亮度。 The substrate 102 is then polished, after the lubricant is applied to the polishing cloth wheel, and then the first surface 1022 of the substrate 102 is rubbed with a polishing cloth wheel that rotates at a high speed to remove scratch marks on the surface thereof. ,improve The flatness of the first surface 1022 and the brightness of the light.

然後對該基體102進行清洗,以去除該基體102之第一表面1022上之潤滑劑等污漬。 The substrate 102 is then cleaned to remove stains such as lubricant on the first surface 1022 of the substrate 102.

最後對所述複數通孔1026進行封孔處理,將透明填充物104填充入複數通孔1026內。 Finally, the plurality of through holes 1026 are sealed, and the transparent filler 104 is filled into the plurality of through holes 1026.

可以理解,於該電子產品之殼體之製造方法中,也可以先於基體上加工複數通孔,再圍繞所述通孔加工出複數盲孔,以使通孔形成於所述複數盲孔內。 It can be understood that, in the manufacturing method of the housing of the electronic product, a plurality of through holes may be processed on the substrate, and a plurality of blind holes are formed around the through holes, so that the through holes are formed in the plurality of blind holes. .

可以理解,所述複數盲孔及複數通孔之形狀不僅限於圓形,也可以為其他形狀,如矩形、菱形等。 It can be understood that the shape of the plurality of blind holes and the plurality of through holes is not limited to a circular shape, and may be other shapes such as a rectangle, a diamond shape, or the like.

可以理解,所述透明填充物可為透明樹脂等透明物質,以使光線從殼體內藉由通孔射出。 It can be understood that the transparent filler may be a transparent substance such as a transparent resin to emit light from the inside of the casing through the through hole.

可以理解,所述透明填充物也可填入底部開有通孔之盲孔中。 It can be understood that the transparent filler can also be filled into the blind hole with the through hole at the bottom.

可以理解,所述圓形複數盲孔及複數通孔之直徑可根據產品之大小加以調整。 It can be understood that the diameter of the circular plurality of blind holes and the plurality of through holes can be adjusted according to the size of the product.

可以理解,由該方法加工之殼體不僅可以應用於行動電話中,也可以應用之遊戲機、筆記本電腦等電子產品中。 It can be understood that the casing processed by the method can be applied not only to mobile phones but also to electronic products such as game machines and notebook computers.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵 蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. Should Covered in the scope of the following patent application.

10‧‧‧殼體 10‧‧‧shell

102‧‧‧基體 102‧‧‧ base

1022‧‧‧第一表面 1022‧‧‧ first surface

1024‧‧‧盲孔 1024‧‧‧blind hole

1026‧‧‧通孔 1026‧‧‧through hole

104‧‧‧透明填充物 104‧‧‧Transparent filler

20‧‧‧殼體 20‧‧‧shell

202‧‧‧基體 202‧‧‧ base

2022‧‧‧主體 2022‧‧‧ Subject

2024‧‧‧盲孔 2024‧‧‧Blind hole

2026‧‧‧通孔 2026‧‧‧through hole

2027‧‧‧側壁 2027‧‧‧ side wall

2028‧‧‧側壁 2028‧‧‧ side wall

2029‧‧‧外表面 2029‧‧‧ outer surface

204‧‧‧透明填充物 204‧‧‧Transparent filler

圖1為本發明第一較佳實施方式之殼體之立體示意圖;圖2為本發明第一較佳實施方式之殼體沿II-II線之剖示圖;圖3為本發明第二較佳實施方式之殼體之剖示圖。 1 is a perspective view of a casing according to a first preferred embodiment of the present invention; FIG. 2 is a cross-sectional view of the casing of the first preferred embodiment of the present invention taken along line II-II; A cross-sectional view of a housing of a preferred embodiment.

10‧‧‧殼體 10‧‧‧shell

102‧‧‧基體 102‧‧‧ base

1022‧‧‧第一表面 1022‧‧‧ first surface

1024‧‧‧盲孔 1024‧‧‧blind hole

1026‧‧‧通孔 1026‧‧‧through hole

104‧‧‧透明填充物 104‧‧‧Transparent filler

Claims (18)

一種電子產品之殼體,其包括一不透明基體,其改良在於:所述基體上開設複數盲孔,至少部分盲孔底部開設有通孔,且該至少部分盲孔與通孔連通。 A housing for an electronic product, comprising an opaque substrate, wherein the base body has a plurality of blind holes, at least a portion of the blind holes are provided with a through hole at the bottom, and the at least part of the blind holes communicate with the through holes. 如申請專利範圍第1項所述之電子產品之殼體,其中所述複數通孔中填有透明填充物。 The casing of the electronic product of claim 1, wherein the plurality of through holes are filled with a transparent filler. 如申請專利範圍第1項所述之電子產品之殼體,其中所述複數盲孔中填有透明填充物。 The housing of the electronic product of claim 1, wherein the plurality of blind holes are filled with a transparent filler. 如申請專利範圍第2項或第3項所述之電子產品之殼體,其中所述不透明基體由金屬材料製成。 The casing of the electronic product of claim 2, wherein the opaque substrate is made of a metal material. 如申請專利範圍第4項所述之電子產品之殼體,其中所述複數盲孔及通孔之形狀皆為圓形。 The casing of the electronic product of claim 4, wherein the plurality of blind holes and the through holes are all circular in shape. 如申請專利範圍第5項所述之電子產品之殼體,其中所述複數盲孔之直徑為0.3 mm,複數通孔之直徑為0.2 mm。 The housing of the electronic product of claim 5, wherein the plurality of blind holes have a diameter of 0.3 mm and the plurality of through holes have a diameter of 0.2 mm. 如申請專利範圍第6項所述之電子產品之殼體,其中所述複數盲孔之深度為0.1 mm~0.2 mm。 The casing of the electronic product of claim 6, wherein the plurality of blind holes have a depth of 0.1 mm to 0.2 mm. 一種電子產品之殼體之製造方法,包括以下步驟:成型一基體;於所述基體上加工複數盲孔;於部分盲孔底部加工通孔,且該部分盲孔與通孔連通。 A manufacturing method of a casing for an electronic product, comprising the steps of: molding a substrate; processing a plurality of blind holes on the substrate; processing a through hole at a bottom portion of the blind hole, and the portion of the blind hole is in communication with the through hole. 如申請專利範圍第8項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法中之基體由衝壓機床衝壓成型。 The method of manufacturing a casing for an electronic product according to claim 8, wherein the substrate in the method of manufacturing the electronic product is stamped and formed by a press machine. 如申請專利範圍第8項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法中之所述複數盲孔及通孔係 應用鐳射雕刻技術加工形成。 The method of manufacturing a casing for an electronic product according to claim 8, wherein the plurality of blind holes and through holes in the method of manufacturing the electronic product It is processed by laser engraving technology. 如申請專利範圍第8項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法還包括於加工通孔後再對基體進行抛光處理之步驟。 The method of manufacturing a casing for an electronic product according to claim 8, wherein the method of manufacturing the electronic product further comprises the step of polishing the substrate after processing the through hole. 如申請專利範圍第11項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法還包括於抛光處理後再對該基體進行清洗之步驟。 The method of manufacturing a casing for an electronic product according to claim 11, wherein the method of manufacturing the electronic product further comprises the step of cleaning the substrate after the polishing treatment. 如申請專利範圍第12項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法還包括於清洗後再將透明填充物填入所述通孔中之步驟。 The method of manufacturing a casing for an electronic product according to claim 12, wherein the method of manufacturing the electronic product further comprises the step of filling a transparent filler into the through hole after cleaning. 如申請專利範圍第12項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法還包括於清洗後再將透明填充物填入所述盲孔中之步驟。 The method of manufacturing a casing for an electronic product according to claim 12, wherein the method of manufacturing the electronic product further comprises the step of filling a transparent filler into the blind hole after cleaning. 一種電子產品之殼體之製造方法,包括以下步驟:成型一基體;於所述基體上加工通孔;於所述通孔週緣及基體上加工複數盲孔,且盲孔與通孔連通。 A manufacturing method of a casing for an electronic product, comprising the steps of: forming a base body; processing a through hole on the base body; processing a plurality of blind holes on the periphery of the through hole and the base body, and the blind hole is in communication with the through hole. 如申請專利範圍第15項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法中之所述複數盲孔及通孔係應用鐳射雕刻技術加工形成。 The method of manufacturing a casing for an electronic product according to claim 15, wherein the plurality of blind holes and through holes in the method of manufacturing the electronic product are formed by laser engraving. 如申請專利範圍第16項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法還包括將透明填充物填入所述通孔中之步驟。 The method of manufacturing a casing for an electronic product according to claim 16, wherein the method of manufacturing the electronic product further comprises the step of filling a transparent filler into the through hole. 如申請專利範圍第16項所述之電子產品之殼體之製造方法,其中該電子產品之製造方法還包括將透明填充物填入所 述盲孔中之步驟。 The method of manufacturing a casing for an electronic product according to claim 16, wherein the method of manufacturing the electronic product further comprises filling a transparent filler The steps in the blind hole.
TW96120772A 2007-06-08 2007-06-08 Housing for electronic product and method of making the same TWI384932B (en)

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US9538673B2 (en) 2013-07-30 2017-01-03 Fu Tai Hua Industry (Shenzhen) Co., Ltd. Electronic device and method for manufacturing housing for same

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