TWI384512B - - Google Patents
Info
- Publication number
- TWI384512B TWI384512B TW97147808A TW97147808A TWI384512B TW I384512 B TWI384512 B TW I384512B TW 97147808 A TW97147808 A TW 97147808A TW 97147808 A TW97147808 A TW 97147808A TW I384512 B TWI384512 B TW I384512B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97147808A TW201023219A (en) | 2008-12-09 | 2008-12-09 | Buried capacitor structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW97147808A TW201023219A (en) | 2008-12-09 | 2008-12-09 | Buried capacitor structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201023219A TW201023219A (en) | 2010-06-16 |
TWI384512B true TWI384512B (en) | 2013-02-01 |
Family
ID=44833306
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97147808A TW201023219A (en) | 2008-12-09 | 2008-12-09 | Buried capacitor structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201023219A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI295912B (en) * | 2005-10-14 | 2008-04-11 | Advanced Semiconductor Eng | Method for manufacturing a substrate embedded with an electronic component and device from the same |
TWI296910B (en) * | 2005-12-27 | 2008-05-11 | Phoenix Prec Technology Corp | Substrate structure with capacitance component embedded therein and method for fabricating the same |
-
2008
- 2008-12-09 TW TW97147808A patent/TW201023219A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI295912B (en) * | 2005-10-14 | 2008-04-11 | Advanced Semiconductor Eng | Method for manufacturing a substrate embedded with an electronic component and device from the same |
TWI296910B (en) * | 2005-12-27 | 2008-05-11 | Phoenix Prec Technology Corp | Substrate structure with capacitance component embedded therein and method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
TW201023219A (en) | 2010-06-16 |