TWI381921B - Punching method - Google Patents

Description

Punching method

The present invention relates to a punching technique, and more particularly to a method of punching a circuit board substrate.

Printed circuit boards have been widely used due to their high assembly density. For applications on high-density interconnect boards, see the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab., High density multilayer printed circuit board for HITAC M -880, IEEE Trans. on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 418-425.

The cover film is adhered to the surface of the circuit board product and between different layers to protect the circuit. An opening is formed in the protective film to form an area in the conductive line pattern that needs to communicate with the outside. Therefore, before the cover film is attached to the circuit board, the cover film needs to be punched to form an opening to match the circuit board to which it is to be attached. In order to increase the speed of the cover film punching type, the cover film punching type adopts a method of jumping or rotating. The jumper is a film that is in the form of a roll and is fixed to the punching machine. By rotating the roll of the cover film, one end of the cover film is continuously punched toward the other end. The rotary rushing is performed after the surface of the cover film is finished, so that the cover film is rotated by 180 degrees in a plane parallel thereto, and another punching pattern is performed, thereby obtaining mutually symmetrical structures in the cover film. In the prior art, there is a lack of a systematic detection method for the above two types of punching methods, usually a punching type. After the product is attached to the circuit board, it can be found by visual inspection that the cover film obtained by the punch type is deviated, and the cover film needs to be removed, and the cover film with the deviation satisfying the requirements is re-applied, thereby wasting Time, affecting board production efficiency.

In view of the above, it is necessary to provide a punching method capable of detecting a deviation of a punched substrate before bonding after punching.

A punching method will be described below by way of example.

A punching method comprising the steps of: providing a punching die, the punching die comprising a first die, a second die and a third die arranged in sequence; providing a punching substrate, the punching substrate comprising the first non a product area, a first product area, a second non-product area, and a second product area, the first product area being located between the first non-product area and the second non-product area; using the punching die to punch the substrate Performing a first punching pattern such that the first die forms a first test pattern on the first non-product region of the punched substrate, the second die forms a first product pattern in the product region, and the third die is in the second non-product region Forming a second test pattern; moving the punched substrate after the first punching so that the second non-product region of the moved stamped substrate is located at the first non-product region of the punched substrate before moving a second product region of the punched substrate after the movement is located at a position of the first product region of the punched substrate before the moving; and the punched substrate is subjected to the second punching by using the punching die. To make the first Forming a first test pattern in the second non-product area of the die-cast substrate, the second die forming a second product pattern in the second product area; detecting the second formation of the second non-product area Test pattern and second rush Forming a relative position of the first test pattern formed in the second non-product area, thereby determining that the first product pattern formed in the first product region and the second product region are formed in the second product region when the first punching pattern is formed Whether the deviation of the second product pattern satisfies the requirement of the offset tolerance.

Compared with the prior art, the punching method provided by the technical solution only needs to set the punching die with the first test pattern and the die of the second test pattern corresponding to the first test pattern, and the punching pattern is formed twice. The positional relationship between the first test pattern and the second test pattern is detected, so that it can be determined whether the deviation between the two punch patterns satisfies the requirement of the offset tolerance. The deviation detection method of the technical solution can prevent the punched product whose offset tolerance does not meet the requirements from flowing into the subsequent production process, and has the characteristics of simple process and easy operation.

The punching method provided by the technical solution will be further described below with reference to the accompanying drawings and the plural embodiments.

The first embodiment of the present technical solution provides a punching method, and the punching method can be applied to the detection of the deviation of the punching type substrate, and the punching method includes the steps: refer to FIG. 1, the first step, A punching die 100 is provided.

The punching die 100 includes a first die 110, a second die 120, and a third die 130 which are sequentially disposed. The first die 110 is used to form a first test pattern, the second die 120 is used to form a product pattern, and the third die 130 is used to form a second test pattern.

In this embodiment, the first die 110 has four cross sections that are circular and the first one. The punch 111 and the four first punches 111 have the same diameter and are equiangularly disposed, that is, the four first punches 111 are symmetrically disposed at the center. The third die 130 has a second punch 131 having a circular cross section. The distance between the center of each first punch 111 and the center of symmetry is equal to the sum of the radius of the second punch 131, the radius of the first punch 111, and the misalignment tolerance. The offset tolerance can be determined according to the accuracy of the actual fabricated circuit board, which can be ±0.05 mm, ±0.07 mm, or ±0.10 mm. The diameters of the first punch 111 and the second punch 131 may be equal or may not be equal.

In the second step, referring to FIG. 2, a stamped substrate 200 is provided. The punched substrate 200 may be a cover film or the like. The punched substrate 200 includes a plurality of product regions and non-product regions alternately arranged along the length thereof, and a line connecting the center of the first die 110 and the center of the third die 130 is parallel to the longitudinal direction of the punched substrate 200. In this embodiment, the punched substrate 200 includes a first non-product region 210, a first product region 220, a second non-product region 230, and a second product region 240, which are sequentially arranged, that is, the first product region 220 is located at the first non-product. Between the product area 210 and the second non-product area 230, the second product area 240 is adjacent to the second non-product area 230. The size of the first product area 220 and the second product area 240 corresponds to the size of the second die 120, and the size of the first non-product area 210 and the second non-product area 230 and the size of the first die 110 and the third die 130 Corresponding.

In the third step, referring to FIG. 3, the punching type substrate 200 is subjected to the first punching type by using the punching die 100, so that the first die 110 forms the first test pattern 250 in the first non-product region 210 of the punched substrate 200. The second die 120 forms a first product pattern 221 in the first product region 220, and the third die 30 forms a second test pattern 260 in the second non-product region 230.

The first die 110 of the stamping die 100 corresponds to the first non-product region 210 of the stamped substrate 200, the second die 120 corresponds to the first product region 220 of the stamped substrate 200, and the third die 130 is The second non-product region 230 of the stamped substrate 200 corresponds. The punching die 100 forms a first test pattern 250 on the first non-product region 210 of the punched substrate 200 under the pressure of a punching machine (not shown), and the first product region 220 of the stamped substrate 200 A first product pattern 221 is formed, and the second non-product region 230 of the stamped substrate 200 forms a second test pattern 260. In this embodiment, the first test pattern 250 is four centrally symmetric and equiangularly arranged circular holes, and the center of symmetry of the four circular holes is defined as the center of the first test pattern 250. The second test pattern 260 is a circular hole whose center is defined as the center of the second test pattern 260. The distance between the center of the first test pattern 250 and the center of the second test pattern 260 is defined as the distance between the first test pattern 250 and the second test pattern 260.

In the fourth step, referring to FIG. 3, the punched substrate 200 of the first punch type is moved in a direction parallel to the center of the first die 110 and the center of the third die 130, so as to make the punched base after the movement. The second non-product area 230 of the material 200 is located at the position of the first non-product area 210 before the movement, and the second product area 240 of the moved stamped substrate 200 is located at the position of the first product area 220 before the movement.

In this embodiment, the line connecting the center of the first die 110 and the center of the third die 130 is parallel to the length direction of the punched substrate 200, and is connected to the center of the third die 130 along the center parallel to the first die 110. Moving the first punched substrate 200 in the direction of the line, and moving the punched substrate 200 by a distance equal to the distance between the first test pattern 250 and the second test pattern 260 So that the second non-product area 230 of the moved stamped substrate 200 is located at the position of the first non-product area 210 before the movement, and the second product area 240 of the moved stamped substrate 200 is before the movement. The location at which the first product area 220 is located.

In the fifth step, referring to FIG. 4, the punched substrate 200 is subjected to a second punching process by using the punching die 100, so that the first die 110 forms the second non-product region 230 of the punched substrate 200. A test pattern 250, the second die 120 forms a second product pattern 241 in the second product region 240.

By the movement of the punched substrate 200 in the previous step, the first die 110 corresponds to the second non-product region 230 of the stamped substrate 200, and the second die 120 and the second product region of the stamped substrate 200 240 corresponds. Under the pressure of the punching machine, the first die 110 forms a first test pattern 250 in the second non-product area 230, and the second die 120 forms a second product pattern 241 in the second product area 240. Moreover, the second test pattern 260 formed by the first punching pattern and the first test pattern 250 formed by the second punching pattern overlap each other.

In the sixth step, the first positional relationship between the second test pattern 260 formed by the first punching pattern of the second non-product region of the stamped substrate 200 and the first test pattern 250 formed by the second punching pattern is detected, thereby determining the first position. Whether the deviation between the first product pattern 221 formed in the first product region 220 and the second product pattern 241 formed in the second product region 240 during the second punching type meets the requirement of the offset tolerance.

In this embodiment, the second test pattern 260 and the second punch type formed in the second non-product region 230 during the first punching can be visually detected. The relative positional relationship of the first test pattern 250 formed in the second product region 240 is detected. Referring to FIG. 3, when the deviation between the first punching pattern and the second punching pattern meets the requirement of the offset tolerance, one of the second test pattern 260 formed by the first punching pattern is formed by the second punching pattern and the second punching pattern. The four test holes of the first test pattern 250 do not intersect, that is, the four round holes of the first test pattern 250 formed by the second punch pattern surround a circular hole of the second test pattern 260 formed by the first punch.

Referring to FIG. 5 and FIG. 6 , when the deviation between the first punching pattern and the second punching pattern does not meet the requirement of the offset tolerance, one of the second test patterns 260 formed by the first punching pattern has a circular hole and a second time. One or more of the four circular holes of the first test pattern 250 formed by the punching pattern intersect. Of course, the circular hole of one of the second test patterns 260 formed by the first punching type is not located in the middle of the four circular holes of the first test pattern 250 formed by the second punching type, and the offset tolerance requirement cannot be satisfied.

It can be understood that the punched substrate 200 provided in this embodiment may include a plurality of product regions and non-product regions that are alternately disposed, thereby detecting whether the deviation between the product patterns formed by the adjacent two product regions meets the requirement of the offset tolerance. . For example, when moving the punched substrate 200 after the first punching, the third non-product region is located at the position of the second non-product region of the punched substrate before the movement, and the punching mold is used to move When the second punching type substrate 200 performs the second punching type, a second test pattern is further formed in the third non-product area, and the punching method further comprises the following steps after forming the second test pattern in the third non-product area; Moving the punched substrate parallel to the direction of the center of the first die and the center of the second die, so that the third product region after the movement is located at the position of the second product region before the movement, and the third non-product after the movement The product area is located at the position of the second non-product area before the movement; the punching type substrate is subjected to the third punching type by using the punching mold, so that the second die forms a third product pattern in the third product area, so that the first die is Forming, by the third non-product area, a first test pattern; detecting a second test pattern formed between the second test pattern formed by the third non-product area and the third test pattern formed by the third non-product area The relative position is used to determine whether the deviation between the second product pattern formed in the second product region and the third product pattern formed in the third product region during the third punching type satisfies the deviation tolerance requirement.

The second embodiment of the technical solution provides a punching method, which can be applied to the detection of the offset tolerance of the rotary punching type.

Referring to FIG. 7, the first step is to provide a die 300.

The punching die 300 includes a first die 310, a second die 320, and a third die 330. The first die 310 is used to form a first test pattern, the second die 320 is used to form a product pattern, and the third die 330 is used to form a second test pattern, and the first die 310 and the third die 330 are adjacent to the center of the die 300 Centered symmetrically.

In this embodiment, the first die 310 has four first punches 311 having a circular cross section, and the four first punches 311 are equal in diameter and equiangularly disposed, that is, the four first punches 311 are symmetrically disposed at the center. . The third die 330 has a second punch 331 having a circular cross section. The distance between the center of each first punch 311 and the center of symmetry is equal to the sum of the radius of the second punch 331, the radius of the first punch 311, and the misalignment tolerance. The offset of the offset can be determined according to the accuracy of the actual circuit board, which can be ±0.05 mm, ± 0.07 mm or ±0.10 mm. The diameters of the first punch 311 and the second punch 331 may be equal or may not be equal.

Referring to Figure 8, a stamped substrate 400 is provided. The punched substrate 400 may be a cover film or the like. The stamped substrate 400 includes a first non-product region 410, a first product region 420, a second non-product region 430, and a second product region 440 that are sequentially arranged. The first product region 420 and the second product region 440 are located between the first non-product region 410 and the second non-product region 430, and the first product region 420 and the second product region 440 are symmetrically disposed about the center of the punched substrate 400. The size of the first product region 420 corresponds to the size of the second die 320, and the size of the first non-product region 410 and the second non-product region 430 corresponds to the size of the first die 310 and the third die 330.

In the third step, referring to FIG. 9, the punching type substrate 400 is subjected to the first punching type by using the punching die 300, so that the first die 310 forms the first test pattern on the first non-product region 410 of the punched substrate 400. 450, the second die 320 forms a first product pattern 421 in the first product region 420, and the third die 330 forms a second test pattern 460 in the second non-product region 430.

The first die 310 of the stamping die 300 corresponds to the first non-product region 410 of the stamped substrate 400, the second die 320 corresponds to the first product region 420 of the stamped substrate 400, and the third die 330 is associated with The second non-product region 430 of the stamped substrate 400 corresponds. The punching die 300 forms a first test pattern 450 on the first non-product region 410 of the punched substrate 400 under the pressure of a punching machine (not shown), and the first product region 420 of the punched substrate 400 A first product pattern 421 is formed, and a second non-product region 430 of the stamped substrate 400 forms a second test pattern 460. In this embodiment, the first test pattern 450 is a circular hole with four centers symmetrically and equally spaced at equal intervals. And define the center of symmetry of the four circular holes as the center of the first test pattern 450. The second test pattern 460 is a circular hole whose center of the circle is defined as the center of the second test pattern 460.

In the fourth step, referring to FIG. 10, the punched substrate 400 after the first punching is rotated 180 degrees in the center of the punching die 300 in the plane thereof, so that the punched substrate 200 after the rotation is rotated. The first non-product area 410 is located at the position of the second non-product area 430 before the movement, and the second non-product area 430 of the moved punched substrate 400 is located at the position of the first non-product area 410 before the movement, moving The rear second product area 440 is located at the location of the first product area 420 before the move.

In the fifth step, referring to FIG. 10, the punched substrate 400 is subjected to a second punching process by using the punching die 300 so that the first die 310 is formed in the second non-product region 430 of the punched substrate 400. The first test pattern 450, the second die 320 forms a second product pattern 422 in the first product region 420, and the third die 330 forms a second test pattern 460 in the first non-product region 410.

By rotating the punched substrate 400 in the previous step, the first die 310 corresponds to the second non-product region 430 of the stamped substrate 400, and the second die 320 and the second product region of the stamped substrate 400 Corresponding to 440, the third die 330 corresponds to the first non-product region 410 of the stamped substrate 400. Under the pressure of the punching machine, the first die 310 forms a first test pattern 450 in the second non-product area 430, and the second die 120 forms a second product pattern 422 in the second product area 440. Moreover, the first test pattern 260 formed by the first punching pattern and the first test pattern 250 formed by the second punching pattern overlap each other, and the first test pattern 250 formed by the first punching pattern is The second test patterns 260 formed by the second punching pattern are coincident with each other, and the first product pattern 421 formed by the first punching pattern is centrally symmetric with the second product pattern 441 formed by the second punching pattern.

The sixth step is to detect the relative position and the first position of the first test pattern 450 formed by the punched substrate 400 during the first punching of the first non-product region 410 and the second test pattern 460 formed during the second punching. The second test pattern 460 formed in the second non-product area 430 and the relative position of the first test pattern 450 formed in the second non-product area 430 in the second shot type, thereby determining the first shot type Whether the deviation between the first product pattern 421 formed in the first product region 420 and the second product pattern 441 formed in the second product region 440 at the second punching type satisfies the requirement of the offset tolerance.

In this embodiment, the first test pattern 460 formed by the first punch forming and the first test pattern 450 formed by the second punching pattern and the first test pattern formed by the first punching type may be visually measured. The relative positional relationship between 450 and the second test pattern 460 formed by the second punch is detected. When the deviation between the first punching pattern and the second punching pattern satisfies the requirement of the offset tolerance, the first test pattern 450 formed by one of the second test pattern 460 formed by the second punching pattern and the first punching pattern is formed. The four circular holes are not intersected, that is, the four circular holes of the first test pattern 450 formed by the second punching pattern surround a circular hole of the second test pattern 460 formed by the first punching type; and, the first punching type is formed. One of the circular holes of the second test pattern 460 does not intersect with the four circular holes of the first test pattern 450 formed by the second punch.

When the deviation between the first product pattern 421 formed by the first punching pattern and the second product pattern 441 formed by the second punching pattern does not satisfy the requirement of the offset tolerance, the second test pattern 460 formed by the second punching pattern is a round hole with the first rush At least one of the four circular holes formed by the first test pattern 450 is formed, and one of the first test pattern 460 formed by the first punching pattern and the fourth round hole formed by the first test pattern 450 of the second punching pattern are At least one intersects. When the second test pattern formed by the two punch patterns is not located between the four circular holes of the first formed test pattern, the tolerance requirement is not satisfied.

In the technical solution, the shape of the cross section of the first punch of the first die and the second punch of the second die is not limited to the circular shape provided by the embodiment, and may also be a shape such as a regular polygon. The number of the first punches is not limited to four, and it may be three or more. Additionally, the first die may include only one punch and the second die includes a plurality of punches.

The detection method of the punching deviation provided by the technical solution only needs to set the die of the punching die with the first test pattern and the second test pattern corresponding to the first test pattern, and the first step of forming the punching pattern twice The positional relationship between the test pattern and the second test pattern is detected, so that it can be determined whether the deviation between the two punch patterns satisfies the requirement of the offset tolerance. The deviation detection method of the technical solution can prevent the punched product whose offset tolerance does not meet the requirements from flowing into the subsequent production process, and has the characteristics of simple process and easy operation.

In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

100,300‧‧‧ punching mould

110, 310‧‧‧ first die

111, 311‧‧‧ first punch

120, 320‧‧‧second die

130, 330‧‧‧ third die

131,331‧‧‧second punch

200,400‧‧‧ punched substrate

210, 410‧‧‧ first non-product area

220, 420‧‧‧ first product area

221, 421‧‧‧ first product pattern

230, 430‧‧‧ second non-product area

240, 440‧‧‧Second product area

241, 441‧‧‧ second product pattern

250, 450‧‧‧ first test pattern

260, 460‧‧‧ second test pattern

1 is a schematic view of a punching die provided by a first embodiment of the present technical solution.

2 is a schematic view of a stamped substrate provided by the first embodiment of the present technical solution.

FIG. 3 is a schematic view showing the first punching type of the punched substrate provided by the first embodiment of the present technical solution.

FIG. 4 is a schematic view showing that the offset tolerance of the second punching type of the punched substrate provided by the first embodiment of the present technical solution satisfies the requirements.

FIG. 5 is a schematic view showing that the offset tolerance of the second type of the punched substrate provided by the first embodiment of the present technical solution does not satisfy the requirement.

FIG. 6 is another schematic diagram of the offset tolerance of the second type of punched substrate provided by the first embodiment of the present technical solution.

FIG. 7 is a schematic view of a punching mold provided by a second embodiment of the present technical solution.

FIG. 8 is a schematic view of a stamped substrate provided by a second embodiment of the present technical solution.

FIG. 9 is a schematic view showing the first punching type of the punched substrate provided by the second embodiment of the present technical solution.

FIG. 10 is a schematic view showing the second punching type of the punched substrate provided by the second embodiment of the present technical solution.

210‧‧‧First non-product area

220‧‧‧First product area

221‧‧‧ first product pattern

230‧‧‧Second non-product area

240‧‧‧Second product area

241‧‧‧Second product pattern

250‧‧‧First test pattern

260‧‧‧Second test pattern

Claims (10)

A punching method comprising the steps of: providing a punching die, the punching die comprising a first die, a second die and a third die arranged in sequence; providing a punching substrate, the punching substrate comprising the first non a product area, a first product area, a second non-product area, and a second product area, the first product area being located between the first non-product area and the second non-product area; using the punching die to punch the substrate Performing a first punching pattern such that the first die forms a first test pattern on the first non-product region of the punched substrate, the second die forms a first product pattern in the product region, and the third die is in the second non-product region Forming a second test pattern; moving the punched substrate after the first punching so that the second non-product region of the moved stamped substrate is located at the first non-product region of the punched substrate before moving a second product region of the punched substrate after the movement is located at a position of the first product region of the punched substrate before the moving; and the punched substrate is subjected to the second punching by using the punching die. To make the first Forming a first test pattern in the second non-product area of the die-cast substrate, the second die forming a second product pattern in the second product area; detecting the second formation of the second non-product area The relative position of the first test pattern formed in the second non-product area when the second pattern is pressed, thereby determining the first product pattern and the second pattern formed in the first product region during the first punching Whether the deviation of the second product pattern formed in the second product region satisfies the requirement of the offset tolerance. The punching method according to claim 1, wherein the punching type The first die of the mold has a plurality of first punches having a circular cross section, the plurality of first punches being symmetric with respect to a center of a symmetric center, and the second punching die having a second punch having a circular cross section The distance between the center of each first punch and the center of symmetry is equal to the sum of the radius of the first punch, the radius of the second punch, and the absolute value of the offset tolerance. The punching method of claim 2, wherein the plurality of first punches have the same diameter. The punching method of claim 2, wherein, in the second non-product area, when a circular hole of the second test pattern intersects at least one of the plurality of circular holes of the first test pattern , the deviation between the first punching pattern and the second punching type does not satisfy the requirement of the offset tolerance; when the plurality of circular holes of the first test pattern surround a circular hole of the second test pattern, and one of the second test patterns The circular hole and the plurality of circular holes of the first test pattern are separated from each other, and the deviation between the first product pattern formed by the first punching pattern and the second product pattern formed by the second punching pattern satisfies the requirement of the offset tolerance. The punching method according to the first aspect of the invention, wherein the first die, the second die and the third die of the punching die are sequentially disposed along a length direction of the punching substrate, and the center of the first die is The connection of the center of the third die is parallel to the length direction of the punched substrate, and the first non-product area, the first product area, the second non-product area, and the second product area of the punched substrate are also The length direction of the substrate is sequentially set. The punching method according to claim 5, wherein after the first punching, the punching substrate is translated along a line parallel to the center of the first die and the center of the second die, and the punching type The distance the substrate moves is equal to the distance between the center of the first die and the center of the third die. The punching method according to claim 5, wherein the punching type The substrate further includes a third non-product area and a third product area, the third non-product area being located between the second product area and the third product area, and further moving the punched substrate after the first punching Positioning the third non-product area at a position of the second non-product area of the punched substrate before moving, and using the punching die to perform the second punching of the moved punched substrate, and third The non-product area forms a second test pattern, and the punching method further comprises the step of: moving the line along a line parallel to the center of the first die and the center of the second die after forming the second test pattern in the third non-product area The substrate is such that the moved third product region is located at the position of the second product region before the movement, and the moved third non-product region is located at the position of the second non-product region before the movement; the punching type substrate is punched by the punching die Performing a third punching pattern, so that the second die forms a third product pattern in the third product region, so that the first die forms a first test pattern in the third non-product region; and detects the second punch pattern in the third non-product region shape Determining a relative position between the second test pattern and the first test pattern formed by the third punching pattern in the third non-product region, thereby determining a second product pattern formed in the second product region during the second punching pattern The deviation of the third product pattern formed in the third product region during the three-time punching type satisfies the requirement of the offset tolerance. The punching method according to claim 1, wherein the first die and the third die are symmetrically disposed with respect to a center of the punching die, and the first product region and the second product region of the punching substrate Both are located between the first non-product area and the second non-product area. The method according to claim 8, wherein after the first punching, the punching substrate is rotated 180 degrees in the center of the punching die in the plane of the punching substrate, The first non-production of the punched substrate after the rotation The product area is located at the position of the second non-product area before the movement, and the moved first product area is located at the position of the second product area before the movement. The punching method according to claim 9, wherein the punching method further comprises: detecting a first non-product area of the punched substrate in the first test pattern formed by the first punching pattern and the second time The relative positional relationship of the second test pattern formed during the punching type, thereby further determining whether the deviation between the first product pattern formed in the product region and the second product pattern formed in the second punching pattern during the first punching type is Meet the requirements of offset tolerance.