TWI381179B - Apparatus for performing an electrical inspection - Google Patents

Description

Device for performing electronic inspection

The present invention relates to an apparatus for performing an electronic inspection. More particularly, the present invention relates to an apparatus for performing an electronic inspection of an object to be inspected by contact with an object.

In a semiconductor manufacturing process, a semiconductor device including a circuit pattern is integrally formed on a semiconductor substrate such as a germanium wafer and then an electronic inspection process such as an electronic die sorting (EDS) process can be performed to inspect the semiconductor device. Electronic features.

An electronic inspection device, such as a probe card, can be used to perform an electronic inspection process. Now, as semiconductor substrates have become larger, electronic inspection apparatuses have been developed to cope with semiconductor substrates having relatively large diameters. For example, electronic inspection devices have been primarily developed to successfully perform an electronic inspection process on a semiconductor substrate having a larger diameter, such as an 8-inch wafer or a 12-inch wafer.

In contrast, electronic inspection devices for performing electronic inspection processes on discrete devices such as radio frequency integrated circuit (RFIC) devices, active components, passive components, and the like have been relatively slow to develop. That is, the development of an electronic inspection apparatus corresponding to a device having a relatively small size has not been sufficiently performed.

As described above, since the development of an electronic inspection apparatus suitable for performing an electronic inspection process on an RFIC device has been delayed, it is not possible to satisfactorily perform an electronic inspection process on the RFIC device.

Example embodiments of the present invention provide an apparatus suitable for performing an electronic inspection of an electronic inspection of discrete devices such as radio frequency integrated circuit (RFIC) devices.

An apparatus for performing an electronic inspection according to an aspect of the present invention may include: a first substrate having a first surface and a second surface opposite to the first surface, and being disposed in the first substrate to electrically connect the first surface and the second a signal line of the surface; the electrical contact portion is disposed on the first surface of the first substrate and electrically connected to the signal line, the electrical contact portion having elasticity to bend when the electrical contact portion contacts the object to be inspected; and a connection portion electrically connected to the second surface of the first substrate and having a microstrip line structure including a first conductive layer serving as a transmission line, a second conductive layer serving as a connection wire, and being disposed at the first conduction a dielectric layer between the layer and the second conductive layer.

According to some example embodiments of the invention, the first substrate may comprise a ceramic material or glass.

According to some example embodiments of the present invention, the electrical connection portion may be electrically connected to a coplanar waveguide (CPW) structure disposed on the second surface of the first substrate and including wave conduction Route and ground wire.

According to some example embodiments of the present invention, a CPW structure including a waveguide circuit line and a ground line may be disposed on a first surface of the first substrate, and the electrical contact portion may be electrically connected to the signal line by the waveguide circuit line.

According to some example embodiments of the present invention, the electrical contact may include: a bump disposed on the first surface of the first substrate; extending from the bump and having a bullet a beam; and a tip disposed at an end of the beam to contact the object.

According to some example embodiments of the invention, the electrical connection may comprise a flexible cable or a flexible printed circuit board (FPCB).

According to some example embodiments of the present invention, the apparatus may further include a second substrate electrically connected to the second surface of the first substrate by the electrical connection.

According to some example embodiments of the invention, the object may be an RFIC device, an active component, or a passive component.

An apparatus for performing an electronic inspection according to another aspect of the present invention may include: a first substrate having a first surface and a second surface opposite to the first surface and disposed in the first substrate to electrically connect the first surface and the second a signal line of the surface; the electrical contact portion is disposed on the first surface of the first substrate and electrically connected to the signal line, the electrical contact portion having elasticity to bend when the electrical contact portion contacts the object to be inspected; a substrate having a through hole to receive the first substrate; and an electrical connection portion electrically connecting the second surface of the first substrate and the second substrate.

According to some example embodiments of the invention, the first substrate may comprise a ceramic material or glass. The electrical contact may include: a bump disposed on the first surface of the first substrate; a beam extending from the bump and having elasticity; and a tip disposed at an end of the beam to contact the object. The electrical connection can include a flexible cable or FPCB.

According to some example embodiments of the present invention, the first substrate may be received in the through hole of the second substrate to allow the electrical contact to protrude from the surface of the second substrate.

According to some example embodiments of the invention, the device may further comprise a support a support portion is disposed through the through hole of the second substrate and connected to the second surface of the first substrate to support the first substrate; the cover includes a plate-shaped central portion and an annular edge portion, the annular edge portion being from the center A portion extends toward the second substrate to partially receive the support portion; and a plurality of fasteners for mounting the cover on the second substrate.

According to some example embodiments of the present invention, the apparatus may further include an elastic member disposed between the edge portion of the cover and the second substrate and coupled to the support member to elastically support the support portion.

According to some example embodiments of the present invention, the apparatus may further include a plurality of level adjustment members extending through the cover and pressing the support portion to adjust the levelness of the first substrate.

According to some example embodiments of the invention, the object may be an RFIC device, an active component, or a passive component.

According to some example embodiments of the invention, the electrical connection is removably coupled to the second substrate.

According to some example embodiments of the present invention, the electrical connection portion may have a microwire strip structure including a first conductive layer serving as a transmission line, a second conductive layer serving as a ground line, and being disposed in the first a dielectric layer between the conductive layer and the second conductive layer. Moreover, the electrical connection can be electrically connected to the CPW structure, the CPW structure being disposed on the second surface of the first substrate and including the waveguide circuit line and the ground line.

According to some example embodiments of the present invention, a CPW structure including a waveguide circuit line and a ground line may be disposed on a first surface of the first substrate, and the electrical contact portion may be electrically connected to the signal line by the waveguide circuit line.

According to an example embodiment of the present invention, as described above, an electronic inspection apparatus that performs an electronic inspection process on a discrete device such as an RFIC device may include an electrical contact that contacts an object to be inspected, and has an electrical contact with the electrical contact. a first substrate of the first surface. The size of the first substrate can vary depending on the size of the discrete devices, thereby coping with various discrete devices.

Moreover, the electronic inspection apparatus may further include a second substrate electrically connected to the first substrate. The first substrate can be electrically connected to the second substrate by an electrical connection. The electrical connection portion may have a microwire strap structure, and the CPW structure may be disposed on the second surface of the first substrate and may be electrically connected to the electrical connection portion. Therefore, the transmission efficiency of the high frequency signal can be improved.

Various example embodiments are described more fully hereinafter with reference to the drawings, in which certain example embodiments are illustrated. However, the invention may be embodied in different forms and should not be construed as limited to the example embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity.

It is understood that when an element or layer is referred to as "on" or "connected" to another element or layer, it may be directly on another element or layer or directly connected to another element. Or a layer, or an intervening element or layer. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers. Throughout the text, similar component symbols indicate similar components. The term "and/or" as used herein includes one of the associated listed items or Any and all combinations of multiples.

It will be appreciated that, although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers and/or portions, such elements, components, regions, and layers And/or parts are not to be limited by these terms. The terms are used to distinguish one element, component, region, layer, Thus, a first element, component, region, layer, or section, which is discussed below, may be referred to as a second element, component, region, layer or section.

For the convenience of description, spatially relative terms such as "lower" and "upper" may be used to describe the relationship of one element or feature illustrated in the drawings to the other element or feature. It will be appreciated that spatially relative terms will encompass different orientations of the device in use or in operation in addition to the orientation depicted in the drawings. For example, elements in the "following" or "bottom" of the other elements or features are to be "above" the other elements or features. Therefore, the example term "below" can encompass both orientations above and below. The device may be oriented (rotated 90 degrees or at other orientations) in other ways and the spatially relative descriptors used are interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and Unless the context clearly dictates otherwise, the singular forms "a", "an", "the" and "the" are intended to include the plural, and the terms "include" and / or "include". When used in this specification, the stated features, integers, steps, operations, components and/or components are recited, but one or more others are not excluded. The presence or addition of features, integers, steps, operations, components, components, and/or groups thereof.

Unless otherwise defined, all terms (including technical terms) used herein have the same meaning as commonly understood by those skilled in the art. It should also be understood that terms, such as those defined in commonly used dictionaries, should be understood as having a meaning consistent with their meaning in the relevant technical context and should not be construed as having an ideal unless clearly defined herein. Or too formal meaning.

Example embodiments are described with reference to cross-sectional illustrations of schematic illustrations of the idealized embodiments (and intermediate structures thereof). Accordingly, it is contemplated that there may be differences from the illustrated shapes due to, for example, manufacturing techniques and/or tolerances. Thus, the example embodiments should not be construed as limiting the particular shapes of the embodiments described herein, but rather, including, for example, variations in the. The regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of the regions of the device and are not intended to limit the scope of the invention.

1 is a schematic view illustrating an apparatus for performing an electronic inspection according to an exemplary embodiment of the present invention, FIG. 2 is a schematic view illustrating an electrical contact portion of the electronic inspection apparatus illustrated in FIG. 1, and FIG. 3 is a view illustrating the electrical contact illustrated in FIG. A schematic view of a portion in contact with an object to be inspected, and FIG. 4 is a schematic view illustrating an electrical connection portion connected to a second surface of the first substrate shown in FIG. 1.

Referring to FIGS. 1 and 2, the apparatus 100 for performing an electronic inspection may include a first substrate 11, an electrical contact 13, an electrical connection 15, a second substrate 17, and the like.

In particular, the first substrate 11 may be formed of a solid material to facilitate its manufacture. Made. For example, the solid material that can be used for the first substrate 11 can include ceramic materials, glass, and the like. These solid materials can be used singly or in combination.

The signal line 11c can be disposed in the first substrate 11 to transmit an electronic signal. In particular, the first substrate 11 may have a first surface 11a and a second surface 11b opposite to the first surface 11a, and the signal line 11c may be disposed in the first substrate 11 to connect the first surface 11a and the second surface 11b .

As described above, since the first substrate 11 is made of a solid material, and the signal line 11c is disposed in the first substrate 11 for electrical connection between the first surface 11a and the second surface 11b, the first substrate 11 It can be equivalent to a micro-probe head (MPH) or a space transformer of a conventional probe card. However, according to some example embodiments of the present invention, the first substrate 11c of the electronic inspection apparatus 100 may have an electronic device suitable for performing on a discrete device such as a radio frequency integrated circuit (RFIC) device, an active device, a passive device, or the like. Check the size of the process. Therefore, the first substrate 11c can be distinguished from the space transformer of the MPH or the conventional probe card.

As shown in FIG. 2, the electrical contact portion 13 may be disposed on the first surface 11a of the first substrate 11 to be in contact with the article 300 to be inspected. In particular, the electrical contact portion 13 can be electrically connected to the signal line 11c in the first substrate 11. According to some example embodiments of the present invention, a plurality of electrical contacts 13 may be disposed on the first surface 11a of the first substrate 11, and a plurality of signal lines 11c electrically connected to the electrical contacts 13 may be disposed on the first substrate. 11 inside.

Moreover, the electrical contacts 13 can be configured to flex when in contact with the article 300, as shown in FIG. In particular, when the electrical contact 13 and the object are made When the pad 300a of 300 is in contact to perform an electronic inspection process on the article 300, the electrical contact portion 13 is required to have elasticity to be bent. For example, the electrical contact portion 13 can have a cantilever structure to become curved when the electrical contact portion 13 is brought into contact with the pad 300a of the article 300.

Meanwhile, in the case where the electrical contact portion 13 is formed of a solid material, in the same manner as the first substrate 11, the electrical contact portion 13 and the pad 300a of the article 300 may be due to the pad 300a at which the electrical contact portion 13 and the article 300 are made The force applied to the electrical contact 13 or the object 300 upon contact is damaged. However, according to certain example embodiments of the present invention, the force applied to the electrical contact 13 or the article 300 may be elastically absorbed by the electrical contact 13, thereby preventing damage to the electrical contact 13 and the pad 300a of the article 300. Moreover, the electrical contact portion 13 can be sufficiently brought into contact with the pad 300a of the article 300, so that the reliability of the electronic inspection process must be improved.

For example, the electrical contact portion 13 can include a bump 13a, a beam 13b, and a tip end 13c. The bump 13a may be disposed on the first surface 11a of the first substrate 11 to connect the beam 13b to the first substrate 11. The beam 13b may be coupled to the bump 13a and may extend in a direction parallel to the first surface 11a of the first substrate 11. The tip end 13c may be coupled to the end of the beam 13b and may also be disposed at an end of the tip end 13c in a direction perpendicular to the first surface 11a of the first substrate. In particular, the tip 13c can be disposed toward the article 300 such that the tip 13c can be in direct contact with the pad 300a of the article 300. Moreover, the beam 13b may have elasticity to become curved when the tip 13c is brought into contact with the pad 300a of the article 300. Here, the bump 13a can function as an element that electrically connects the beam 13b to the first substrate 11.

In the name "Cantilever type probe and method of An example of a cantilever-type electrical contact portion 13 including a bump 13a, a beam 13b and a tip end 13c is disclosed in Korean Patent No. 664,443, the entire disclosure of which is hereby incorporated by December 27, 2006. Therefore, a further detailed description of the manufacturing method of the cantilever type electric contact portion 13 including the bump 13a, the beam 13b, and the tip end 13c will be omitted.

The electrical connection portion 15 may be disposed on the second surface 11b of the first substrate 11. In particular, the electrical connection portion 15 can be disposed on the second surface 11b of the first substrate to be electrically connected to the signal line 11c disposed in the first substrate 11. According to some example embodiments of the present invention, the plurality of electrical connections 15 may be disposed on the second surface 11b of the first substrate and may be electrically connected to the plurality of signal lines 11c disposed in the first substrate 11.

The electrical connection portion 15 can be provided to transmit an electronic signal, and the electronic signal is transmitted from the electrical contact portion 13 to the outside via the first substrate 11, for example, to the second substrate 17. That is, the electrical connection portion 15 can electrically connect the first substrate 11 and the second substrate 17.

The electrical connection portion 15 may be formed of a flexible material to facilitate electrical connection between the first substrate 11 and the second substrate 17. Examples of electrical connections 15 may include flexible cables, flexible printed circuit boards (FPCBs), and the like, in accordance with certain example embodiments of the invention.

According to some example embodiments of the present invention as described above, the electronic inspection apparatus 100 may include: a first substrate 11 formed of a solid material, wherein the signal line 11c is disposed in the first substrate 11; the electrical contact portion 13 is disposed On the first surface 11a of the first substrate 11 and having elasticity to be in contact with the object 300 The pad 300a is time-varved when in contact; and the electrical connection portion 15 is formed of a flexible material and disposed on the second surface 11b of the first substrate 11. Here, the electrical connection portion 15 is detachably connected to the first substrate 17. For example, a socket (not shown) may be disposed on the second substrate 17, and a plug (not shown) may be coupled to the end of the electrical connection portion 15. That is, the electrical connection portion 15 can be detachably coupled to the second substrate 17 by a socket and a plug.

According to an embodiment of the present invention, a plurality of first substrates 11 and a plurality of electrical contacts 13 may be prepared to cope with various discrete devices, and the first substrate 11 and the electrical contacts 13 are selectively connected to the second substrate 17, whereby Easily perform electronic inspection processes on a variety of discrete devices.

According to some example embodiments of the present invention, the second substrate 17 may have a through hole to receive the first substrate 11 having the first surface 11a connected to the electrical contact portion 13. That is, the first substrate 11 having the first surface 11a connected to the electrical contact portion 13 may be disposed in the through hole of the second substrate 17, and the electrical connection portion 15 may electrically connect the first substrate 11 and the second substrate 17. Here, the electrical connection portion 15 is detachably connected to the second substrate 17. In particular, the size of the first substrate 11 can be varied to cope with discrete devices, and thus the electrical connections 15 are required to be formed of a flexible material. Meanwhile, the second substrate 17 may be a printed circuit board (PCB).

As described above, although the second substrate 17 has a through hole to receive the first substrate 11, the scope of the present invention is not limited by the through hole of the second substrate 17. That is, the configuration in which the first substrate 11 and the second substrate 17 are electrically connected using the electrical connection portion 15 can be changed according to the shape of the discrete device.

Meanwhile, the first substrate 11 received in the through hole of the second substrate 17 may protrude from the second substrate 17 to allow the electrical contact portion 13 and the pad of the object 300 300a contact. That is, as shown in FIG. 1, the first substrate 11 may be disposed in the through hole of the second substrate 17 to allow the electrical contact portion 13 to be spaced apart from the object substrate 300 and the second substrate 17.

According to some example embodiments of the present invention, the electronic inspection apparatus 100 may include a support portion 19 to support the first substrate 11. Moreover, the support portion 19 may be provided to mount the first substrate 11 on the second substrate 17 and protect the first substrate 11. The support portion 19 is connectable to the second surface 11b of the first substrate 11. For example, the support portion 19 may be connected to the remaining portion of the second surface 11b of the first substrate 11 except for the edge portion, and the electrical connection portion 15 may be connected to the edge portion of the second surface 11b of the first substrate 11.

In particular, as shown in FIG. 1, the support portion 19 may include a first support member 19a that is connected to the remaining portion of the second surface 11b of the first substrate 11 except for the edge portion. Here, each of the first support members 19a may be cylindrical. Moreover, the support portion 19 may further include a third support member 19c connected to the second substrate 17 and a second support member 19b connecting the first support member 19a and the third support member 19c. However, according to another example embodiment of the present invention, the support portion 19 may include a first support member.

According to some example embodiments of the present invention, the electronic inspection apparatus 100 may include a cover 21 mounted to the second substrate 17. The cover 21 can be configured to partially receive the support portion 19. For example, as shown in FIG. 1, the cover 21 may include a plate-like central portion 21a disposed on the third support member 19c of the support portion 19 and an annular edge portion 21b extending from the central portion 21a toward the second substrate 21a. Here, the edge portion 21b of the cover 21 may be disposed in the second The substrate 17 is surrounded by a through hole surrounding the second substrate 17 and can be mounted on the second substrate 17 by a plurality of fasteners 23, and the fastener 23 is drilled into the second substrate 17 through the edge portion 21b of the cover 21. Alternatively, the fastener 23 may be drilled through the second substrate 17 into the edge portion 21b of the cover 21. Moreover, a plurality of bolts and a plurality of nuts may be used as the fasteners 23 for mounting the cover 21 on the second substrate 17.

In particular, as shown in FIG. 1, the third support member 19c of the support portion 19 may be disposed in the cover 21, and the second support member 19b of the support portion 19 may extend through the through hole of the second substrate 17. Here, the third support member 19c of the support portion 19 may have a width larger than the width of the through hole of the second substrate 17, and the third support 19c of the support portion 19 may be stably fixed to the second substrate 17 and the cover 21 Between the spaces.

According to some example embodiments of the present invention, the electronic inspection apparatus 100 may further include a level adjustment member 25 to adjust the levelness or flatness of the first substrate 11. The level adjustment member 25 may be provided to bring the electrical contact portion 13 into full contact with the pad 300a of the article 300.

In particular, the level adjustment member 25 may extend through the central portion 21a of the cover and may press the support portion 19 to adjust the levelness of the first substrate 11. For example, a plurality of threaded holes may be formed through the central portion 21a of the cover 21, and a plurality of leveling members 25 may be screwed into the threaded holes. Specifically, as shown in FIG. 1, the level adjustment member 25 may protrude toward the third support member 19c of the support portion 19 and may press the third support member 19c of the support portion 19 to adjust the levelness of the first substrate 11. . Moreover, a plurality of recesses may be formed in the third portion of the support portion 19 opposite to the central portion 21a of the cover 21. The surface portion of the support member 19c, and the level adjustment member 25 can be inserted in the recess. According to some example embodiments of the present invention, a plurality of fixing screws may be used as the leveling adjustment member 25.

According to some example embodiments of the present invention, the electronic inspection apparatus 100 may further include an elastic member 27 disposed between the second substrate 17 and the edge portion 21b of the cover 21 to elastically support the support portion 19. The elastic member 17 may be a ring plate formed of an elastic material and may be disposed between the second substrate 17 and the edge portion 21b of the cover 21 to allow the second support member 19b of the support portion 19 to extend through the through hole of the elastic member 27. At the same time, the third support member 19c of the support portion 19 may be connected to the second substrate 17 via the elastic member 27.

The third support member 19c of the support portion 19 may be disposed between the central portion 21a of the cover 21 and the elastic member 27 and may be elastically supported by the elastic member 27. As a result, the third support member 19c of the support portion 19 can be fixed by the level adjustment member 25 and the elastic member 27. Specifically, the second support member 19b of the support portion 19 may be coupled to a central portion of the lower surface of the third support member 19c, and the elastic member 27 may elastically support the edge portion of the lower surface of the third support member 19c. Here, the edge portion of the lower surface of the third support member 19c may be beveled to allow the elastic member 27 to elastically support the support portion 19. Moreover, the second support member 19b of the support portion 19 can extend downward through the through hole of the second substrate 17 and the through hole of the elastic member 27.

As described above, the third supporting member 19c of the support portion 19 can be elastically supported by the elastic member 27, and the level of the first substrate 11 can be easily adjusted by the level adjusting member 25.

As shown in FIG. 1, although an annular elastic member 27 having a through hole is employed, However, a plurality of elastic members may be employed to elastically support the third support member 19c of the support portion 19. For example, a plurality of leaf springs may be disposed between the second substrate 17 and the edge portion 21b of the cover 21 and may extend toward a central axis of the through hole of the second substrate 17 to elastically support the third support of the support portion 19 Member 19c.

According to some example embodiments of the present invention as described above, the electronic inspection apparatus 100 may include: a first substrate 11 formed of a solid material, wherein the signal line 11c is disposed in the first substrate 11; the electrical contact portion 13 is disposed On the first surface 11a of the first substrate 11 and having elasticity to become curved when the electrical contact portion 13 is brought into contact with the pad 300a of the object 300; the electrical connection portion 15 is formed of a flexible material and disposed on the first substrate a second surface 11b of 11; a support portion 19 for supporting the first substrate 11, a cover 21 for mounting the support portion 19 on the second substrate 17, and an elastic member 27 disposed on the second substrate 17 and the cover 21 The support portion 19 is elastically supported therebetween; and the level adjustment member 25 is disposed through the cover 21 to apply pressure to the support portion 29 to adjust the levelness of the first substrate 11. As described above, the degree of horizontality of the first substrate 11 can be adjusted by the level adjustment member 25 and the elastic member 27 to improve the reliability of the electronic inspection apparatus.

Referring to FIG. 4, the electrical connection portion 15 may have a microstrip line structure. In particular, the electrical connection portion 15 may include a first conductive layer 15b serving as a transmission line, a second conductive layer 15c serving as a ground line, and a dielectric disposed between the first conductive layer 15b and the second conductive layer 15c. Layer 15a. A coplanar waveguide (CPW) structure may be disposed on the second surface 11b of the first substrate 11 and may be electrically connected to the electrical connection portion 15. The CPW structure may include a waveguide circuit line 41 and a ground line 43.

According to another example embodiment of the present invention, although not shown in the drawings, the first CPW structure including the first waveguide circuit line and the first ground line may be disposed on the first surface 11a of the first substrate 11, and A second CPW structure including the second waveguide circuit line and the second ground line may be disposed on the second surface 11b of the first substrate 11. The first waveguide circuit line can electrically connect the electrical contact portion 13 and the signal line 11c, and the second waveguide circuit line can electrically connect the signal line 11c and the second substrate 17 via the first conductive layer 15b of the electrical connection portion 15. The first ground line may be electrically connected to the second ground line by a via wiring formed through the first substrate 11, and the second ground line may be electrically connected to the second conductive layer 15c of the electrical connection portion 15. .

As described above, when the microstrip line type electrical connection portion 15 and the CPW structure are used on the second surface 11b of the first substrate, the first conductive layer 15b serving as a transmission line can be electrically connected to the waveguide circuit line 41 of the CPW structure, And the second conductive layer 15c serving as a ground line can be electrically connected to the ground line 43 of the CPW structure. In particular, the ground line 43 electrically connected to the second conductive layer 15c may be electrically connected to the via wiring formed through the first substrate 11. At the same time, the electrical connection portion 15 can be electrically connected to the CPW structure disposed on the second surface 11b of the first substrate 11 by a solder bonding process.

As described above, when the electrical connection portion 15 has a microstrip line structure, the width of the first conductive layer 15b serving as the transmission line and the height between the first conductive layer 15b and the second conductive layer 15c may be high depending on the to-be-transmitted The frequency of the frequency signal changes. Moreover, when the CPW structure is disposed on the second surface 11b of the first substrate 11, the width of the waveguide circuit line 41 and the gap between the waveguide circuit line 41 and the ground line 43 can change the frequency of the high frequency signal. As a result, the height can be improved Frequency transmission efficiency.

According to some example embodiments of the present invention as described above, an electronic inspection apparatus for performing an electronic inspection process on discrete devices such as RFIC devices may include electrical contacts that are in contact with an object to be inspected, having electrical contact a first substrate connected to the first surface, and a second substrate electrically connected to the first substrate. The size of the first substrate can be varied depending on the size of the discrete devices to cope with various discrete devices.

Moreover, the electrical connection portion for electrically connecting the first substrate and the second substrate may have a microstrip line structure, and the CPW structure may be disposed on the second surface of the first substrate and connectable to the electrical connection portion. Therefore, the transmission efficiency of the high frequency signal can be improved.

As a result, when the electronic inspection process is performed using the electronic inspection apparatus, the reliability of the electronic inspection process can be remarkably improved.

The foregoing examples are illustrative of certain embodiments and are not to be considered as limiting. Although a few example embodiments have been described, it will be apparent to those skilled in the art that many modifications may be made to the example embodiments without departing from the novel teachings and advantages of the invention. Accordingly, all such modifications are intended to be included within the scope of the invention as defined by the appended claims.

11‧‧‧First substrate

11a‧‧‧ first surface

11b‧‧‧ second surface

11c‧‧‧ signal line

13‧‧‧Electrical contact

13a‧‧‧Bumps

13b‧‧‧Liang

13c‧‧‧ cutting edge

15‧‧‧Electrical connection

15a‧‧‧Dielectric layer

15b‧‧‧First Conductive Layer

15c‧‧‧second conductive layer

17‧‧‧second substrate

19‧‧‧Support

19a‧‧‧First support member

19b‧‧‧Second support member

19c‧‧‧ Third support member

21‧‧‧ cover

21a‧‧‧ plate-shaped central part

21b‧‧‧ring edge section

23‧‧‧fasteners

25‧‧‧Level adjustment component

27‧‧‧Flexible components

41‧‧‧Wave circuit line

43‧‧‧ Grounding wire

100‧‧‧Electronic inspection device

300‧‧‧Items to be inspected

300a‧‧‧ pads

Example embodiments of the present invention, as well as the following detailed description,

1 is a schematic diagram illustrating an apparatus for performing an electronic inspection in accordance with an example embodiment of the present invention.

FIG. 2 is a view for explaining an electrical contact portion of the electronic inspection device shown in FIG. 1. intention.

Fig. 3 is a schematic view showing a state in which the electrical contact portion shown in Fig. 1 is in contact with an object to be inspected.

4 is a schematic view illustrating an electrical connection portion connected to a second surface of the first substrate illustrated in FIG. 1.

11‧‧‧First substrate

13‧‧‧Electrical contact

15‧‧‧Electrical connection

17‧‧‧second substrate

19‧‧‧Support

19a‧‧‧First support member

19b‧‧‧Second support member

19c‧‧‧ Third support member

21‧‧‧ cover

21a‧‧‧ plate-shaped central part

21b‧‧‧ring edge section

23‧‧‧fasteners

25‧‧‧Level adjustment component

27‧‧‧Flexible components

100‧‧‧Electronic inspection device

Claims (14)

An apparatus for performing an electronic inspection, comprising: a first substrate having a first surface and a second surface opposite to the first surface; and disposed in the first substrate to electrically connect the first surface and the first a signal line of the two surfaces; an electrical contact portion disposed on the first surface of the first substrate and electrically connected to the signal line, the electrical contact portion having elasticity to allow the electrical contact portion to be The inspected article is bent when contacted; and the electrical connection portion is electrically connected to the second surface of the first substrate and has a microstrip line structure including a first conductive layer serving as a transmission line, a second conductive layer serving as a ground line and a dielectric layer disposed between the first conductive layer and the second conductive layer; wherein the electrical connection portion is electrically connected to the coplanar waveguide structure, the coplanar waveguide structure And disposed on the second surface of the first substrate and including a waveguide circuit line and a ground line. The apparatus for performing an electronic inspection as described in claim 1, wherein the first substrate comprises a ceramic material or glass. The apparatus for performing an electronic inspection according to claim 1, wherein the electrical contact portion includes: a bump disposed on the first surface of the first substrate; a beam extending from the bump And having elasticity; and a tip disposed at an end of the beam to contact the article. The apparatus for performing an electronic inspection as described in claim 1, wherein the electrical connection portion comprises a flexible cable or a flexible printed circuit board. The apparatus for performing an electronic inspection according to claim 1, further comprising a second substrate electrically connected to the second surface of the first substrate by the electrical connection portion. The apparatus for performing an electronic inspection as described in claim 1, wherein the object is a radio frequency integrated circuit device, an active element, or a passive element. An apparatus for performing an electronic inspection, comprising: a first substrate having a first surface and a second surface opposite to the first surface; and disposed in the first substrate to electrically connect the first surface and the first a signal line of the two surfaces; an electrical contact portion disposed on the first surface of the first substrate and electrically connected to the signal line, the electrical contact portion having elasticity to be in the electrical contact portion and to be inspected The object is bent when contacted; the second substrate has a through hole to receive the first substrate; the electrical connection portion is for electrically connecting the second surface of the first substrate and the second substrate; wherein The electrical connection portion is electrically coupled to the coplanar waveguide structure disposed on the second surface of the first substrate and including a waveguide circuit line and a ground line. The apparatus for performing an electronic inspection according to claim 7, wherein the first substrate comprises a ceramic material or glass; and the electrical contact portion comprises a protrusion disposed on the first surface of the first substrate. a block, a beam extending from the bump and having elasticity, and a placement a tip at the end of the beam in contact with the article; and the electrical connection comprises a flexible cable or a flexible printed circuit board. The apparatus for performing an electronic inspection according to claim 7, wherein the first substrate is received in the through hole of the second substrate to allow the electrical contact to be from a surface of the second substrate protruding. The apparatus for performing an electronic inspection according to claim 7, further comprising: a support portion disposed through the through hole of the second substrate and connected to the second surface of the first substrate Supporting the first substrate; a cover including a plate-shaped central portion and an annular edge portion extending from the central portion toward the second substrate to partially receive the support portion; and a plurality of a fastener for mounting the cover on the second substrate. The apparatus for performing an electronic inspection according to claim 10, further comprising an elastic member disposed between the edge portion of the cover and the second substrate and connected to the support portion The support portion is elastically supported. The apparatus for performing an electronic inspection according to claim 11, further comprising a plurality of level adjustment members extending through the cover and applying pressure to the support portion to adjust the first The level of the level of a substrate. The apparatus for performing an electronic inspection as described in claim 7, wherein the object is a radio frequency integrated circuit device, an active element, or a passive element. The apparatus for performing an electronic inspection according to claim 7, wherein the electrical connection portion has a microstrip line structure including a first conductive layer serving as a transmission line and a grounding wire a second conductive layer and a dielectric layer disposed between the first conductive layer and the second conductive layer.