TWI380864B - A method and a cutting tool for forming small holes - Google Patents

A method and a cutting tool for forming small holes Download PDF

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Publication number
TWI380864B
TWI380864B TW98144999A TW98144999A TWI380864B TW I380864 B TWI380864 B TW I380864B TW 98144999 A TW98144999 A TW 98144999A TW 98144999 A TW98144999 A TW 98144999A TW I380864 B TWI380864 B TW I380864B
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processing
glass
glass substrate
tool
housing
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TW98144999A
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Chinese (zh)
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TW201121677A (en
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Dong Yea Sheu
Chung Chieh Cheng
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Univ Nat Taipei Technology
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玻璃細孔加工方法及其刀具Glass hole processing method and tool thereof

本發明係關於一種加工的方法與其加工之刀具,更特別的是一種在玻璃基板上形成出孔的一玻璃細孔加工方法及其刀具,且所提供之玻璃細孔加工所需之刀具係具有伸縮性。The present invention relates to a processing method and a tool for processing the same, and more particularly to a glass hole processing method and a tool for forming a hole in a glass substrate, and the tool for the glass hole processing provided has Scalability.

習知技術中,如第1圖所示,係為傳統的一鑽石刀具1示意圖,其係對一玻璃基板2進行出孔的研磨與切削加工,當該鑽石刀具1接觸到該玻璃基板2時,該鑽石刀具1係透過該玻璃基板2回饋一軸向壓力,然而,從習知技術中可以了解到,該軸向壓力係為一固定值,且出孔的品質與碎屑的數量係與該軸向壓力有關,故當該軸項壓力以相同的作用力持續地進行出孔加工時,會因該玻璃基板之該出孔加工處的工件強度無法支撐出孔加工所施加的力量,而造成出孔處邊緣破裂損毀,進而導致除了出孔的碎屑數量增加外,亦會在出孔處形成品質上的缺陷。In the prior art, as shown in FIG. 1 , it is a schematic view of a conventional diamond cutter 1 which performs grinding and cutting processing on a glass substrate 2 when the diamond cutter 1 contacts the glass substrate 2 . The diamond cutter 1 feeds back an axial pressure through the glass substrate 2. However, it is known from the prior art that the axial pressure is a fixed value, and the quality of the exit hole and the number of debris are The axial pressure is related, so when the shaft item pressure is continuously performed by the same force, the strength of the workpiece at the hole processing of the glass substrate cannot support the force applied by the hole processing. The edge of the hole is broken and damaged, which leads to the formation of quality defects at the exit hole in addition to the increase in the amount of debris in the hole.

本發明之一目的在於提出一種玻璃細孔加工的刀具,係於一玻璃基板上進行研磨與切削的加工,用以形成一出孔,且可有效降低於出孔加工過程中所產生與該出孔邊緣有關之碎屑的數量,並且同時可用以改善其出孔的品質。An object of the present invention is to provide a tool for processing glass pores, which is processed by grinding and cutting on a glass substrate to form an exit hole, and can effectively reduce the occurrence and the outflow during the hole processing. The amount of debris associated with the edge of the hole, and at the same time can be used to improve the quality of its exit hole.

本發明之另一目的在於提出一種玻璃細孔加工的方法,用於一玻璃基板的出孔加工,其係提供一彈性體吸收一鑽石刀作用於一玻璃基板時所產生一軸向壓力,用以改善出孔加工的品質。Another object of the present invention is to provide a method for processing glass pores for the hole processing of a glass substrate, which provides an elastic body to absorb an axial pressure generated when a diamond knife acts on a glass substrate. To improve the quality of the hole processing.

為達上述目的及其它目的,本發明提出一種玻璃細孔加工的刀具,係用於一玻璃基板的出孔加工,且該玻璃細孔加工的刀具作用於該玻璃基板時具有伸縮性,其包含一殼體、一加工部、一彈性體與一延伸部。一殼體係提供一容置部;一加工部係具有凸出於該殼體之一鑽石刀,用以對該玻璃基板進行研磨與切削,而該加工部於該玻璃基板產生對應的一軸向壓力;一彈性體係設置於該容置部,並且根據該軸向壓力對應地產生一伸縮彈力;以及一延伸部係結合該加工部與該彈性體於該容置部,並且透過該延伸部使得該彈性體產生之該伸縮彈力吸收調整該加工部於該玻璃基板所產生之該軸向壓力。In order to achieve the above and other objects, the present invention provides a tool for processing glass pores for use in a hole-finishing process of a glass substrate, and the tool for processing the glass-holes has flexibility when acting on the glass substrate, and includes A housing, a processing portion, an elastomer and an extension. a housing is provided with a receiving portion; a processing portion has a diamond knife protruding from the housing for grinding and cutting the glass substrate, and the processing portion generates a corresponding axial direction on the glass substrate a resilient system is disposed in the accommodating portion, and correspondingly generates a telescopic elastic force according to the axial pressure; and an extension portion is coupled to the processing portion and the elastic body at the accommodating portion, and is transmitted through the extending portion The elastic elastic force generated by the elastic body adjusts the axial pressure generated by the processing portion on the glass substrate.

為達上述目的及其它目的,本發明提出一種玻璃細孔加工的方法,係用於一玻璃基板的出孔加工,其步驟包含:(i)提供具有一容置部之一殼體;(ii)提供具有凸出於該殼體之一鑽石刀,當該鑽石刀作用於該玻璃基板時產生對應的一軸向壓力;(iii)設置一彈性體於該容置部,且該彈性體提供對應該軸向壓力的一伸縮彈力;以及(iv)結合該鑽石刀與該彈性體於該容置部中,並且透過該延伸部使得該彈性體之該伸縮彈力吸收調整該軸向壓力。In order to achieve the above and other objects, the present invention provides a method for processing glass pores for use in a hole processing of a glass substrate, the steps comprising: (i) providing a housing having a receiving portion; (ii) Providing a diamond knife having a protrusion protruding from the housing, and generating a corresponding axial pressure when the diamond knife acts on the glass substrate; (iii) providing an elastic body to the receiving portion, and the elastic body provides a telescopic elastic force corresponding to the axial pressure; and (iv) combining the diamond blade and the elastic body in the accommodating portion, and transmitting the elastic force of the elastic body to adjust the axial pressure through the extending portion.

與習知技術相較,本發明之玻璃細孔加工方法及其刀具係可用以有效解決玻璃基板進行出孔加工時,由於玻璃基板之強度無法支撐刀具研磨與切削的力量,所造成的玻璃基板破裂現象,本發明除了可用以改善出孔加工的品質外,亦可有效降低於加工過程中所產生與出孔處有關之碎屑的數量。Compared with the prior art, the glass pore processing method and the cutter of the present invention can be used to effectively solve the problem that the glass substrate is subjected to the hole punching process, and the glass substrate is not supported by the strength of the glass substrate due to the strength of the glass substrate. In addition to the rupture phenomenon, the present invention can be used to improve the quality of the boring process, and can also effectively reduce the amount of debris generated during the processing and the hole.

為充分瞭解本發明之目的、特徵及功效,茲藉由下述具體之實施例,並配合所附之圖式,對本發明做一詳細說明,說明如後:參考第2圖,係本發明於一實施例中之玻璃細孔加工刀具之示意圖。於本實施例中係提供一玻璃細孔加工的刀具10,其係用於一玻璃基板2的出孔加工,亦即在該玻璃基板2上以加工的工法,進行如研磨與切削的動作,用以形成一出孔3,如第5圖所示,較佳地,該玻璃細孔加工刀具作用於該玻璃基板2時具有伸縮性。該玻璃細孔加工刀具10係包含一殼體12、一加工部14、一彈性體16與一延伸部18。其中,該殼體12係提供一容置部122;該加工部14係提供具有凸出於該殼體12之一鑽石刀142,以垂直於該玻璃基板2的方向y1進行研磨與切削,而該加工部14於該玻璃基板2產生對應的一軸向壓力,且該軸向壓力係根據研磨與切削的行進方向y1而以方向y2回饋至該加工部14,並且使得該加工部14朝向該容置部122的方向內縮,其中該鑽石刀142係可為一內凹圓弧、一平面放電或一單切刃的刀具,較佳地,該鑽石刀142係為內凹圓弧的結構;該彈性體16係設置於該容置部122,且提供對應該軸向壓力的一伸縮彈力,且該伸縮彈力係以方向y3吸收/調整該軸向壓力,其中該彈性體16係可為一彈簧或一彈片,於此係以彈簧為例進行說明;該延伸部18係結合該加工部14與該彈性體16於該容置部122,並且透過該延伸部18,使得該彈性體12之該伸縮彈力吸收/調整該軸向壓力。In order to fully understand the object, features and advantages of the present invention, the present invention will be described in detail by the following specific embodiments and the accompanying drawings, which are illustrated as follows: A schematic view of a glass hole machining tool in an embodiment. In the present embodiment, a glass-hole machining tool 10 is provided for performing the hole-cutting process of a glass substrate 2, that is, performing the operations such as grinding and cutting on the glass substrate 2 by a processing method. For forming an exit hole 3, as shown in FIG. 5, preferably, the glass hole machining tool has elasticity when acting on the glass substrate 2. The glass hole machining tool 10 includes a housing 12, a processing portion 14, an elastic body 16, and an extension portion 18. The housing 12 is provided with a receiving portion 122; the processing portion 14 is provided with a diamond knife 142 protruding from the housing 12 for grinding and cutting in a direction y1 perpendicular to the glass substrate 2, and The processing portion 14 generates a corresponding axial pressure on the glass substrate 2, and the axial pressure is fed back to the processing portion 14 in the direction y2 according to the traveling direction y1 of the grinding and cutting, and the processing portion 14 faces the processing portion 14 The direction of the receiving portion 122 is retracted, wherein the diamond knife 142 can be a concave arc, a planar discharge or a single cutting edge cutter. Preferably, the diamond cutter 142 is a concave arc structure. The elastic body 16 is disposed on the accommodating portion 122 and provides a telescopic elastic force corresponding to the axial pressure, and the elastic elastic force absorbs/adjusts the axial pressure in the direction y3, wherein the elastic body 16 can be A spring or a spring piece is exemplified by a spring; the extending portion 18 is coupled to the processing portion 14 and the elastic body 16 at the receiving portion 122, and is transmitted through the extending portion 18 such that the elastic body 12 The telescopic spring force absorbs/adjusts the axial pressure.

此外,該玻璃細孔加工刀具10更可包含一連接部20,係用以連接該殼體12與外部的一轉體4,且該轉體4係用以提供該玻璃細孔加工刀具10旋轉,如第2圖所示,且該轉體4係可為一馬達,亦即當連接部20鎖固於該轉體4時,該玻璃細孔加工刀具10係可根據該轉體4的轉速同步地進行旋轉,一般而言該轉體4的轉速可操作在數千或者數萬轉/每小時(round per minute,rpm)。In addition, the glass hole machining tool 10 further includes a connecting portion 20 for connecting the housing 12 and an outer rotating body 4, and the rotating body 4 is for providing the glass hole machining tool 10 to rotate. As shown in FIG. 2, the rotating body 4 can be a motor, that is, when the connecting portion 20 is locked to the rotating body 4, the glass hole machining tool 10 can be rotated according to the rotating body 4. Rotating synchronously, in general, the rotational speed of the swivel 4 can be operated at thousands or tens of thousands of revolutions per minute (rpm).

參考第4圖,係說明第3圖之玻璃細孔加工刀具之作動示意圖。在示意圖(a)中,該玻璃細孔加工刀具10係垂直地朝向該玻璃基板2移動,此時該彈性體12之該伸縮彈力係使得該加工部14透過該延伸部18固定於該容置部122中,此時該軸向壓力係尚未產生,僅存在該彈性體12所產生之該伸縮彈力,亦即該伸縮彈力使得該加工部14靜止於該容置部122;接著在示意圖(b)中,該玻璃細孔加工刀具10之該加工部14之該鑽石刀142係於該玻璃基板2進行研磨與切削,使得在該玻璃基板2上形成該出孔3,再者,該玻璃細孔加工刀具10因為接觸到該玻璃基板2,其同步地在該加工部14產生該軸向壓力,而此時該軸向壓力係大於該彈性體12所產生之該伸縮彈力,其使得該加工部14朝向該容置部122內縮,可用以吸收/調整該軸向壓力;又接著在示意圖(c)中,當彈性體12之該伸縮彈力係無法持續的吸收/調整該加工部14之該軸向壓力時,則該玻璃細孔加工刀具10重置為與示意圖(a)相同的狀態,亦即使得該加工部14不對該玻璃基板2產生該軸向壓力,而彈性體12之該伸縮彈力又再度回復到未受到壓縮的狀態;再接著示意圖(d),係重複示意圖(b)之研磨與切削的作動,直到於該出孔3處穿透該玻璃基板2,形成如示意圖(e)的狀態。再者,熟悉該項技術領域者應當可以了解到,其該出孔3之碎屑的數量係與該軸向壓力正相關,亦即較大的該軸向壓力會造成出孔處或孔邊緣該3大量的碎屑數量。故可根據上述的作動示意圖(a)-(e),更加的了解到其係可利用本發明之具有伸縮式之玻璃細孔加工刀具,使得該玻璃基板2於出孔加工時可有效的降低該軸向壓力,進而減少於加工過程中所產生該出孔碎屑的數量,並且同時可改善該出孔的品質,亦即可有效地降低該出孔於加工過程中所造成該玻璃基板2表面上裂痕的現象。Referring to Fig. 4, there is shown a schematic diagram of the operation of the glass hole machining tool of Fig. 3. In the schematic view (a), the glass hole machining tool 10 is vertically moved toward the glass substrate 2, and the elastic force of the elastic body 12 is such that the processed portion 14 is fixed to the receiving portion through the extending portion 18. In the portion 122, the axial pressure is not yet generated, and only the elastic force generated by the elastic body 12 exists, that is, the elastic force causes the processing portion 14 to be stationary at the accommodating portion 122; The diamond blade 142 of the processing portion 14 of the glass hole machining tool 10 is ground and cut on the glass substrate 2 such that the hole 3 is formed on the glass substrate 2, and further, the glass is thin. Because the hole machining tool 10 contacts the glass substrate 2, the axial pressure is generated synchronously in the processing portion 14, and the axial pressure is greater than the elastic force generated by the elastic body 12, which makes the processing The portion 14 is retracted toward the receiving portion 122 to absorb/adjust the axial pressure; and then in the schematic view (c), when the elastic elastic force of the elastic body 12 is unable to continuously absorb/adjust the processing portion 14 When the axial pressure is applied, the glass is processed The device 10 is reset to the same state as the schematic (a), that is, the processing portion 14 does not generate the axial pressure on the glass substrate 2, and the elastic elastic force of the elastic body 12 is restored to the uncompressed state again; Next, in the schematic view (d), the grinding and cutting operations of the diagram (b) are repeated until the glass substrate 2 is penetrated at the exit hole 3 to form a state as shown in the schematic (e). Moreover, those skilled in the art should be aware that the number of debris in the outlet 3 is positively related to the axial pressure, that is, the larger axial pressure causes the hole or the edge of the hole. The 3 lots of debris. Therefore, according to the above-mentioned actuation diagrams (a)-(e), it can be further understood that the retractable glass pore processing tool of the present invention can be utilized, so that the glass substrate 2 can be effectively reduced during the hole processing. The axial pressure, in turn, reduces the amount of the out-of-hole debris generated during the processing, and at the same time improves the quality of the exit hole, and can effectively reduce the glass substrate 2 caused by the exit hole during the processing. The phenomenon of cracks on the surface.

參考第6圖,係本發明於一實施例中之玻璃細孔加工的方法流程圖。於本實施例中,其玻璃細孔加工的方法包含:步驟1,係提供具有一容置部之一殼體;步驟2,係提供具有凸出於該殼體之一鑽石刀,當該鑽石刀作用於該玻璃基板時產生對應的一軸向壓力;步驟3,係設置一彈性體於該容置部,且該彈性體提供對應該軸向壓力的一伸縮彈力;以及步驟4,係結合該鑽石刀與該彈性體於該容置部中,並且透過該延伸部使得該彈性體之該伸縮彈力吸收調整該軸向壓力。此外,該玻璃細孔加工的方法更可包含步驟5,係提供連接該殼體與外部的一轉體之一連接部,使得該鑽石刀可藉由該轉體旋轉,用以對該玻璃基板進行研磨與切削。Referring to Fig. 6, a flow chart of a method for processing glass pores in an embodiment of the present invention is shown. In the embodiment, the method for processing the glass pores comprises: step 1 is to provide a casing having a receiving portion; and step 2 is to provide a diamond knife having a protrusion protruding from the casing, when the diamond When the knife acts on the glass substrate, a corresponding axial pressure is generated; in step 3, an elastic body is disposed on the receiving portion, and the elastic body provides a telescopic elastic force corresponding to the axial pressure; and step 4 is combined The diamond knife and the elastic body are in the accommodating portion, and the elastic portion of the elastic body absorbs and adjusts the axial pressure through the extending portion. In addition, the method for processing the glass pores further includes the step of providing a connection portion of a rotating body connecting the housing and the outer portion, so that the diamond knife can be rotated by the rotating body for the glass substrate. Grinding and cutting.

與習知技術相較,本發明之玻璃細孔加工之方法及其刀具結構係可用以解決當玻璃基板進行出孔加工時,由於玻璃基板之強度無法支撐刀具研磨與切削的力量,所造成玻璃基板破裂的現象,進而可達到出孔品質的提升。Compared with the prior art, the method for processing the glass pores of the present invention and the tool structure thereof can be used to solve the problem that when the glass substrate is subjected to the hole processing, the strength of the glass substrate cannot support the grinding and cutting force of the tool, and the glass is caused. The phenomenon of cracking of the substrate can further improve the quality of the hole.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明之範圍。應注意的是,舉凡與該實施例等效之變化與置換,均應設為涵蓋於本發明之範疇內。因此,本發明之保護範圍當以下文之申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be included within the scope of the present invention. Therefore, the scope of the invention is defined by the scope of the following claims.

1...鑽石刀具1. . . Diamond cutter

2...玻璃基板2. . . glass substrate

3...出孔3. . . Outlet

4...轉體4. . . Swivel

10...玻璃細孔加工刀具10. . . Glass hole machining tool

12...殼體12. . . case

122...容置部122. . . Housing

14...加工部14. . . Processing department

142...鑽石刀142. . . Diamond knife

16...彈性體16. . . Elastomer

18...延伸部18. . . Extension

20...連接部20. . . Connection

y1、y2、y3...方向Y1, y2, y3. . . direction

第1圖係習知技術之鑽石刀具之示意圖;Figure 1 is a schematic view of a conventional diamond tool;

第2圖係本發明於一實施例中之玻璃細孔加工刀具之示意圖;2 is a schematic view of a glass hole machining tool according to an embodiment of the present invention;

第3圖係本發明於另一實施例中之玻璃細孔加工刀具之示意圖;Figure 3 is a schematic view showing a glass hole machining tool according to another embodiment of the present invention;

第4圖係說明第3圖之玻璃細孔加工刀具之作動示意圖;Figure 4 is a schematic view showing the operation of the glass hole machining tool of Fig. 3;

第5圖係說明玻璃基板之出孔示意圖;以及Figure 5 is a schematic view showing the exit hole of the glass substrate;

第6圖係本發明於一實施例中之玻璃細孔加工的方法流程圖。Figure 6 is a flow chart showing the method of glass pore processing in an embodiment of the present invention.

10...玻璃細孔加工刀具10. . . Glass hole machining tool

12...殼體12. . . case

122...容置部122. . . Housing

14...加工部14. . . Processing department

142...鑽石刀142. . . Diamond knife

16...彈性體16. . . Elastomer

18...延伸部18. . . Extension

y1、y2、y3...方向Y1, y2, y3. . . direction

Claims (7)

一種玻璃細孔加工的刀具,係用於一玻璃基板的出孔加工,且該玻璃細孔加工的刀具作用於該玻璃基板時具有伸縮性,其包含:一殼體,係提供一容置部;一加工部,係具有凸出於該殼體之一鑽石刀,用以對該玻璃基板進行研磨與切削,而該加工部於該玻璃基板產生對應的一軸向壓力;一彈性體,係設置於該容置部,並且根據該軸向壓力對應地產生一伸縮彈力;以及一延伸部,係結合該加工部與該彈性體於該容置部,並且透過該延伸部使得該彈性體產生之該伸縮彈力吸收調整該加工部於該玻璃基板所產生之該軸向壓力。 The utility model relates to a tool for processing glass pores, which is used for the hole processing of a glass substrate, and the tool for processing the glass pores has elasticity when acting on the glass substrate, and comprises: a housing for providing a receiving portion a processing portion having a diamond knife protruding from the housing for grinding and cutting the glass substrate, and the processing portion generates a corresponding axial pressure on the glass substrate; an elastic body Provided in the accommodating portion, and correspondingly generating a telescopic elastic force according to the axial pressure; and an extending portion combining the processing portion and the elastic body in the accommodating portion, and transmitting the elastic body through the extending portion The telescopic elastic force absorbs and adjusts the axial pressure generated by the processing portion on the glass substrate. 如申請專利範圍第1項所述之玻璃細孔加工的刀具,更包含一連接部,係連接該殼體與外部的一轉體,且該轉體係用以提供該玻璃細孔加工的刀具旋轉。 The tool for processing a glass hole according to claim 1, further comprising a connecting portion connecting the housing and the outer rotating body, and the rotating system is configured to provide the tool rotation of the glass hole processing. . 如申請專利範圍第2項所述之玻璃細孔加工的刀具,其中該轉體係為一馬達。 The tool for processing a glass pore according to claim 2, wherein the rotating system is a motor. 如申請專利範圍第1項所述之玻璃細孔加工的刀具,其中該鑽石刀係為一內凹圓弧、一平面放電或一單切刃的刀具結構。 The tool for processing a glass hole according to claim 1, wherein the diamond blade is a tool structure having a concave arc, a plane discharge or a single cutting edge. 如申請專利範圍第1項所述之玻璃細孔加工的刀具,其中該彈性體係為一彈簧或一彈片。 The tool for processing a glass pore according to claim 1, wherein the elastic system is a spring or a spring. 一種玻璃細孔加工的方法,係用於一玻璃基板的出孔加 工,其步驟包含:提供具有一容置部之一殼體;提供具有凸出於該殼體之一鑽石刀,當該鑽石刀係對該玻璃基板進行研磨與切削時產生對應的一軸向壓力;設置一彈性體於該容置部,且該彈性體提供對應該軸向壓力的一伸縮彈力;以及結合該鑽石刀與該彈性體於該容置部中,並且透過該延伸部使得該彈性體之該伸縮彈力吸收調整該軸向壓力。 A method for processing glass pores for use in a glass substrate The method includes the steps of: providing a housing having a receiving portion; providing a diamond cutter having a protrusion protruding from the housing, and generating a corresponding axial direction when the diamond cutter performs grinding and cutting on the glass substrate Pressure; providing an elastic body to the receiving portion, and the elastic body provides a telescopic elastic force corresponding to the axial pressure; and combining the diamond knife and the elastic body in the receiving portion, and transmitting the through portion The telescopic spring force of the elastomer adjusts the axial pressure. 如申請專利範圍第6項所述之玻璃細孔加工的方法,其步驟更包含:提供連接該殼體與外部的一轉體之一連接部,使得該鑽石刀藉由該轉體旋轉,用以對該玻璃基板進行研磨與切削。 The method for processing a glass pore according to claim 6, wherein the method further comprises: providing a connection portion of a rotating body connecting the housing and the outer portion, so that the diamond knife is rotated by the rotating body, The glass substrate is ground and cut.
TW98144999A 2009-12-25 2009-12-25 A method and a cutting tool for forming small holes TWI380864B (en)

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