TWI379868B - - Google Patents

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TWI379868B
TWI379868B TW95116952A TW95116952A TWI379868B TW I379868 B TWI379868 B TW I379868B TW 95116952 A TW95116952 A TW 95116952A TW 95116952 A TW95116952 A TW 95116952A TW I379868 B TWI379868 B TW I379868B
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electrical
parts
hydrocarbon group
electronic parts
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TW95116952A
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TW200740923A (en
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Jun Horikoshi
Tsuneo Kimura
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Shinetsu Chemical Co
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02Polyamines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/296Organo-silicon compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/17Amines; Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/54Silicon-containing compounds
    • C08K5/541Silicon-containing compounds containing oxygen
    • C08K5/5415Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0162Silicon containing polymer, e.g. silicone
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Details Of Resistors (AREA)

Description

1379868 (1) 九、發明說明 【發明所屬之技術領域】1379868 (1) IX. Description of the invention [Technical field to which the invention pertains]

本發明係有關,以電氣♦電子零件之保護爲目的而使 用之室溫硬化型聚矽氧橡膠組成物者。尤其係有關以防止 、延遲由於含有硫之氣體對電氣•電子零件,特別是銀電 極或銀晶片電阻器等含有銀之精密電子零件的腐蝕爲目的 之電氣·電子零件保護用聚矽氧橡膠組成物,以及安裝電 路板、銀電極及銀晶片電阻器者。 【先前技術】The present invention relates to a room temperature hardening type polyoxymethylene rubber composition for the purpose of protecting electrical ♦ electronic parts. In particular, it is composed of a poly-xylene rubber for electrical and electronic parts protection for preventing or delaying the corrosion of electrical and electronic components, particularly silver-containing precision electronic components such as silver electrodes or silver chip resistors. And the installation of circuit boards, silver electrodes and silver chip resistors. [Prior Art]

以往,電氣•電子零件之封閉、密封所使用的聚矽氧 橡膠組成物,雖以防止/延遲封閉之電氣·電子零件的腐 蝕爲目的,電氣•電子零件曝露於含硫氣體(硫氣體、亞 硫酸氣體等)之情況,以往之聚矽氧橡膠不能防止/延遲 含硫氣體到達電氣•電子零件,尤其不能獲得金屬零件之 腐蝕的防止/延遲效果。 又,近年來精密電子零件之各裝置,進行小型化、小 電力化、電極或晶片電阻器之原料由銅改變爲銀,又電極 之厚度朝向薄型化方向進行,電極間之空隙亦向狹窄方向 發展,更進一步容易引起含硫氣體的腐蝕。 特開2003-096301號公報(專利文獻1 )、特開2005-1 1 3 1 1 5號公報(專利文獻2)中,分別有在聚矽氧橡膠組 成物中添加藉由含硫氣體容易硫化之金屬粉0.5〜90質量 %',添加0.01〜0.5質量%之電氣.電子零件封閉或密封用 (2)137.9868In the past, electrical and electronic parts were exposed to sulfur-containing gases (sulfur gas, sub-products) for the purpose of preventing/delaying the corrosion of electrical and electronic parts that are used for the sealing and sealing of electrical and electronic parts. In the case of sulfuric acid gas or the like, the conventional polyoxyxene rubber cannot prevent/delay the passage of the sulfur-containing gas to the electric/electronic parts, and in particular, the corrosion prevention/delay effect of the corrosion of the metal parts cannot be obtained. In addition, in recent years, each device of precision electronic components has been miniaturized and reduced in electric power, and the material of the electrode or the chip resistor has been changed from copper to silver, and the thickness of the electrode has proceeded toward the thinning direction, and the gap between the electrodes has also been narrowed. Development, further susceptible to corrosion of sulfur-containing gases. In JP-A-2003-096301 (Patent Document 1) and JP-A-2005-1 1 3 1 1 (Patent Document 2), it is easy to vulcanize by adding a sulfur-containing gas to the polyoxyethylene rubber composition. Metal powder 0.5~90% by mass', adding 0.01~0.5% by mass of electrical. Electronic parts for sealing or sealing (2) 137.9868

聚矽氧橡膠組成物,可防止或延遲含硫氣體到達電氣•電 子零件之提案。如上所述,在聚矽氧橡膠組成物中高塡充 金屬粉之情況,一部份之金屬粉恐有凝聚之虞;藉此,恐 有電極間之短路、絕緣電阻値下降之虞。又,金屬粉之添 加量少的情況,有效果不能持續之缺點。進而,聚矽氧橡 膠組成物與金屬粉的密度相異之故,在長期儲存之情況有 金屬粉沉降的問題,不能開發低黏度之塗佈用聚矽氧橡膠 組成物。又,特開2004-14961 1號公報(專利文獻3 )中 有,在聚矽氧橡膠組成物中添加苯并三唑或其衍生物時, 可抑制含硫化合物之電氣•電子零件的腐蝕、移動之電蝕 的提案。含有芳香族胺基之化合物的胺基活性低,抑制含 硫化合物之電氣·電子零件的腐蝕、移動之電蝕的效果小A polyoxyxene rubber composition that prevents or delays the proposal for sulfur-containing gases to reach electrical and electronic components. As described above, in the case where the polyfluorene rubber composition is filled with the metal powder, a part of the metal powder may be agglomerated; thereby, there is a fear that the short circuit between the electrodes and the insulation resistance decrease. Further, when the amount of metal powder added is small, there is a disadvantage that the effect cannot be sustained. Further, since the density of the polyoxyxene rubber composition differs from that of the metal powder, there is a problem that the metal powder settles in the case of long-term storage, and it is impossible to develop a low-viscosity coating polyoxymethylene rubber composition. In addition, when benzotriazole or a derivative thereof is added to a polyoxyxene rubber composition, it is possible to suppress corrosion of electrical and electronic parts of a sulfur-containing compound, The proposal for mobile galvanic erosion. The compound having an aromatic amine group has a low amine group activity, and the effect of suppressing corrosion and movement of the electrical and electronic parts containing the sulfur compound is small.

專利文獻1 :特開2003-09630 1號公報 專利文獻2:特開2005-113115號公報 專利文獻3 :特開2004-14961 1號公報 【發明內容】 [發明所欲解決之課題] 本發明鑑於上述各項問題,以提供在藉由聚矽氧橡膠 封閉或密封之電氣•電子零件中,可防止或延遲含硫氣體 之電氣•電子零件的腐蝕、全無電極間之短路或絕緣電阻 値降低的電氣•電子零件保護(封閉、密封)用室溫硬化 型聚矽氧橡膠組成物,以及安裝電路板、銀電極及銀晶片 •6- (3)1379868 電阻器爲目的。 [課題之解決手段]Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. 2005-113115. The above problems are provided to prevent or delay the corrosion of electrical and electronic parts containing sulfur gas, the short circuit between electrodes, or the reduction of insulation resistance in electrical and electronic parts sealed or sealed by polyoxyethylene rubber. The electrical and electronic parts protection (enclosure, sealing) is made of a room temperature hardened polyoxymethylene rubber composition and a 6-(3)1379868 resistor for mounting circuit boards, silver electrodes and silver wafers. [Resolution of the subject]

本發明的工作同仁,爲達成上述目的,經深入探討不 斷硏究之結果發現,以在室溫硬化型聚矽氧橡膠組成物中 添加含有非芳香族胺基化合物、較佳爲1分子中含有至少 2個胺基之含非芳香族胺基化合物、更佳爲1分子中含有 至少1個一級胺基與至少1個多級胺基之含非芳香族胺基 化合物的硬化物,封閉或密封電氣·電子零件,尤其是銀 電極或銀晶片電阻器之情況,硬化物中之該胺化合物具有 防止或延遲電氣·電子零件的腐鈾之特異作用,進而可獲 得全無電極間之短路或絕緣電阻値降低的電氣•電子零件 ,完成本發明。 因此,本發明提供一種室溫硬化型聚矽氧橡膠組成物 ,其特徵爲含有:In order to achieve the above object, the inventors of the present invention have found that a non-aromatic amine-based compound, preferably one molecule, is added to the room temperature hardening type polyoxymethylene rubber composition. a hardened substance containing at least two amine groups containing a non-aromatic amine compound, more preferably a non-aromatic amine group containing at least one primary amine group and at least one multistage amine group in one molecule, sealed or sealed In the case of electrical and electronic parts, especially silver or silver wafer resistors, the amine compound in the hardened material has the specific effect of preventing or delaying the uranium of the electrical and electronic parts, thereby obtaining a short circuit or insulation between the electrodes. The present invention has been completed in electrical and electronic parts with reduced resistance. Accordingly, the present invention provides a room temperature hardening polyxanthene rubber composition characterized by comprising:

(A) 下述一般式(1)所示之有機聚矽氧烷 100質量份 (B) R3bSiX4_b所示之有機矽化合物或其部份水解縮合 物(式中,R3爲取代或非取代之一價烴基;X爲水解性基;b 1〜50質量份 〇·1〜20質量份 (1) 爲〇 ' 1或2) (C)含有非芳香族胺基化合物 所成, 【化1】 (R 〇)3-Si-Z-(SiO),rSi -Z -Si-(OR1).^ (式中,R1爲氫原子、或取代或非取代之一價烴基; (4)137.9868 r2爲取代或非取代之一價烴基;Z爲氧原子或 ;3爲〇、1或2; η爲10以上之整數)》 又’本發明提供,裝載以此組成物之硬化 氣《•電子零件之安裝電路板、銀電極及銀晶片'(A) 100 parts by mass of the organic polyoxane shown in the following general formula (1) (B) an organic hydrazine compound represented by R3bSiX4_b or a partially hydrolyzed condensate thereof (wherein R3 is one of substituted or unsubstituted) a hydrocarbon group; X is a hydrolyzable group; b 1 to 50 parts by mass of 〇·1 to 20 parts by mass (1) is 〇' 1 or 2) (C) is a compound containing a non-aromatic amine group, R 〇) 3-Si-Z-(SiO), rSi -Z -Si-(OR1).^ (wherein R1 is a hydrogen atom or a substituted or unsubstituted one-valent hydrocarbon group; (4) 137.9868 r2 is substituted Or an unsubstituted one-valent hydrocarbon group; Z is an oxygen atom or; 3 is ruthenium, 1 or 2; η is an integer of 10 or more) and the present invention provides a hardened gas loaded with the composition "• Installation of electronic parts Circuit board, silver electrode and silver chip'

[發明之功效] 依本發明之室溫硬化型聚矽氧橡膠組成物 物J在銀電極或銀晶片電阻器等表面之至少一部 銅 '銀、其他之金屬部份的電氣•電子零件封 能防止含硫氣體之對電氣•電子零件的腐蝕。 二價之烴基 物封閉的電 霞阻器。 ,以其硬化 份,將具有 閉之情況, [發明之實施形態] < (A )成份>[Effects of the Invention] The room temperature hardening type polyoxyxene rubber composition J according to the present invention is at least one copper-silver, other metal part electrical/electronic part seal on the surface of a silver electrode or a silver wafer resistor or the like. It can prevent the corrosion of electrical and electronic parts caused by sulfur-containing gases. A divalent hydrocarbon-based closed circuit breaker. , with the hardening portion, will have a closed condition, [Embodiment of the Invention] < (A) Ingredients>

構成本發明之室溫硬化型聚矽氧橡膠組成 (A)成份,係下述一般式(1)所示者。 【化2】 物的主劑之 R2a H2 R2 (1) (式中,R1爲氫原子、或取代或非取代之 R2爲取代或非取代之一價烴基;z爲氧原子或 ;a爲0、1或2; η爲10以上之整數)。 於此,R1爲氫原子、或碳數1〜6'尤其: 或非取代的一價烴基,例如甲基 '乙基、丙基 氰基乙基、3·氰基丙基、2-氰基丁基等氰化烴 、異丙烯基等。a爲0、1時’以一價烴基爲佳 -8·’ 一價烴基; 二價之烴基 〜4之取代 等院基、2 -基、烯丙基 ,尤其以甲 137.9868The composition (A) of the room-temperature hardening type polyoxo rubber of the present invention is represented by the following general formula (1). R2a H2 R2 (1) (wherein R1 is a hydrogen atom, or substituted or unsubstituted R2 is a substituted or unsubstituted one-valent hydrocarbon group; z is an oxygen atom or; a is 0 , 1 or 2; η is an integer of 10 or more). Here, R1 is a hydrogen atom or a carbon number of 1 to 6' especially: or an unsubstituted monovalent hydrocarbon group such as methyl 'ethyl, propyl cyanoethyl, 3 · cyanopropyl, 2-cyano A cyanide hydrocarbon such as butyl or an isopropenyl group. When a is 0 or 1, the monovalent hydrocarbon group is preferably -8·' monovalent hydrocarbon group; the divalent hydrocarbon group is substituted with ~4, etc., the base group, the 2-base group, the allyl group, especially the group A 137.9868

⑸ 基、乙基更佳。3爲2時,以氣原子爲佳。 又,R2爲碳數1〜15,尤其以1〜10者爲佳, 基 '乙基、丙基、異丙基、丁基'2 -乙基丁基 '辛 基、環己基、環戊基等環烷基、乙烯基、烯丙基等 、苯基、甲苯基、二甲苯基、萘基、聯苯基、菲基 、苄基、苯基乙基等芳烷基,進而氯甲基、三氯丙 氟丙基、溴苯基、氯環己基等鹵化烴基、2-氰基乙 氰基丙基、2·氰基丁基等氰化烴基。以甲基、乙條 基、三氟丙基爲佳,以甲基更適合。 Z爲例如氧原子、伸甲基、伸乙基、伸丙基等 〜12,尤其1〜10之伸烷基;其中以氧原子、伸乙 進而,上述式(1)中之η爲10以上的整數, 聚矽氧烷於23°C之黏度爲25mPa · s以上,較佳爲 1,000,000mPa · s、更佳爲 5 0 0 〜2 0 0,00 0 m P a · s 之寒 < (B )成份> 本發明使用1分子中具有2個以上之R3bSiX, 的水解性基之矽烷、或其水解縮合物,作爲硬化劑 取代或非取代之較佳爲碳數1〜10,更佳爲1〜8之 鍵稀基、芳基等一價烴基,較佳爲甲基、乙基、丙 嫌基 '苯基等。X爲水解性基,b爲0、1或2)。 ’其水解性基(X)有,甲氧基、乙氧基、丁氧基 基' 二甲基酮肟基 '甲基乙基酮肟基等酮肟基、乙 .例如甲 基等院 鏈烯基 等芳基 基、三 ,基、3-基、苯 碳數1 基爲佳 此有機 ,1 00 〜 δ圍。 η»所示 (R3爲 烷基、 基、乙 此情況 等院氧 醯氧基 -9- (8) (8)(5) The base and ethyl group are more preferred. When 3 is 2, the gas atom is preferred. Further, R2 is preferably a carbon number of from 1 to 15, especially preferably from 1 to 10, and the group 'ethyl, propyl, isopropyl, butyl '2-ethylbutyl 'octyl, cyclohexyl, cyclopentyl An aralkyl group such as an alkyl group, a vinyl group, an allyl group or the like, a phenyl group, a tolyl group, a xylyl group, a naphthyl group, a biphenyl group, a phenanthryl group, a benzyl group or a phenylethyl group, and further a chloromethyl group. A halogenated hydrocarbon group such as a trichloropropyl fluoride group, a bromophenyl group or a chlorocyclohexyl group; a cyanated hydrocarbon group such as 2-cyanoethyl cyanopropyl group or 2 cyanobutyl group; Methyl, ethyl, trifluoropropyl is preferred, and methyl is more suitable. Z is, for example, an oxygen atom, a methyl group, a methyl group, a propyl group, or the like, and particularly an alkylene group of 1 to 10; wherein, in the oxygen atom, the extension of B, the η in the above formula (1) is 10 or more. The integer, the viscosity of the polyoxyalkylene at 23 ° C is 25 mPa · s or more, preferably 1,000,000 mPa · s, more preferably 5 0 0 ~ 2 0 0, 000 0 m P a · s cold &lt (B) Component> The present invention uses a hydrolyzable group of two or more R3bSiX in one molecule, or a hydrolyzed condensate thereof, and is preferably substituted or unsubstituted as a curing agent, preferably having a carbon number of 1 to 10, More preferably, it is a monovalent hydrocarbon group such as a dilute group or an aryl group of 1 to 8, preferably a methyl group, an ethyl group, a propyl group, a phenyl group or the like. X is a hydrolyzable group, and b is 0, 1, or 2). 'The hydrolyzable group (X) has a ketone oxime group such as a methoxy group, an ethoxy group, a butoxy group 'dimethyl ketone oxime 'methyl ethyl ketone oxime group, and a chain such as a methyl group. The aryl group such as an alkenyl group, a trisyl group, a 3-yl group, and a benzene carbon number group are preferably organic, and have a range of from 100 to δ. η» (R3 is alkyl, amide, B. This is the case of oxooxy-9-(8) (8)

1379868 化鋁等金屬氧化物;氮化硼、氮化鋁等金屬氮 鈣、碳酸鎂、碳酸鋅等金屬碳酸鹽;石棉、玻 、微粉雲母、熔融二氧化矽粉末、聚苯乙烯、 聚丙烯等合成樹脂粉末。此等塡充劑之配合量 本發明之目的範圍可隨意使用。又,使用此等 先進行乾燥處理去除水份爲佳。 <添加劑、黏著助劑成份> 進而,添加劑可添加觸變性提升劑之聚醚 劑、抗菌劑、黏著助劑之7-環氧丙氧基丙基 烷、β- (3,4-環氧環己基)乙基三甲氧基矽烷 類等。還有,本發明之室溫硬化型聚矽氧橡膠 尙可隨意添加顏料、染料、防老化劑、抗氧化 劑、氧化銻、氯化石臘等難燃劑等。 <組成物之調製等> 本發明之室溫硬化型聚矽氧橡膠組成物, 述(Α)〜(C)成份,進而硬化觸媒、塡充劑 添加劑’在乾燥氣體環境中予以均勻混合而得 本發明之室溫硬化型聚矽氧橡膠組成物, 穩定’曝露於空氣中時,由於其濕氣而迅速硬 應需求可添加甲苯 '石油醚等烴系溶劑,酮、 使用。 還有,本發明之聚矽氧橡膠組成物,不使 化物;碳酸 璃棉、碳黑 聚氯乙烯、 ,在不損及 之前,以預 ,作爲防黴 三甲氧基矽 等環氧矽烷 組成物中, 劑、防靜電 係藉由將上 及上述各種 〇 雖在密封下 化。又,因 酯等稀釋劑 用稀釋劑之 -12- 1379868 ⑼ 情況,於23°C之黏度較佳爲300Pa . s以下,更佳爲 200Pa · s以下,最佳爲i〇〇pa · s以下》1379868 Metal oxides such as aluminum; metal nitrates such as boron nitride and aluminum nitride; metal carbonates such as magnesium carbonate and zinc carbonate; asbestos, glass, fine powder mica, molten cerium oxide powder, polystyrene, polypropylene, etc. Synthetic resin powder. The amount of these chelating agents is within the scope of the object of the present invention. Further, it is preferred to use such a drying treatment to remove water. <Additive, Adhesive Aid Ingredient> Further, the additive may be added with a polyether agent of a thixotropic enhancer, an antibacterial agent, an adhesion promoter of 7-glycidoxypropyl alkane, and a β-(3,4-ring) Oxycyclohexyl)ethyltrimethoxynonane and the like. Further, the room temperature-hardening type polyoxyxene rubber of the present invention may optionally contain a flame retardant such as a pigment, a dye, an anti-aging agent, an antioxidant, cerium oxide or chlorinated paraffin. <Preparation of Composition, etc.> The room-temperature-hardening polyxanthene rubber composition of the present invention, the (Α) to (C) component, and further the hardening catalyst and the chelating agent additive are uniformly distributed in a dry gas atmosphere The room-temperature-hardening polyxanthene rubber composition of the present invention is mixed and stabilized. When exposed to air, a hydrocarbon-based solvent such as toluene' petroleum ether or a ketone can be added as needed due to moisture. Further, the polyoxyxene rubber composition of the present invention is not a compound; the carbonated cotton, the carbon black polyvinyl chloride, and the epoxy decane composition such as mildew resistant trimethoxy fluorene are preliminarily not damaged. In the case of the agent and the antistatic system, the upper and the above various enamels are sealed. Further, in the case of a diluent such as an ester such as -12-1379868 (9), the viscosity at 23 ° C is preferably 300 Pa·s or less, more preferably 200 Pa·s or less, and most preferably i 〇〇 pa · s or less. 》

本發明之聚矽氧橡膠組成物,作爲電氣·電子零件保 護用而使用,依常法藉由將電氣.電子零件封閉、密封、 塗佈等而使用。此情況’電氣•電子零件,以在至少表面 之一部份具有使用金屬’尤其銀、銅等所形成的部份者爲 佳;例如裝載電氣•電子零件(此情況,電氣.電子零件 可爲於表面無金屬部份者)之安裝電路板 '銀電極、銀晶 片電阻器等。 【實施方式】 [實施例] 以實施例、比較例具體說明本發明如下。本發明並非 限定於此等實施例者。還有,組成物之黏度,係藉由旋轉 黏度計於2 3 °C測定之値。The polyoxyethylene rubber composition of the present invention is used for the protection of electrical and electronic parts, and is used by sealing, sealing, coating, etc. of electrical and electronic parts according to a usual method. In this case, 'electrical and electronic parts are preferably formed on at least one part of the surface using metal, especially silver, copper, etc.; for example, electrical/electronic parts are loaded (in this case, electrical and electronic parts can be Mount the board 'silver electrode, silver chip resistor, etc. on the surface without metal parts. [Embodiment] [Examples] The present invention will be specifically described below by way of examples and comparative examples. The invention is not limited to the embodiments. Further, the viscosity of the composition was measured by a rotary viscometer at 23 ° C.

[實施例1〜3、比較例1〜4 ] 將作爲(A)成份之黏度700mPa· s(23°C)的分子 鏈兩末端被羥基封鎖之二甲基聚矽氧烷100質量份、與黏 度爲300 mPa· s(23°C)之分子鏈兩末端被甲基封鎖的二 甲基聚矽氧烷20質量份,以品川式攪拌機在室溫下混合 20分鐘後;將作爲(B)成份之苯基三(異丙烯基氧)矽 烷8質量份、硬化觸媒成份之1,1,3,3-四甲基-2-[3-(三甲 氧基甲砂院基)丙基]胍1質量份、及(C)成份或作爲比 -13- (12)1379868 成組成物。 [表3] 實施例'比較例 (C)成份添加質量份 比較成份:添加質量份 實施例7 N-2(胺基乙基)3-胺基丙基三 甲氧基矽烷:1質量份 比較例7 吡啶:1質量份[Examples 1 to 3, Comparative Examples 1 to 4] 100 parts by mass of dimethyl polyoxane which is blocked by a hydroxyl group at both ends of a molecular chain having a viscosity of 700 mPa·s (23 ° C) as component (A) 20 parts by mass of dimethyl polyoxane blocked by methyl groups at both ends of the molecular chain having a viscosity of 300 mPa·s (23 ° C), mixed with a Shinagawa mixer at room temperature for 20 minutes; 8 parts by mass of phenyl tris(isopropenyloxy) decane as component, 1,1,3,3-tetramethyl-2-[3-(trimethoxysartoin)propyl] as a curing catalyst component胍 1 part by mass, and (C) component or as a composition of the ratio -13-(12)1379868. [Table 3] Example 'Comparative Example (C) Ingredients Adding parts by mass Comparative component: Adding parts by mass Example 7 N-2 (aminoethyl) 3-aminopropyltrimethoxydecane: 1 part by mass of Comparative Example 7 pyridine: 1 part by mass

[比較例8 ][Comparative Example 8]

將(A)成份之黏度700mPa· s(23°C)的分子鏈兩 末端被羥基封鎖之二甲基聚矽氧烷100質量份、與黏度 3 00mPa · s (23t )之分子鏈兩末端被甲基封鎖的二甲基 聚矽氧烷20質量份,以品川式攪拌機在室溫下混合20分 鐘後;將(B)成份之苯基二(異丙烯基氧)矽烷8質量 份、硬化觸媒成份之1,1,3,3 -四甲基-2- [3-(三甲氧基甲矽 烷基)丙基]胍1質量份,於無水之狀態混合,其次進行 2〇分鐘之脫泡混合,即調製成組成物(表4 )。 [表4] 實施例、比較例 (C)成份:添加質量份 比較例8 Μ '»、、 <硬化性試驗> 硬化性試驗,係將上述實施例1〜7、比較例1〜8所 -16 - (13)1379868 調製之各組成物,在23 °C /5 0 %RH之環境條件下曝露,在 20分鐘後確認各組成物之表面的硬化。結果如表5所示。 〇:硬化 X :未硬化 <腐蝕性試驗>The molecular weight chain of the (A) component having a viscosity of 700 mPa·s (23 ° C) at both ends of the molecular chain blocked by a hydroxyl group is 100 parts by mass, and the molecular chain at a viscosity of 300 mPa · s (23 t ) is 20 parts by mass of methyl blocked dimethyl polyoxane, after mixing at room temperature for 20 minutes in a Shinagawa mixer; 8 parts by mass of phenyl bis(isopropenyloxy) decane of component (B), hardening contact 1 part by mass of 1,1,3,3-tetramethyl-2-[3-(trimethoxycarbamidino)propyl]anthracene, mixed in the anhydrous state, followed by defoaming for 2 minutes Mix, ie, modulate into a composition (Table 4). [Table 4] Examples and Comparative Examples (C) Ingredients: Adding Parts by Mass Comparative Example 8 Μ '», <Sturability Test> Curability Test, the above Examples 1 to 7 and Comparative Examples 1 to 8 Each of the compositions prepared in the range of -16 - (13) 1379868 was exposed to ambient conditions of 23 ° C / 5 0 % RH, and the surface of each composition was hardened after 20 minutes. The results are shown in Table 5. 〇: hardening X: not hardened <corrosive test>

腐蝕性試驗,係在施行銀電鍍之鐵板上,塗佈上述實 施例1〜7、比較例1〜8所調製之各組成物成爲厚度2mm ,經硬化即製成試驗用試料。將試料與硫粉〇.2g同時置 入100cc玻璃瓶中,予以密閉加熱至80 °C進行放置,100 小時後將硬化之組成物剝離,以目視觀測銀電鍍之腐蝕程 度。結果如表5所示。 ◎:無腐蝕 〇:幾乎無腐蝕 X :有腐蝕(黑色化)The corrosion test was carried out on a silver plated iron plate, and each of the compositions prepared in the above Examples 1 to 7 and Comparative Examples 1 to 8 was applied to have a thickness of 2 mm, and cured to prepare a test sample. The sample and the sulfur powder 〇 2 g were placed in a 100 cc glass bottle at the same time, and the mixture was heated to 80 ° C to be placed, and after 100 hours, the hardened composition was peeled off to visually observe the degree of corrosion of the silver plating. The results are shown in Table 5. ◎: no corrosion 〇: almost no corrosion X: corrosion (blackening)

<儲存性試驗> 儲存性試驗,係將上述實施例1〜7、比較例1〜8所 調製之各組成物,置入lOOcc玻璃瓶中,在23°C下靜置 1 ,〇〇〇小時’觀測聚矽氧組成物之分離或構成成份之沈降 •分離。結果如表5所示。 〇:無沉降.分離 X:有沉降•分離 -17- (14)1379868 [表5] 實施 例 比較例 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 硬化性 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 腐蝕性試驗 〇 ◎ ◎ 〇 ◎ ◎ 〇 X X X 〇 X 〇 X X 儲存性試驗 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 X 〇 X 〇 〇<Storage Test> The storage property test was carried out by placing each of the compositions prepared in the above Examples 1 to 7 and Comparative Examples 1 to 8 in a 100 cc glass bottle and standing at 23 ° C for 1 〇〇 〇 hours' observation of the separation or separation of constituents of the polyoxo-oxygen composition. The results are shown in Table 5. 〇: no sedimentation. Separation X: sedimentation and separation -17- (14) 1379868 [Table 5] Example Comparative Example 1 2 3 4 5 6 7 1 2 3 4 5 6 7 8 Sclerosing 〇〇〇〇〇〇 〇〇〇〇〇〇〇〇〇 Corrosion test 〇 ◎ ◎ 〇 ◎ ◎ 〇 XXX 〇 X 〇 XX Storage test 〇〇〇〇〇〇〇〇〇〇 X 〇 X 〇〇

由上述之結果確認’使用未添加(C)成份之聚矽氧 橡膠組成物(比較例1〜3、5、7、8)者不能防止銀電鍍 的腐蝕;又,使用添加銅粉之聚矽氧橡膠組成物(比較例 4' 6)者儲存穩定性降低。 相對於此,確認使用添加(C )成份之聚矽氧橡膠組 成物(實施例1〜7)者,能防止銀電鍍之腐蝕,具有優越 之儲存穩定性。From the above results, it was confirmed that the use of the polyoxyethylene rubber composition (Comparative Examples 1 to 3, 5, 7, and 8) in which the (C) component was not added could not prevent the corrosion of the silver plating; The oxygen rubber composition (Comparative Example 4'6) had a reduced storage stability. On the other hand, it was confirmed that the polyoxyethylene rubber composition (Examples 1 to 7) to which the component (C) was added can prevent corrosion by silver plating and has excellent storage stability.

-18--18-

Claims (1)

1379868 4 第095110952號專利申請案中文申請專利範圍修正本 民國101年9月 21 日修正 十、申請專利範圍 1·—種電氣•電子零件保護用室溫硬化型聚矽氧橡 膠組成物,其特徵爲含有: (A) 下述一般式(1)所示之有機聚矽氧烷 10 0質量份 (B) R3bSiX4_b所示之有機矽化合物或其部份水解縮合 物(式中’ R3爲非取代之一價烴基;X爲水解性基;b爲0、 1或2 ) 1〜5 0質量份 (C) 選自Ν’-{3-(三甲氧基矽烷基)-丙基}二乙烯三胺及 參(2-胺基乙基)胺之含有非芳香族胺基化合物 0· 1〜20質量份 所成 R2 R2 【化1】 R2» (1) (R'O)}——Z—(SiOXT-Si —Zr-Si 一(OR1)1379868 4 Patent application No. 095110952 Revision of the scope of application for Chinese patents Amendment dated September 21, 101 of the Republic of China. Patent application scope 1. The composition of room temperature hardening polysilicone rubber for electrical and electronic parts protection, its characteristics The organic anthracene compound represented by the following formula (1): (10) an organopolysiloxane represented by the following general formula (1): (B) an organic hydrazine compound represented by R3bSiX4_b or a partial hydrolysis condensate thereof (wherein R3 is an unsubstituted a monovalent hydrocarbon group; X is a hydrolyzable group; b is 0, 1 or 2) 1 to 50 parts by mass (C) selected from Ν'-{3-(trimethoxydecyl)-propyl}divinyl three Amine and ginseng (2-aminoethyl)amine containing non-aromatic amine-based compound 0·1~20 parts by mass of R2 R2 【化1】 R2» (1) (R'O)}——Z— (SiOXT-Si —Zr-Si one (OR1) (式中,R1爲氫原子、或非取代之一價烴基;R2爲經 鹵素取代或 氰基取代或非取代之一價烴基;Z爲氧原子 或二價之烴基;a爲0、1或2; η爲10以上之整數)。 2-—種裝載電氣•電子零件之安裝電路板(circuit board),其特徵爲以申請專利範圍第1項之電氣·電子零 件保護用室溫硬化型聚矽氧橡膠組成物之硬化物封閉》 3. —種銀電極,其特徵爲以申請專利範圍第1項之 電氣•電子零件保護用室溫硬化型聚矽氧橡膠組成物之硬 化物封閉。 1379868 4. 一種銀晶片電阻器,其特徵爲以申請專利範圍第1 項之電氣•電子零件保護用室溫硬化型聚矽氧橡膠組成物 之硬化物封閉。(wherein R1 is a hydrogen atom or an unsubstituted one-valent hydrocarbon group; R2 is a halogen-substituted or cyano-substituted or unsubstituted one-valent hydrocarbon group; Z is an oxygen atom or a divalent hydrocarbon group; a is 0, 1 or 2; η is an integer of 10 or more). 2--mounting circuit board for mounting electrical and electronic parts, characterized by curing of a hardened material of a room-temperature hardening type polyoxymethylene rubber for electrical and electronic parts protection according to the first application of the patent scope 3. A silver electrode characterized by being cured by a hardened material of a room temperature hardening type polyoxymethylene rubber composition for electrical and electronic component protection according to the first application of the patent scope. 1379868 4. A silver wafer resistor characterized by being cured by a hardened material of a room temperature hardening type polyoxymethylene rubber composition for electrical and electronic component protection according to the first aspect of the patent application.
TW095116952A 2005-05-13 2006-05-12 Room temperature curable type silicone rubber composition for protecting electric/electronic part, circuit-mounted plate, silver electrode and silver chip resistor TW200740923A (en)

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US20060257672A1 (en) 2006-11-16
KR101390614B1 (en) 2014-04-29
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US7553901B2 (en) 2009-06-30
CN1876720B (en) 2012-05-23

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