1376008 九、發明說明： 本申請案係根據2 0 0 3年1 1月7曰提出之美國專利第 60/518,238號及第60/518, 188號申請案主張優先權，並 在此併入該案内容以供參考。 【發明所屬之技術領域】 本發明係關於用以處理半導體晶圓的系統。特別是，本 發明係關於晶圓載具門。 【先前技術】 半導體晶圓在製程中會經過多數之處理步驟。此等製程 通常需要將晶圓從一工作站運送到另一工作站，以由特殊 設備進行加工。 此製程之一部分係將晶圓暫時儲存於容器中或將其運 送至其他工廠或終端使用者。在這個階段，晶圓可能會受 到污染而使晶圓損壞。 為了減少污染物對晶圓造成的損害，已發展特殊的容器 以將污染的產生降到最低，並將晶圓與容器外部的污染物 隔離。這種裝置的主要共同特徵在於其設有可拆卸的門或 殼體。 上述之晶圓處理容器有幾個問題。在容器的使用年限期 間，殼體或門係藉由機器手臂或人工多次地裝附及拆卸。 在每一次的裝附或拆卸，部分門緣就會括傷容器的門框。 在如此之重複過程中，會產生細微之粒子，其可藉由空氣 之搬運而附著在儲存於容器内的晶圓上。 如此之微粒產生的問題亦可歸因於門與容器的製造過 5 312XP/發明說明書(補件)/94-02/93 1 339 76 1376008 程。容器與門通常係由射出成型塑膠材料而形成，例 碳酸酯。在這樣的成型製程中，成型部件的收縮與變 不可避免的。 雖然塑膠射.出成型技術已經相當成熟，然而由同一 所形成之不同部件之間，仍然會有個別之尺寸偏差。 輕微之尺寸偏差通常不致於損及門在關閉容器時的功 但其會改變工作精度，而使在門與門框之接觸增加（ 而造成微粒的產生）。尺寸之改變亦可能由鑄模本身 生，而為正常之磨損的結果。這樣的問題在門與容器 件的.公差累積及增加時，會變得顯著。 隨著半導體產業的演進，晶圓與晶圓載具的尺寸已 地增加。半導體製造設備現在已可處理3 0 0 m m之晶圓 在用以容納30 Omni之晶圓的較大載具中，模塑載具的 形、收縮與公差問題將變得更為顯著。 為了將晶圓載具部件上的污染物之產生降到最低， 複使用之前，晶圓載具係被徹底地清潔。清潔最好是 能將晶圓載具外部與内部表面的污染物清除，而且能 有内部腔室内的污染物清除。 為了能夠減少由於晶圓載具殼體與晶圓載具門在一 摩擦所產生之污染物，門導引件係被設計用來裝附於 載具門的角落。例如，美國專利第6 , 2 0 6 , 1 9 6號與第 6，4 6 4 , 0 8 1號便揭示有此種門導引件，此2項專利皆： 與本案申請人，而併入於此以供參考。 【發明内容】 312XP/發明說明書(補件)/94-02/93133976 如聚 形係 錄模 雖然 能， 並進 所產 之部 顯著 。 而 變 在重 不只 將所 起 晶圓 皮授 6 1376008 本發明係關於能與晶圓載具殼體一起使用之晶圓載具 門。晶圓載具門包括内門部分與外門部分。在第一實施例 中，外門部分包括複數個形成於其中的孔，以協助清潔内 門部分與外門部分之間的腔室。 在本發明第二實施例中，外門部分包括複數個自其延伸 的門導引件。内門部分包括複數個形成於其中的門導引件 凹槽。當内門部分裝附於外門部分時，門導引件會延伸貫 穿門導引孔，在晶圓載具門裝附於晶圓載具殼體時，以使 門導引件能夠與晶圓載具殼體接觸。 【實施方式】 本發明之實施例係一晶圓載具門，如圖1之部件符號1 〇 所示。晶圓載具門1 0大致密封晶圓載具殼體1 2，以收容 半導體晶圓（未圖示）於晶圓載具14内。 本發明之晶圓載具門1 0可強化在使用間有效清潔晶圓 載具門1 0的能力。晶圓載具門1 0亦可減少在開及關晶圓 載具1 4時污染物的產生。晶圓載具門1 0亦設有門導引件 8 0，其可減少因晶圓載具門1 0與晶圓載具殼體1 2間的摩 擦接合所產生的污染物。 晶圓載具門1 0包括内門部分2 0與外門部分2 2，如圖2 及圖3所示。内門部分20與外門部分22係互相匹配以在 其間形成腔室24。 至少一鎖定機構3 0係安裝在腔室2 4内，其可透過内門 部分2 0而觀視。此至少一鎖定機構3 0可協助將晶圓載具 門1 0裝附至晶圓載具殼體1 2上。將此至少一鎖定機構3 0 7 312XP/發明說明書(補件)/94-02/93133976 1376008 安裝至腔室24中可保護此至少一鎖定機構30，使其在晶 圓載具1 4的使用時而不受到損害。 内門部分2 0較佳地係大致為連續者，以防止污染物透 過内門部分20而進入晶圓載具殼體12内。為了進一步協 助在晶圓載具門1 0與晶圓載具殼體1 2間形成密封，可沿 著内門部分2 0之外緣3 4設置彈性襯墊3 2。 内門部分2 0較佳地係包括在其中央附近的矩形凹槽 3 6。此矩形凹槽3 6的形狀較佳係可以容納晶圓減震器（未 圖示），如美國專利第6，2 6 7 , 2 4 5號所揭示者，該專利係 被授與本案申請人。 外門部分2 2之形狀較佳係相對應於内門部分2 0的外部 尺寸，在晶圓載具門1 0被裝附於晶圓載具殼體1 2時，以 使外門部分2 2大致地覆蓋内門部分2 0。 外門部分2 2具有複數個形成於其中的孔4 0。在使用間 清潔晶圓載具門1 0時，孔4 0可協助清除腔室2 4内的污染 物。在清潔程序完成時，孔40亦可協助自腔室24清除清 潔流體。孔4 0較佳地延伸覆蓋至少外門部分2 2表面的 2 5%，更佳地覆蓋至少外門部分22表面的50%。 孑L 40較佳地具有一細長狀且方向係沿著該至少一鎖定 機構3 0的側邊，因為在操作該至少一鎖定機構3 0時部件 的摩擦可能會產生污染物。孔4 0較佳地配置成3組，第一 側邊組6 2、中央組6 4及第二側邊組6 6。孔4 0較佳地延伸 覆蓋至少外門部分22表面的50%。 透過使用外門部分2 2之孔4 0的陣列，可使晶圓載具同 8 312XP/發明說明書(補件)/94-02/93133976 1376008 時展現以下好處，即，可將具有潛在損害性的靜電放電， 而在不打開晶圓載具1 4的情況下，便可觀視晶圓載具1 4 内的物件。 孔4 0較佳地配置成一陣列，其係由複數個水平部分4 2 與複數個垂直部分4 4所界定。複數個水平部分4 2與複數 個垂直部分44較佳地配置成大致垂直狀。各個水平部分 4 2之寬度係較佳地小於孔4 0的寬度。 孔4 0較佳地具有長度大於一寬度，以協助將清潔流體 在大致平行孔4 0之長度方向流通晶圓載具門1 0的内部。 水平部分42與垂直部分44之寬度與厚度係被製造成能 夠提供晶圓載具門1 0足夠之結構剛性的程序，以防止在習 知的使用狀況下發生變形。 由於靜電荷會對半導體部件造成損害，因此一般皆使用 能夠分散此電荷之材料來製造晶圓載具的部件。一般可達 到此靜電放電之程度要求的材料係不為透明者。而以不透 明材料來形成晶圓載具門會妨礙對儲存於晶圓載具内之物 品的觀視能力。為了克服此一限制，係在不透明之晶圓載 具門上形成一透明區域。 雖然可能對於孔4 0可大致覆蓋外門部分2 2的整個表 面，孔4 0較佳地係不要位於鎖定機構3 0的上方。在此配 置下，位於鎖定機構3 0下方之外門部分2 2 ·的内表面係大 致平坦，以協助順暢地操作鎖定機構3 0。 本發明之晶圓載具之另一態樣係其可適用於晶圓容 器，該晶圓容器包含一内部殼體，其可形成一密閉容納空 9 3 ] 2XP/發明說明書(補件)/94-02/93丨33976 1376008 間，以及與内部透明殼體相間隔且延伸覆蓋至少 殼體之一部分的陣列、柵欄或網格。該柵欄、陣 具有複數個形成於其中的孔。該柵欄可藉此保護 體，防止其受到接觸，並防止其受到例如靜電電 的損害，同時可允許人員能夠觀視晶圓載具，而 可觀視晶圓載具内部的物件。 外門部分2 2較佳地使用複數個自外門部分2 2 整片70而固定於内門部分20，如圖4及圖5所 片7 0較佳地包括主段7 2與自主段7 2延伸於外严 的相反側之末段7 4。 内門部分20大致包括中央面板90與自中央面 致垂直延伸的側面板9 2。側面板9 2較佳地大致. 央面板9 0而延伸。而在中央面板9 0之相反側， 係自側面板92延伸。緣部94較佳地大致取向垂 板92。 側面板92與緣部94之至少其一包括調整片孔 狀係可配合調整片7 0的尺寸。如此之配置可允穿 70之末段74能夠延伸穿過調整片孔76。接著， 便固定於調整片孔7 6内，以將内門部分2 0相對 分22保持於一固定部分，如圖5所示》 當内門部分20裝附於外門部分22時，調整片 出内門部分2 0，在晶圓載具門1 0裝附於晶圓載： 時，使得調整片7 0可與晶圓載具殼體1 2接觸。 置可減少内門部分2 0與晶圓載具殼體1 2之間的肩 312XP/發明說明書(補件)/94-02/93133976 内部透明 列或網格 内部殼 擊與磨損 較佳地係 延伸的調 示。調整 ]部分22 板90大 環繞著中 緣部94 直於側面 76，其形 卜調整片 末段74 於外門部 70可超 Βτ殼體1 2 如此之配 t擦接觸。 10 1376008 外門部分2 2較佳地亦包括複數個自其延伸的角落導引 件8 0。角落導引件8 0較佳地自外門部分2 2大致筆直延 伸，如圖4所示。角落導引件80較佳地係大致取向垂直於 角落導引件80所相鄰之外門部分22的邊緣。外門部分22 之各邊較佳地係在其末端附近包括一角落導引部8 0。 内門部分2 0較佳地亦包括角落導引孔8 2，其形狀係可 配合角落導引件8 0的尺寸。如此之配置可允許角落導引件 8 0延伸穿過角落導引孔8 2。當内門部分2 0裝附於外門部 分22時，角落導引件80係延伸超出内門部分20的侧壁 8 4。角落導引件8 0之製造材料較佳地係可將與晶圓載具殼 體1 2的摩擦接合最小化。 使用如此配置可大幅減低内門部分2 0與晶圓載具殼體 1 2之間的摩擦接觸。相對於習知技術中將角落導引件分別 獨立地自内門部分與外門部分形成，此製程亦.可減少部件 的數量。 内門部分2 0與外門部分2 2較佳地係皆由射出成型所製 成。内門部分2 0與外門部分2 2較佳地係由聚碳酸酯、聚 醚醯亞胺、聚醚醚酮或其他熟習此技藝者所熟知的材料製 成。 本發明所揭示之特徵功能以及上述之併入於此以供參 考之申請案所揭示者係可彼此搭配混合，以適用於特定之 使用狀況。熟悉本技藝者可對其作出各種改良與變化。 【圖式簡單說明】 圖1為使用本發明之門的晶圓載具。 11 312XP/發明說明書(補件)/94-02/93133976 1376008 圖2為晶圓載具門的内部視圖。 圖3為晶圓載具門的外部視圖。 圖4為内門部分與外門部分未組裝時，晶圓載具門之角 落的放大圖。 圖5為内門部分與外門部分組裝時，晶圓載具門之角落 的放大圖。 【主要部件符號說明】 10 晶 圓 載 具 門 12 晶 圓 載 具 殼體 14 晶 圓 載 具 20 内 門 部 分 22 外 門 部 分 24 腔 室 30 鎖 定 機 構 32 彈 性 襯 墊 34 外 緣 36 . 矩 形 凹 槽 40 孔 42 水 平 部 分 44 垂 直 部 分 62 第 — 側 邊 組 64 中 央 組 66 第 二 側 邊 組 70 調 整 片 312XP/發明說明書(補件)/94-02/93133976</ RTI> </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The contents of the case are for reference. TECHNICAL FIELD OF THE INVENTION The present invention relates to systems for processing semiconductor wafers. In particular, the present invention relates to wafer carrier doors. [Prior Art] A semiconductor wafer undergoes a majority of processing steps in the process. These processes typically require wafers to be transported from one workstation to another for processing by special equipment. One part of this process is to temporarily store the wafer in a container or transport it to other factories or end users. At this stage, the wafer may be contaminated and the wafer damaged. In order to reduce the damage caused by contaminants to the wafer, special containers have been developed to minimize contamination and isolate the wafer from contaminants outside the container. The main common feature of such devices is that they are provided with a detachable door or housing. The wafer processing container described above has several problems. The housing or door is attached and detached multiple times by robotic or manual use during the life of the container. At each attachment or disassembly, part of the door edge will cover the door frame of the container. During such repetition, fine particles are produced which can be attached to the wafer stored in the container by the transport of air. The problems caused by such particles can also be attributed to the manufacture of the door and container 5 312 XP / invention specification (supplement) / 94-02/93 1 339 76 1376008. Containers and doors are typically formed by injection molding a plastic material, such as a carbonate. In such a molding process, shrinkage and deformation of the molded part are unavoidable. Although the plastic injection molding technology is quite mature, there are still individual dimensional deviations between the different components formed by the same. Slight dimensional deviations generally do not impair the work of the door when the container is closed, but it changes the accuracy of the work and increases the contact between the door and the door frame (resulting in the generation of particles). The change in size may also be caused by the mold itself, as a result of normal wear. Such a problem becomes significant when the tolerances of the door and the container are accumulated and increased. As the semiconductor industry has evolved, the size of wafer and wafer carriers has increased. Semiconductor manufacturing equipment is now capable of handling 300 m m wafers. In larger carriers for holding 30 Omni wafers, the shape, shrinkage and tolerance issues of the molding carriers will become more pronounced. In order to minimize the generation of contaminants on the wafer carrier components, the wafer carriers are thoroughly cleaned prior to reuse. Cleaning is best done to remove contaminants from the exterior and interior surfaces of the wafer carrier and to remove contaminants from the interior chamber. In order to be able to reduce contaminants generated by friction between the wafer carrier housing and the wafer carrier door, the door guides are designed to be attached to the corners of the carrier door. For example, U.S. Patent Nos. 6,206, 196 and 6,4,6,0,8,8, disclose such door guides, both of which are: Enter here for reference. [Description of the Invention] 312XP/Invention Manual (Supplement)/94-02/93133976 If the poly-type recording module can, it is remarkable. The invention is based on the wafer carrier door that can be used with the wafer carrier housing. The wafer carrier door includes an inner door portion and an outer door portion. In a first embodiment, the outer door portion includes a plurality of apertures formed therein to assist in cleaning the chamber between the inner door portion and the outer door portion. In a second embodiment of the invention, the outer door portion includes a plurality of door guides extending therefrom. The inner door portion includes a plurality of door guide recesses formed therein. When the inner door portion is attached to the outer door portion, the door guide extends through the door guiding hole when the wafer carrier door is attached to the wafer carrier housing to enable the door guide to be coupled to the wafer carrier The housing is in contact. [Embodiment] An embodiment of the present invention is a wafer carrier door, as shown by the symbol 1 in FIG. The wafer carrier door 10 substantially seals the wafer carrier housing 12 to receive a semiconductor wafer (not shown) in the wafer carrier 14. The wafer carrier door 10 of the present invention enhances the ability to effectively clean the wafer carrier door 10 during use. The wafer carrier door 10 also reduces the generation of contaminants when the wafer carrier 14 is turned on and off. The wafer carrier door 10 is also provided with a door guide 80 that reduces contaminants generated by frictional engagement between the wafer carrier door 10 and the wafer carrier housing 12. The wafer carrier door 10 includes an inner door portion 20 and an outer door portion 22, as shown in FIGS. 2 and 3. The inner door portion 20 and the outer door portion 22 are mated to each other to form a chamber 24 therebetween. At least one locking mechanism 30 is mounted within the chamber 24 and is viewable through the inner door portion 20. The at least one locking mechanism 30 can assist in attaching the wafer carrier door 10 to the wafer carrier housing 12. Mounting at least one locking mechanism 3 0 7 312XP/invention specification (supplement)/94-02/93133976 1376008 into the chamber 24 protects the at least one locking mechanism 30 during use of the wafer carrier 14 Without being damaged. The inner door portion 20 is preferably substantially continuous to prevent contaminants from entering the wafer carrier housing 12 through the inner door portion 20. To further assist in forming a seal between the wafer carrier door 10 and the wafer carrier housing 12, an elastomeric liner 3 2 can be disposed along the outer edge 34 of the inner door portion 20. The inner door portion 20 preferably includes a rectangular recess 36 in the vicinity of its center. The shape of the rectangular recess 36 is preferably such that it can accommodate a wafer damper (not shown), as disclosed in U.S. Patent No. 6,267, 254, which is assigned to the present application. people. The shape of the outer door portion 22 is preferably corresponding to the outer dimension of the inner door portion 20, when the wafer carrier door 10 is attached to the wafer carrier housing 12 such that the outer door portion 22 is substantially The ground covers the inner door portion 20. The outer door portion 22 has a plurality of holes 40 formed therein. The hole 40 assists in cleaning up contaminants within the chamber 24 when the wafer carrier door 10 is cleaned during use. The aperture 40 also assists in clearing the cleaning fluid from the chamber 24 when the cleaning procedure is completed. The aperture 40 preferably extends over at least 25% of the surface of the outer door portion 2 2, more preferably covering at least 50% of the surface of the outer door portion 22. The 孑L 40 preferably has an elongated shape and is oriented along the side of the at least one locking mechanism 30 because friction of the components may cause contaminants when the at least one locking mechanism 30 is operated. The holes 40 are preferably arranged in three groups, a first side group 6, a central group 64 and a second side group 66. The aperture 40 preferably extends over at least 50% of the surface of the outer door portion 22. By using an array of apertures 40 of the outer door portion 22, the wafer carrier can be used with the 8 312XP/invention specification (supplement)/94-02/93133976 1376008 to provide the following benefits, ie potentially damaging Electrostatic discharge, while the wafer carrier 14 is not opened, the objects in the wafer carrier 14 can be viewed. The apertures 40 are preferably arranged in an array defined by a plurality of horizontal portions 4 2 and a plurality of vertical portions 44. The plurality of horizontal portions 4 2 and the plurality of vertical portions 44 are preferably arranged to be substantially vertical. The width of each horizontal portion 42 is preferably smaller than the width of the aperture 40. The apertures 40 preferably have a length greater than a width to assist in flowing the cleaning fluid through the interior of the wafer carrier door 10 in the direction of the length of the substantially parallel apertures 40. The width and thickness of the horizontal portion 42 and the vertical portion 44 are fabricated to provide a sufficient structural rigidity of the wafer carrier door 10 to prevent deformation under known use conditions. Since electrostatic charges can cause damage to semiconductor components, materials capable of dispersing this charge are generally used to fabricate components of the wafer carrier. Materials that are generally required to reach this level of electrostatic discharge are not transparent. Forming a wafer carrier door with an opaque material can hinder the viewing capability of the items stored in the wafer carrier. To overcome this limitation, a transparent region is formed on the opaque wafer carrier door. While it is possible for the aperture 40 to substantially cover the entire surface of the outer door portion 22, the aperture 40 is preferably not located above the locking mechanism 30. In this configuration, the inner surface of the outer door portion 2 2 · located below the locking mechanism 30 is substantially flat to assist in smooth operation of the locking mechanism 30. Another aspect of the wafer carrier of the present invention is applicable to a wafer container, the wafer container including an inner casing that can form a sealed containment space 9 3 ] 2XP / invention specification (supplement) / 94 -02/93丨33976 1376008, and an array, fence or grid spaced from the inner transparent casing and extending over at least one portion of the casing. The fence, array has a plurality of holes formed therein. The barrier protects the body from contact and protects it from, for example, electrostatic discharge, while allowing personnel to view the wafer carrier and view the contents of the wafer carrier. The outer door portion 22 is preferably secured to the inner door portion 20 using a plurality of outer door portions 2 2 from the entire piece 70, as shown in Figures 4 and 5, preferably comprising a main segment 7 2 and an autonomous segment 7 2 extends to the end of the opposite side of the outer side of the 7 4 . The inner door portion 20 generally includes a central panel 90 and a side panel 92 that extends perpendicularly from the center. The side panel 92 preferably extends substantially the center panel 90. On the opposite side of the center panel 90, it extends from the side panel 92. The rim 94 is preferably substantially oriented with the land 92. At least one of the side panel 92 and the edge portion 94 includes a tab aperture to match the size of the tab 70. Such a configuration allows the end section 74 of the end 70 to extend through the tab aperture 76. Then, it is fixed in the tab hole 7 6 to hold the inner door portion 20 relative to the portion 22 in a fixed portion, as shown in FIG. 5" when the inner door portion 20 is attached to the outer door portion 22, the tab The inner door portion 20 is such that when the wafer carrier door 10 is attached to the wafer carrier: the tab 70 can be brought into contact with the wafer carrier housing 12. The shoulder 312XP between the inner door portion 20 and the wafer carrier housing 1 2 can be reduced. / Inventive Specification (Supplement) / 94-02/93133976 Internal transparent column or mesh internal shell impact and wear preferably extended The instructions. The adjustment portion 22 plate 90 is large around the middle edge portion 94 to the side surface 76, and the end portion 74 of the adjustment piece is formed at the outer door portion 70 so as to be in contact with the housing 1 2 . 10 1376008 The outer door portion 2 2 preferably also includes a plurality of corner guides 80 extending therefrom. The corner guide 80 preferably extends substantially straight from the outer door portion 2 2 as shown in FIG. The corner guides 80 are preferably oriented generally perpendicular to the edges of the outer door portions 22 adjacent the corner guides 80. Each side of the outer door portion 22 preferably includes a corner guide 80 adjacent its end. The inner door portion 20 preferably also includes a corner guide hole 82 which is shaped to fit the size of the corner guide 80. Such a configuration may allow the corner guide 80 to extend through the corner guide hole 82. When the inner door portion 20 is attached to the outer door portion 22, the corner guide 80 extends beyond the side wall 84 of the inner door portion 20. The manufacturing material of the corner guide 80 is preferably to minimize frictional engagement with the wafer carrier housing 12. With such a configuration, the frictional contact between the inner door portion 20 and the wafer carrier housing 12 can be greatly reduced. In contrast to the prior art, the corner guides are independently formed from the inner door portion and the outer door portion, and the process can also reduce the number of components. Both the inner door portion 20 and the outer door portion 2 2 are preferably formed by injection molding. The inner door portion 20 and the outer door portion 22 are preferably made of polycarbonate, polyetherimide, polyetheretherketone or other materials well known to those skilled in the art. The features and functions disclosed in the present invention, as well as those disclosed in the above-referenced application, can be combined with each other to suit a particular use. Various modifications and variations can be made by those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a wafer carrier using the door of the present invention. 11 312XP/Invention Manual (Supplement)/94-02/93133976 1376008 Figure 2 is an internal view of the wafer carrier door. Figure 3 is an external view of the wafer carrier door. Figure 4 is an enlarged view of the corner of the wafer carrier door when the inner door portion and the outer door portion are not assembled. Figure 5 is an enlarged view of the corner of the wafer carrier door when the inner door portion and the outer door portion are assembled. [Main component symbol description] 10 wafer carrier door 12 wafer carrier housing 14 wafer carrier 20 inner door portion 22 outer door portion 24 chamber 30 locking mechanism 32 elastic spacer 34 outer edge 36. rectangular groove 40 hole 42 Horizontal portion 44 Vertical portion 62 First side group 64 Central group 66 Second side group 70 Adjustment piece 312XP / Invention manual (supplement) / 94-02/93133976
12 1376008 7 2 主段 7 4 末段 7 6 調整片孔 80 門導引件 82 角落導引孔 90 中央面板 9 2 側面板 94 緣部 312XP/發明說明書(補件)/94-02/9313397612 1376008 7 2 Main section 7 4 End section 7 6 Adjustment aperture 80 Door guide 82 Corner guide hole 90 Center panel 9 2 Side panel 94 Edge 312XP / Invention manual (supplement) /94-02/93133976