101年04月11日修正替換頁 1374182 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種混合方法及系統，特別係關於一種熱 介面材料混合方法及系統。 【先前技術】 [0002] 近年來，隨著半導體器件集成工藝快速發展，半導體器 件之集成化程度愈來愈高，而器件體積卻變得愈來愈小 ，其散熱成為一個愈來愈重要之問題，其對散熱之要求 也愈來愈高。為滿足這些需要，各種散熱方式被大量運 用，如利用風扇散熱、水冷辅助散熱及熱管散熱等方式 ，並取得一定散熱效果，但由於散熱器與半導體集成器 件之接觸介面並不.平整，一般相互接觸只有不到2%面積 ，沒有理想各接觸介面，從根本上極大地影響了半導體 器件向散熱器進行熱傳遞之效果，因此於散熱器與半導 體器件之接觸介面間增加一導熱係數較高之熱介面材料 來增加介面之接觸程度就顯得十分必要。 [0003] 為獲得較佳之導熱性能，傳統之熱介面材料將一些導熱 係數較高之微粒，如石墨、氮化硼、氧化矽.、氧化鋁、 銀等材料之微粒，與聚合物材料混合，以形成複合熱介 面材料。 [0004] 傳統複合熱介面材料混合系統包括一混合容器、及一與 該混合容器相配合之攪拌裝置。所述攪拌裝置之攪拌端 通常採用複數攪拌葉片。使用時，將基體材料及導熱顆 粒置於所述混合容器中，藉由攪拌裝置之複數攪拌葉片 之旋轉以攪拌所述基體材料及導熱顆粒，使其混合以形 0941398#單編號删1 第3頁/共16頁 1013135290-0 1374182 101年.04月11日修正替换頁 成熱介面材料。由此形成之熱介面材料之導熱性能在很 大程度上取決於基體材料之性質。其中以油脂、相變材 料為基體之複合材料因其使用時為液態而能與熱源表面 浸潤故接觸熱阻較小，而以矽膠與橡膠為基體之複合材 料之接觸熱阻就比較大。這些材料之普遍缺陷係整個材 料導熱係數比較小，典型值在1瓦/米·開爾文（W/m · K) ，已經愈來愈不能適應半導體集成化程度之提高對散熱 之需求，而增加基體材料中導熱顆粒之含量使顆粒與顆 粒儘量相互接觸可以增加整個複合材料之導熱係數，如 某些特殊熱介面材料因此可達到4-8W/m · K。 [0005] 上述熱介面及材料混合裝置進行較高比例之導熱顆粒基 體材料混合時，則會造成整個熱介面材料之黏度過高， 攪拌困難，甚至混合材料全部黏附於攪拌轉子上，使所 述熱介面材料混合系統無法正常使用，導致熱介面材料 無法混合均勻，傳熱性能大大降低。 [0006] 有鑒於此，提供一種可將較高比例之導熱顆粒及基體材 料均勻混合之熱介面材料混合方法及系統實為必要。 【發明内容】 [0007] 以下，將以實施例說明一種可將較高比例之導熱顆粒及 基體材料均勻混合之熱介面材料混合方法及系統。 [0008] 一種熱介面材料混合方法，其包括：由底部向一混合容 器内鼓吹氣體；向該混合容器内通入粉末狀導熱顆粒， 使其隨所述氣體分散；藉由喷料頭向該混合容器内喷射 液狀基體材料，使該基體材料與所述導熱顆粒充分接觸 :自該混合容器側壁之出料口排出經過充分接觸之基體 09413980产單编號 A〇101 第4頁/共16頁 1013135290-0 1374182 101年.04月11日修正替換頁 材料與導熱顆粒，即獲得熱介面材料；藉由該輾壓裝置 對該熱界面材料辍壓，以獲得片狀熱介面材料。 [0009] 以及，一種熱介面材料混合系統，其包括：一混合容器 ，具有一漏斗狀底部；一進氣口，設於所述混合容器之 漏斗狀底部，用於向該混合容器内鼓入氣體；一進料口 ，設於所述混合容器側壁；至少一喷料頭，用於向所述 鼓入之氣體喷料；一出料口，設於所述混合容器側壁， 以排出混合後之產物；一輾壓裝置，用於輾壓混合後之 產物5以獲得片狀熱介面材料。 [0010] 相較於先前技術，所述熱介面材料混合方法中藉由氣流 帶動導熱顆粒分散，再藉由喷料頭使基體材料成霧狀分 散，以與導熱顆粒充分接觸，可均勻混合較高比例之導 熱顆粒與基體材料，形成導熱性能優良之熱介面材料， 避免先前技術中進行較高比例之導熱顆粒及基體材料混 合時難以攪拌而導致該二者分佈不均之現象。 【實施方式】 [0011] 下面將結合附圖對本發明作進一步詳細說明。 [0012] 請參閱第一圖，本發明較佳實施例之熱介面材料混合系 統1包括：一混合容器1 5，具有一漏斗狀底部1 51 ;該漏 斗狀底部151開設一用於通入氣流之進氣口 1 7，該進氣口 17由進氣口閥門171控制；該混合容器15側壁設置一進料 口 13，該進料口 13由進料口閥門131控制；至少一喷料頭 14，該喷料頭14設置於所述混合容器15頂端；所述混合 容器15側壁設置一出料口 16，用於排出均勻混合後之熱 〇 介面材料1 〇。 1013135290-0 094139801^單編號A〇1〇l 第5頁/共16頁 1374182MODIFICATION OF REPLACEMENT PAGE 1374182 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a mixing method and system, and more particularly to a method and system for mixing a thermal interface material. [Prior Art] [0002] In recent years, with the rapid development of semiconductor device integration processes, the integration of semiconductor devices has become higher and higher, and the device size has become smaller and smaller, and heat dissipation has become an increasingly important one. The problem is that the requirements for heat dissipation are getting higher and higher. In order to meet these needs, various heat dissipation methods have been widely used, such as fan cooling, water cooling, heat dissipation, and heat pipe cooling, and have achieved a certain heat dissipation effect, but the contact interface between the heat sink and the semiconductor integrated device is not flat, generally mutual The contact area is less than 2%, and there is no ideal contact interface, which fundamentally greatly affects the heat transfer effect of the semiconductor device to the heat sink. Therefore, a thermal conductivity is increased between the contact surface of the heat sink and the semiconductor device. Thermal interface materials are necessary to increase the degree of interface contact. [0003] In order to obtain better thermal conductivity, the conventional thermal interface material mixes some particles with higher thermal conductivity, such as particles of graphite, boron nitride, cerium oxide, aluminum oxide, silver, etc., with the polymer material. To form a composite thermal interface material. [0004] A conventional composite thermal interface material mixing system includes a mixing vessel and a stirring device cooperating with the mixing vessel. The agitating end of the agitating device usually employs a plurality of agitating blades. In use, the base material and the heat conductive particles are placed in the mixing container, and the base material and the heat conductive particles are stirred by the rotation of the plurality of stirring blades of the stirring device, and mixed to form a shape of 0941398#. Page / Total 16 pages 1013135290-0 1374182 101 years. April 11 revised the replacement page into a thermal interface material. The thermal conductivity of the thermal interface material thus formed depends to a large extent on the nature of the matrix material. Among them, the composite material based on grease and phase change material can be infiltrated with the surface of the heat source because it is liquid in use, so the contact thermal resistance is small, and the contact heat resistance of the composite material based on silicone rubber and rubber is relatively large. The common defect of these materials is that the thermal conductivity of the whole material is relatively small, typically 1 W/m·Kelvin (W/m · K), which has become increasingly incapable of adapting to the increase in semiconductor integration and the need for heat dissipation. The amount of thermally conductive particles in the material allows the particles and particles to contact each other as much as possible to increase the thermal conductivity of the entire composite, such as some special thermal interface materials, which can reach 4-8 W/m·K. [0005] When the above-mentioned thermal interface and material mixing device are mixed with a relatively high proportion of the heat conductive particle base material, the viscosity of the entire thermal interface material is too high, the stirring is difficult, and even the mixed material is all adhered to the stirring rotor, so that The thermal interface material mixing system cannot be used normally, resulting in the thermal interface material not being uniformly mixed and the heat transfer performance being greatly reduced. In view of the above, it is necessary to provide a method and system for mixing a thermal interface material which can uniformly mix a relatively high proportion of thermally conductive particles and a matrix material. SUMMARY OF THE INVENTION [0007] Hereinafter, a method and system for mixing a thermal interface material which can uniformly mix a relatively high proportion of thermally conductive particles and a matrix material will be described by way of examples. [0008] A method of mixing a thermal interface material, comprising: blowing a gas from a bottom into a mixing container; introducing powdery thermally conductive particles into the mixing container to disperse with the gas; The liquid material is sprayed into the mixing container to make the base material in full contact with the heat conductive particles: the substrate which is in sufficient contact with the outlet of the side wall of the mixing container is discharged, and the number of the substrate is 09413980. Page 1013135290-0 1374182 101. On April 11th, the replacement page material and the thermally conductive particles are corrected, that is, the thermal interface material is obtained; the thermal interface material is pressed by the rolling device to obtain a sheet-like thermal interface material. [0009] Also, a thermal interface material mixing system comprising: a mixing container having a funnel-shaped bottom; an air inlet disposed at a funnel-shaped bottom of the mixing container for bubbling into the mixing container a gas inlet; a feed port disposed on the side wall of the mixing container; at least one spray head for spraying the gas into the drum; and a discharge port disposed on the side wall of the mixing container for discharging and mixing a product; a rolling device for rolling the mixed product 5 to obtain a sheet-like thermal interface material. [0010] Compared with the prior art, in the method of mixing the thermal interface material, the heat conductive particles are dispersed by the air flow, and the base material is dispersed in a mist by the spray head to fully contact the heat conductive particles, and the mixture can be uniformly mixed. A high proportion of the heat-conducting particles and the base material form a thermal interface material with excellent thermal conductivity, which avoids the phenomenon that the prior art is difficult to stir when a high proportion of the heat-conductive particles and the matrix material are mixed, resulting in uneven distribution of the two. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings. [0012] Referring to the first drawing, the thermal interface material mixing system 1 of the preferred embodiment of the present invention comprises: a mixing container 15 having a funnel-shaped bottom portion 151; the funnel-shaped bottom portion 151 defines a flow for opening The air inlet 17 is controlled by the air inlet valve 171; the side wall of the mixing container 15 is provided with a feed port 13 controlled by the inlet port valve 131; at least one spray head 14. The spray head 14 is disposed at the top end of the mixing container 15; a discharge port 16 is disposed on the side wall of the mixing container 15 for discharging the uniformly mixed thermal interface material 1 〇. 1013135290-0 094139801^单单A〇1〇l Page 5 of 16 1374182
[ΐ〇1年_〇4月11日修正眷換頁I[ΐ〇1年_〇April 11th Amendment眷Change page I
[0013] 所述混合容器15之漏斗狀底部151可為正圓錐狀、斜圓錐 狀、正棱錐狀或斜棱錐狀等，使得混合容器15内物料沈 落時由其傾斜之側壁滑向進氣口 17，本實施例中，漏斗 狀底部151設為圓錐狀》 [0014] 所述喷料頭14包括一個或一個以上，可選擇性設置於所 述混合容器15頂端、側壁或漏斗狀底部151。 [0015] 優選的’該出料口 16軸線傾斜向下，便於出料。 [0016] 優選的，熱介®材料混合系統1進一步包括一輾壓裝置2 ，該輾壓裝置2包括：一傳送裝置，即傳送帶22，用於傳 送由出料口 161輸出之熱介面材料1〇 ; —上壓件，即上滾 輪20 ;及一與該上滚輪2〇相配合輾壓之下壓件，即下滾 輪21 ; —括取裝置，即括刀23，用於刮取經上述兩滾輪 20、21輾壓成片而附著於傳送帶22上表面之片狀熱介面 材料10’ ：一收集器24 ’用於收集到刀23刮取之片狀熱 介面材料10’成品。 [0017] 請一併參閱第一圖及第二圖，使用上述熱介面材料混合 系統1混合作為熱介面材料原料之基體材料丨8及導熱顆粒 19時’可採用以下操作步驟： [0018] ·步驟101，由底部向混合容器15内鼓吹體11。具體的， 由進氣口 17向混合容器15内吹入氣體11，由於該氣體h 由進氣口 17高速吹入混合容器15，該高速氣體11具有一 向上速度而以直線上升，直至該氣體11在自身重力作用 下’其向上速度逐漸減小為零，該氣體11再向四周分散 ，並逐漸向壓力較低之下方流動，°最终形成循環氣流。 09413980^單编號 A0101 第6頁/共16頁 1013135290-0 1374182 101年.04月11日修正替換頁 [0019] 步驟102，由進料口 13向混合容器15内通入粉末狀導熱顆 粒19，使其隨所述氣體11分散。此時，粉末狀導熱顆粒 19在上述循環氣流帶動下，於混合容器15内循環流動而 達成分散狀態。 [0020] 步驟103，藉由噴料頭14向該鼓入氣體11内噴射液狀基體 材料18，使該基體材料18與所述導熱顆粒19充分接觸。 藉由喷料頭14向鼓入氣體11噴射基體材料18，使基體材 料18於混合容器15内以霧狀均勻分散。循環流動而分散 之粉末狀導熱顆粒19與霧狀均勻分散之基體材料18於混 合容器15内充分接觸，從而達成該二者均勻混合。 [0021] 步驟1G4，充分接觸後之基體材料18與導熱顆粒19自該混 合容器15之出料口 16排出，即獲得熱介面材料10。基體 材料18及導熱顆粒19之混合物在上述循環氣流作用下， 有些自出料口 16排出，即獲得基體材料18與導熱顆粒19 混合均勻之熱介面材料1 0，未由出料口 1 6排出之混合物 ，隨上述循環氣流進入下一次循環。 [0022] 優選的，還可藉由輾壓裝置2對熱介面材料10進行一輾壓 操作，以獲得片狀熱介面材料10’成品，該輾壓操作具 體包括下列步驟： [0023] 首先，自出料口 16排出之熱介面材料10在自身重力之作 用下，落至循環傳送之傳送帶22上，當該傳送帶22將熱 介面材料10傳送至滾輪20、21處時，在滾輪20、21相配 合之機械輾壓作用下，如第三圖所示，熱介面材料10分 別承受上滾輪20之向下作用力F1及下滚輪21之向上作用 094139801^單編號 A〇101 第7頁/共16頁 1013135290-0 1374182 ιοί年〇4月11日修正替换π 力F2 ’在此二力作用下，均勻混合於基體材料18内之導 熱顆粒19將以更密集的方式均勻分佈於基體材料18内， 且原本露出基體材料18外之導熱顆粒19將被完全包覆於 基體材料18内’從而，經過該輾壓過程後，導熱顆粒19 將以高密度、高均勻性分佈於基體材料18 ，形成片狀熱 介面材料10’成品（如第四圖所示）。 [0024] 然後，用括刀23刮取經上述兩滾輪20、21輾壓成片而附 著於傳送帶22上表面之熱介面材料1〇，，再用收集器24 收集刮刀23到取之熱介面材料1〇，片狀成品。 [0025] 上述向混合容器15内通入粉末狀導熱顆粒19，與向該混 合容器15内喷射液狀基體材料18之步驟，亦可同時或反 序進行。 [0026] 當持續由進料口 13輸入粉末狀導熱顆粒19、及由喷料頭 14噴射霧狀基體材料18，並不斷由進氣口 17鼓入氣體11 時’即可實現片狀熱介面材料10’成品之連續生產》 [0027] 對所述吹入之氣體n，僅需滿足不與熱介面材料混合系 統1之材質、基體材料18及導熱顆粒19反應之氣體即可適 用’例如空氣、氮氣、氖氣或氬氣等氣體。 [0028] 所述基體材料18與導熱顆粒19之質量比可為1 : 3至1 : 5 ’可藉由對基體材料18與導熱顆粒19之進料流量之控制 而達成所述質量比。 [0029] 所述基體材料18選自矽油（Silicone Oil)或聚乙二醇 (PEG，Polyethylene Glycol)等材料》 094139801^單編號 A〇101 第8頁/共16頁 1013135290-0 1374182 [0030] 101年04月ll·日修正脊&頁 所述導熱顆粒19之材料選自銀（Ag)、氮化硼（BN)或氧化 鋁（ai2〇3)等。 [0031]综上Μ述，本發明確已符合發明專利之要件，遂依法提 出專剎申請β惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0032] 第一圖係本發明較佳實施例熱介面材料混合系統之示意 圖。 [0033] 第二圖係本發明較佳實施例熱介面材料混合方法流程圖 [0034] 第三圖係本發明較佳實施例.熱介面材料承受輾壓時之受 力示意圖。 [0035] 第四圖係本發明較佳實施例熱介面材料報壓後結構示意 圖。 【主要元件符號說明】 [0036] 熱介面材料混合系統 1 氣體11 [0037] 進料口 13 進料口閥門131 [0038] 喷料頭14 混合容器 15 [0039] 漏斗狀底部 151出料口 16 [0040] 進氣口 17 進氣口閥門 171 〇941398〇产·單编號i Α0101 第9頁/共16頁 1013135290-0 1374182 101年04月11日修正替換頁 [0041] 基體材料18導熱顆粒19 [0042] 熱介面材料10片狀熱介面材料10’ [0043] 輾壓裝置2上滾輪20 [0044] 下滾輪 21傳送帶22 [0045] 刮刀23收集器24 094139801^單编號 A〇101 第10頁/共16頁 1013135290-0[0013] The funnel-shaped bottom 151 of the mixing container 15 may be a regular conical shape, a slanted conical shape, a regular pyramid shape or a pyramidal shape, etc., so that the material in the mixing container 15 is slid toward the air inlet by the inclined side wall when it sinks. The mouth 17, in the present embodiment, the funnel-shaped bottom 151 is formed in a conical shape. [0014] The spray head 14 includes one or more, which may be selectively disposed at the top end of the mixing container 15, the side wall or the funnel-shaped bottom 151. . [0015] Preferably, the discharge port 16 is inclined downward to facilitate discharge. [0016] Preferably, the heat medium material mixing system 1 further comprises a rolling device 2, the rolling device 2 comprising: a conveying device, that is, a conveyor belt 22 for conveying the thermal interface material 1 outputted from the discharge port 161上; - the upper pressing member, that is, the upper roller 20; and a pressing member that is pressed against the upper roller 2 辗, that is, the lower roller 21; - a fitting device, that is, a knife 23 for scraping through the above two The roller 20, 21 is rolled into a sheet and attached to the upper surface of the conveyor belt 22 by a sheet-like thermal interface material 10': a collector 24' for collecting the sheet-like thermal interface material 10' scraped off by the blade 23. [0017] Please refer to the first figure and the second figure together. When the above-mentioned thermal interface material mixing system 1 is used to mix the base material 丨8 and the heat conductive particles 19 as raw materials of the thermal interface material, the following operation steps can be adopted: [0018] In step 101, the body 11 is blown from the bottom into the mixing container 15. Specifically, the gas 11 is blown into the mixing container 15 from the gas inlet port 17, and the gas h is blown into the mixing container 15 at a high speed by the gas inlet port 17, and the high velocity gas 11 has an upward velocity and rises straight until the gas 11 Under its own gravity, its upward velocity gradually decreases to zero, and the gas 11 is dispersed to the periphery and gradually flows downward to the lower pressure, and finally forms a circulating airflow. 09413980^单编号A0101 Page 6/16 pages 1013135290-0 1374182 101. April 11th Revision Replacement Page [0019] Step 102, the powdery heat conductive particles 19 are introduced into the mixing container 15 from the feed port 13 It is dispersed with the gas 11. At this time, the powdery heat-conductive particles 19 are circulated and flowed in the mixing container 15 by the above-mentioned circulating air flow to reach a dispersed state. [0020] Step 103, the liquid material 18 is sprayed into the blasting gas 11 by the spray head 14, and the base material 18 is brought into full contact with the heat conductive particles 19. The base material 18 is sprayed onto the blasting gas 11 by the spray head 14, so that the base material 18 is uniformly dispersed in the mist in the mixing container 15. The powdery heat-conductive particles 19 which are circulated and dispersed are sufficiently contacted with the mist-like uniformly dispersed base material 18 in the mixing container 15, thereby achieving uniform mixing of the two. [0021] In step 1G4, the sufficiently contacted base material 18 and the thermally conductive particles 19 are discharged from the discharge port 16 of the mixing container 15, that is, the thermal interface material 10 is obtained. The mixture of the base material 18 and the heat conductive particles 19 is discharged from the discharge port 16 by the above-mentioned circulating air flow, that is, the heat interface material 10 which is uniformly mixed with the base material 18 and the heat conductive particles 19 is not discharged from the discharge port 16 The mixture, with the above circulating gas stream, enters the next cycle. [0022] Preferably, the hot interface material 10 can be subjected to a rolling operation by the rolling device 2 to obtain a sheet-like thermal interface material 10' finished product, and the rolling operation specifically includes the following steps: [0023] First, The thermal interface material 10 discharged from the discharge port 16 falls under the action of its own gravity onto the conveyor belt 22 which is circulated, and when the conveyor belt 22 conveys the thermal interface material 10 to the rollers 20, 21, on the rollers 20, 21 Under the action of mechanical rolling, as shown in the third figure, the thermal interface material 10 is respectively subjected to the downward force F1 of the upper roller 20 and the upward action of the lower roller 21, 094139801^, single number A〇101, page 7 / total 16 pages 1013135290-0 1374182 ιοί年〇11月11 Revision replacement π force F2 'Under this two forces, the thermally conductive particles 19 uniformly mixed in the matrix material 18 will be evenly distributed in the matrix material 18 in a more dense manner And the heat conductive particles 19 which are originally exposed outside the base material 18 will be completely covered in the base material 18'. After the rolling process, the heat conductive particles 19 will be distributed to the base material 18 with high density and high uniformity, forming Flaky hot media The finished material 10' is finished (as shown in the fourth figure). [0024] Then, the heat interface material 1〇 which is pressed into the sheet by the two rollers 20 and 21 and adhered to the upper surface of the conveyor belt 22 is scraped off by the cutter 23, and then the scraper 23 is collected by the collector 24 to take the heat interface material. 1〇, a sheet of finished product. [0025] The step of introducing the powdery heat conductive particles 19 into the mixing container 15 and spraying the liquid substrate material 18 into the mixing container 15 may be performed simultaneously or in reverse. [0026] When the powdery heat-conducting particles 19 are continuously fed from the feed port 13, and the mist-like base material 18 is sprayed by the spray head 14, and the gas 11 is continuously blown in from the air inlet 17, the sheet-shaped heat interface can be realized. Continuous Production of Material 10' Finished Product [0027] For the gas to be blown n, it is only necessary to satisfy a gas that does not react with the material of the thermal interface material mixing system 1, the base material 18, and the heat conductive particles 19, for example, air. Gas such as nitrogen, helium or argon. [0028] The mass ratio of the base material 18 to the thermally conductive particles 19 may be 1:3 to 1:5' to achieve the mass ratio by controlling the feed flow rate of the base material 18 and the thermally conductive particles 19. [0029] The base material 18 is selected from the group consisting of Silicone Oil or polyethylene glycol (PEG, Polyethylene Glycol) and the like. 094139801^Single number A〇101 Page 8/16 pages 1013135290-0 1374182 [0030] The material of the thermally conductive particles 19 described in the revised ridge & page 101 is selected from the group consisting of silver (Ag), boron nitride (BN) or alumina (ai2〇3). [0031] In summary, the present invention has indeed met the requirements of the invention patent, and the application for the special application of the law is based on the law. The above is only a preferred embodiment of the present invention, and the patent application of the case cannot be limited thereby. range. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0032] The first drawing is a schematic view of a preferred embodiment of a thermal interface material mixing system in accordance with the present invention. [0033] The second drawing is a flow chart of a method for mixing a thermal interface material according to a preferred embodiment of the present invention. [0034] The third drawing is a schematic view of a preferred embodiment of the present invention. [0035] The fourth figure is a schematic view of the structure of the hot interface material after the pressure is reported in the preferred embodiment of the present invention. [Main Component Symbol Description] [0036] Thermal Interface Material Mixing System 1 Gas 11 [0037] Feed Port 13 Feed Port Valve 131 [0038] Spray Head 14 Mixing Container 15 [0039] Funnel-shaped bottom 151 discharge port 16 [0040] Intake port 17 Inlet port valve 171 〇 941398 〇 · 单 单 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 101 004 004 004 004 004 004 004 004 004 004 004 004 004 004 004 004 004 004 19 [0042] Thermal Interface Material 10 Sheet Thermal Interface Material 10' [0043] Rolling Device 2 Upper Roller 20 [0044] Lower Roller 21 Transfer Belt 22 [0045] Scraper 23 Collector 24 094139801^Single Number A〇101 10 pages / total 16 pages 1013135290-0