九、發明說明： 【發明所屬之技術領域】 本發明係關於一種液晶顯示裝置及其製作方法，特別是 關於一種與補強結構有關之液晶顯示裝置及其製作方法。 【先前技術】 在液晶顯示器大型化的發展潮流與可攜式電子裝置輕 里化的要求下’玻璃基板的薄型化、輕量化已經是不可避 免的趨勢。玻璃基板之使用主流厚度從1995年的1丨毫米演 變至今的0.7毫米。在玻璃基板之發展上，到目前為止厚度 更降低至0_4毫米以下，玻璃基板的輕量薄型化不僅可減輕 基板的重量，更可以降低玻璃基板的内部缺陷、生產成本 以及提高製造良率。以行動裝置如手機、個人數位助理器 (Portable Digital Assistant ; PDA )或筆記型電腦等而言， 若使用板厚0.5毫米之玻璃基板取代目前主流之〇7毫米的 情形下’前述裝置所使用之玻璃基板重量可減少35〇/〇。 儘管使用較薄之玻璃基板有許多的益處，但是由於玻璃 基板的硬脆性質，較薄之玻璃基板在受碰擊時容易破損。 況且在薄膜電晶體液晶顯示器模組中’安設積體電路元件 與可挽性印刷電路板（Fiexibie Print Circuit ; FPC)之底 層玻璃基板為單一層板。因此，當使用較薄之玻璃基板時， 在做積體電路元件與可撓性印刷電路板之接合製程時可能 會發生玻璃基板承受不住接合之應力導致破損，此一問題 將使生產良率降低，甚至成本提高。另外，較薄之玻璃基 板安裝於模組時亦可能因震動而導致玻璃基板承受應力， 1373660 導致破損機率提高。 除了應力的問題之外，以玻璃基材熱膨脹係數與積體電 路元件之熱膨脹係數不同導致翹曲（Warpag〇的情形，在 使用較薄之基板更顯嚴重。 上述問題是由於產品追求薄型化、輕量化而產生因此 採用之解決手段必須兼顧產品薄型化、輕量化之目標。本 發明即對上述問題並兼顧產品發展之趨勢提出一解決方 案。 【發明内容】 本發明提供-種液晶顯示裝置及其製作方法，利用補強 結構以防止製作過程中以及安裝於模組後液晶基板之損 壞，從而提昇生產良率、產品穩定性及可靠度。另—方面， 藉由本發明之補強設計，可適用於玻璃基板之薄型化發 展，例如玻璃基板之厚度小於或等於〇4毫米的情況。 本發明之液晶顯示裝置包含_基板及—補強件。基板包 含-顯示區和—非顯示區’其中該非顯示區包含一上表面 二口與該上表面相對應之—τ表面。補強件係設置在非顯示 區之下表面，用以補強該基板之該非顯示區。 -實施例中，補強件與基板可以黏膠接合。該非顯示區 之上表面包含複數個電極墊，用以連接積體電路元件，或 連接軟性電路板以提供與外部電性接合之用。 本發明之液晶顯示器之製作方法係先行提供_基板及 一補強件，其中該基板包含一顯示區和一非顯示區，而該 非』不區包含一下表面。之後將該補強件膠合設置在對應 於該非顯示區位置之該下表面上，用以補強該非顯示區。 【實施方式】 。。。 圖1顯示本發明一實施例之液晶顯示器透視圖。液晶顯示 器之原理係以施電壓於薄膜電晶體上來操縱液晶之轉向， 藉以控制來自背光模組之光線是否得以通過而到達顯示像 素上。薄膜電晶體被製作於一基板丨丨上顯示區12之上表面 18,該基板11係為一顯示器模組之下玻璃基板。顯示區 之上表面18包含複數個由薄膜電晶體所構成且以陣列式排 列之畫素，而液晶顯示器之顯像係以控制著這些畫素來達 成。畫素之控制需藉由積體電路元件15 ( Integrated Circuit ; 1C)來達成，而其控制係由依照外界指令來決定 施加於晝素上之電壓。電壓之施加係透過縱向與橫向排列 之信號線與閘線。由於晝素位在顯示區12中，要讓位在顯 示區12外之1C元件15得以控制畫素，則必須在顯示區12外 設置一些電極墊（Pad) 13以提供1C元件15和軟性電路板 (FPC) 16與信號線和閘線做電性接合。通常該些電極墊 13被放置在非顯示區14之上表面19(第一表面）上。IC元件 15則可以是以帶狀自動化黏合構裝（Tape Aut〇mated Bonding ; TAB )、晶粒軟膜接合（Chip 〇n Film ; c〇F )、 晶粒玻璃接合（Chip on Glass ; COG)等方式將iC元件15 接合至電極墊13上，使IC元件15得以驅動顯示區12内之晝 素；而外部之控制訊號或電源訊號則可利用接合之軟性電 路板16將訊號導入。 隨著液晶顯示器之輕薄發展’使用之基板丨丨厚度也變 1373660 J，例如基板11之厚度可能小於或等於〇 4毫米例如U 毫米0.3毫米、〇·2毫米、〇」毫米或者〇 〇3毫米等，這使 付位在基板u邊緣之非顯示區14在從事元件u或軟性電 路板16之接合製程時，會面臨到非顯示區部份之基板可 能無法承受接合力量所產生之應力而導致破損使產品的 良率降低，而且，即使完成顯示器模組之後，也容易因震 動導致基板11承受應力而破損。對此產品發展上所產生之[Technical Field] The present invention relates to a liquid crystal display device and a method of fabricating the same, and more particularly to a liquid crystal display device related to a reinforcing structure and a method of fabricating the same. [Prior Art] Under the trend of the large-scale development of liquid crystal displays and the demand for lighter portable electronic devices, the thinning and weight reduction of glass substrates are inevitable. The mainstream thickness of the glass substrate has been changed from 1 mm in 1995 to 0.7 mm. In the development of the glass substrate, the thickness has been reduced to below 0 to 4 mm, and the lightweight and thin glass substrate can not only reduce the weight of the substrate, but also reduce the internal defects of the glass substrate, the production cost, and the manufacturing yield. For mobile devices such as mobile phones, Portable Digital Assistants (PDAs) or notebook computers, if a glass substrate with a thickness of 0.5 mm is used instead of the current mainstream 〇 7 mm, the device used in the previous device The weight of the glass substrate can be reduced by 35 〇 / 〇. Although the use of a thinner glass substrate has many benefits, the thinner glass substrate is susceptible to breakage when struck due to the hard and brittle nature of the glass substrate. Moreover, in the thin film transistor liquid crystal display module, the integrated circuit element and the underlying glass substrate of the fabric board (Fisibie Print Circuit; FPC) are a single layer. Therefore, when a thin glass substrate is used, it may occur that the glass substrate cannot withstand the stress caused by the bonding during the bonding process of the integrated circuit component and the flexible printed circuit board, and this problem will result in a production yield. Reduce, even increase costs. In addition, when the thin glass substrate is mounted on the module, the glass substrate may be stressed due to vibration, and the 1373660 may cause an increase in the probability of damage. In addition to the problem of stress, warpage is caused by the difference in thermal expansion coefficient of the glass substrate and the thermal expansion coefficient of the integrated circuit component (Warpag〇 is more serious in the use of a thinner substrate. The above problem is due to the pursuit of thinning of the product, Therefore, the present invention provides a solution for the above problems and taking into account the trend of product development. [Invention] The present invention provides a liquid crystal display device and a liquid crystal display device. The manufacturing method utilizes a reinforcing structure to prevent damage of the liquid crystal substrate during the manufacturing process and after mounting on the module, thereby improving production yield, product stability and reliability. On the other hand, the reinforcing design of the present invention can be applied to The thinning of the glass substrate, for example, the case where the thickness of the glass substrate is less than or equal to 〇4 mm. The liquid crystal display device of the present invention comprises a substrate and a reinforcing member. The substrate includes a display area and a non-display area, wherein the non-display area The upper surface includes a surface corresponding to the upper surface - a surface of the τ. The non-display area is disposed on the lower surface of the non-display area for reinforcing the non-display area of the substrate. In the embodiment, the reinforcing member and the substrate may be adhesively bonded. The upper surface of the non-display area includes a plurality of electrode pads for connecting the integrated body. The circuit component, or the flexible circuit board is connected to provide external electrical connection. The liquid crystal display manufacturing method of the present invention provides a substrate and a reinforcing member, wherein the substrate comprises a display area and a non-display area, and The non-" region includes a surface. The reinforcing member is then glued on the lower surface corresponding to the non-display area to reinforce the non-display area. [Embodiment] FIG. 1 shows an embodiment of the present invention. The liquid crystal display is based on the principle of applying a voltage to the thin film transistor to manipulate the steering of the liquid crystal to control whether light from the backlight module passes through to the display pixel. The thin film transistor is fabricated on a substrate. The upper surface 18 of the upper display area 12 is a glass substrate under a display module. The upper surface 18 of the display area A plurality of pixels consisting of thin film transistors arranged in an array, and the imaging of the liquid crystal display is controlled by controlling the pixels. The control of the pixels is performed by the integrated circuit component 15 (Integrated Circuit; 1C). The control is based on the external command to determine the voltage applied to the element. The voltage is applied through the longitudinal and laterally arranged signal lines and gate lines. Since the element is in the display area 12, The 1C element 15 located outside the display area 12 is allowed to control the pixels, and some electrode pads (Pad) 13 must be disposed outside the display area 12 to provide the 1C element 15 and the flexible circuit board (FPC) 16 with the signal lines and the gate lines. Electrically bonding. Usually, the electrode pads 13 are placed on the upper surface 19 (first surface) of the non-display area 14. The IC element 15 may be a tape-shaped automated bonding structure (TAB). The iC element 15 is bonded to the electrode pad 13 in a manner such as chip 〇n film (c〇F), chip on glass (COG), etc., so that the IC element 15 is driven into the display area 12.昼素; and external control Or the power signal can be joined using the flexible circuit board 16 will be introduced into the signal. With the light and thin development of liquid crystal displays, the thickness of the substrate used has also changed to 1373660 J. For example, the thickness of the substrate 11 may be less than or equal to 〇4 mm, such as U mm 0.3 mm, 〇·2 mm, 〇 mm or 〇〇3 mm. In this way, when the non-display area 14 of the edge of the substrate u is engaged in the bonding process of the component u or the flexible circuit board 16, the substrate of the non-display area may not be able to withstand the stress generated by the bonding force. The damage causes the yield of the product to be lowered, and even after the display module is completed, the substrate 11 is easily damaged by the vibration and is damaged. The development of this product
問題，本實施例揭示一補強件17，利用此一補強件17分散 承又外卩電性接合時或者震動時所產生之應力使該處之 土板11知以承受接合時或者震動時之力量。補強件1 7係設 置在基板11上非顯示區14中與上表面19相對應面之下表面 20(第二表面）’且涵蓋整個側邊。 圖2顯示圖1沿2-2線之剖面示意圖。iC元件丨5與基板工i 上之電極墊13之接合是將ic元件15上之凸塊21以熱壓之方 式壓合於舖設在電極墊13上之異方性導電膠膜22 (Anisotropic Conductive Film)。異方性導電膠膜22中含 有用以導通電流用之導電粒子’要獲得較佳之導通電流， 則必須在熱壓時施以一定強度之壓力使在凸塊2丨與電極塾 13間之導電粒子被適度地擠塵或變形。除了壓力之外，高 達160°C-220°C間之壓合溫度同樣會產生不小之問題。以玻 璃為材料之基材11之熱膨服係數約為4ppm/°C，而一般ic 元件15之熱膨脹係數約為3ppm/°C而言，因熱膨脹係數之 不同導致起曲的情形在使用較薄之基板11更顯嚴重。軟性 電路板16之接合係將其上之金屬線23熱壓在異方性導電膠 1373660^ 膜22上，同樣地熱壓力量也容易對較薄基材丨丨邊緣造成損 壞。如本實施例所揭示，將一補強件17設置在非顯示區14 之下表面20，以強化非顯示區14在接合製程時所需之強度 以及安裝於模組後之穩定性。補強件17所使用之材質可為 非金屬材料或金屬材料。非金屬材料可包含如聚曱基丙烯 酸甲酯（Polymethylmethacrylate ; PMMA )、聚碳酸酯 (Polycarbonate ; PC)或玻璃；金屬材料可包含不銹鋼及 铭合金。不銹鋼可選自如SUS 304或SUS 403等不錄鋼材 料。補強件17係以黏膠24固定在非顯示區14之下表面2〇 上，其中該黏膠24包含如矽膠（Silicone)、紫外線固化膠 (UV glue )、熱固化膠、壓克力膠（Acryiic glue )或環氧 樹脂。 本發明所揭示之技術，係以解決產品輕薄化所產生之問 題’解決之方法以不影響此發展之目標為佳，所以需考量 到使用補強件17之厚度te。一下偏光板25貼合在顯示區12 之下表面30，而位在背光模組26上之光學膜27以一預定距 離d平行設置在其相對位置，且該光學膜27係對應該顯示區 12°光學膜27例如是棱鏡片、擴散片或增亮膜等。該固定 距離d在不同模組設計下，會有不同之數值，所以非一固定 值。在本實施例中，補強件17之厚度^以小於下偏光板25 之厚度tp與該固定距離d之總和值為佳》雖在本實施例以 COG為例，但本發明所揭示之技術不限定於c〇G上之應 用’例如亦可以使用TAB或者COF等接合方式。 設置於顯示區12上之彩色濾光片28係使液晶顯示器藉空 丄373660 間混色技術來得到全彩化顯示功能。由背光模組26發射出 來的光’透過紅、藍、綠彩色濾光片28後形成三種色彩光 源°藉控制薄膜電晶體電壓強度使三種色彩光源變化，而 顯現出不同顏色及亮度之畫素。 光偏極化方向相互垂直之下偏光板25和上偏光板29相配 合’再加上以薄膜電晶體來控制液晶分子之扭轉，達到明The problem is that the reinforcing member 17 is disclosed by the present embodiment. The reinforcing member 17 is used to disperse the stress generated during the external electrical connection or the vibration, so that the soil plate 11 at the place can be subjected to the force of the joint or the vibration. . The reinforcing member 17 is disposed on the lower surface 20 (second surface)' of the non-display area 14 on the substrate 11 corresponding to the upper surface 19 and covers the entire side. Figure 2 is a cross-sectional view taken along line 2-2 of Figure 1. The bonding of the iC element 丨5 to the electrode pad 13 on the substrate i is to press the bump 21 on the ic element 15 to the anisotropic conductive film 22 (Anisotropic Conductive) laid on the electrode pad 13 by means of hot pressing. Film). The anisotropic conductive film 22 contains conductive particles for conducting current. To obtain a better on-current, it is necessary to apply a certain strength to the conductive between the bump 2 and the electrode 13 during hot pressing. The particles are moderately dusted or deformed. In addition to the pressure, a press temperature of between 160 ° C and 220 ° C is also a problem. The thermal expansion coefficient of the substrate 11 made of glass is about 4 ppm/° C., and the thermal expansion coefficient of the general ic element 15 is about 3 ppm/° C., due to the difference in thermal expansion coefficient, the occurrence of the bending is in use. The thin substrate 11 is more serious. The bonding of the flexible circuit board 16 heats the metal wires 23 thereon onto the anisotropic conductive adhesive 1373660. The same thermal stress is also likely to cause damage to the edges of the thinner substrate. As disclosed in this embodiment, a reinforcing member 17 is disposed on the lower surface 20 of the non-display area 14 to enhance the strength required for the non-display area 14 during the bonding process and the stability after mounting to the module. The material used for the reinforcing member 17 may be a non-metallic material or a metal material. The non-metallic material may comprise, for example, polymethylmethacrylate (PMMA), polycarbonate (Polycarbonate; PC) or glass; the metallic material may comprise stainless steel and alloy. The stainless steel may be selected from unrecorded steel materials such as SUS 304 or SUS 403. The reinforcing member 17 is fixed on the lower surface 2 of the non-display area 14 with an adhesive 24, such as silicone, ultraviolet glue, heat curing adhesive, acrylic adhesive ( Acryiic glue ) or epoxy resin. The technique disclosed in the present invention is to solve the problem caused by the thinning of the product, and the method of solving the problem is not to affect the development goal. Therefore, it is necessary to consider the thickness te of the reinforcing member 17. The polarizing plate 25 is attached to the lower surface 30 of the display area 12, and the optical film 27 on the backlight module 26 is disposed in parallel at a predetermined distance d, and the optical film 27 corresponds to the display area 12. The optical film 27 is, for example, a prism sheet, a diffusion sheet, a brightness enhancement film, or the like. The fixed distance d will have different values under different module designs, so it is not a fixed value. In the present embodiment, the thickness of the reinforcing member 17 is smaller than the sum of the thickness tp of the lower polarizing plate 25 and the fixed distance d. Although COG is taken as an example in the present embodiment, the technique disclosed in the present invention does not The application limited to c〇G' can also use a bonding method such as TAB or COF. The color filter 28 disposed on the display area 12 allows the liquid crystal display to obtain a full color display function by using the 373660 color mixing technique. The light emitted by the backlight module 26 passes through the red, blue, and green color filters 28 to form three color light sources. By controlling the voltage of the thin film transistor, the three color light sources are changed, and the pixels of different colors and brightness are displayed. . The polarization polarization directions are perpendicular to each other below the polarizing plate 25 and the upper polarizing plate 29, and the thin film transistor is used to control the twist of the liquid crystal molecules.
暗顯不之控制。依本實施例所示，上偏光板29設置於彩色 據光片2 8之上。 圖3顯不本發明另一實施例之液晶顯示器剖面示意圖。本 實施例與圖2顯不之實施例之不同處在於背光模組％與補 強件17間無光學膜27之存在，這使得可使用較厚之補強件 1^。理論上，補強件17之厚度％只要小於等於下偏光板25 厚度tP、下偏光板25與光學膜27間之固定距離4和光學膜27 之厚度t。總和即可’亦即te $ tp+d+t。。但以安裝裕度之考Dark control is not controlled. According to this embodiment, the upper polarizing plate 29 is disposed above the color light film 28. Figure 3 is a cross-sectional view showing a liquid crystal display according to another embodiment of the present invention. The difference between this embodiment and the embodiment shown in Fig. 2 is that there is no optical film 27 between the backlight module % and the reinforcing member 17, which makes it possible to use a thicker reinforcing member. Theoretically, the thickness % of the reinforcing member 17 is less than or equal to the thickness tP of the lower polarizing plate 25, the fixed distance 4 between the lower polarizing plate 25 and the optical film 27, and the thickness t of the optical film 27. The sum can be ‘that is, te $ tp+d+t. . But with the test of the margin
量，以小於或等於該下偏光板25厚度tp與該光學膜厚度％ 之總和值為佳》 ° 圖4A和圖4B顯示本發明—實施例之液晶顯示器^ ®補強件1 7原則上係設置於IC元件} 5與軟性電路板16 _ 性接合所在相對應之非顯示區14之下表面2〇,而其形狀貝, 順應非顯示區14之外相a — 之外形而定。但隨著顯示器模組設計之1 同，補強件17的佈詈方, 方式或其大小亦可不同。圖4A顯示^The amount is less than or equal to the sum of the thickness tp of the lower polarizing plate 25 and the thickness % of the optical film. FIG. 4A and FIG. 4B show that the liquid crystal display of the present invention - the embodiment of the reinforcing member 1 7 is set in principle. The lower surface of the non-display area 14 corresponding to the IC device 5 and the flexible circuit board 16 _ is 2 〇, and its shape is compliant with the outer shape of the non-display area 14 a. However, as the design of the display module is the same, the layout of the reinforcing member 17, the manner or the size thereof may be different. Figure 4A shows ^
較小之補強件1 7設置;丨邊aA _邊局部料以進行基板11之局旬 補強。圖4B則顯示可以兩y ^ _ 兩片補強件17或更多較小之補強伯 17 ’以間隔性地之設署 又置方式進行間隔性補強。 -10 1373660 圖5A至5D顯示本發明其他實施例之液晶顯示器佈置 圖。1C元件15與軟性電路板16之電性接合處是在基板η之 兩個侧邊在此情形下，需對兩個側邊進行補強。圖5 a顯 .. 不以一完整L型之補強件17進行整邊補強。圖㈤和圖冗則 • 是以兩片做單邊各自之補強。圖5D則是以多片較小之補強 件1 7來進行間隔性補強。 圖6A和圖6B顯示本發明其他實施例之液晶顯示器佈置 • 圖。液晶顯示器在不同之應用上，可設計不同之形狀。本 實施例顯示為一橢圓形狀之液晶顯示器。圖顯示在橢圓 形狀之長軸知上具有1C元件15與軟性電路板16之壓合 處，在該處則設置一類似回力標形之補強件17。圖6b因應 長軸兩端上均具有有IC元件15與軟性電路板16之壓合處， 則該兩處都設置一類似回力標形之補強件17 ^ -圖7A和圖7B顯示本發明之液晶顯示器補強方法之流程 不意圓。圖7A所顯示之流程圖中，在步驟S7〇1中，先將黏 • 冑塗在一顯示器模組下玻璃基板上非顯示區之下表面。在 步驟S702中，將補強件黏合在塗黏膠之位置。在步驟湖 :判疋黏膠是否需要做固化處理？若否，則結束此流程； 若然’則進行步驟S704之固化程序。如是使用紫外線固化 膠則以紫外線照射來進行固化；若是使用熱固化膠則 以加熱來進行固化。完成補強件膠合後，就可進行如步驟 所*，將積體電路元件與軟性電路板接合於非顯示區 之上表面。圖7B與圖7A程序之不同在於將黏膠塗佈在補強 件上，如步驟S706所示，然後再將補強件貼合在非顯示區 q衣曲位置，h步驟S707所示。接著則是相@之判斷步 驟S708與固化程序步驟謂。最後將積體電路元件與軟性 電路板接合於非顯示區之下表面之相對上表面如步驟 S710所示。雖在圖7八與圖7B之實施例以c〇g為例但本發 明所揭示之技術不限定於c〇G上之應用，例如亦可以使用 TAB或者C〇F等接合方式。 本發月之技術内谷及技術特點已揭示如上，然而熟悉本 項技術之人士仍可能基於本發明之教示及揭示而作種種不 背離本發明精神之替換及修飾。因此，本發明之保護範圍 應不限於實施例所揭示者，而應包括各種不背離本發明之 替換及修飾’並為以下之申請專利範圍所涵蓋。 【圖式簡單說明】 圖1顯示本發明一實施例之液晶顯示器透視圖； 圖2顯示圖1沿2_2線之剖面圖； 圖3顯示本發明另一實施例之液晶顯示器剖面示意圖； 圖4A和圖4B顯示本發明一實施例之液晶顯示器佈置示 意圖； 圖5A至5D顯示本發明另一實施例之液晶顯示器佈置示 意圖； 圖6A和圖6B顯示本發明又一實施例之液晶顯示器佈置 示意圓；及 圖7A和圖7B顯示本發明一實施例之液晶顯示器補強方 法流程圖。 【主要元件符號說明】 1373660 11 基板 12 顯示區 13 電極墊 14 非顯示區 15 1C元件 16 軟性電路板 17 補強件 18 ' 19上表面 20 下表面 21 凸塊 22 異方性導電膠膜 23 金屬線 24 黏膠 25 下偏光板 26 背光模組 27 光學膜 28 彩色瀘光片 29 上偏光板 30 下表面 S701-S705 流程步驟 S706〜S710 流程步驟 < S > 13·The smaller reinforcing member is set to 7; the side aA _ is partially covered to perform the reinforcement of the substrate 11. Fig. 4B shows that the two y ^ _ two-piece reinforcing members 17 or more of the reinforcing reinforcing members 17 ′ can be spaced apart in a spaced manner. -10 1373660 Figures 5A through 5D show a liquid crystal display arrangement of another embodiment of the present invention. The electrical junction of the 1C element 15 and the flexible circuit board 16 is on both sides of the substrate η. In this case, the two sides need to be reinforced. Figure 5 a shows that the integral reinforcement is not performed with a complete L-shaped reinforcement 17 . Figure (5) and the diagram are redundant • The two sides are unilaterally reinforced. Figure 5D is a spacer reinforcement with a plurality of smaller reinforcements 17 . 6A and 6B are views showing a liquid crystal display arrangement of another embodiment of the present invention. Liquid crystal displays can be designed in different shapes for different applications. This embodiment is shown as an elliptical liquid crystal display. The figure shows a press-fit of the 1C element 15 and the flexible circuit board 16 on the long axis of the elliptical shape, where a stiffener 17 similar to the pullback feature is placed. 6b, in response to the nip of the IC component 15 and the flexible circuit board 16 on both ends of the long axis, a reinforcing member similar to the pullback shape is provided at both places. 17 - FIG. 7A and FIG. 7B show the present invention. The process of the LCD display reinforcement method is not satisfactory. In the flow chart shown in Fig. 7A, in step S7〇1, the adhesive is first applied to the lower surface of the non-display area on the glass substrate under the display module. In step S702, the reinforcing member is bonded to the position where the adhesive is applied. In the step lake: Do you need to cure the adhesive? If not, the process ends; if so, the curing process of step S704 is performed. If UV curable is used, it is cured by UV irradiation; if it is cured, it is cured by heating. After the reinforcing member is glued, the integrated circuit component and the flexible circuit board are bonded to the upper surface of the non-display area as in the step of *. The difference between the procedure of Fig. 7B and Fig. 7A is that the adhesive is applied to the reinforcing member, as shown in step S706, and then the reinforcing member is attached to the non-display area q-clad position, h step S707. Then, it is the judgment step S708 of the phase and the step of the curing procedure. Finally, the integrated circuit component and the flexible circuit board are bonded to the opposite upper surfaces of the lower surface of the non-display area as shown in step S710. Although the embodiment of Figs. 7 and 7B is exemplified by c〇g, the technique disclosed in the present invention is not limited to the application on c〇G, and for example, a bonding method such as TAB or C〇F may be used. The technical and technical features of the present invention have been disclosed above, but those skilled in the art may still make various substitutions and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be construed as not limited by the scope of the invention, and the invention is intended to be BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a liquid crystal display according to an embodiment of the present invention; FIG. 2 is a cross-sectional view taken along line 2-2 of FIG. 1. FIG. 3 is a cross-sectional view showing a liquid crystal display according to another embodiment of the present invention; 4B is a schematic view showing the arrangement of a liquid crystal display according to an embodiment of the present invention; FIGS. 5A to 5D are views showing the arrangement of a liquid crystal display according to another embodiment of the present invention; and FIGS. 6A and 6B are views showing a schematic arrangement of a liquid crystal display according to still another embodiment of the present invention; 7A and 7B are flowcharts showing a method for reinforcing a liquid crystal display according to an embodiment of the present invention. [Main component symbol description] 1373660 11 Substrate 12 Display area 13 Electrode pad 14 Non-display area 15 1C component 16 Flexible circuit board 17 Reinforcing member 18 '19 Upper surface 20 Lower surface 21 Bump 22 Anisotropic conductive film 23 Metal wire 24 Adhesive 25 Lower polarizer 26 Backlight module 27 Optical film 28 Color calender sheet 29 Upper polarizing plate 30 Lower surface S701-S705 Flow steps S706 to S710 Flow step < S > 13·