CN101251670B - LCD device and method for making the same - Google Patents
LCD device and method for making the same Download PDFInfo
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- CN101251670B CN101251670B CN 200810088670 CN200810088670A CN101251670B CN 101251670 B CN101251670 B CN 101251670B CN 200810088670 CN200810088670 CN 200810088670 CN 200810088670 A CN200810088670 A CN 200810088670A CN 101251670 B CN101251670 B CN 101251670B
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- display area
- stiffener
- liquid crystal
- substrate
- crystal indicator
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Abstract
The invention relates to a liquid crystal display device and a manufacturing method for the same. The liquid crystal display device comprises a substrate and a stiffener, wherein, the substrate comprises a display area and a non-display area which comprises a lower surface; the stiffener is arranged on the lower surface of the non-display area and used for stiffening the non-display area of the substrate. In an embodiment, the stiffener and the substrate can be joined through viscose. The non-display area comprises a plurality of electrode pads which can be electrically connected with an integrated circuit component or the outside of a soft circuit board. The liquid crystal display device can be suitable for thinning development of the glass substrate and can utilizes the stiffening structure to prevent damage of the liquid crystal substrate during the manufacturing process and after assembly to a module, thereby the production qualification rate, the product stability and the productreliability are improved.
Description
Technical field
The present invention relates to a kind of liquid crystal indicator and preparation method thereof, particularly a kind of liquid crystal indicator relevant with reinforced structure and preparation method thereof.
Background technology
Under trend and the light-weighted requirement of portable electronic devices that LCD maximizes, the slimming of glass substrate, lightweight have been inevitable trend.The use main flow thickness of glass substrate is from up till now 0.7 millimeter of 1.1 millimeters differentiation of nineteen ninety-five.In the development of glass substrate, up to the present thickness more is reduced to below 0.4 millimeter, and the light weight slimming of glass substrate not only can alleviate the weight of substrate, can also reduce inherent vice, the production cost of glass substrate and improve the manufacturing qualification rate.With running gear such as mobile phone, personal digital aid (PDA) (Portable Digital Assistant; PDA) or notebook computer etc., replace under 0.7 millimeter the situation of present main flow at the glass substrate that uses 0.5 millimeter of thickness of slab, the employed glass substrate weight of aforementioned means can reduce 35%.
Although use thinner glass substrate that many benefits are arranged, because the hard fragility matter of glass substrate, thinner glass substrate is damaged easily when being subjected to percussion.Moreover in the Thin Film Transistor-LCD module, install integrated circuit component and flexible printed circuit (Flexible Print Circuit; FPC) bottom glass substrate is single laminate.Therefore, when using thinner glass substrate, glass substrate may take place when carrying out the joining process of integrated circuit component and flexible printed circuit bear the stress that incessantly engages and cause breakage, this problem will make the production qualification rate reduce, even cost is improved.In addition, also may meet with stresses because vibrations cause glass substrate when thinner glass substrate is installed on module, thereby cause damaged probability to improve.
Except the problem of stress, with the different situations that cause warpage (Warpage) with the thermal expansivity of integrated circuit component of glass baseplate thermal expansivity, more apparent serious when using thinner substrate.
The problems referred to above are that therefore the solution that adopts must be taken into account product slimming, light-weighted target owing to product is pursued slimming, lightweight produces.
Summary of the invention
At the problems referred to above, the invention provides a kind of liquid crystal indicator and preparation method thereof, its utilize reinforced structure to prevent in the manufacturing process and be installed on module after the damage of crystal liquid substrate, thereby improve production qualification rate, product stability and fiduciary level.On the other hand, reinforcement design of the present invention is applicable to the slimming development of glass substrate, and for example the thickness of glass substrate is less than or equal to 0.4 millimeter situation.
Liquid crystal indicator of the present invention comprises a substrate and a stiffener.Substrate comprises a viewing area and a non-display area, and wherein this non-display area comprises a first surface and a second surface corresponding with this first surface, and this first surface of this non-display area arranges a plurality of electronic padses.Stiffener is arranged on the second surface of non-display area, bears the stress that produces when the outside electrically engages in order to this non-display area and the dispersion of this substrate of reinforcement, and described stiffener is arranged between the backlight module of this substrate and this liquid crystal indicator.
In one embodiment, stiffener can engage by viscose with substrate.The upper surface of this non-display area comprises a plurality of electronic padses, in order to connecting integrated circuit component, or connects flexible circuit board and electrically engages to provide with the outside.
The method for making of LCD of the present invention is: a substrate and a stiffener are provided earlier, and wherein this substrate comprises a viewing area and a non-display area, and this non-display area comprises a surface.Then this stiffener gummed is arranged on this surface corresponding to this non-display area position, bear the stress that produces when the outside electrically engages in order to this non-display area of reinforcement and dispersion, wherein said stiffener is arranged between the backlight module of this substrate and this liquid crystal indicator.
LCD of the present invention is applicable to the slimming of glass substrate development, and can utilize reinforced structure to prevent in the manufacturing process and be installed on module after the damage of crystal liquid substrate, thereby improve production qualification rate, product stability and fiduciary level.
Description of drawings
Fig. 1 shows the stereographic map of the LCD of one embodiment of the invention;
Fig. 2 shows along the cut-open view of the 2-2 line of Fig. 1;
Fig. 3 shows the cross-sectional schematic of the LCD of another embodiment of the present invention;
Fig. 4 A and Fig. 4 B show the layout synoptic diagram of the LCD of one embodiment of the invention;
Fig. 5 A to Fig. 5 D shows the layout synoptic diagram of the LCD of another embodiment of the present invention;
Fig. 6 A and Fig. 6 B show the layout synoptic diagram of the LCD of further embodiment of this invention; And
Fig. 7 A and Fig. 7 B show the reinforcement process flow diagram of the LCD of one embodiment of the invention.
Wherein, description of reference numerals is as follows:
11 substrates, 12 viewing areas, 13 electronic padses, 14 non-display areas
15 IC elements, 16 flexible circuit boards, 17 stiffeners 18,19 upper surfaces
20 lower surfaces, 21 projections, 22 anisotropic conductive films, 23 metal wires
25 times Polarizers of 24 viscoses, 26 backlight modules, 27 bloomings
Polarizer 30 lower surfaces on 28 colored filters 29
S701～S705 process step S706～S710 process step
Embodiment
Fig. 1 shows the stereographic map of the LCD of one embodiment of the invention.The principle of LCD is to handle turning to of liquid crystal by executing voltage on thin film transistor (TFT), and whether the light of controlling from backlight module can pass through and arrive on the display pixel.Thin film transistor (TFT) is made in the upper surface 18 of the viewing area 12 on the substrate 11, and this substrate 11 is the lower glass substrate of a display apparatus module.The upper surface 18 of viewing area 12 comprises a plurality of pixels that constituted and arranged with array by thin film transistor (TFT), and the video picture of LCD realizes by controlling these pixels.The control of pixel need be passed through integrated circuit component 15 (Integrated Circuit; IC) realize, and integrated circuit component 15 controls are by deciding the voltage that puts on the pixel according to external world's instruction.Voltage applies by vertical and transversely arranged signal wire and brake cable.Because pixel is arranged in viewing area 12, therefore if will make the IC elements 15 that are positioned at outside the viewing area 12 can control pixel, some electronic padses (Pad) 13 then must be set outside viewing area 12 do electrical the joint so that IC element 15 and flexible circuit board (FPC) 16 to be provided with signal wire and brake cable.Usually these electronic padses 13 are placed on the upper surface 19 (first surface) of non-display area 14.15 of IC elements can bind structure dress (Tape Automated Bonding with banded robotization; TAB), the crystal grain mantle engages (Chip on Film; COF), ambetti engages modes such as (Chip on Glass COG) IC element 15 is engaged on the electronic pads 13, makes IC element 15 can drive pixel in the viewing area 12; Outside control signal or power supply signal then can utilize the flexible circuit board 16 of joint that signal is imported.
Frivolous development along with LCD, the thickness of the substrate 11 that uses also diminishes, for example the thickness of substrate 11 may be less than or equal to 0.4 millimeter, for example 0.4 millimeter, 0.3 millimeter, 0.2 millimeter, 0.1 millimeter or 0.03 millimeter etc., this makes and is positioned at the non-display area 14 at substrate 11 edges when being engaged in the joining process of IC element 15 or flexible circuit board 16, the substrate of non-display area 14 parts possibly can't bear and engage the stress that strength produces and cause breakage, the qualification rate of product is reduced, and, even finish after the display apparatus module, also to cause substrate 11 to meet with stresses damaged because of vibrations easily.To the problem that produces in this production development, present embodiment discloses a stiffener 17, utilizes this stiffener 17 to disperse to bear the outside stress that produces when electrically engaging or during vibrations, makes the substrate 11 at this place can bear when engaging or the strength during vibrations.Stiffener 17 is arranged on the substrate 11 in the non-display area 14 lower surface 20 (second surface) with 19 corresponding of upper surfaces, and contains whole side.
Fig. 2 shows along the cross-sectional schematic of the 2-2 line of Fig. 1.IC element 15 is that the projection 21 on the IC element 15 is pressed on the anisotropic conductive film 22 (Anisotropic Conductive Film) that is laid on the electronic pads 13 with hot pressing mode with engaging of electronic pads 13 on the substrate 11.Contain the conducting particles of using in order to the conducting electric current in the anisotropic conductive film 22, obtain preferable conducting electric current, the pressure that then must impose certain intensity when hot pressing is moderately pushed the conducting particles between projection 21 and the electronic pads 13 or is out of shape.Except pressure, can produce no small problem equally up to the pressing-in temp between 160 ℃-220 ℃.The thermal expansivity that with glass is the base material 11 of material is about 4ppm/ ℃, and the thermal expansivity of general IC element 15 is about 3ppm/ ℃, because the difference of thermal expansivity causes the situation of warpage more apparent serious when using thinner substrate 11.The joint of flexible circuit board 16 be with metal wire 23 hot pressing on it on anisotropic conductive film 22, hot pressing strength similarly also easily causes damage to the edge of thinner base material 11.Disclose as present embodiment, a stiffener 17 be arranged on the lower surface 20 of non-display area 14, with strengthen non-display area 14 when the joining process required intensity and be installed on module after stability.Stiffener 17 employed materials can be nonmetallic materials or metal material.Nonmetallic materials can comprise as polymethylmethacrylate (Polymethylmethacrylate; PMMA), polycarbonate (Polycarbonate; PC) or glass; Metal material can comprise stainless steel and aluminium alloy.Stainless steel materials such as the optional SUS freely 304 of stainless steel or SUS 403.Stiffener 17 is fixed on viscose 24 on the lower surface 20 of non-display area 14, and wherein this viscose 24 comprises as silica gel (Silicone), ultraviolet curing glue (UV glue), heat-curable glue, acryl glue (Acrylic glue) or epoxy resin.
Disclosed technology is in order to solve the lightening problem that produces of product, and the method for solution is good with the target that does not influence this development, so need consider the thickness t of using stiffener 17
eOnce Polarizer 25 is fitted in the lower surface 30 of viewing area 12, and the blooming 27 that is positioned on the backlight module 26 is set in parallel in its relative position with a predetermined distance d, and this blooming 27 is corresponding to this viewing area 12.Blooming 27 for example is prismatic lens, diffusion sheet or brightness enhancement film etc.This fixed range d has different numerical value, so a non-fixed value under the disparate modules design.In the present embodiment, the thickness t of stiffener 17
eWith the thickness t less than following Polarizer 25
pWith the total value of this fixed range d be good.Though be example with COG at present embodiment, disclosed technology is not limited to the application on the COG, for example also can use junctures such as TAB or COF.
The colored filter 28 that is arranged on the viewing area 12 makes LCD obtain full-colorization Presentation Function by spacing color mixed technology.Light by backlight module 26 emits forms three kinds of color light sources by red, blue, green colored filter 28 backs.By control thin film transistor (TFT) voltage strength three kinds of color light sources are changed, thereby show the pixel of different colours and brightness.
The orthogonal Polarizer 25 down of light polarization direction and last Polarizer 29 match, and add with thin film transistor (TFT) and control reversing of liquid crystal molecule, reach the control that light and shade shows.Shown in present embodiment, last Polarizer 29 is arranged on the colored filter 28.
Fig. 3 shows the cross-sectional schematic of the LCD of another embodiment of the present invention.The different existence that are in no blooming 27 between backlight module 26 and stiffener 17 of the embodiment that present embodiment and Fig. 2 show, this is feasible can to use thicker stiffener 17.In theory, the thickness t of stiffener 17
eAs long as smaller or equal to following Polarizer 25 thickness t
p, down the fixed range d between Polarizer 25 and the blooming 27 and the thickness t of blooming 27
oSummation get final product that is t
e≤ t
p+ d+t
oBut based on the consideration that nargin is installed, to be less than or equal to this time Polarizer 25 thickness t
pWith this optical film thickness t
oTotal value be good.
Fig. 4 A and Fig. 4 B show the arrangenent diagram of the LCD of one embodiment of the invention.Stiffener 17 is arranged at the lower surface 20 that electrically engages the corresponding non-display area 14 in place, place with IC element 15 and flexible circuit board 16 in principle, and its shape is then complied with the profile of non-display area 14 and decided.But along with the difference of display apparatus module design, the arrangement of stiffener 17 or its size also can be different.Fig. 4 A demonstration is arranged at the local part of side so that substrate 11 is carried out local reinforcement with less stiffener 17.Fig. 4 B then shows can two stiffeners 17 or how less stiffener 17, carries out the reinforcement of interval property with at intervals set-up mode.
Fig. 5 A to Fig. 5 D shows the arrangenent diagram of the LCD of other embodiment of the present invention.The electrical joint of IC element 15 and flexible circuit board 16 in this case, needs carry out reinforcement to two sides at two sides of substrate 11.Fig. 5 A shows that the stiffener 17 with a complete L type carries out the treating selvedge reinforcement.Fig. 5 B and Fig. 5 C do monolateral reinforcement separately with two stiffeners 17.Fig. 5 D carries out the reinforcement of interval property with the less stiffener 17 of multi-disc.
Fig. 6 A and Fig. 6 B show the arrangenent diagram of the LCD of other embodiment of the present invention.LCD can design different shapes in different application.Present embodiment is shown as the LCD of an elliptical shape.Fig. 6 A is presented at pressing place that has IC element 15 and flexible circuit board 16 on major axis one end of elliptical shape, and the stiffener 17 of one similar time power ennuple is set in this pressing place.Therefore Fig. 6 B arranges the stiffener 17 of one similar time power ennuple owing to all have pressing place of IC element 15 and flexible circuit board 16 on the major axis two ends at this two place.
Fig. 7 A and Fig. 7 B show the schematic flow sheet of LCD reinforcement of the present invention.In the shown process flow diagram of Fig. 7 A, in step S701, earlier viscose is coated in the lower surface of non-display area on the lower glass substrate of a display apparatus module.In step S702, stiffener is binded in the position that scribbles viscose.Do you in step S703, judge that viscose needs to do curing and handles? if not, then finish this flow process; If then carry out the program curing of step S704.If the use ultraviolet curing glue then shines to be cured with ultraviolet ray; If the use heat-curable glue then is cured with heating.After finishing stiffener gummed, just can be shown in step S705, integrated circuit component and flexible circuit board are engaged in the upper surface of non-display area.The difference of Fig. 7 B and Fig. 7 A program is viscose is coated on the stiffener, shown in step S706, and then stiffener is fitted in the lower surface position of non-display area, shown in step S707.Then then be identical determining step S708 and program curing step S709.At last integrated circuit component and flexible circuit board are engaged in the upper surface relative with the lower surface of non-display area, shown in step S710.Though the embodiment at Fig. 7 A and Fig. 7 B is example with COG, disclosed technology is not limited to the application on the COG, for example also can use junctures such as TAB or COF.
Technology contents of the present invention and technical characterstic disclose as above, yet those skilled in the art still may make all replacement and modifications that does not break away from the present invention's design based on instruction of the present invention and disclosure.Therefore, protection scope of the present invention should be not limited to the content that embodiment discloses, and should comprise various do not break away from replacement of the present invention and modifications, and is as the criterion with the scope of appended claims.
Claims (20)
1. liquid crystal indicator comprises:
One substrate, it comprises a viewing area and a non-display area, and wherein this non-display area comprises a first surface and a second surface corresponding with this first surface, and this first surface of this non-display area arranges a plurality of electronic padses; And
At least one stiffener is arranged on this second surface of this non-display area, bears the outside stress that produces when electrically engaging in order to this non-display area of reinforcement and dispersion, and described stiffener is arranged between the backlight module of this substrate and this liquid crystal indicator.
2. liquid crystal indicator according to claim 1 wherein, disposes a plurality of pixels in this viewing area, and described pixel and described electronic pads electrically connect.
3. liquid crystal indicator according to claim 1, wherein, this non-display area is provided with the integrated circuit component that is connected to described a plurality of electronic padses.
4. liquid crystal indicator according to claim 1, wherein, described a plurality of electronic padses connect at least one flexible circuit board.
5. liquid crystal indicator according to claim 1, wherein, described stiffener uses nonmetallic materials or metal material to make.
6. liquid crystal indicator according to claim 5, wherein, these nonmetallic materials are polymethylmethacrylate, polycarbonate or glass.
7. liquid crystal indicator according to claim 5, wherein, this metal material is stainless steel or aluminium alloy.
8. liquid crystal indicator according to claim 1, wherein, this stiffener contains on one side whole side of this substrate, be arranged on this substrate on one side the part or be arranged on one side of this substrate at intervals.
9. liquid crystal indicator according to claim 1 also comprises:
Polarizer once is fitted in a surface of this viewing area, and wherein this second surface of this surface of this viewing area and this non-display area is adjacent; And
One backlight module, it has a blooming, and this blooming relatively be arranged in parallel with a preset distance and this time Polarizer.
10. liquid crystal indicator according to claim 9, wherein this blooming is corresponding to this viewing area.
11. liquid crystal indicator according to claim 9, wherein, the thickness of this stiffener is less than the summation of the thickness of this preset distance and this time Polarizer.
12. liquid crystal indicator according to claim 10, wherein, the thickness of this stiffener is less than the summation of the thickness of the thickness of this preset distance, this time Polarizer and this blooming.
13. liquid crystal indicator according to claim 1, wherein, the thickness of this substrate is less than or equal to 0.4mm.
14. the method for making of a LCD, this method may further comprise the steps:
One substrate is provided, and this substrate comprises a viewing area and a non-display area, and this non-display area comprises a surface;
One stiffener is provided; And
This stiffener is glued on this surface of this non-display area, bears the stress that produces when the outside electrically engages in order to this non-display area of reinforcement and dispersion, wherein said stiffener is arranged between the backlight module of this substrate and this liquid crystal indicator.
15. the method for making of LCD according to claim 14 comprises that also the viscose that this gummed is used carries out the step of ultraviolet ray irradiation step of curing or heat curing.
16. the method for making of LCD according to claim 14, the step of wherein gluing together this stiffener comprise with viscose coat this stiffener or should the surface on.
17. the method for making of LCD according to claim 14, wherein this non-display area is provided with at least one integrated circuit component.
18. the method for making of LCD according to claim 17, after on this surface that this stiffener is glued at this non-display area, also comprise with this integrated circuit component be bonded on this non-display area, with respect to another lip-deep step on this surface.
19. the method for making of LCD according to claim 14, wherein this non-display area connects at least one flexible circuit board.
20. the method for making of LCD according to claim 19, on this surface that this stiffener is glued at this non-display area after, also comprise with this flexible circuit board be bonded on this non-display area, with respect to another lip-deep step on this surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810088670 CN101251670B (en) | 2008-04-10 | 2008-04-10 | LCD device and method for making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810088670 CN101251670B (en) | 2008-04-10 | 2008-04-10 | LCD device and method for making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101251670A CN101251670A (en) | 2008-08-27 |
| CN101251670B true CN101251670B (en) | 2013-09-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810088670 Expired - Fee Related CN101251670B (en) | 2008-04-10 | 2008-04-10 | LCD device and method for making the same |
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| CN (1) | CN101251670B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104393014B (en) | 2014-10-22 | 2017-09-26 | 京东方科技集团股份有限公司 | A kind of array base palte and preparation method thereof, flexible display panels and display device |
| CN105759476B (en) * | 2016-05-24 | 2019-09-06 | 武汉华星光电技术有限公司 | Liquid crystal display panel and its thin-film transistor array base-plate |
| CN110244485B (en) | 2019-06-24 | 2021-07-23 | 武汉华星光电技术有限公司 | Display panel structure and display |
| CN113721397A (en) * | 2021-08-20 | 2021-11-30 | Tcl华星光电技术有限公司 | Binding structure, display device, detection method and detection device |
-
2008
- 2008-04-10 CN CN 200810088670 patent/CN101251670B/en not_active Expired - Fee Related
Non-Patent Citations (2)
| Title |
|---|
| JP特开2002-141620A 2002.05.17 |
| JP特开平8-273720A 1996.10.18 |
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| CN101251670A (en) | 2008-08-27 |
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