TWI372588B - Method for fabricating a package substrate with a cavity - Google Patents

Method for fabricating a package substrate with a cavity

Info

Publication number
TWI372588B
TWI372588B TW098103378A TW98103378A TWI372588B TW I372588 B TWI372588 B TW I372588B TW 098103378 A TW098103378 A TW 098103378A TW 98103378 A TW98103378 A TW 98103378A TW I372588 B TWI372588 B TW I372588B
Authority
TW
Taiwan
Prior art keywords
fabricating
cavity
package substrate
package
substrate
Prior art date
Application number
TW098103378A
Other languages
Chinese (zh)
Other versions
TW201031300A (en
Inventor
Kuo Ching Chen
Tsung Yuan Chen
Original Assignee
Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to TW098103378A priority Critical patent/TWI372588B/en
Publication of TW201031300A publication Critical patent/TW201031300A/en
Application granted granted Critical
Publication of TWI372588B publication Critical patent/TWI372588B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
TW098103378A 2009-02-03 2009-02-03 Method for fabricating a package substrate with a cavity TWI372588B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098103378A TWI372588B (en) 2009-02-03 2009-02-03 Method for fabricating a package substrate with a cavity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098103378A TWI372588B (en) 2009-02-03 2009-02-03 Method for fabricating a package substrate with a cavity

Publications (2)

Publication Number Publication Date
TW201031300A TW201031300A (en) 2010-08-16
TWI372588B true TWI372588B (en) 2012-09-11

Family

ID=44854448

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098103378A TWI372588B (en) 2009-02-03 2009-02-03 Method for fabricating a package substrate with a cavity

Country Status (1)

Country Link
TW (1) TWI372588B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053728A1 (en) 2010-10-20 2012-04-26 Lg Innotek Co., Ltd. Printed circuit board and method for manufacturing the same
CN109587974A (en) * 2017-09-28 2019-04-05 宏启胜精密电子(秦皇岛)有限公司 The manufacturing method of flexible circuit board and the flexible circuit board
TWI661759B (en) * 2018-07-19 2019-06-01 欣興電子股份有限公司 Substrate structure and manufacturing method thereof
CN117747436A (en) * 2022-09-15 2024-03-22 鹏鼎控股(深圳)股份有限公司 Package substrate structure and method for manufacturing the same

Also Published As

Publication number Publication date
TW201031300A (en) 2010-08-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees