TWI371866B - Electronic device contact structures - Google Patents

Electronic device contact structures

Info

Publication number
TWI371866B
TWI371866B TW093137378A TW93137378A TWI371866B TW I371866 B TWI371866 B TW I371866B TW 093137378 A TW093137378 A TW 093137378A TW 93137378 A TW93137378 A TW 93137378A TW I371866 B TWI371866 B TW I371866B
Authority
TW
Taiwan
Prior art keywords
electronic device
contact structures
device contact
structures
electronic
Prior art date
Application number
TW093137378A
Other languages
Chinese (zh)
Other versions
TW200531311A (en
Inventor
Alexei A Erchak
Eleftrios Lidorikis
John W Graff
Original Assignee
Luminus Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/735,498 external-priority patent/US7166871B2/en
Priority claimed from US10/794,452 external-priority patent/US7074631B2/en
Priority claimed from US10/794,244 external-priority patent/US20040259279A1/en
Priority claimed from US10/871,877 external-priority patent/US7105861B2/en
Application filed by Luminus Devices Inc filed Critical Luminus Devices Inc
Publication of TW200531311A publication Critical patent/TW200531311A/en
Application granted granted Critical
Publication of TWI371866B publication Critical patent/TWI371866B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0083—Periodic patterns for optical field-shaping in or on the semiconductor body or semiconductor body package, e.g. photonic bandgap structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Led Device Packages (AREA)
TW093137378A 2003-12-12 2004-12-03 Electronic device contact structures TWI371866B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US10/735,498 US7166871B2 (en) 2003-04-15 2003-12-12 Light emitting systems
US10/794,452 US7074631B2 (en) 2003-04-15 2004-03-05 Light emitting device methods
US10/794,244 US20040259279A1 (en) 2003-04-15 2004-03-05 Light emitting device methods
US55389404P 2004-03-16 2004-03-16
US10/871,877 US7105861B2 (en) 2003-04-15 2004-06-18 Electronic device contact structures

Publications (2)

Publication Number Publication Date
TW200531311A TW200531311A (en) 2005-09-16
TWI371866B true TWI371866B (en) 2012-09-01

Family

ID=34714664

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093137378A TWI371866B (en) 2003-12-12 2004-12-03 Electronic device contact structures

Country Status (2)

Country Link
TW (1) TWI371866B (en)
WO (1) WO2005060586A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471069B (en) * 2013-05-22 2015-01-21 Takamatsu Plating Co Ltd Metal board used for led

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006013408A1 (en) * 2006-03-17 2007-09-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Light emitting diode unit for use as signal unit, has electrical conductors led along outer surface of electrically conducting electrodes based on electrical contact, overlapping electrodes in area wise, and forming power supply line
DE102008019049B4 (en) * 2008-04-15 2013-12-24 Novaled Ag Light emitting organic device and device
CN109075057B (en) * 2016-03-09 2023-10-20 应用材料公司 Pad structure and method of manufacture

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3293513A (en) * 1962-08-08 1966-12-20 Texas Instruments Inc Semiconductor radiant diode
US3922706A (en) * 1965-07-31 1975-11-25 Telefunken Patent Transistor having emitter with high circumference-surface area ratio
US4864370A (en) * 1987-11-16 1989-09-05 Motorola, Inc. Electrical contact for an LED
US6307218B1 (en) * 1998-11-20 2001-10-23 Lumileds Lighting, U.S., Llc Electrode structures for light emitting devices
US7105861B2 (en) * 2003-04-15 2006-09-12 Luminus Devices, Inc. Electronic device contact structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI471069B (en) * 2013-05-22 2015-01-21 Takamatsu Plating Co Ltd Metal board used for led

Also Published As

Publication number Publication date
WO2005060586A2 (en) 2005-07-07
WO2005060586A3 (en) 2006-03-30
TW200531311A (en) 2005-09-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees