TWI369934B - Flip-chip substrate with improved bending resistance - Google Patents

Flip-chip substrate with improved bending resistance

Info

Publication number
TWI369934B
TWI369934B TW098100302A TW98100302A TWI369934B TW I369934 B TWI369934 B TW I369934B TW 098100302 A TW098100302 A TW 098100302A TW 98100302 A TW98100302 A TW 98100302A TW I369934 B TWI369934 B TW I369934B
Authority
TW
Taiwan
Prior art keywords
flip
bending resistance
chip substrate
improved bending
improved
Prior art date
Application number
TW098100302A
Other languages
Chinese (zh)
Other versions
TW201028064A (en
Inventor
Tung Yu Chang
Hsien Chieh Lin
Kuo Chun Chiang
Shing Fun Ho
Original Assignee
Nan Ya Printed Circuit Board
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nan Ya Printed Circuit Board filed Critical Nan Ya Printed Circuit Board
Priority to TW098100302A priority Critical patent/TWI369934B/en
Publication of TW201028064A publication Critical patent/TW201028064A/en
Application granted granted Critical
Publication of TWI369934B publication Critical patent/TWI369934B/en

Links

TW098100302A 2009-01-07 2009-01-07 Flip-chip substrate with improved bending resistance TWI369934B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW098100302A TWI369934B (en) 2009-01-07 2009-01-07 Flip-chip substrate with improved bending resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098100302A TWI369934B (en) 2009-01-07 2009-01-07 Flip-chip substrate with improved bending resistance

Publications (2)

Publication Number Publication Date
TW201028064A TW201028064A (en) 2010-07-16
TWI369934B true TWI369934B (en) 2012-08-01

Family

ID=44853395

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098100302A TWI369934B (en) 2009-01-07 2009-01-07 Flip-chip substrate with improved bending resistance

Country Status (1)

Country Link
TW (1) TWI369934B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105097723A (en) * 2014-05-19 2015-11-25 矽品精密工业股份有限公司 Packaging substrate and packaging structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105097723A (en) * 2014-05-19 2015-11-25 矽品精密工业股份有限公司 Packaging substrate and packaging structure
CN105097723B (en) * 2014-05-19 2018-09-28 矽品精密工业股份有限公司 packaging substrate and packaging structure

Also Published As

Publication number Publication date
TW201028064A (en) 2010-07-16

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Legal Events

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MC4A Revocation of granted patent