TWI368957B - Semiconductor structure and method of forming the same - Google Patents

Semiconductor structure and method of forming the same

Info

Publication number
TWI368957B
TWI368957B TW097107099A TW97107099A TWI368957B TW I368957 B TWI368957 B TW I368957B TW 097107099 A TW097107099 A TW 097107099A TW 97107099 A TW97107099 A TW 97107099A TW I368957 B TWI368957 B TW I368957B
Authority
TW
Taiwan
Prior art keywords
forming
same
semiconductor structure
semiconductor
Prior art date
Application number
TW097107099A
Other languages
Chinese (zh)
Other versions
TW200937542A (en
Inventor
Hsin Chi Sun
Wen Chung Chen
Chih Cherng Liao
Sung Min Wei
Original Assignee
Vanguard Int Semiconduct Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanguard Int Semiconduct Corp filed Critical Vanguard Int Semiconduct Corp
Priority to TW097107099A priority Critical patent/TWI368957B/en
Publication of TW200937542A publication Critical patent/TW200937542A/en
Application granted granted Critical
Publication of TWI368957B publication Critical patent/TWI368957B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW097107099A 2008-02-29 2008-02-29 Semiconductor structure and method of forming the same TWI368957B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097107099A TWI368957B (en) 2008-02-29 2008-02-29 Semiconductor structure and method of forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097107099A TWI368957B (en) 2008-02-29 2008-02-29 Semiconductor structure and method of forming the same

Publications (2)

Publication Number Publication Date
TW200937542A TW200937542A (en) 2009-09-01
TWI368957B true TWI368957B (en) 2012-07-21

Family

ID=44867082

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107099A TWI368957B (en) 2008-02-29 2008-02-29 Semiconductor structure and method of forming the same

Country Status (1)

Country Link
TW (1) TWI368957B (en)

Also Published As

Publication number Publication date
TW200937542A (en) 2009-09-01

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