TWI368548B - Apparatus and method for solder ball filling - Google Patents
Apparatus and method for solder ball fillingInfo
- Publication number
- TWI368548B TWI368548B TW098100792A TW98100792A TWI368548B TW I368548 B TWI368548 B TW I368548B TW 098100792 A TW098100792 A TW 098100792A TW 98100792 A TW98100792 A TW 98100792A TW I368548 B TWI368548 B TW I368548B
- Authority
- TW
- Taiwan
- Prior art keywords
- solder ball
- ball filling
- filling
- solder
- ball
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US2881608P | 2008-02-14 | 2008-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200934605A TW200934605A (en) | 2009-08-16 |
TWI368548B true TWI368548B (en) | 2012-07-21 |
Family
ID=40957185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098100792A TWI368548B (en) | 2008-02-14 | 2009-01-09 | Apparatus and method for solder ball filling |
Country Status (2)
Country | Link |
---|---|
TW (1) | TWI368548B (en) |
WO (1) | WO2009102281A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102610535B (en) * | 2011-01-21 | 2014-07-09 | 三星半导体(中国)研究开发有限公司 | Ball attachment device, solder ball picking method and solder ball mounting method |
US20140154037A1 (en) * | 2011-06-03 | 2014-06-05 | Orion Systems Integration Pte Ltd | Method and systems for semiconductor chip pick & transfer and bonding |
CN104576418A (en) * | 2013-10-25 | 2015-04-29 | 博磊科技股份有限公司 | Ball laying and placing device and method for substrate of integrated circuit |
SG10201701738VA (en) * | 2017-03-03 | 2018-10-30 | Aurigin Tech Pte Ltd | Apparatus And Method For Filling A Ball Grid Array |
CN115621170A (en) * | 2022-11-10 | 2023-01-17 | 上海世禹精密机械有限公司 | Automatic alignment compensation device for ball mounting jig and ball laying jig and using method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5655704A (en) * | 1994-08-30 | 1997-08-12 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
US6604673B1 (en) * | 1999-03-17 | 2003-08-12 | Novatec Sa | Filling device and method for filling balls in the apertures of a ball-receiving element |
US6766938B2 (en) * | 2002-01-08 | 2004-07-27 | Asm Assembly Automation Ltd. | Apparatus and method of placing solder balls onto a substrate |
TWI272708B (en) * | 2002-10-14 | 2007-02-01 | Aurigin Technology Pte Ltd | Apparatus and method for filling a ball grid array template |
-
2008
- 2008-11-10 WO PCT/SG2008/000429 patent/WO2009102281A1/en active Application Filing
-
2009
- 2009-01-09 TW TW098100792A patent/TWI368548B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2009102281A1 (en) | 2009-08-20 |
TW200934605A (en) | 2009-08-16 |
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