TWI368278B - Semiconductor device having recess gate - Google Patents
Semiconductor device having recess gateInfo
- Publication number
- TWI368278B TWI368278B TW095149448A TW95149448A TWI368278B TW I368278 B TWI368278 B TW I368278B TW 095149448 A TW095149448 A TW 095149448A TW 95149448 A TW95149448 A TW 95149448A TW I368278 B TWI368278 B TW I368278B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor device
- recess gate
- recess
- gate
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
- H01L29/4236—Disposition, e.g. buried gate electrode within a trench, e.g. trench gate electrode, groove gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66621—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation using etching to form a recess at the gate location
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66628—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation recessing the gate by forming single crystalline semiconductor material at the source or drain location
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20060060292 | 2006-06-30 | ||
KR1020060124735A KR100780620B1 (en) | 2006-06-30 | 2006-12-08 | Semiconductor device with recess gate and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200802620A TW200802620A (en) | 2008-01-01 |
TWI368278B true TWI368278B (en) | 2012-07-11 |
Family
ID=39011590
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095149448A TWI368278B (en) | 2006-06-30 | 2006-12-28 | Semiconductor device having recess gate |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100780620B1 (en) |
CN (1) | CN101097957B (en) |
TW (1) | TWI368278B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101036927B1 (en) | 2008-12-31 | 2011-05-25 | 주식회사 하이닉스반도체 | Semiconductor device with vertical gate and method for manufacturing the same |
US9064699B2 (en) * | 2013-09-30 | 2015-06-23 | Samsung Electronics Co., Ltd. | Methods of forming semiconductor patterns including reduced dislocation defects and devices formed using such methods |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990000763A (en) * | 1997-06-10 | 1999-01-15 | 문정환 | Manufacturing Method of Semiconductor Device |
US6677205B2 (en) * | 2001-09-28 | 2004-01-13 | Infineon Technologies Ag | Integrated spacer for gate/source/drain isolation in a vertical array structure |
KR20050119244A (en) * | 2004-06-16 | 2005-12-21 | 주식회사 하이닉스반도체 | Method for forming gate of semiconductor device |
KR100574497B1 (en) * | 2004-12-24 | 2006-04-27 | 주식회사 하이닉스반도체 | Asysmmetry recess channel mosfet and method for manufacturing thereof |
-
2006
- 2006-12-08 KR KR1020060124735A patent/KR100780620B1/en not_active IP Right Cessation
- 2006-12-28 TW TW095149448A patent/TWI368278B/en not_active IP Right Cessation
-
2007
- 2007-04-26 CN CN2007100969994A patent/CN101097957B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101097957A (en) | 2008-01-02 |
CN101097957B (en) | 2010-10-06 |
KR100780620B1 (en) | 2007-11-30 |
TW200802620A (en) | 2008-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |