TWI367919B - - Google Patents

Info

Publication number
TWI367919B
TWI367919B TW094103705A TW94103705A TWI367919B TW I367919 B TWI367919 B TW I367919B TW 094103705 A TW094103705 A TW 094103705A TW 94103705 A TW94103705 A TW 94103705A TW I367919 B TWI367919 B TW I367919B
Authority
TW
Taiwan
Application number
TW094103705A
Other languages
Chinese (zh)
Other versions
TW200535193A (en
Inventor
Tadashi Araki
Tsuneo Kimura
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200535193A publication Critical patent/TW200535193A/en
Application granted granted Critical
Publication of TWI367919B publication Critical patent/TWI367919B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
TW094103705A 2004-02-05 2005-02-04 Room temp solidified organic polysiloxane composition TW200535193A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004028990A JP4438937B2 (en) 2004-02-05 2004-02-05 Room temperature curable organopolysiloxane composition

Publications (2)

Publication Number Publication Date
TW200535193A TW200535193A (en) 2005-11-01
TWI367919B true TWI367919B (en) 2012-07-11

Family

ID=34879175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094103705A TW200535193A (en) 2004-02-05 2005-02-04 Room temp solidified organic polysiloxane composition

Country Status (4)

Country Link
JP (1) JP4438937B2 (en)
KR (1) KR101127301B1 (en)
CN (1) CN100368478C (en)
TW (1) TW200535193A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4530136B2 (en) * 2004-04-06 2010-08-25 信越化学工業株式会社 Room temperature curable organopolysiloxane composition and method for producing the same
JP4466846B2 (en) * 2004-09-24 2010-05-26 信越化学工業株式会社 Room temperature curable organopolysiloxane composition
DE102005040323A1 (en) * 2005-08-25 2007-03-15 Wacker Chemie Ag Organopolysiloxanes and a process for their preparation
JP5019036B2 (en) * 2006-04-03 2012-09-05 信越化学工業株式会社 Silicone rubber adhesive
JP2007321122A (en) * 2006-06-05 2007-12-13 Shin Etsu Chem Co Ltd Room temperature-curable organopolysiloxane composition
JP4912754B2 (en) * 2006-06-05 2012-04-11 信越化学工業株式会社 Room temperature curable organopolysiloxane composition
JP4530177B2 (en) * 2006-12-11 2010-08-25 信越化学工業株式会社 Room temperature curable organopolysiloxane composition
JP5266788B2 (en) * 2008-02-25 2013-08-21 株式会社スリーボンド Oil surface adhesive room temperature curable organopolysiloxane composition and cured product thereof
CN106255696A (en) * 2014-04-25 2016-12-21 信越化学工业株式会社 Novel silicon compound containing double (alkoxysilyl Asia ethylene) bases and preparation method thereof
KR101864504B1 (en) * 2016-11-11 2018-06-29 주식회사 케이씨씨 Organosiloxane compositions
JP6957435B2 (en) * 2018-10-23 2021-11-02 信越化学工業株式会社 Thermally conductive silicone composition and its cured product
CN110982482B (en) * 2019-12-25 2021-08-17 广西华纳新材料科技有限公司 Low-modulus high-elongation silicone sealant with good adhesion and preparation method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0778158B2 (en) * 1986-11-04 1995-08-23 旭有機材工業株式会社 Powdered phenolic resin composition for binder
JP2784045B2 (en) * 1989-06-15 1998-08-06 東芝シリコーン株式会社 Room temperature curable silicone rubber composition
JP3176213B2 (en) * 1994-03-08 2001-06-11 丸尾カルシウム株式会社 Modified silicone resin composition having improved storage stability and sealant comprising the same
JP3685031B2 (en) * 1998-04-10 2005-08-17 丸尾カルシウム株式会社 Surface treated calcium carbonate filler for synthetic resin, method for producing the same, and resin composition comprising the filler
JP4494543B2 (en) * 1998-11-20 2010-06-30 東レ・ダウコーニング株式会社 Room temperature curable silicone rubber composition
JP3871824B2 (en) * 1999-02-03 2007-01-24 キャボットスーパーメタル株式会社 Tantalum powder for high capacity capacitors
JP2001072890A (en) * 1999-09-06 2001-03-21 Maruo Calcium Co Ltd Surface-treated calcium carbonate, resin composition for porous film, and production of porous film
DE19957336A1 (en) * 1999-11-29 2001-07-12 Wacker Chemie Gmbh Crosslinkable organopolysiloxane compositions
JP5101762B2 (en) * 1999-11-29 2012-12-19 東レ・ダウコーニング株式会社 Room temperature curable silicone rubber composition
JP2002069300A (en) * 2000-08-31 2002-03-08 Dow Corning Toray Silicone Co Ltd Vibration-insulating silicon compound
JP2003034760A (en) * 2001-05-18 2003-02-07 Maruo Calcium Co Ltd Surface-treated calcium carbonate heavy and method for producing the same, and resin composition containing surface-treated calcium carbonate heavy
JP2003026954A (en) * 2001-07-23 2003-01-29 Maruo Calcium Co Ltd Surface-treated calcium carbonate and sealing composition comprising the same
JP3957486B2 (en) * 2001-10-12 2007-08-15 コニシ株式会社 Polysulfide curable composition
JP2004292724A (en) * 2003-03-28 2004-10-21 Shin Etsu Chem Co Ltd Room temperature curable organopolysiloxane composition
JP4912754B2 (en) * 2006-06-05 2012-04-11 信越化学工業株式会社 Room temperature curable organopolysiloxane composition

Also Published As

Publication number Publication date
KR101127301B1 (en) 2012-03-30
JP4438937B2 (en) 2010-03-24
CN100368478C (en) 2008-02-13
TW200535193A (en) 2005-11-01
CN1651517A (en) 2005-08-10
JP2005220215A (en) 2005-08-18
KR20060041688A (en) 2006-05-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees