TWI366239B - Wire bonding method and wire bonder adopting the same - Google Patents

Wire bonding method and wire bonder adopting the same

Info

Publication number
TWI366239B
TWI366239B TW094110140A TW94110140A TWI366239B TW I366239 B TWI366239 B TW I366239B TW 094110140 A TW094110140 A TW 094110140A TW 94110140 A TW94110140 A TW 94110140A TW I366239 B TWI366239 B TW I366239B
Authority
TW
Taiwan
Prior art keywords
wire
adopting
same
bonding method
bonder
Prior art date
Application number
TW094110140A
Other languages
Chinese (zh)
Other versions
TW200539363A (en
Inventor
Kyung-Wan Kang
Ki-Dong Kim
Yong-Bok Chung
Kook-Hwan Kim
Geun-Sik Ahn
Original Assignee
Samsung Techwin Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020040035860A external-priority patent/KR100548008B1/en
Priority claimed from KR1020040097030A external-priority patent/KR100651808B1/en
Application filed by Samsung Techwin Co Ltd filed Critical Samsung Techwin Co Ltd
Publication of TW200539363A publication Critical patent/TW200539363A/en
Application granted granted Critical
Publication of TWI366239B publication Critical patent/TWI366239B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
TW094110140A 2004-05-20 2005-03-30 Wire bonding method and wire bonder adopting the same TWI366239B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040035860A KR100548008B1 (en) 2004-05-20 2004-05-20 A method for automatically forming a ball of wire bonding device
KR1020040097030A KR100651808B1 (en) 2004-11-24 2004-11-24 Wire bonding method and wire bonder adopting the same

Publications (2)

Publication Number Publication Date
TW200539363A TW200539363A (en) 2005-12-01
TWI366239B true TWI366239B (en) 2012-06-11

Family

ID=52349136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094110140A TWI366239B (en) 2004-05-20 2005-03-30 Wire bonding method and wire bonder adopting the same

Country Status (1)

Country Link
TW (1) TWI366239B (en)

Also Published As

Publication number Publication date
TW200539363A (en) 2005-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees