TWI365503B - Chip structure and forming method thereof - Google Patents

Chip structure and forming method thereof

Info

Publication number
TWI365503B
TWI365503B TW097115602A TW97115602A TWI365503B TW I365503 B TWI365503 B TW I365503B TW 097115602 A TW097115602 A TW 097115602A TW 97115602 A TW97115602 A TW 97115602A TW I365503 B TWI365503 B TW I365503B
Authority
TW
Taiwan
Prior art keywords
forming method
chip structure
chip
forming
Prior art date
Application number
TW097115602A
Other languages
Chinese (zh)
Other versions
TW200945460A (en
Inventor
Chien Hao Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW097115602A priority Critical patent/TWI365503B/en
Publication of TW200945460A publication Critical patent/TW200945460A/en
Application granted granted Critical
Publication of TWI365503B publication Critical patent/TWI365503B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
TW097115602A 2008-04-28 2008-04-28 Chip structure and forming method thereof TWI365503B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097115602A TWI365503B (en) 2008-04-28 2008-04-28 Chip structure and forming method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097115602A TWI365503B (en) 2008-04-28 2008-04-28 Chip structure and forming method thereof

Publications (2)

Publication Number Publication Date
TW200945460A TW200945460A (en) 2009-11-01
TWI365503B true TWI365503B (en) 2012-06-01

Family

ID=44869751

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097115602A TWI365503B (en) 2008-04-28 2008-04-28 Chip structure and forming method thereof

Country Status (1)

Country Link
TW (1) TWI365503B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI550704B (en) * 2014-07-14 2016-09-21 國立屏東科技大學 Semiconductor processing, chip structure thereof and chip bonding structure
TWI550793B (en) * 2014-08-05 2016-09-21 國立屏東科技大學 Chip fabrication process and structure thereof

Also Published As

Publication number Publication date
TW200945460A (en) 2009-11-01

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