TWI364345B - - Google Patents

Download PDF

Info

Publication number
TWI364345B
TWI364345B TW97121208A TW97121208A TWI364345B TW I364345 B TWI364345 B TW I364345B TW 97121208 A TW97121208 A TW 97121208A TW 97121208 A TW97121208 A TW 97121208A TW I364345 B TWI364345 B TW I364345B
Authority
TW
Taiwan
Prior art keywords
diamond grinding
grinding disc
polishing
polishing pad
diamond
Prior art date
Application number
TW97121208A
Other languages
Chinese (zh)
Other versions
TW200950926A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW097121208A priority Critical patent/TW200950926A/en
Publication of TW200950926A publication Critical patent/TW200950926A/en
Application granted granted Critical
Publication of TWI364345B publication Critical patent/TWI364345B/zh

Links

Landscapes

  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

1364345 九、發明說明: 【發明所屬之技術領域】 本發明係與玻璃研磨/拋光設備有關,更詳而言之 是指一種修整裝置及玻璃研磨/拋光設備之平整度修 整方法者。 【先前技術】 按,習知玻璃研磨/拋光設備之鑽石研磨盤/抛光塾 係設置於旋轉盤(或稱下盤)上,研磨/抛光玻璃基板 時,係將玻璃基板貼置於上盤,再降下上盤使玻璃基 板可貼置於鑽石研磨盤/拋光墊上進行研磨/拋光之動 作。 由於鑽石研磨盤/拋光墊使用曰久其平整度會漸 漸失準’故,玻璃研磨/拋光設備使用一段時間後其鑽 石研磨盤/拋光墊皆必須進行平整度修整之動作,俾避 免加工後之玻璃基板其平整度不符合精度要求。而習 知修整鑽石研磨盤/拋光墊平整度之動作多賴人工方 式進行’不僅操作不易,且,修整時間長、鑽石研磨 盤/拋光墊之平整度多不易達到最佳化。 是以,如中華民國發明第89109317號「修整裝置 及磨平裝置」專利所示,係揭露利用機械方式修整鑽 石研磨盤/拋光墊平整度之裝置與方法。惟,該專利案 所揭之修整方式揭係將修整器裝設於玻璃研磨/拋光 設備之上盤,藉以研磨研磨盤或拋光墊,且,修整器 5 1364345 之修整面係大於鑽石研磨盤/抛光墊之面積,雖可達成 較受手工方式準確地修整鑽石研磨盤/拋光塾平整度 之效果’不過’構置成本較不經濟。 【發明内容】 本發明之主要目的即在提供一種修整裝置及玻璃 研磨/拋光設備之平整度修整方法,其巧妙地利用固設 於玻璃研磨/拋光設備之工作台護欄上之定位器與置 於鑽石研磨盤/拋光墊上之修整器之搭配設計來修整 鑽石研磨盤/拋光塾之平整度’操作簡易、修整時間 短,且,其修整器之外徑係大於鑽石研磨盤/拋光墊之 半徑、小於鑽石研磨盤/撤光墊之外徑,修整時可使鑽 石研磨盤/拋光塾之平整度達到最佳化,相較於習知修 整鑽石研磨盤/拋光墊平整度之設計,顯然更經濟、更 具實用價值。 緣是’為達成前述之目的,本發明係提供一種修 整裝置,用以修整玻璃研磨/拋光設備之鑽石研磨盤/ 拋光墊之平整度’包含有一定位器,固設於玻璃研磨/ 拋光設備之鑽石研磨盤/拋光墊一側,包含一擔止件, 位於該鑽石研磨盤/拋光墊上方;一修整器,置於該鑽 石研磨盤/拋光墊上並對應擋止件,用以當該鑽石研磨 盤/拋光墊旋轉時可受擋止件之阻擋而不隨之移動,其 外徑係大於該鑽石研磨盤/抛光塾之半徑。 此外’本發明更提供一種玻璃研磨/拋光設備之平 1364345 整度修整方法,係利用申請專利範圍第1項所述之修 整裝置修整鑽石研磨盤/拋光墊之平整度,包含有以下 步驟:a)將該定位器固.設於玻璃研磨/拋光設備之工作 台護攔並對應鑽石研磨盤/拋光墊;b)將該修整器置於 鑽石研磨盤/拋光墊上並對應擋止件;c)於修整器與鑽 石研磨盤/拋光墊之研磨部位供應液體;d)啟動該玻璃 研磨/拋光設備,使該鑽石研磨盤/拋光墊旋轉,用以使 該修整器受擋止件之阻擋而持續修整鑽石研磨盤/拋 光墊各部分之平整度。 【實施方式】 以下’茲舉本發明數較佳實施例,並配合圖式做 進一步之詳細說明如後: 首先’請參閱第一圖及第二圖所示,本發明一較 佳實施例之修整裝置10,係可用以修整習知玻璃研磨 設備1 (或拋光設備)之圓盤狀鑽石研磨盤2之鑽石 研磨錠平整度,該鑽石研磨盤2係設置於修整玻璃研 磨/拋光設備1之旋轉盤(圖中未示)頂侧,用以可受 旋轉盤帶動而旋轉。該修整裝置10係包含有一定位器 12與一修整器14。 該定位器12,係由一固定座22與一擋止件24所 構成。該固定座22係鎖固於玻璃研磨/拋光設備1之 工作台護搁3’該擔止件24具有一彎曲狀之基部26, 係固接於該固定座22底端對應鑽石研磨盤2之一側, 7 擋止部28’由二滑輪所構成,設於該基部26二端, 而位於該鑽石研磨盤2上方。 該修整器14,具有一環狀本體3〇,該本體3〇之 外技係大於鑽石研磨盤2之半徑,多數研磨旋32,可 為習知含有氧化鋁或鑽石等成分之研磨錠,設於該本 體30 —側,其外側則分別形成一修整面34。 藉此’該修整器14係置於鑽石研磨盤2之頂側並 辦應擋止件24,使各該研磨錠32之修整面34貼接鑽 石研磨盤2’俾該玻璃研磨設備1啟動而使鑽石研磨 盤2旋轉時,該修整器14可受擋止件24之阻擒而不 會隨者鑽石研磨盤2移動,用以可使該修整器14相對 鑽石研磨盤2滑動’如此一來,即可利用該修整器14 修整鑽石研磨盤2之鑽石研磨錠平整度。 其次,該修整器14之外徑係大於鑽石研磨盤2之 半徑、小於鑽石研磨盤2之外徑,俾該鑽石研磨盤2 旋轉之際修整器14即可平均地研磨其所有部位之鑽 石研磨錠、獲致最佳之平整度,而不需採用外徑過大 之修整器14來修整鑽石研磨盤2,尺寸設計甚為精 簡’亦可減少修整器14之購買成本。再者,由於該鑽 石研磨盤2旋轉時會產生帶動修整器14沿其切線方向 移動之力’該擋止部28之設計可使修整器14於鑽石 研磨盤2之旋轉過程中略為原地旋動,俾可保持研磨 鑽石研磨盤2之平順度及平整度。 如第三圖及第四圖所示,係本發明另一較佳實施 例之t整裝置4G’係用以修整習知抱光設備之圓盤狀 拋光塾之平整度,其結構大體上與前揭修整裝置1〇相 同’不同處在於:其修整器42係包含一圓盤狀本體 44,該本體44之外徑係大於拋光墊46之半徑,一修 整面48,設於該本體44對應拋光墊46之一側。藉此, 該修整裝置40亦具備前揭可修整習知拋光設備之拋 光墊平整度等效果。 由上可知,本發明更可提供玻璃研磨/拋光設備之 平整度修整方法,如第五圖所示,其步驟如下: 本發明之第一步驟:係先將該定位器12固設於玻 璃研磨/拋光設備丨之工作台護攔3並對應鑽石研磨盤 2 (或拋光塾)。 本發明之第二步驟:係將該修整器14置於鑽石研 磨盤2上並對應擋止件24。 本發明之第三步驟:係於該修整器14與鑽石研磨 盤2之研磨部值供應研磨液體,該研磨液體可為習知 研磨鑽石研磨盤之鑽石錠或拋光墊所採用之潤滑研磨 液0 本發明之第四步驟:係啟動該玻璃研磨/拋光設備 1’使該鑽石研磨盤2旋轉,用以使該修整器14受擋 止件24之阻擋而持續修整鑽石研磨盤2各部分之平整 度。 1364345 由上可知,本發明所提供之修整裝置及玻璃研磨 抛光設備之平整度修整方法,其利用固設於玻璃研磨 拋光設備之工作台護攔上之定位器與置於鑽石研磨盤 /拋光墊上之修整器之搭配設計,巧妙運用玻璃研磨/ 拋光設備原有之操作特性來修整鑽石研磨盤/抛光墊 之平整度,操作簡易,且,修整時間短、可使鑽石研 磨盤/拋光墊之平整度達到最佳化,相較於習知修整鑽 #石研磨盤/拋光塾平整度之設計,轉明顯然更具備進 步性與實用價值;緣是,本發明確實符合發明專利之 要見’爰依法提出申請。 【圖式簡單說明】 第一圖係本發明一較佳實施例之組合示意圖。 第一圖係本發明一較佳實施例之頂側示意圖,顯 不擋止件、修整器與鑽石研磨盤之相對關係。 第二圖係本發明另一較佳實施例之組合示意圖。 一第四圖係本發明另一較佳實施例之頂側示意圖, 顯示擋止件、修整器與拋光墊之相對關係。 第五圖係本發明再一較佳實施例之平整度修整方 法之流程圖。 1364345 【主要元件符號說明】 玻璃研磨設備1 鑽石研磨盤2 工作台護欄3 修整裝置10 定位器12 修整器14 固定座22 擋止件24 基部26 擋止部28 本體30 研磨錠32 修整面34 修整裝置40 修整器42 本體44 拋光塾46 修整面481364345 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a glass grinding/polishing apparatus, and more particularly to a trimming apparatus and a flatness trimming method of a glass grinding/polishing apparatus. [Prior Art] According to the conventional glass grinding/polishing equipment, the diamond grinding disc/polished enamel is disposed on the rotating disc (or the lower disc), and when the glass substrate is polished/polished, the glass substrate is placed on the upper disc. Lower the upper plate so that the glass substrate can be placed on the diamond grinding disc/polishing pad for grinding/polishing. Since the diamond grinding disc/polishing pad will gradually become out of alignment after using it for a long time, the diamond grinding disc/polishing pad must be flattened after using the glass grinding/polishing equipment for a period of time, so as to avoid processing. The flatness of the glass substrate does not meet the accuracy requirements. However, it is customary to trim the diamond grinding disc/polishing pad flatness more than the manual method. Not only is the operation difficult, but also the dressing time is long, and the flatness of the diamond grinding disc/polishing pad is not easily optimized. Therefore, as shown in the patent of the Republic of China Invention No. 89109317 "Finishing Device and Smoothing Device", it is disclosed that the device and method for mechanically trimming the grinding plate/polishing pad flatness by mechanical means are disclosed. However, the trimming method disclosed in the patent discloses that the dresser is mounted on the upper surface of the glass grinding/polishing apparatus, thereby grinding the grinding disc or the polishing pad, and the trimming surface of the dresser 5 1364345 is larger than the diamond grinding disc/ The area of the polishing pad can achieve the effect of accurately trimming the diamond grinding disc/polished flatness by hand. However, the cost of the configuration is less economical. SUMMARY OF THE INVENTION The main object of the present invention is to provide a flattening method for a dressing device and a glass grinding/polishing device, which skillfully utilizes a positioner and a placement on a workbench guardrail of a glass grinding/polishing device. The combination of the diamond grinding disc/polishing pad and the polishing pad is designed to trim the flatness of the diamond grinding disc/polish. The operation is simple, the dressing time is short, and the outer diameter of the dresser is larger than the radius of the diamond grinding disc/polishing pad. Less than the outer diameter of the diamond grinding disc/removal pad, the flatness of the diamond grinding disc/polished crucible can be optimized during dressing, which is obviously more economical than the design of the conventional diamond grinding disc/polishing mat flatness. More practical value. The edge is 'to achieve the foregoing purpose, the present invention provides a dressing device for trimming the flatness of a diamond grinding disc/polishing mat of a glass grinding/polishing apparatus' comprising a positioner fixed to the glass grinding/polishing apparatus One side of the diamond grinding disc/polishing pad, comprising a supporting member located above the diamond grinding disc/polishing pad; a trimmer placed on the diamond grinding disc/polishing pad and corresponding to the stopper for grinding the diamond The disc/polishing pad can be blocked by the stop member without being moved when rotated, and its outer diameter is greater than the radius of the diamond abrasive disc/polish. In addition, the present invention further provides a flat 1364345 uniformity dressing method for a glass grinding/polishing apparatus, which is characterized in that the flatness of the diamond grinding disc/polishing pad is trimmed by the dressing device described in claim 1 of the patent application, comprising the following steps: a The locator is fixed to the table guard of the glass grinding/polishing apparatus and corresponds to the diamond grinding disc/polishing pad; b) the trimmer is placed on the diamond grinding disc/polishing pad and corresponding to the stopper; c) Supplying a liquid to the polishing portion of the dresser and the diamond grinding disc/polishing pad; d) activating the glass grinding/polishing device to rotate the diamond grinding disc/polishing pad to prevent the trimmer from being blocked by the stopper Trim the flatness of each part of the diamond grinding disc/polishing pad. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following, a preferred embodiment of the present invention will be described in detail with reference to the drawings as follows: First, please refer to the first and second figures, which show a preferred embodiment of the present invention. The dressing device 10 can be used to trim the flatness of the diamond grinding ingot of the disc-shaped diamond grinding disc 2 of the conventional glass grinding apparatus 1 (or polishing apparatus), which is disposed in the trimming glass grinding/polishing apparatus 1 The top side of the rotating disk (not shown) is rotatable by the rotating disk. The dressing device 10 includes a locator 12 and a trimmer 14. The positioner 12 is composed of a fixing base 22 and a stopper 24. The fixing base 22 is locked to the table guard 3 of the glass grinding/polishing apparatus 1 . The supporting member 24 has a curved base portion 26 fixed to the bottom end of the fixing base 22 corresponding to the diamond grinding disc 2 On one side, the 7-stop portion 28' is composed of two pulleys, and is disposed at both ends of the base portion 26 and above the diamond grinding disc 2. The dresser 14 has an annular body 3〇, the body 3〇 is larger than the radius of the diamond grinding disc 2, and the plurality of grinding coils 32 can be a conventional grinding ingot containing alumina or diamond. On the side of the body 30, a trimming surface 34 is formed on the outer side. Therefore, the trimmer 14 is placed on the top side of the diamond grinding disc 2 and the stopper 24 is disposed so that the trimming surface 34 of each of the polishing ingots 32 is attached to the diamond grinding disc 2', and the glass grinding apparatus 1 is activated. When the diamond grinding disc 2 is rotated, the trimmer 14 can be blocked by the stopper 24 without being moved by the diamond grinding disc 2 to slide the dresser 14 relative to the diamond grinding disc 2. The dresser 14 can be used to trim the diamond grinding ingot of the diamond grinding disc 2. Secondly, the outer diameter of the dresser 14 is larger than the radius of the diamond grinding disc 2 and smaller than the outer diameter of the diamond grinding disc 2. When the diamond grinding disc 2 rotates, the dresser 14 can evenly grind all parts of the diamond grinding. The ingots are optimally flattened without the use of an oversized outer dresser 14 to trim the diamond grinding disc 2, and the size design is very simplified, which also reduces the purchase cost of the trimmer 14. Moreover, since the diamond grinding disc 2 rotates, a force that drives the dresser 14 to move in the tangential direction thereof is generated. The design of the stopping portion 28 allows the dresser 14 to rotate slightly during the rotation of the diamond grinding disc 2. The 俾 can maintain the smoothness and flatness of the ground diamond grinding disc 2. As shown in the third and fourth figures, the t-device 4G' of another preferred embodiment of the present invention is used for trimming the flatness of a disc-shaped polishing crucible of a conventional glazing apparatus, and its structure is substantially the same as The pre-extrusion device is the same as the same: the trimmer 42 includes a disc-shaped body 44, the outer diameter of the body 44 is greater than the radius of the polishing pad 46, and a trimming surface 48 is provided on the body 44. One side of the polishing pad 46. Thereby, the dressing device 40 also has the effects of flattening the polishing pad of the conventional polishing device. As can be seen from the above, the present invention further provides a flatness trimming method for the glass grinding/polishing apparatus, as shown in the fifth figure, the steps of which are as follows: The first step of the present invention: firstly fixing the positioner 12 to the glass grinding / Polishing equipment 工作 Workbench barrier 3 and corresponding to diamond grinding disc 2 (or polished 塾). The second step of the invention is to place the dresser 14 on the diamond grinding disc 2 and corresponding to the stop member 24. The third step of the present invention is to supply the grinding liquid to the grinding portion of the dresser 14 and the diamond grinding disc 2, and the grinding liquid can be the lubricating slurry used for the diamond ingot or polishing pad of the conventional grinding diamond grinding disc. The fourth step of the present invention is to activate the glass grinding/polishing apparatus 1' to rotate the diamond grinding disc 2, so that the trimmer 14 is blocked by the stopper 24 to continuously trim the flat portions of the diamond grinding disc 2. degree. 1364345 It can be seen from the above that the flattening method for the dressing device and the glass grinding and polishing device provided by the present invention utilizes a positioner fixed on the table guard of the glass grinding and polishing device and placed on the diamond grinding disk/polishing pad. The design of the trimmer is ingeniously used to trim the flatness of the diamond grinding disc/polishing pad with the original operating characteristics of the glass grinding/polishing equipment. It is easy to operate and has a short dressing time to smooth the diamond grinding disc/polishing mat. The degree of optimization is better than that of the conventional dressing #石磨盘/polished flatness design, which is obviously more progressive and practical. The reason is that the invention does meet the requirements of the invention patent. Apply in accordance with the law. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic view of a combination of a preferred embodiment of the present invention. The first figure is a top side view of a preferred embodiment of the present invention showing the relative relationship between the stop, the dresser and the diamond grinding disc. The second drawing is a schematic view of a combination of another preferred embodiment of the present invention. A fourth drawing is a top side view of another preferred embodiment of the present invention, showing the relative relationship between the stopper, the dresser and the polishing pad. Fig. 5 is a flow chart showing a flatness trimming method in accordance with still another preferred embodiment of the present invention. 1364345 [Description of main components] Glass grinding equipment 1 Diamond grinding disc 2 Workbench guardrail 3 Dressing device 10 Positioner 12 Dresser 14 Fixing seat 22 Stopper 24 Base 26 Stopper 28 Body 30 Abrasive ingot 32 Trimming surface 34 Trimming Device 40 dresser 42 body 44 polished 塾 46 trimming surface 48

Claims (1)

1364345 π年(I月郎营(於正资爲 十、申請專利範圍:—一"! -一一一^ 1. 一種修整裝置’用以修整玻璃研磨/拋光設備之 鑽石研磨盤/抛光墊之平整度,包含有: 一定位器,固設於玻璃研磨/拋光設備之鑽石研磨 盤/拋光墊一側,包含一固定座,一擋止件,設於該固 定座對應鑽石研磨盤/拋光墊之一端,包含一基部,概 呈彎曲狀,係連接該固定座,一檔止部,係由二滑輪 • 所構成’該二滑輪係樞設於基部二端;及 一修整器’置於該鑽石研磨盤/拋光墊上並抵接二 滑輪’用以當該鑽石研磨盤/拋光墊旋轉時可受二滑輪 之阻播而不隨之移動,其外徑係大於該鑽石研磨盤/ 拋光墊之半徑。1364345 π年(I Yue Langying (Yu Zhengzi is ten, the scope of patent application: -1 "! -11-1) 1. A dressing device used to trim the diamond grinding/polishing pad of glass grinding/polishing equipment The flatness includes: a locator fixed on one side of the diamond grinding disc/polishing pad of the glass grinding/polishing equipment, comprising a fixing seat and a stopping member disposed on the fixing seat corresponding to the diamond grinding disc/polishing One end of the pad includes a base portion which is substantially curved and connected to the fixing seat. The first stop portion is formed by two pulleys. The two pulley systems are pivotally disposed at the two ends of the base; and a trimmer is placed The diamond grinding disc/polishing pad is abutted against the two pulleys' for being blocked by the two pulleys when the diamond grinding disc/polishing pad is rotated without being moved, and the outer diameter is larger than the diamond grinding disc/polishing pad The radius. 1212
TW097121208A 2008-06-06 2008-06-06 Trimming device and trimming method for a smooth level of glass grinding and polishing device TW200950926A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097121208A TW200950926A (en) 2008-06-06 2008-06-06 Trimming device and trimming method for a smooth level of glass grinding and polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097121208A TW200950926A (en) 2008-06-06 2008-06-06 Trimming device and trimming method for a smooth level of glass grinding and polishing device

Publications (2)

Publication Number Publication Date
TW200950926A TW200950926A (en) 2009-12-16
TWI364345B true TWI364345B (en) 2012-05-21

Family

ID=44871534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097121208A TW200950926A (en) 2008-06-06 2008-06-06 Trimming device and trimming method for a smooth level of glass grinding and polishing device

Country Status (1)

Country Link
TW (1) TW200950926A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI598190B (en) * 2016-09-21 2017-09-11 Ying Chieh Chiu Automatic glass polishing machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI598190B (en) * 2016-09-21 2017-09-11 Ying Chieh Chiu Automatic glass polishing machine

Also Published As

Publication number Publication date
TW200950926A (en) 2009-12-16

Similar Documents

Publication Publication Date Title
JP6401319B2 (en) Polishing equipment
CN102814738B (en) Method and apparatus for conditioning a polishing pad
CA2717530C (en) Orbital smoothing device
TW200949921A (en) Grinding method for grinding back-surface of semiconductor wafer and grinding apparatus for grinding back-surface of semiconductor wafer used in same
TW201446427A (en) Polishing pad dresser and manufacturing method thereof, polishing pad dressing device and polishing system
KR101410144B1 (en) Knife grinder
WO2019007006A1 (en) Thinning and polishing device for wafer
JP6271339B2 (en) Grinding and polishing equipment
TWI364345B (en)
JP5405979B2 (en) Grinding wheel
CN207077303U (en) A kind of automatic saw blade polishing machine
US20220339753A1 (en) Processing method
CN212496900U (en) Angle grinding device for processing prism base cover plate
CN210173287U (en) Mirror surface grinding machine
JP2015500151A (en) Wafer polishing apparatus and wafer polishing method
CN103144040A (en) Chemical mechanical polishing equipment
CN207309688U (en) A kind of twin grinder
CN220994033U (en) Wafer polishing equipment for semiconductor
CN210024801U (en) Polishing device for inorganic grindstone
JP2003170338A (en) Method and device for grinding
TWI510332B (en) Polishing pad dresser, polishing pad dressing device and polishing system
KR102470301B1 (en) Dresser for double-sided grinding machine
CN218697273U (en) Abrasive machine with fixed polishing function
KR101273938B1 (en) Polishing method using pad tool with a lower position
CN218312736U (en) Burnishing device is used in precision mold processing with prevent excursion function

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees