1363431 ' 100年.11.月09日梭正^頁 六、發明說明： ‘ 【發明所屬之技術領域】 [0001] 本發明涉及一種發光二極體及一種採用該發光二極體之 光源裝置。 【先前技術】 [0002] 發光二極體（Light Emi 11 ing Diode, LED )係利用 半導體材料中之電子與電洞結合時能量帶（Energy Gap )位階之改變，以發光形式釋放出能量。目前於市場上 應用之發光二極體所發出之光為紅、綠、藍及白光等多 種。由於發光二極體具有體積小、壽命長、驅動電壓低 、耗電量低、反應速率快、耐震性佳等優點，可應用於 銀行匯率看板、汽車第三煞車燈、交通號誌、戶外資訊 看板與日常照明等各種應用領域中。 [0003] 目前，日常使用之照明工具一般為日光燈，由於日光燈 内部燈管含有汞蒸氣。當日光燈損壞或回收時，易會造成 汞蒸氣之外洩，對環境造成污染。由於LED之使用壽命遠 遠大於曰光燈，且回收時，不會造成對環境之污染，因此 以LED作為曰常照明工具來替代曰光燈係未來發展趨勢之 一。惟，目前一般發光二極體光利用率較低，用作照明 時，效果不理想。 【發明内容】 [0004] 有鑒於此，有必要提供一種發光二極體及一種光源裝置 〇 [0005] 一種發光二極體，包括一發光晶片及一具有出光部之封 裝體，該封裝體用於封裝所述發光晶片，所述發光晶片 094135087 表單編號A0101 第3頁/共12頁 1003414426-0 1363431 100年.11月09日俊正替換頁 ·.，· -—— 發出之光從該出光部出射，其中，所述出光部具有一凹 部及一凸部，該凸部正對發光晶片且向所述發光二極體 外部突出，且該凸部位於所述凹部之底面中央處。 [0006] 一種光源裝置包括：複數發光二極體及一位於所述發光 二極體出光方向側之非球面透鏡。每一發光二極體包括 一發光晶片及一具有出光部之封裝體，該封裝體用於封 裝所述發光晶片’所述發光晶片發出之光從該出光部出 射’其中’所述出光部具有一凹部及一凸部，該凸部正 對發光晶片且向所述發光二極體外部突出，且該凸部位 於所述凹部之底面中央處。 [0007] 相對於先前技術，所述之發光二極體藉由封裝體之出光 部之設計，採用凹部及凹部中間之凸部相互配合，發光 晶片發光之光一部分從凸部出射至照明方向，另一部分 光經封裝體邊緣反射至凹部出射至照明方向，可增強照 明方向之輝度，提高光利用率。所述之光源裝置藉由非 球面透鏡使複數發光二極體形成之發光面更加均勻。 【實施方式】 [0008] [0009] [0010] 以下將結合附圖對本發明作進一步之詳細說明。 請參閲第一圖’本發明第一實例提供一種發光二極體1〇 ，其包括一發光晶片12、一封裝體16、一反射罩22及一 印刷電路板24。 發光晶片12選自红光發光晶片、綠光發光晶片或藍光發 光晶片以此製作成彩色光源。還可於發光晶片12上塗覆 營光粉（圖未示），發光晶片12發出之光激發螢光粉，使 094135087 表單编號A0101 第4頁/共12頁 1003414426-0 1363431 [ϊοο年.llj 09.日修正頁 螢光粉産生與發光晶片12發出之光不相同之光，再與發 光晶片12發出之光混合以産生白光而製造成白光光源。 [0011] 該封裝體16封裝發光晶片12。封裝體16具一出光部18, 發光晶片12發出之光從出光部18出射。該出光部18具有 一凹部184及一凸部182 ,該凸部182正對發光晶片12且 向發光二極體10外部突出，且該凸部182位於凹部184之 底面中央處。發光晶片12發出之光一部分直接從凸部Μ〗 出射至照明方向，另一部分光經封裝體邊緣162反射至凹 部184出射至照明方向，可增強照明方向之輝度，提高光 利用率，同時也可增加照明面積。 [0012] 封裝體16之材料可選用聚酯樹脂（p〇iyester Resins) ’如聚乙烯對笨二甲酸酯（Polyethylene Tereph - thalate，PET)、聚二酸二乙酯（p〇iyethyiene1363431 '100 years.11.月09日梭正^页 VI. Description of the invention: ‘Technical field to which the invention pertains. [0001] The present invention relates to a light-emitting diode and a light source device using the same. [Prior Art] [0002] Light Emi 11 ing Diode (LED) utilizes a change in the energy Gap level when electrons in a semiconductor material are combined with a hole to release energy in the form of light. The light emitted by the LEDs currently used in the market is red, green, blue and white. Because the light-emitting diode has the advantages of small volume, long life, low driving voltage, low power consumption, fast reaction rate and good shock resistance, it can be applied to bank exchange rate board, automobile third lamp, traffic sign, outdoor information. In various application fields such as billboards and daily lighting. [0003] Currently, lighting tools for daily use are generally fluorescent lamps, since the internal lamps of the fluorescent lamps contain mercury vapor. When the fluorescent lamp is damaged or recycled, it will easily cause mercury vapor to escape and pollute the environment. Since the service life of LEDs is far greater than that of xenon lamps, and it does not cause environmental pollution when recycling, LEDs are used as a common lighting tool to replace one of the future development trends of the Xenon lamp system. However, at present, the general light-emitting diode has a low light utilization rate, and when used for illumination, the effect is not satisfactory. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a light emitting diode and a light source device. [0005] A light emitting diode comprising a light emitting chip and a package having a light exiting portion, the package body For encapsulating the illuminating wafer, the illuminating wafer 094135087 Form No. A0101 Page 3 / Total 12 Page 1003414426-0 1363431 100. November 09 Jun Jun Replacement Page ·., · - - The light emitted from the light exiting portion And the light exiting portion has a concave portion and a convex portion facing the light emitting chip and protruding toward the outside of the light emitting diode, and the convex portion is located at a center of the bottom surface of the concave portion. A light source device includes: a plurality of light emitting diodes and an aspherical lens on a light emitting direction side of the light emitting diode. Each of the light-emitting diodes includes a light-emitting chip and a package having a light-emitting portion for encapsulating the light-emitting chip. The light emitted by the light-emitting chip is emitted from the light-emitting portion, wherein the light-emitting portion has a concave portion and a convex portion that face the light-emitting chip and protrude toward the outside of the light-emitting diode, and the convex portion is located at the center of the bottom surface of the concave portion. [0007] Compared with the prior art, the light-emitting diodes are designed by the light-emitting portions of the package, and the convex portions in the middle of the concave portion and the concave portion are matched with each other, and a part of the light emitted from the light-emitting chip is emitted from the convex portion to the illumination direction. Another part of the light is reflected by the edge of the package to the concave portion and emitted to the illumination direction, which can enhance the brightness of the illumination direction and improve the light utilization efficiency. The light source device makes the light-emitting surface formed by the plurality of light-emitting diodes more uniform by the aspherical lens. [Embodiment] [0009] [0010] The present invention will be further described in detail below with reference to the accompanying drawings. Referring to the first figure, a first embodiment of the present invention provides a light emitting diode 1A comprising a light emitting chip 12, a package body 16, a reflective cover 22 and a printed circuit board 24. The luminescent wafer 12 is selected from a red luminescent wafer, a green luminescent wafer or a blue luminescent wafer to produce a colored light source. A luminescent powder (not shown) may also be coated on the luminescent wafer 12, and the light emitted from the luminescent wafer 12 excites the luminescent powder to make 094135087 Form No. A0101 Page 4 / Total 12 Page 1003414426-0 1363431 [ϊοο年.llj 09. The correction sheet generates phosphor light which is different from the light emitted from the light-emitting chip 12, and is mixed with the light emitted from the light-emitting chip 12 to generate white light to be a white light source. [0011] The package body 16 encapsulates the light emitting chip 12. The package body 16 has a light exit portion 18, and light emitted from the light-emitting chip 12 is emitted from the light exit portion 18. The light exit portion 18 has a concave portion 184 and a convex portion 182 which is opposite to the light emitting chip 12 and protrudes to the outside of the light emitting diode 10, and the convex portion 182 is located at the center of the bottom surface of the concave portion 184. A part of the light emitted by the illuminating chip 12 is directly emitted from the convex portion to the illumination direction, and another portion of the light is reflected by the package edge 162 to the concave portion 184 to be emitted to the illumination direction, thereby enhancing the brightness of the illumination direction and improving the light utilization rate. Increase the lighting area. [0012] The material of the package 16 may be selected from a polyester resin (p〇iyester Resins) such as polyethylene terephthalate (PET), polyethylene diacrylate (p〇iyethyiene).
Naphthalate，PEN);丙烯酸樹脂（Acrylic Resins) ，如聚甲基丙稀酸甲酯（Polymethyl Methacrylate) 、改良之聚曱基丙稀酸甲醋（Modified Polymethyl Methacrylate);氟化樹脂（Fluororesins)，如聚偏 氟乙稀樹脂（Polyvinylidene Fluoride, PVDF);氯 乙烯樹脂（Vinyl Chloride Resins)，如氯乙烯共聚物 (Vinyl Chloride Compolyraers)等等。透過封裝製程 後，封裝體16將發光晶片12加以覆蓋保護》 [0013] 反射罩22環繞封裝體16設置，反射罩22包括一第一開口 222及第二開口 224，該第二開口 224之直徑較第一開口 222之直徑大。封裝體16位於第一開口 222處，第一開口 222與印刷電路板24結合在一起，第二開口 224遠離印刷 094135087 表單編號Α0101 第5頁/共12頁 1003414426-0 1363431 100年11月09曰梭正雜頁 電路板24。反射罩22之外表面226為一垂直於印刷電路板 24之直線之旋轉面，内表面228為一與印刷電路板24成一 銳角之直線之旋轉面，其為一光反射面。外表面226與内 表面228形成一夾角0。發光晶片12發出之光到達封裝體 邊緣162時’不滿足全反射條件之光從封裝體邊緣162出 射後被反射罩22之内表面228反射至預定角度加以利用， 提咼光利用率。因此可藉由設計夾角0之大小來控制光 之能量分佈，以達到預定之照明效果。 [0014] 印刷電路板24承載發光晶片12、封裝體1 6及反射罩22， 印刷電路板24電性連接於發光晶片12。 [0015] 請參閱第二圖，本發明第二實施例提供一種光源裝置40 ’其包括.複數發光-一極體4 2、非球面透鏡4 4及· 一基 板46。複數發光二極體42選自本發明第一實施例提供之 發光二極體1 0 〇.Naphthalate, PEN); Acrylic Resins, such as Polymethyl Methacrylate, Modified Polymethyl Methacrylate; Fluororesins, such as Polyvinylidene Fluoride (PVDF); Vinyl Chloride Resins, such as Vinyl Chloride Compolyraers, and the like. After the package process, the package 16 protects the luminescent wafer 12 from the package. The reflector 22 is disposed around the package 16. The reflector 22 includes a first opening 222 and a second opening 224. The diameter of the second opening 224 It is larger than the diameter of the first opening 222. The package body 16 is located at the first opening 222, the first opening 222 is combined with the printed circuit board 24, and the second opening 224 is away from the printing 094135087. Form No. 1010101 Page 5 / Total 12 Page 1003414426-0 1363431 100 November 09曰Shuttle is a page board 24. The outer surface 226 of the reflector 22 is a linear plane perpendicular to the printed circuit board 24. The inner surface 228 is a linear rotating surface at an acute angle to the printed circuit board 24, which is a light reflecting surface. Outer surface 226 forms an angle 0 with inner surface 228. When the light emitted from the light-emitting chip 12 reaches the package edge 162, light that does not satisfy the total reflection condition is emitted from the package edge 162 and is reflected by the inner surface 228 of the reflection cover 22 to a predetermined angle to utilize the light utilization efficiency. Therefore, the energy distribution of light can be controlled by designing the angle of the angle 0 to achieve a predetermined illumination effect. [0014] The printed circuit board 24 carries the light-emitting chip 12, the package body 16 and the reflector cover 22, and the printed circuit board 24 is electrically connected to the light-emitting chip 12. Referring to the second figure, a second embodiment of the present invention provides a light source device 40' which includes a plurality of light-emitting bodies 4, an aspherical lens 44 and a substrate 46. The plurality of light-emitting diodes 42 are selected from the light-emitting diodes provided by the first embodiment of the present invention.
[0016] 複數發光二極體42呈矩陣狀排列，非球面透鏡44位於複 數發光二極體42出光方向侧，該非球面透鏡44之面積與 複數發光二極體42矩陣面積大致相同。複數發光二極體 42發光之光經過非球面透鏡44後，使複數發光二極體42 形成之發光面更加均勻。 [0017] 本實施例提供之發光二極體10，藉由封裝體之出光部18 之設計’採用凹部184及凹部184中間之凸部182相互配 合，發光晶片12發光之光一部分從凸部182出射至照明方 向，另一部分光經封裝體邊緣162反射至凹部184出射， 可增強照明方向之輝度，提高光利用率。光源裝置40藉 094135087 表單编號A0101 第6頁/共12頁 1003414426-0 1363431 100年.11月09日按正替換頁 由非球面透鏡44使複數發光二極體42形成之發光面更加 均勻。 [0018] 綜上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施例 ，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0019] 第一圖為本發明第一實施例提供之一種發光二極體之剖 面示意圖。 [0020] 第二圖為本發明第二實施例提供之一種光源裝置之剖面 , 示意圖。 【主要元件符號說明】 [0021] 發光二極體：10，42 [0022] 封裝體：16 [0023] 凹部：184 , [0024] 反射罩：22 [0025] 外表面：226 [0026] 光源裝置：40 [0027] 非球面透鏡：44 , [0028] 封裝體邊緣：162 [0029] 發光晶片：12 094135087 表單編號A0101 第7頁/共12頁 1003414426-0 1363431 100年.11月09日修正替換頁 [0030] 出光部：18 [0031] 凸部：182 [0032] 内表面：228 [0033] 第一開口 ： 222 [0034] 第二開口 ： 224 [0035] 基板：46 [0036] 印刷電路板：24 1003414426-0 094135087 表單编號A0101 第8頁/共12頁The plurality of light-emitting diodes 42 are arranged in a matrix, and the aspherical lens 44 is located on the light-emitting direction side of the plurality of light-emitting diodes 42, and the area of the aspherical lens 44 is substantially the same as the matrix area of the plurality of light-emitting diodes 42. After the light emitted from the plurality of light-emitting diodes 42 passes through the aspherical lens 44, the light-emitting surface formed by the plurality of light-emitting diodes 42 is made more uniform. [0017] The light-emitting diode 10 provided in this embodiment is configured by the concave portion 184 and the convex portion 182 in the middle of the concave portion 184 by the design of the light-emitting portion 18 of the package. The light emitted by the light-emitting chip 12 is partially emitted from the convex portion 182. The light is emitted to the illumination direction, and another part of the light is reflected by the package edge 162 to the concave portion 184 to enhance the brightness of the illumination direction and improve the light utilization efficiency. Light source device 40 borrows 094135087 Form No. A0101 Page 6 of 12 1003414426-0 1363431 100. November 09 Pressing the replacement page The aspherical lens 44 makes the light-emitting surface formed by the complex LEDs 42 more uniform. [0018] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0019] The first figure is a schematic cross-sectional view of a light-emitting diode according to a first embodiment of the present invention. 2 is a cross-sectional view showing a light source device according to a second embodiment of the present invention. [Description of Main Component Symbols] [0021] Light Emitting Diode: 10, 42 [0022] Package: 16 [0023] Recess: 184, [0024] Reflector: 22 [0025] Outer surface: 226 [0026] Light source device :40 [0027] Aspheric lens: 44, [0028] Package edge: 162 [0029] Light-emitting wafer: 12 094135087 Form number A0101 Page 7 / Total 12 pages 1003414426-0 1363431 100 years. November 09 correction replacement Page [0030] Light exit portion: 18 [0031] Projection: 182 [0032] Inner surface: 228 [0033] First opening: 222 [0034] Second opening: 224 [0035] Substrate: 46 [0036] Printed circuit board :24 1003414426-0 094135087 Form No. A0101 Page 8 of 12