TWI362304B - Method for consolidating tough coated hard powders - Google Patents
Method for consolidating tough coated hard powders Download PDFInfo
- Publication number
- TWI362304B TWI362304B TW094119344A TW94119344A TWI362304B TW I362304 B TWI362304 B TW I362304B TW 094119344 A TW094119344 A TW 094119344A TW 94119344 A TW94119344 A TW 94119344A TW I362304 B TWI362304 B TW I362304B
- Authority
- TW
- Taiwan
- Prior art keywords
- intermediate layer
- group
- outer layer
- particles
- core
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 85
- 239000000843 powder Substances 0.000 title description 23
- 239000010410 layer Substances 0.000 claims description 161
- 239000002245 particle Substances 0.000 claims description 100
- 238000005245 sintering Methods 0.000 claims description 86
- 239000000463 material Substances 0.000 claims description 81
- 239000007771 core particle Substances 0.000 claims description 71
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 239000007788 liquid Substances 0.000 claims description 34
- 239000007791 liquid phase Substances 0.000 claims description 31
- 239000000203 mixture Substances 0.000 claims description 31
- 229910017052 cobalt Inorganic materials 0.000 claims description 28
- 239000010941 cobalt Substances 0.000 claims description 28
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 28
- 238000000151 deposition Methods 0.000 claims description 26
- 239000011162 core material Substances 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 23
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 22
- -1 metalloid nitrides Chemical class 0.000 claims description 22
- 230000008021 deposition Effects 0.000 claims description 18
- 229910052752 metalloid Inorganic materials 0.000 claims description 18
- 239000011236 particulate material Substances 0.000 claims description 16
- 239000004568 cement Substances 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 238000004090 dissolution Methods 0.000 claims description 13
- 239000000126 substance Substances 0.000 claims description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 125000004429 atom Chemical group 0.000 claims description 12
- 238000007596 consolidation process Methods 0.000 claims description 11
- 229910052742 iron Inorganic materials 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 10
- 150000002739 metals Chemical class 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000010432 diamond Substances 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 7
- 230000003993 interaction Effects 0.000 claims description 7
- 150000002738 metalloids Chemical class 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 229910003682 SiB6 Inorganic materials 0.000 claims description 6
- 238000005253 cladding Methods 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 229910052734 helium Inorganic materials 0.000 claims description 6
- 239000001307 helium Substances 0.000 claims description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- 229910007948 ZrB2 Inorganic materials 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- VWZIXVXBCBBRGP-UHFFFAOYSA-N boron;zirconium Chemical compound B#[Zr]#B VWZIXVXBCBBRGP-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 claims description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
- 229910003862 HfB2 Inorganic materials 0.000 claims description 4
- 229910015173 MoB2 Inorganic materials 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- 229910004533 TaB2 Inorganic materials 0.000 claims description 4
- 229910033181 TiB2 Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000005229 chemical vapour deposition Methods 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000005240 physical vapour deposition Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- 229910004542 HfN Inorganic materials 0.000 claims description 3
- 229910015425 Mo2B5 Inorganic materials 0.000 claims description 3
- 229910020968 MoSi2 Inorganic materials 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- 229910034327 TiC Inorganic materials 0.000 claims description 3
- 229910026551 ZrC Inorganic materials 0.000 claims description 3
- 229910008322 ZrN Inorganic materials 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 3
- 229910052961 molybdenite Inorganic materials 0.000 claims description 3
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 238000010532 solid phase synthesis reaction Methods 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 2
- 229910016006 MoSi Inorganic materials 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 2
- 239000012298 atmosphere Substances 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 229910052712 strontium Inorganic materials 0.000 claims description 2
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims description 2
- 229910003468 tantalcarbide Inorganic materials 0.000 claims 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 4
- 229910003864 HfC Inorganic materials 0.000 claims 2
- 229910002111 aluminum magnesium boride Inorganic materials 0.000 claims 2
- 229910001315 Tool steel Inorganic materials 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- RJEIKIOYHOOKDL-UHFFFAOYSA-N [Li].[La] Chemical compound [Li].[La] RJEIKIOYHOOKDL-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims 1
- 235000003642 hunger Nutrition 0.000 claims 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims 1
- YIADEKZPUNJEJT-UHFFFAOYSA-N n-ethyloctadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCNCC YIADEKZPUNJEJT-UHFFFAOYSA-N 0.000 claims 1
- 229910052754 neon Inorganic materials 0.000 claims 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims 1
- 239000000049 pigment Substances 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 229910052724 xenon Inorganic materials 0.000 claims 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 47
- 238000000576 coating method Methods 0.000 description 46
- 101000653548 Homo sapiens Trichoplein keratin filament-binding protein Proteins 0.000 description 45
- 102100030645 Trichoplein keratin filament-binding protein Human genes 0.000 description 45
- 239000011248 coating agent Substances 0.000 description 43
- YCCHNFGPIFYNTF-UHFFFAOYSA-N tertiary cymene hydroperoxide Natural products CC1=CC=C(C(C)(C)OO)C=C1 YCCHNFGPIFYNTF-UHFFFAOYSA-N 0.000 description 43
- 239000012071 phase Substances 0.000 description 11
- 229910009043 WC-Co Inorganic materials 0.000 description 8
- 239000007767 bonding agent Substances 0.000 description 7
- 230000000670 limiting effect Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000000280 densification Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 6
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 5
- 238000006722 reduction reaction Methods 0.000 description 5
- 230000002829 reductive effect Effects 0.000 description 5
- 229910052707 ruthenium Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000005056 compaction Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 229910052758 niobium Inorganic materials 0.000 description 4
- 239000010955 niobium Substances 0.000 description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 241000238633 Odonata Species 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 238000003763 carbonization Methods 0.000 description 3
- 230000001627 detrimental effect Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 229910052746 lanthanum Inorganic materials 0.000 description 3
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 3
- 238000004372 laser cladding Methods 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 150000001247 metal acetylides Chemical class 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000010587 phase diagram Methods 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000008707 rearrangement Effects 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000009827 uniform distribution Methods 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- RZJQYRCNDBMIAG-UHFFFAOYSA-N [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] Chemical class [Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Cu].[Zn].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Ag].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn].[Sn] RZJQYRCNDBMIAG-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000009770 conventional sintering Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000005242 forging Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- REFMYUOVHSCDIA-UHFFFAOYSA-N n-ethyl-n-octadecyloctadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCCCN(CC)CCCCCCCCCCCCCCCCCC REFMYUOVHSCDIA-UHFFFAOYSA-N 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- NUMXHEUHHRTBQT-AATRIKPKSA-N 2,4-dimethoxy-1-[(e)-2-nitroethenyl]benzene Chemical compound COC1=CC=C(\C=C\[N+]([O-])=O)C(OC)=C1 NUMXHEUHHRTBQT-AATRIKPKSA-N 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- 229910001339 C alloy Inorganic materials 0.000 description 1
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- 238000001016 Ostwald ripening Methods 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 102000043030 TCHP family Human genes 0.000 description 1
- 108091084801 TCHP family Proteins 0.000 description 1
- CKUAXEQHGKSLHN-UHFFFAOYSA-N [C].[N] Chemical compound [C].[N] CKUAXEQHGKSLHN-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- FDTGUDJKAXJXLL-UHFFFAOYSA-N acetylene Chemical group C#C.C#C FDTGUDJKAXJXLL-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229960000074 biopharmaceutical Drugs 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910002110 ceramic alloy Inorganic materials 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 239000011246 composite particle Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 238000005261 decarburization Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000006392 deoxygenation reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000000469 dry deposition Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005518 electrochemistry Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000007749 high velocity oxygen fuel spraying Methods 0.000 description 1
- 210000000003 hoof Anatomy 0.000 description 1
- 238000001513 hot isostatic pressing Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002737 metalloid compounds Chemical class 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 238000009768 microwave sintering Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000011238 particulate composite Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 229910000753 refractory alloy Inorganic materials 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 150000004772 tellurides Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/628—Coating the powders or the macroscopic reinforcing agents
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/628—Coating the powders or the macroscopic reinforcing agents
- C04B35/62802—Powder coating materials
- C04B35/62828—Non-oxide ceramics
- C04B35/62831—Carbides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/628—Coating the powders or the macroscopic reinforcing agents
- C04B35/62802—Powder coating materials
- C04B35/62842—Metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3817—Carbides
- C04B2235/3839—Refractory metal carbides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
- C04B2235/3886—Refractory metal nitrides, e.g. vanadium nitride, tungsten nitride
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
Description
1362304 九、發明說明: 【發明所屬之技術領域】 本發明揭示一種使韌性經塗佈硬粉(TCHp)在低或無壓力 固結成基本完全密度之方法及用該方法固結之物件。此方 法為-種基於液相燒結之製造TCHp材料燒結體之成本有 效方法,該方法提供超過習知硬物件和目前技藝上已知工 具材料之增值。 【先前技術】 φ 可將燒結界定為出於使顆粒-起接合以產生固體物件目 的之粉末或壓坯熱處理。 在粉末由具有不同溶點的至少兩種不同材料之粉末混合 物組成的某些應用中,將粉末混合物緊壓成多孔("生") 體二將該體加熱到高於最低熔融組成之溶點,並使部分經 緊壓的鬆散粉末混合物液化。在燒結溫度保持該體預定時 間後,使該材料冷#,液體固化,並使該體"黏結”成緻密 化有用結構。此等系統之實例為銅/錫、鐵/銅和碳化鶴/ • 銘。 在此等方法中,緊壓體之緻密作用在液相存在下進行, 且此等燒結方法被稱為”液相燒結"(Lps) ^在一些系統 中特别地,硬金屬"(如,碳化鎢)與其他陶瓷顆粒之固 結(LPS)有時被稱為習知燒結。在Lps方法中,有利具有在 燒結溫度存在的某一最低量液才目,以保證傳輸接合劑相, " 完成均勻分佈及緻密化。為避免零'件變形及晶粒生長,一 ^ 般亦有利限制所存在的液相之量。 102496.doc 例如,該液化使得能夠增加物質傳輸、顆粒重排、生長 骨架結構及緻密。一般認為,這藉由在外部不規則物液化 時顆粒圓化及該液體遷移以填充空隙達到。在冷卻時,發 生再結晶,且經常發生晶粒生長。由於結構緻密,孔隙率 (作為總體積之百分比)可能降低例如,緻密率可受(例 如)燒結溫度、燒結時間、燒結壓力、燒結氣體及所存在 的接合劑組分重量分數影響。 習知硬金屬(如碳化鎢-鈷(wc_co)壓坯)之液相燒結一般 在1325 °C至1475°c範圍之燒結溫度進行。 由於在WC-Co硬金屬燒結期間加熱Wc_c〇壓坯,鈷開始 在約700°C具有很黏性液體性質,且由於在c〇黏度對應降 低’擴散隨溫度增加而增加。由於c〇盡可能與wc表面一 樣濕潤之傾向,咸信Co金屬之油脂狀性質及黏性產生毛細 官吸引力。這導致WC顆粒重排,且複合物開始收縮,甚 至在第一液相形成之前。 在1275 °C,Co接合劑金屬開始溶解wc顆粒,且三元共 晶反應開始生成Co-W-C合金。在溫度繼續增加時,增加 的表面濕潤、液化及毛細管力導致顆粒繼續重排,且由於 晶粒邊界移動通過WC晶粒和c〇接合劑相間之界面,粉末 團收縮成所需物件之形狀。 燒結零件中高密度、均勻性及wc化學計量為wc_c〇微 結構完整性及強度之基本需要,在液相燒結期間保證適當 局部碳平衡消除脆性乏碳的CwWsC 7?相形成及由太多碳 導致的碳孔隙率,這對提供WC-Co材料之斷裂韌度亦很重 I02496,doc 1362304 要。消除剝奪強度的孔隙率及微結構中晶粒生長可通過選 擇適合燒結溫度和壓力達到。例如,溫度必須高得足以使 足置材料液化,以達到填充顆粒間孔隙所必需的物質轉 移,同時保持足夠低溫度,以避免導致晶粒生長的貿(:過 度/合解。在毛細管力不足以提供緻密作用以接近理論密度 之範圍’可施加外部壓力。 在習知燒結中,一般使小百分比(3_18重量%)鈷與混 合。鈷接合劑在緻密中擔當一定角色,且為在wc_c〇微結 構中達到均勻性,需要其均勻分佈。微結構缺陷一般在經 燒結的WC-Co零件中發現。一般原因為近似相等直徑的 WC和Co粉末之内在不完全摻合(甚至長時間)^因此,需 要此方法以剛好合適量c〇包封(或至少部分結合)各1匸顆 粒,以使Co對WC之比遍及混合物基本均勻。統計上取得 此結果非常不可能,因為鈷不可以足夠小奈米顆粒得到, 以致不能與WC顆粒均勻摻合。鈷氧化、爆炸性自燃反應 及顆粒附聚為其可利用性之障礙。 結果為具有富鈷和貧鈷區域之WC_C〇混合物。液相首先 出現於富Co區域,而以WC不飽和的鈷藉由以下方式尋求 熱力學平衡:(a)消耗附近的較小WC晶體(最小者可能全部 消耗)及(b)不飽和的c〇經長距離向貧c〇區域運動,以溶解 越來越多的WC’直到達到飽和。因此,在需要平衡及足 夠Co液體濕潤WC顆粒時,需要比產生液相所需者更高之 溫度液化及輸送鈷到貧Co區域。 對抗該不均Co分佈效應一般利用(a)很長球磨研磨時 102496.doc 1362304 間,(b)較高燒結溫度,及⑷較長燒結時間。球磨研磨傾 向於使很多WC顆粒減小成細粉,這在加熱期間優先由c〇 溶解。後兩種措施確實幫助舖展接合劑相,且在燒結期間 使液體鈷分佈標準化,但亦増加wc溶解。此外,一些 沿其晶粒邊界穿透wc顆粒,因為wc/wc界面能量比 WC/CO界面能量更高(更主動),至少在晶粒邊界以接近垂 直於表面之界面存在時。在冷卻時,飽和的臂。。溶液沈 澱WC ,在固化時,優先使貿(:成核及再結晶於相鄰剩餘較 大未溶解的WC晶體上,產生不理想的奥斯特瓦爾德 (Ostwald)成熟(晶粒生長)現象。該晶粒生長繼續,直到溫 度降低到低於Co-W-C系統之1275X:三元共晶。圖工顯示假 二元WC-Co相圖。接近100%之燒結密度對wc_c〇材料而 言很平常。 增加燒結溫度因此有助於接合劑流動性,但亦導致過多 WC溶解’產生不合乎需要的晶粒生長。在燒結溫度及燒 結時間之間有一必須注意平衡的折衷方案。最高溫度應高 得足以使足夠物質液化’以達到填充顆粒間孔隙所需的物 質轉移(損害結構強度),同時應設法避免太高溫度歷太長 時間’以避免晶粒生長(晶粒生長亦降低結構強度)。 由於控制燒結溫度為高品質硬金屬微結構的一個主要方 面’所以已利用替代性燒結技術。此等技術包括研究縮短 燒結時間(例如,微波燒結)和使用氣體壓力(例如,熱壓、 熱荨壓麼力[HiP]及塞若坎(Ceracon)和羅-太克(Roc-Tec)燒 結-锻造方法),以在較低溫度達到固結。 102496.doc 1362304 使習知硬金屬固結的另-方法為增加接合劑(如銘)之 重量分數。這可在制重量%之範圍内。這不僅增加液體 之量,而且可具有增加結構動度之有利作用…此方法 具有兩個明顯缺陷,因此一般避免。首先,增加接合劑之 重量百分比減小結構中wc(抗磨相)之重量百分比,並相應 減低耐磨性。其次,辦知接人為丨 如 增加接σ劑之量亦溶解更多wc,顯 著促進在冷卻期間晶粒生長。 過去的七十年來’改良習知碳化物耐磨性(同時保持 WC-Co基材的高斷裂勃度)的僅用方法一直為⑷連續改進 及改良習知粉末及固結處理方法,晴加薄耐磨性塗層, 及⑷使季交硬材料層合於WC_c〇基材上。改良習知wc_c〇微 結構為時間、溫度、晶粒大小和其他產物及製程參數之精 細平衡。通過較佳燒結溫度控制和使用較高純度、高均勻 性WC及Co起始粉末,過去的五十年已取得習知碳化物的 漸進改良由於—十多年m引人外部塗層,具有勤 度的材料耐磨性改良已減慢得幾乎停頓。 雖然此等技術已減少習知硬金屬液相燒結中出現的問 題’但仍需要製造具㈣及在燒結時於整個.和接合劑 粉末之均勻性質之顆粒之方法及自此等顆粒形成之物件。 為避免前述缺陷’本發明提供一種藉由液相燒結固結— 新種類具有“極端性f組合之經設計微結構顆粒材料之 方法,T材料被稱為韌性塗佈硬粉(TCHPS或 EternAloy )。該新穎燒結顆粒材料族由一或多種具有極 耐磨性、潤滑性及其它性質的超硬加德族c(Geidrat 102496.doc 1362304 Ο或較大陶究或耐火合金芯顆粒所組成,此等顆粒⑴各自 Λ Μ 用具有相對較高斷裂韌度之金屬化合物奈米層塗佈,如 WC或Tac,⑺亦用含金屬接合劑(如c〇或Ni)之第二層塗 佈。在TCHP燒結結構内的多性質合金之組合允許正 突的極端性質(包括,但不限於勃度、磨損性、化學耐性 及輕質)至今在多種水平組合,以提供具有用燒結均質粉 末不能獲得的優良性質之材料,TCHP材料揭示於頒予把 斯(Toth)的美國專利第6,372,346號,料利係以引用之併 入本文中。 本發明之方法允許在單—材料中結合熱力學不相容物質 相及極端性質。因此,可設計TCHp材料,以使接近金剛 石之硬度與大於碳化鎢之斷裂韌度及接近鈦之重量组人。 因此,了咖可顯著超過習知金屬㈣和成形工具「磨 料、摩擦及磨損產物及熱塗層以及汽車、航空航天、重工 業及防紫零件之耐磨性。 【發明内容】 鑒於前述’本發明提供自顆粒材料形成物件之方法。該 方法包括提供複數個芯顆粒’該芯顆粒由一種芯顆粒材料 或複數種不同芯顆粒材料所組成’該芯顆粒材料係選自金 屬及准金屬氮化物、金屬及准金屬碳化物、金屬及准金屬 碳氮化物、金屬及准金屬硼化物、金屬及准金屬氧化物、 金屬及准金屬硫化物、金屬及准金屬矽化物及金剛石。 在大部分芯顆粒上提供中間層。中間層包括組成上與芯 顆粒材料不同且具有相對較高斷裂款度之第二化合物。第 102496.doc 1362304 二化合物能夠與芯顆粒材料接合及能夠與選自鐵、鈷、 鎳、銅、鈦、鋁、鎂、鋰、鈹、銀、金、鉑及其混合物之 金屬接合》芯顆粒與中間層結合形成經塗佈顆粒。 將外層加到經塗佈顆粒。外層包括選自鐵、鈷、鎳及其 混合物之金屬,且在中間層上形成實質連續外層。經塗佈 顆粒和外層結合形成組分顆粒。 使複數個組分顆粒形成物件。 物件在無顯著外部固結壓力下於足以使至少部分外層液 化之溫度及足以在自外層形成的.液體中溶解部分中間層之 時間燒結到實質完全密度。 自外層和中間層形成的液體在液體與芯顆粒顯著有害作 用之前固化。 在一具體實施例中,芯顆粒材料具有化學式MaXb,其中 Μ為選自鈦、鍅、铪、釩、鈮、鈕、鉻、鉬、鎢、鋁、 鎂、銅及矽之金屬;X為選自氮、碳、硼、硫及氧之元 素;a和b為大於〇到且包括14之數。 在另一具體實施例中,芯顆粒材料係選自TiN、τ丨CN、1362304 IX. Description of the Invention: [Technical Field of the Invention] The present invention discloses a method of consolidating a tough, coated hard powder (TCHp) to a substantially complete density at low or no pressure and an article consolidated by the method. This method is a cost effective method for producing sintered bodies of TCHp materials based on liquid phase sintering, which provides an added value over conventional hard objects and materials known in the art. [Prior Art] φ can be defined as a powder or compact heat treatment for the purpose of causing the particles to join to produce a solid object. In certain applications where the powder consists of a powder mixture of at least two different materials having different melting points, the powder mixture is pressed into a porous ("raw") body 2 to heat the body above the lowest melt composition. The spots are condensed and a portion of the compacted loose powder mixture is liquefied. After the sintering temperature is maintained for a predetermined period of time, the material is allowed to cool, the liquid solidifies, and the body is "bonded" into a densified useful structure. Examples of such systems are copper/tin, iron/copper, and carbonized cranes/ • Ming. In these methods, the compaction of the compacted body is carried out in the presence of a liquid phase, and such sintering methods are referred to as "liquid phase sintering" (Lps) ^ in some systems, in particular, hard metals " (eg, tungsten carbide) and other ceramic particles (LPS) are sometimes referred to as conventional sintering. In the Lps method, it is advantageous to have a certain minimum amount of liquid present at the sintering temperature to ensure the transport of the binder phase, " to achieve uniform distribution and densification. In order to avoid zero-piece deformation and grain growth, it is also advantageous to limit the amount of liquid phase present. 102496.doc For example, the liquefaction enables increased material transport, particle rearrangement, growth skeletal structure, and compactness. It is generally believed that this is achieved by rounding the particles as the external irregularities liquefy and the liquid migrates to fill the voids. Upon cooling, recrystallization occurs and grain growth often occurs. Porosity (as a percentage of the total volume) may be reduced due to structural compaction. For example, the compaction rate may be affected by, for example, sintering temperature, sintering time, sintering pressure, sintering gas, and the weight fraction of the cement component present. Liquid phase sintering of conventional hard metals such as tungsten carbide-cobalt (wc_co) compacts is generally carried out at a sintering temperature in the range of from 1325 °C to 1475 °C. Since the Wc_c compact is heated during the WC-Co hard metal sintering, the cobalt begins to have very viscous liquid properties at about 700 ° C, and the diffusion increases with increasing temperature as the viscosity decreases accordingly. Since c〇 tends to be as wet as possible on the surface of wc, the oily nature and viscosity of the salty Co metal produce capillary appeal. This causes the WC particles to rearrange and the composite begins to shrink, even before the first liquid phase is formed. At 1275 °C, the Co bond metal begins to dissolve the wc particles, and the ternary eutectic reaction begins to form the Co-W-C alloy. As the temperature continues to increase, the increased surface wetting, liquefaction, and capillary forces cause the particles to continue to rearrange, and as the grain boundaries move through the interface between the WC grains and the c〇 bond phase, the powder mass shrinks into the shape of the desired article. The high density, uniformity and wc stoichiometry of sintered parts are the basic needs of wc_c〇 microstructural integrity and strength, ensuring proper local carbon balance during liquid phase sintering to eliminate the formation of CwWsC 7 phase of brittle carbon and caused by too much carbon The carbon porosity, which provides a fracture toughness for WC-Co materials, is also heavy I02496, doc 1362304. The porosity at which the deprivation strength is removed and the grain growth in the microstructure can be achieved by selecting a suitable sintering temperature and pressure. For example, the temperature must be high enough to liquefy the foot material to achieve the transfer of material necessary to fill the pores between the particles while maintaining a sufficiently low temperature to avoid trade leading to grain growth (: over/combination. insufficient capillary force) An external pressure can be applied to provide a densification to a range close to the theoretical density. In conventional sintering, a small percentage (3 to 18% by weight) of cobalt is generally mixed with the cobalt. The cobalt binder plays a certain role in densification, and is in wc_c〇 Uniformity is achieved in the microstructure, which requires uniform distribution. Microstructural defects are generally found in sintered WC-Co parts. The general reason is that the WC and Co powders of approximately equal diameter are incompletely blended (even for a long time)^ Therefore, this method is required to encapsulate (or at least partially bind) each of the ruthenium particles in just the right amount c〇 so that the ratio of Co to WC is substantially uniform throughout the mixture. It is highly unlikely that this result is statistically obtained because cobalt is not sufficient. Small nanoparticles are obtained so that they cannot be uniformly blended with WC particles. Cobalt oxidation, explosive spontaneous combustion reaction and particle agglomeration are obstacles to their availability. The result is a WC_C〇 mixture with cobalt-rich and cobalt-depleted regions. The liquid phase first appears in the Co-rich region, while the WC-unsaturated cobalt seeks a thermodynamic equilibrium by: (a) consuming nearby smaller WC crystals ( The smallest may be consumed entirely) and (b) the unsaturated c〇 moves over a long distance to the lean c〇 region to dissolve more and more WC' until saturation is achieved. Therefore, it is necessary to balance and adequately Co liquid to wet the WC particles. At the same time, it is required to liquefy and transport cobalt to the Co-poor region at a higher temperature than that required to produce the liquid phase. The effect of the uneven Co distribution is generally utilized (a) when a very long ball mill is used, 102496.doc 1362304, (b) High sintering temperature, and (4) longer sintering time. Ball milling tends to reduce many WC particles into fine powder, which is preferentially dissolved by c〇 during heating. The latter two measures do help spread the cement phase and are sintered. During the period, the liquid cobalt distribution is normalized, but it is also dissolved by wc. In addition, some penetrate the wc particles along its grain boundaries because the wc/wc interface energy is higher (more active) than the WC/CO interface, at least at the grain boundaries. Pick up When present at the interface perpendicular to the surface. When cooled, the saturated arm.. Solution precipitates WC. When curing, preferential trade (: nucleation and recrystallization on adjacent remaining large undissolved WC crystals, resulting in no The ideal Ostwald ripening (grain growth) phenomenon. The grain growth continues until the temperature drops below the 1275X: ternary eutectic of the Co-WC system. The plot shows a pseudo binary WC- Co phase diagram. Nearly 100% of the sintered density is common for wc_c〇 materials. Increasing the sintering temperature therefore contributes to the fluidity of the binder, but also causes excessive WC dissolution to produce undesirable grain growth. There is a compromise between the sintering time and the need to pay attention to balance. The maximum temperature should be high enough to liquefy enough material 'to achieve the material transfer required to fill the pores between the particles (damage to structural strength), while trying to avoid too high temperatures for too long 'to avoid grain growth (grain growth) Reduce structural strength). Alternative sintering techniques have been utilized since controlling the sintering temperature to be a major aspect of high quality hard metal microstructures. These techniques include studying the reduction of sintering time (eg, microwave sintering) and the use of gas pressure (eg, hot pressing, hot pressing [HiP], and Ceracon and Roc-Tec sintering). - Forging method) to achieve consolidation at a lower temperature. 102496.doc 1362304 Another method of consolidating conventional hard metals is to increase the weight fraction of the cement (eg, Ming). This can be in the range of % by weight. This not only increases the amount of liquid, but can also have the beneficial effect of increasing the structural mobility... This method has two distinct drawbacks and is therefore generally avoided. First, increasing the weight percent of the cement reduces the weight percent of the wc (wear phase) in the structure and correspondingly reduces wear resistance. Secondly, it is known to increase the amount of slag and dissolve more wc, which significantly promotes grain growth during cooling. The only method used to improve the wear resistance of conventional carbides (while maintaining the high fracture rupture of WC-Co substrates) has been (4) continuous improvement and improvement of conventional powders and consolidation treatments. a thin abrasion resistant coating, and (4) laminating the quarter hard material to the WC_c crucible substrate. The modified wc_c〇 microstructure is a fine balance of time, temperature, grain size, and other product and process parameters. Through the better sintering temperature control and the use of higher purity, high homogeneity WC and Co starting powders, the gradual improvement of conventional carbides has been achieved in the past 50 years due to the introduction of external coatings for more than ten years. The improvement in the wear resistance of the material has slowed down almost to a standstill. Although such techniques have reduced the problems that occur in conventional hard metal liquid phase sintering, there is still a need for methods of fabricating particles having uniform properties of (4) and throughout the sintering process and the particles formed therefrom. . In order to avoid the aforementioned drawbacks, the present invention provides a method for solidifying particulate materials by liquid phase sintering - a new type of "designed microstructured particulate material", which is called a tough coated hard powder (TCHPS or EternAloy). The novel sintered particulate material family consists of one or more superhard Gadec c (Geidrat 102496.doc 1362304 Ο or larger ceramic or refractory alloy core particles) having extremely high wear resistance, lubricity and other properties. The particles (1) are each coated with a metal layer having a relatively high fracture toughness, such as WC or Tac, and (7) is also coated with a second layer containing a metal binder such as c〇 or Ni. The combination of multi-attribute alloys within the TCHP sintered structure allows the extreme properties of orthodontics (including, but not limited to, brilliance, abrasion, chemical resistance, and light weight) to be combined at various levels to provide a material that is not available with sintered homogeneous powder. The TCHP material is disclosed in U.S. Patent No. 6,372,346, the disclosure of which is incorporated herein in Learn the phase and extreme properties of incompatible materials. Therefore, TCHp materials can be designed so that the hardness close to diamond is greater than the fracture toughness of tungsten carbide and the weight of titanium. Therefore, the coffee can significantly exceed the conventional metal (4) And forming tools "abrasives, friction and wear products and thermal coatings, and abrasion resistance of automotive, aerospace, heavy industry, and anti-purple parts. [Invention] The present invention provides a method of forming an article from a particulate material. The invention comprises providing a plurality of core particles consisting of a core particle material or a plurality of different core particle materials selected from the group consisting of metal and metalloid nitrides, metal and metalloid carbides, metals and metalloids. Carbonitrides, metal and metalloid borides, metal and metalloid oxides, metal and metalloid sulfides, metal and metalloid tellurides and diamond. Provide an intermediate layer on most core particles. The intermediate layer consists of a second compound having a different core particle material and having a relatively high degree of fracture. No. 102496.doc 1362304 The core particulate material is bonded and capable of bonding with a metal layer selected from the group consisting of iron, cobalt, nickel, copper, titanium, aluminum, magnesium, lithium, lanthanum, silver, gold, platinum, and mixtures thereof to form coated particles. The outer layer is applied to the coated particles. The outer layer comprises a metal selected from the group consisting of iron, cobalt, nickel, and mixtures thereof, and a substantially continuous outer layer is formed on the intermediate layer. The coated particles and the outer layer combine to form component particles. The component particles form the article. The article is sintered to a substantially full density at a temperature sufficient to liquefy at least a portion of the outer layer without significant external consolidation pressure and sufficient to dissolve a portion of the intermediate layer in the liquid formed from the outer layer. The liquid formed by the layer solidifies before the liquid and the core particles are significantly detrimental. In a specific embodiment, the core particulate material has the chemical formula MaXb, wherein the germanium is selected from the group consisting of titanium, tantalum, niobium, vanadium, niobium, niobium, chrome, molybdenum, a metal of tungsten, aluminum, magnesium, copper, and bismuth; X is an element selected from the group consisting of nitrogen, carbon, boron, sulfur, and oxygen; and a and b are greater than 〇 and include 14. In another specific embodiment, the core particulate material is selected from the group consisting of TiN, τ丨CN,
TiC、TiB2、ZrC、ZrN、ZrB2、Hfc、HfN、HfB2、TaB2、 VC、VN、eBN、hBN、Al2〇3、Si3N4、仙6、siA1CB、 b4c、b2o3、w2b5、Wb2、WS2、A1N、讀洲4、m〇S2、 MoSi〗、M02B5和 M0B2 o 准金屬元素為沿週期表巾金屬和非金屬間之線之彼等元 素。准金屬-般包括棚、石夕、鍺、砰、銻及蹄。針亦經常 被認作為准金屬。准金屬氮化物之非限制實例為立方氮化 102496.doc 1362304 硼(cBN)及以3队。准金屬碳化物之實例為B4(^二元准金 屬化合物之實例為SiB6。 本發明亦揭示一種自顆粒材料形成物件之方法,其包 括提供複數個由一種芯顆粒材料或複數種不同芯顆粒材 料所組成之芯顆粒,如選自TiN、TiCN、丁⑴、、TiC, TiB2, ZrC, ZrN, ZrB2, Hfc, HfN, HfB2, TaB2, VC, VN, eBN, hBN, Al2〇3, Si3N4, Xian6, siA1CB, b4c, b2o3, w2b5, Wb2, WS2, A1N, read Continent 4, m〇S2, MoSi, M02B5 and M0B2 o The metalloid elements are the elements along the line between the periodic table metal and the non-metal. Quasi-metals include sheds, stone eves, dragonflies, dragonflies, dragonflies and hooves. Needles are also often recognized as quasi-metals. Non-limiting examples of metalloid nitrides are cubic nitridation 102496.doc 1362304 boron (cBN) and in 3 teams. An example of a metalloid carbide is B4 (an example of a binary metalloid compound is SiB6. The invention also discloses a method of forming an article from a particulate material, comprising providing a plurality of core particulate materials or a plurality of different core particulate materials The core particles, such as selected from the group consisting of TiN, TiCN, D (1),
ZrC、ZrN、ZrB2、Hfc、細、响、Tam、 _、_、Al2〇3、Si3N4、SiB6、SiAICB、¥、ho]、 w2b5、、WS2、趣、AIMgBu、M〇S2、μ〇^、 Mo2B5、MoB2及金剛石者;及 f大部分此等芯顆粒材料上提供以物件重量計在1 〇至8 〇 重量%之量之中間層]間詹一般包括組成上與芯顆粒材 料不同且具有相對較高斷裂勃度之第二化合物,其中該第. 二化合物係選自wc、Tac、W2C及WC和W2C之混合物, 由此形成經塗佈顆粒。 經塗佈顆粒-般如前述處理,其包括施加外層到經塗佈 顆粒,外層包括選自鐵、銘、鎳及其混合物之金屬,以在 中間層上形成實質連續外層,由此形成組分顆粒; 使複數個組分顆粒形成物件; 在無顯著外部固Μ· Μ A π 之 U力下’於足以使至少部分外層液化 Ό U在自外層形成的液體中溶解5至90體積%之 中間層之時間燒結該物件,以提供有效量液體,以達 質完全密度,該中簡恳+ m 肀間層之固體部分抑制液體與芯顆粒之 學作用;及 使自外層和中問js孙彡u τ门層形成的液體在液體與芯顆粒顯著有害 102496.doc 1362304 作用之前固化。 燒、迦度和時間應使它們不導致完全中間層溶解,但至 夕 些中間層部分溶解,如5-50%中間層溶解或50-99% 中間層’合解》實際上,係中間層之固體部分抑制液體與該 芯顆粒之化學作用。 【實施方式】 本揭不描述用具有其他性質之晶粒邊界改質劑包封及燒 、=/、有所需組性質之細顆粒之方法,如此允許設計先前不 可月b的材料性質組合。TCHP"積木塊"顆粒包含多個要 素如硬度+耐磨性+韌度+金屬接合劑+其他設計者性質, 且以在奈米、微米、宏觀及功能水平同時最佳化的工程化 ϋ質予材料工程師數以千計的新級別材料。 奈米包封與顆粒燒結之結合產生結合熱力學不相容材剩 相和性質之假合金結構。此結合允許此等相及性質在工作 表面和工具邊緣作為複雜組分及作為熱施加塗層操作。多 個性質組合’如低重4、低摩擦係數、高/低熱導率、潤 滑性及潤滑作用,可在沒有由合金、層合、機械性能增強 及熱處理所強加的傳統限制下完成。 本文所述方法包括自顆粒材料形成物件。例如,顆粒材 料或TCHPs包括複數個&材料、在大部分材料上之中間塗 層及顆粒上之外塗層。 f其粉狀具體實施例中,芯顆粒可為由—種芯顆粒材 或後數種不同芯顆粒所組成之獨特複合顆粒材料,該芯 粒材料係選自金屬或准金屬氮化物、碳化物、碳氮:: 102496.doc •13. 1362304 棚化物、氧化物、硫化物和矽化物或金剛石。芯顆粒材料 常為具有化學式MaXb之金屬化合物,其中Μ為至少一種選 自鈦、鍅、铪、釩、鈮、钽、鉻、鉬、鎢、鋁、鎂、鋼、 硼及矽之元素,而X為至少一種選自氮、碳、硼、硫、矽 及氧之元素。 式MaXb中的字母&和5為大於0到14之數》此等化合物之 非限制實例包括 TiN、TiCN、TiC、ZrC、ZrN、VC、VN、ZrC, ZrN, ZrB2, Hfc, fine, loud, Tam, _, _, Al2〇3, Si3N4, SiB6, SiAICB, ¥, ho], w2b5, WS2, interesting, AIMgBu, M〇S2, μ〇^, Mo2B5, MoB2, and diamonds; and f most of these core material materials provide an intermediate layer in an amount of from 1 〇 to 8 〇 by weight based on the weight of the article. Between the two, it generally consists of a composition different from the core particle material and has a relative A second compound having a higher breaking bristles, wherein the second compound is selected from the group consisting of wc, Tac, W2C, and a mixture of WC and W2C, thereby forming coated particles. The coated particles are generally treated as previously described, comprising applying an outer layer to the coated particles, the outer layer comprising a metal selected from the group consisting of iron, indium, nickel, and mixtures thereof to form a substantially continuous outer layer on the intermediate layer, thereby forming a component Particles; forming a plurality of component particles into an article; at a U force without significant external solids Μ A π 'sufficient to liquefy at least a portion of the outer layer Ό U dissolves between 5 and 90% by volume in the liquid formed from the outer layer The layer is sintered at a time to provide an effective amount of liquid to achieve a full density, the solid portion of the intermediate layer and the m layer inhibiting the interaction of the liquid with the core particles; and The liquid formed by the u τ gate layer cures before the liquid and the core particles are significantly detrimental to 102496.doc 1362304. Burning, calorific and time should be such that they do not cause complete interlayer dissolution, but some intermediate layers are partially dissolved, such as 5-50% intermediate layer dissolution or 50-99% intermediate layer 'combination'. Actually, intermediate layer The solid portion inhibits the chemical interaction of the liquid with the core particles. [Embodiment] This disclosure does not describe a method of encapsulating and burning, =/, fine particles having a desired group property with a grain boundary modifier having other properties, thus allowing design of a combination of material properties of the previous non-month b. TCHP"Building Blocks" granules contain multiple elements such as hardness + wear resistance + toughness + metal cement + other designer properties, and are optimized for simultaneous optimization at nano, micro, macro and functional levels. Quality materials engineer thousands of new grade materials. The combination of nanoencapsulation and particle sintering produces a pseudo-alloy structure that combines the residual phase and properties of the thermodynamically incompatible material. This combination allows these phases and properties to operate as complex components on the working surface and tool edges and as a heat application coating. Multiple combinations of properties such as low weight 4, low coefficient of friction, high/low thermal conductivity, lubricity and lubrication can be achieved without the traditional limitations imposed by alloying, lamination, mechanical properties and heat treatment. The methods described herein include forming an article from a particulate material. For example, particulate material or TCHPs include a plurality of & materials, an intermediate coating on most materials, and an overcoat on the particles. f In its powdered embodiment, the core particles may be a unique composite particulate material composed of a core particle or a plurality of different core particles selected from metal or metalloid nitrides and carbides. , carbon nitrogen:: 102496.doc •13. 1362304 shed compounds, oxides, sulfides and tellurides or diamonds. The core particle material is often a metal compound having the chemical formula MaXb, wherein the cerium is at least one element selected from the group consisting of titanium, lanthanum, cerium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, aluminum, magnesium, steel, boron, and lanthanum. X is at least one element selected from the group consisting of nitrogen, carbon, boron, sulfur, antimony and oxygen. The letters & and 5 in the formula MaXb are greater than 0 to 14. Non-limiting examples of such compounds include TiN, TiCN, TiC, ZrC, ZrN, VC, VN,
Al2〇3、Si3N4、SiB6、SiAlCB ' W2B5、AIN、AlMgB丨4、Al2〇3, Si3N4, SiB6, SiAlCB 'W2B5, AIN, AlMgB丨4,
MoS2、MoSi2、m〇2B5和Mo2B。在另一具體實施例中,複 數個芯顆粒包括至少一種選自金剛石、立方氮化硼和六角 形氮化硼及其相互或與任何上述材料之混合物之顆粒。 在本文中,·•選自"(ch〇sen fr〇m)或"選自"(selected如叫 才曰早獨組分或二(或多種)組分之選擇。例如,X可包括僅 亂、兔、领、硫、砂和氧之一,或可包括任何或所有此等 組分之混合物。 在其他具體實施例中,大部分顆粒包括含WC、、 /、鋼:¾革及去S澤奈米鋼合金、氮化⑦或碳化组之中 間層。此等持料具有大於立方氮化蝴之斷裂勒度。但,應 瞭解,中間層材料僅需要比含芯顆粒之材料具有相對較^ 斷裂韌度’且能夠與形成芯顆粒之金屬化合物或材料接 合,亦能夠與選自鐵、鈷、錄、銅、鈦、紹、鎂、鋰、 鈹、銀、金及鉑之金屬接合。 /在非限制具體實施例中’經塗佈顆粒具有小於約副 微米之平均顆粒大小。在另—具體實施例中,經塗佈顆粒 102496.doc • 14- 1362304 可具有小於loo微米之平均顆粒大 半,,认〜 例如,小於約50微MoS2, MoSi2, m〇2B5 and Mo2B. In another embodiment, the plurality of core particles comprise at least one particle selected from the group consisting of diamond, cubic boron nitride, and hexagonal boron nitride, and mixtures thereof with each other or with any of the foregoing materials. In this article, •• is selected from "(ch〇sen fr〇m) or "from" (selected as the choice of the early component or two (or more) components. For example, X can Include only one of chaos, rabbit, collar, sulfur, sand, and oxygen, or may include any or all of these components. In other embodiments, most of the particles include WC, /, steel: 3⁄4 leather And to the intermediate layer of S Zene steel alloy, nitride 7 or carbonization group. These materials have a fracture degree greater than cubic nitride butterfly. However, it should be understood that the intermediate layer material only needs materials than the core particle. Has a relatively good fracture toughness' and can be bonded to a metal compound or material forming the core particles, and can also be selected from the group consisting of iron, cobalt, copper, titanium, samarium, magnesium, lithium, strontium, silver, gold and platinum. Metal Bonding. / In a non-limiting embodiment, the "coated particles have an average particle size of less than about a minor micron. In another embodiment, the coated particles 102496.doc • 14-1362304 may have less than loo micron. The average particle size is more than half, and it is recognized ~ for example, less than about 50 micro
-I 塗佈㈣ 小於約1微米。在另—具體實施例中,經 塗Γ具有在""至麵奈米範圍之平均顆粒大小。 在另一非限制具體實施例中,中間 w顆初古一 c 1層在燒結後可具有在 心顆粒直至鄕範圍之厚度。中間層之厚度對自其製 造之物件之機械性能具有一定影響。 " 田a 在—具體實施例t , 由路徑方法在橫截面顯微照相中圖形檢測,在經 塗佈顆粒(其上具有中間層之芯)具有小於約2微米之平均顆 粒直技時’在相鄰燒結顆粒内的抗錯位移動性提高,這改 良燒結物件之機械性能。即使利用經典機械方法,用有限 ,分析(finite element analysis) ’很明顯,m球周圍的球 殼WC之厚度自約0.m米增加到約〇·4微米可使理論韌度增 加術。以上。在wc、TaC、W2C或WC#D W2C塗層降低= 約奈料,咸信假想應力(image s⑽s)開始逐漸使斷 裂轫度增加到完全高於由有限元分析預測者。如n•洛特 (Louat)’ 冶金學報(Acta MetaUurgica),第 33期第 1號, 第56-69頁(1985)討論,"假想應力"係界定為對微結構位錯 滑動的固有牛頓阻力。 此等中間層可藉由至少一種選自下列之方法沈積:化學 蒸氣沈積、物理蒸氣沈積、電漿沈積、雷射熔覆 cladding)或沈積方法、電漿熔覆、磁力電漿沈積、電化學 鍍覆、無電鍍覆、濺鍍、固相合成、溶液化學沈積方法及 此等方法之組合。 在依賴正經沈積的一或多種化合物、所給經沈積化合物 102496.doc -15- 1362304 所用的各種前驅體、自先前段落使用的層沈積方法、芯顆 粒化學、中間層厚度及所需塗層性質之某些具體實施例 中’中間層係於一溫度沈積,該溫度可在2〇。〇至約8000。〇 之範圍内’例如’ 20°C至125°C。在其他具體實施例中, 中間層係於一溫度沈積,該溫度可在125。〇至18〇(rc、 1800°C至約8000X:及200至80(TC之範圍内。 此外’在某些具體實施例中,中間層包括以物件重量計-I coated (iv) less than about 1 micron. In another embodiment, the coated crucible has an average particle size in the "" to the surface nanometer range. In another non-limiting embodiment, the intermediate w-ancient-c 1 layer may have a thickness in the range of the core particles up to the crucible after sintering. The thickness of the intermediate layer has an effect on the mechanical properties of the article from which it is made. " Tian a in the specific example t, by the path method in the cross-sectional photomicrograph, when the coated particles (with the core of the intermediate layer) have an average particle directness of less than about 2 microns' The misalignment mobility in adjacent sintered particles is increased, which improves the mechanical properties of the sintered article. Even with the classical mechanical method, it is clear that the thickness of the spherical shell WC around the m-ball increases from about 0 m to about 4 m to increase the theoretical toughness. the above. In the wc, TaC, W2C or WC#D W2C coating reduction = about, the imaginary stress (image s (10) s) began to gradually increase the fracture enthalpy to be completely higher than predicted by finite element analysis. For example, "Louat", Journal of Metallurgy (Acta MetaUurgica), No. 33, No. 1, pp. 56-69 (1985) discusses that "imaginary stress" is defined as the inherent slip of microstructural dislocations. Newton resistance. The intermediate layers may be deposited by at least one selected from the group consisting of chemical vapor deposition, physical vapor deposition, plasma deposition, laser cladding, or deposition methods, plasma cladding, magnetic plasma deposition, and electrochemistry. Plating, electroless plating, sputtering, solid phase synthesis, solution chemical deposition methods, and combinations of these methods. Relying on one or more compounds being deposited, various precursors used in the deposited compound 102496.doc -15-1362304, layer deposition methods used in previous paragraphs, core particle chemistry, interlayer thickness, and desired coating properties In some embodiments, the intermediate layer is deposited at a temperature which can be at 2 Torr. 〇 to about 8000. Within the range of ’ 'for example, 20 ° C to 125 ° C. In other embodiments, the intermediate layer is deposited at a temperature, which may be at 125. 〇 to 18 〇 (rc, 1800 ° C to about 8000 X: and 200 to 80 (in the range of TC. Further) In some embodiments, the intermediate layer includes the weight of the article
可在60重量%至98重量%範圍之量之選自wc、TaC、W2C • 或WC和W2C之材料。在另一具體實施例中,中間層包括 以物件重量計可在10重量%至60重量%範圍之量之wc、 TaC、WK或WC和。在另一具體實施例中,中間層包 括以物件重量計可在5重量%至1〇重量%範圍之量之wc、A material selected from the group consisting of wc, TaC, W2C or WC and W2C in an amount ranging from 60% by weight to 98% by weight. In another embodiment, the intermediate layer comprises wc, TaC, WK or WC sum in an amount ranging from 10% to 60% by weight, based on the weight of the article. In another embodiment, the intermediate layer comprises wc in an amount ranging from 5 wt% to 1 wt%, based on the weight of the article,
TaC、W2C 或 WC和 W2C。 在某些具體霄施例中,大部分經塗佈TCHP顆粒然後由 可為連續性的外部接合劑層包封。該層可包括沈積於第二 金屬化合物層外表面上的姑、錄、鐵、其混合物、其合金 或其金屬間化合物。外層一般在燒結後具有在經塗佈顆粒 、直徑3。/。至丨2。/。範圍之厚度。此等外層可進一步包括至少一 層選自其他金屬或陶竟、接合劑、燒結助劑及聚合材料之 層。 外層可藉由至少-種下列方法沈積:化學蒸氣沈積、物 理蒸氣沈積、電漿沈積、雷射熔覆或沈積方法、電漿熔 -覆、磁力電聚.沈積、電化學鍍覆、無電鍍覆、濺鍍、固相 « δ成或'合液化干沈積方法及其組合。在一 TCHP之具體實 102496.doc • 16 · 1362304 施例中’前述外層包括至少一種選自金屬、陶瓷、接合 劑 '燒結助劑、蠟或聚合材料之化合物。在接合劑、燒結 助劑、蠛或聚合材料之例中,可利用或不利用在50至15〇 °c範圍加熱,藉由混合或摻合完成塗層。 利用很多不同方法,可在整個寬溫度範圍沈積TCHP塗 層’ CVD最為普通。CVD塗佈沈積所用的最普通溫度範圍 為200°C至80〇。〇。但,更高溫度(18〇〇。〇至約800(TC )對很 多方法典型’如電漿沈積、磁力電漿沈積、脈衝雷射沈積 及電弧放電。另外,更低溫度(20°C至2001 )對如溶膠-凝 膠浴液化學、電化學及無電沈積之方法典型。 如同中間層,依賴正經沈積的一或多種化合物、所給經 沈積化合物所用的各種前驅體、自先前段落使用的層沈積 方法、芯顆粒化學、中間層厚度及所需塗層性質,各外層 具體實施例係於不同溫度沈積,外層可在2〇°c至650°C範 圍之溫度沈積。在一具體實施例中,外層在2 〇。〇至12 5 °C 範圍之溫度沈積。在另一具體實施例中,外層在125至 6 5 0 C範圍之溫度沈積。在另一具體實施例中,外層可在 200°C至550°C範圍之溫度沈積。 如前所述’顆粒之外層一般在燒結後具有在經塗佈顆粒 直徑3%至12%範圍之厚度。外層之厚度可允許在一經塗佈 顆粒中與位錯有關的應變場通過外接合劑層轉移到間接相 鄰的中間層。 在一具體實施例中,外層包括以物件重量計至多45重量 ·%之量,例如約0.5重量%至3.0重量%。在另一具體實施例 102496.doc 中,外層包括以物件重量計在大於3.0重量%至18重量%範 圍之量,在另一具體實施例中,外層包括以物件重量計在 大於18重量%至45重量%範圍之量》 芯顆粒 '中間層和外層之組合可形成具有小於約1微米 平均顆粒大小之經塗佈顆粒。 利用上述粉末,可設計經燒結TCHP具體實施例同時居 於由顆粒中間塗層和接合劑層組成的高斷裂韌度之公共相 鄰微結構’經燒結TCHP具體實施例包含具有上述複數種 芯顆粒化合物或元素之複數個經燒結TCHP塗佈複合顆粒 邊體。係超過3 0種不同芯顆粒化合物和元素之此等組合及 排列給予TCHP族各具有獨特性質組合之深刻性質變化多 樣性。 通常,製造TCHPs用於最後固結入或熔覆於物件上。設 計經固結TCHP物件用於大量應用,如需要極端耐磨性和 尚韌度二者之彼等應用。在其固結具體實施例中,TCHps 為基本由燒結於統一整體的複數複合7〇:111)3塗佈顆粒所組 ,TCHP經塗佈TaC, W2C or WC and W2C. In some specific embodiments, the majority of the coated TCHP particles are then encapsulated by a layer of external cement that can be continuous. The layer may include ruthenium, ruthenium, iron, a mixture thereof, an alloy thereof, or an intermetallic compound thereof deposited on the outer surface of the second metal compound layer. The outer layer typically has a coated particle size of 3 after sintering. /. As for 2. /. The thickness of the range. The outer layer may further comprise at least one layer selected from the group consisting of other metals or ceramics, cements, sintering aids, and polymeric materials. The outer layer can be deposited by at least one of the following methods: chemical vapor deposition, physical vapor deposition, plasma deposition, laser cladding or deposition methods, plasma fusion-cladding, magnetic electropolymerization, deposition, electrochemical plating, electroless plating. Coating, sputtering, solid phase « δ or ' combined liquefaction dry deposition method and combinations thereof. In a specific embodiment of TCHP, the aforementioned outer layer comprises at least one compound selected from the group consisting of metals, ceramics, cements, sintering aids, waxes or polymeric materials. In the case of a bonding agent, a sintering aid, a crucible or a polymeric material, the coating may be completed by mixing or blending with or without heating in the range of 50 to 15 °C. The TCHP coating can be deposited over a wide temperature range using a number of different methods. CVD is the most common. The most common temperature range for CVD coating deposition is from 200 ° C to 80 Torr. Hey. However, higher temperatures (18 〇〇. 〇 to about 800 (TC) are typical for many methods such as plasma deposition, magnetic plasma deposition, pulsed laser deposition, and arc discharge. In addition, lower temperatures (20 ° C to 2001) Typical methods for chemical, electrochemical and electroless deposition of sol-gel baths. Like the intermediate layer, depending on the one or more compounds being deposited, the various precursors used for the deposited compounds, used in previous paragraphs Layer deposition method, core particle chemistry, interlayer thickness, and desired coating properties, each of the outer layer embodiments is deposited at different temperatures, and the outer layer can be deposited at temperatures ranging from 2 ° C to 650 ° C. In a specific embodiment The outer layer is deposited at a temperature ranging from 2 Torr to 12 5 ° C. In another embodiment, the outer layer is deposited at a temperature in the range of 125 to 65 ° C. In another embodiment, the outer layer may be Deposition at temperatures ranging from 200 ° C to 550 ° C. As mentioned previously, the outer layer of particles generally has a thickness in the range of 3% to 12% of the diameter of the coated particles after sintering. The thickness of the outer layer allows for a coated particle. Related to dislocation The strain field is transferred to the indirectly adjacent intermediate layer by the outer cement layer. In a specific embodiment, the outer layer comprises an amount of up to 45 wt.%, such as from about 0.5 wt% to 3.0 wt%, based on the weight of the article. In the embodiment 102496.doc, the outer layer comprises an amount in the range of more than 3.0% by weight to 18% by weight based on the weight of the article, and in another embodiment, the outer layer comprises in the range of more than 18% by weight to 45% by weight based on the weight of the article. The combination of the core particles 'intermediate layer and outer layer can form coated particles having an average particle size of less than about 1 micron. With the above powder, the sintered TCHP embodiment can be designed to be simultaneously present by the particle intermediate coating and the bonding agent. The common adjacent microstructure of the high fracture toughness of the layer composition 'sintered TCHP specific embodiment comprises a plurality of sintered TCHP coated composite particle edges having the above plurality of core particle compounds or elements. More than 30 different cores These combinations and arrangements of particulate compounds and elements give the TCHP family a unique combination of properties with unique properties. Typically, TCHPs are manufactured. Finally consolidating or cladding onto the object. Designing the consolidated TCHP article for a number of applications, such as applications requiring extreme wear resistance and toughness. In its consolidation embodiment, TCHps is Basically composed of a plurality of composite 7〇:111)3 coated particles sintered in a uniform whole, TCHP coated
成之獨特材料種類。在某些具體實施例中 顆粒用液相燒結燒結成物件。在一具體實2 用敍作為接合劑燒結的液相。在其他具體1 間固結可主要自毛細管力發生。A unique material type. In some embodiments, the particles are sintered in a liquid phase to form an article. In a specific embodiment, the liquid phase is sintered as a bonding agent. Consolidation in other specific ones can occur primarily from capillary forces.
I02496.doc •18· 整個未燒結緊壓粉末體均勻分佈。在某些具體實施例中, 這可藉由在塗佈期間原子挨原子加鈷(或在顆粒上含外層 之其他材料)’以目標c〇:Wc比包封高鄰接WC塗佈的 TCHP顆粒之表面而達到。這繼續到所需c〇:wc比均勻分 佈於TCHP顆粒上及整個粉末。此TCHp特徵允許多個條件 適應很夕不同目標TCHP組合物,例如,藉由(a)保護芯顆 粒不由接合劑溶解,及(b)提供相鄰韌性支撐結構。結果為 比用於習知WC-Co材料者更高的燒結溫度,同時減小對高 外壓之需要,而無WC晶粒生長及強度損失風險。更均勻 Co刀佈亦產生更佳微結構一致性及抗磨相芯顆粒之均勻分 佈。該產生的TCHP均勻微結構具有優良微結構完整性。 這產生較少結構缺陷,且進一步轉換成具有伴隨性能提高 的更佳、更一致材料性質。 在某些具體實施例中,燒結可在多種條件進行足夠時 間’如溫度及/或固結壓力,以便以不包括芯顆粒體積的 層體積計,在外層、中間層或二者中獲得至高(例如)99 5 體積%之液相,如,70體積%,更進一步為以不包括芯顆 粒體積的層體積計至高45體積〇/〇。 在某些具體實施例中,燒結溫度可在600»c至約8〇〇(rc 之範圍内。在一具體實施例中,燒結溫度可在6〇〇 〇c至 1700°C之範圍内,例如,1250。(:至1700。(:。在另一具體實 施例中’燒結溫度可在1700°C至約8000°C之範圍内。 在一非限制具體實施例中,燒結溫度可在6〇〇至1 700 °C之範圍内,且以不包括芯顆粒體積的層體積計,液相之 102496.doc 1362304 量可在6至44體積%之範圍内。 通*,TCHP燒結在高於絕對〇壓力的某一壓力進行, 如’在0絕對壓力至大氣壓力之範圍内。 "真空"燒結壓力典型在丨-760托(丁〇叫(76〇托=1大氣壓), …般將此柄為無壓力"燒結。在此例中,使用低於大氣壓 壓力一般.有兩個目的:在燒結製程期間所用的不同溫度範 圍控制化學反應速率及控制物理製程。氣體可包括(但不 限於)氮氣、氮氣、氦氣、氫氣、氖氣 '氪氣、氙氣、甲 烧乙炔 氧化故、二氧化碳及其混合物及相關化合 物。 應瞭解,π無壓"燒結僅指在燒結溫度燒結或固結,而不 指在冷或溫熱緊壓製程期間(如,冷等壓擠壓(cip))形成預 燒(或生)物件。在緊壓步驟期間,一般以足以形成"生" 物件之量施加外部固結壓力。對熟諳此藝者很清楚,燒結 不在溫熱或冷卻緊壓製程期間進行。 對自本文所述TCHP形成的物件增加生強度所常用的接 合劑包括(但不限於)石壤、硬脂酸、伸乙基雙硬脂醯胺 (EBS)、增塑劑(如’聚乙料、聚乙二醇或合成樹脂)及類 似相關有機化合物。 . 某些TCHP芯粉末,如氮化物,包括(但不限於)TiN、 ZrN及HfN ’由脫出氮反應到高燒結溫度。釋放不含a的 Τι原子可能消耗碳之WC塗層,產生對TCHP機械性能有害 的脫離化學計量條件。能夠通過使用低於大氣壓壓力抑制 或促進的化學TCHP反應之實例包括氧化及還原反應(如, I02496.doc -20- 1362304 芯粉末或塗層中不同組分的脫碳、脫氧、脫氮、脫氣或化 學分解反應)。一致燒結零件及進一步幫助緻密的穩定製 程需要控制此等氧化及還原反應。 一些TCHP芯顆粒為很不規則形狀,並可能需要加入潤 滑劑幫助其固結,因為其不由溶解修圓。此外,薄你〇和 Co TCHP塗層需要保護不經受空氣傳播的氧和水分,這可 能需要額外聚合性保護塗層。能夠通過使用低於大氣壓壓 力控制的物理TCHP方法之實例包括聚合材料輸送(例如, 去接合或去滑(debinding or delubing)速率)、揮發速率、 熱轉移速率及組成材料的可能熱分解。 聚合材料作為易散性接合劑及潤滑劑在此等TCHP應用 中用於保護性包封及提高儲存期限,例如,包括前述者, 例如,石蠟、硬脂酸、伸乙基雙硬脂醯胺(EBS)、增塑劑 (如聚乙烯醇、聚乙二醇或合成樹脂)及類似相關有機化 合物。 低於大氣壓之壓力一般不用於固結目的。高於大氣壓的 絕對壓力的-個目的為使PM零件固結。但,高於大氣壓 之氣體壓力亦解決上列化學反應之控制問題。 應瞭解’外層或令間層中液相體積可藉由至少一種選自 燒結溫度、燒結壓力及接合劑材料含量之參數增加而增 加。接合劑材料的一個非限制實例為鈷。 在局部=整個TCHP體的很均句c〇分佈藉由允許燒結溫 度曰力到问於1275 C共晶點以獲得物質傳輸及TCHp緻密 所需液相i所需者而降低對高外部壓力之需要。 I02496.doc 1362304 在燒結TCHP中,即使在亞共晶溫度,—塗層上的録層 之濕濁角可很小,且進一步(例如)可為〇。在一具體實施例 中’直接塗佈於WC層上的TCHP中㈣僅需移動極短距離 即濕濁及覆蓋WC塗層》在加熱TCHI^間,各wc層中的 外層原子首先擴散,然後溶入外Co層。wc層自外側向内 均勻溶解。在TCHPt,此等層達到熱力學平衡及具有所 需極大減低結移動性之液相。 在某些具體實施例中,鈷未穿透到芯顆粒之塗層。例 如,可存在高度相鄰的WCow塗佈表面塗層結構,該表面 塗層結構典型接近工具插件和其他物件上的CVD塗層。在 沈積皿度的CVD沈積WC(i_x》多晶體可比在習知研磨的wc· Co顆粒小及更緊密填充多達兩個數量級。在wc(l x)塗層碳 化到化學計量期間,在塗層多晶體内有晶粒生長(依碳化 溫度而定)。但,鈷對此等多晶體之緊密接近應使塗層多 晶體在WC塗層周圍均勻溶解,且平衡可限制晶粒生長。 在圖3和4中,可以看到,在燒結後的wc塗層結構中,多 晶體可比習知研磨的WC-Co多晶體小1個數量級。在另一 具體實施例中’在顯著Co-組合發生的區域中可發生至高 約1微米之晶粒生長。 TCHP WC塗層對Co侵银之不透過性可至少部分歸於以 下解釋。不言而喻,TCHP中的WC和Co化學上基本如同習 知硬金屬摻合物中的WC和Co。藉由評估WC-Co相圖(見圖 5) ’可以確定(見圖6),在利用94重量%冒(:-6重量%c〇之塗 層組合物於1500°c燒結由50體積%顆粒(75重量%)WC塗層 102496.doc -22· 1362304 所組成之典型TCHP目標基質時,87.1重量%之WC塗層(或 92.7%初始50體積%WC塗層)仍作為保護性固體wc保留於 TCHP芯顆粒上的TCHP塗層中。由於WC塗層自外溶入, 剩餘固體WC可僅作為目標芯-保護性及結構塗層存在。 由於姑軟化及接近液相,可預料有一些顆粒重排,但僅 重排不足以提供完全緻密’所以必須使額外WC液化。即 使利用很低液相體積,仍可獲得緻密作用β由於液相0〇均 勻分佈於TCHP中,幾乎完全沿所有wc表面而無組合或梯 •度,很低體積液體Co接合劑可提供大部分液相燒結。咸信 WC溶解應提供其餘部分液相燒結。 如前所述,TCHP顆粒之冒(:塗層一般自外部溶入,在芯 顆粒周圍留下未溶解保護性的結構層,且再沈殿及成核, 以加強現有顆粒塗層,或作為動力傳輸孔隙及間隙填料。 在本文中,"間隙填料”指填充相鄰顆粒間空隙(小空間)之 材料。Co接合劑中WC塗層僅部分溶解為緻密、wc再沈澱 修/再結晶及產生相鄰TCHP微結構基質完整性所必須。僅需 的Co和WC移動性為輸送物質以填充經塗佈芯顆粒間的減 小鄰近間隙所需者。 理娜上,至少有二條途徑增加溶質在溶劑中之溶解: (曰 1)增加所存在的溶劑之量(在—具體實施例中,c〇;WC4 比)’ (2)增加溶劑和溶質之溫度’及(3)降低對溶劑和 溶質之廢力°實際上,僅兩條途徑增加燒結TCHP,間存 在的液相之量。討論前兩條途徑。 一些數目的芯顆粒(例如,過渡金屬碳化物及氮化物)將 I02496.doc •23- 1362304 ==接合劑相互化學作用。此等芯顆粒被稱為 戶:二!使溫度增加相關,即使_燒結溫 :顯者增加到足以提供LPS所用液相所需量之量·厚wc 仍將存在,以保護"可溶芯"組顆粒不受録❹。應 溫度增加到高得達到所需,以最小晶粒生長達到完全密度 ^的任何額外液相(”潤滑劑+間隙填料+毛細管吸引材料 例如,在一具體實施例中,如1微米芯TCHP、TiN顆 来且WC^〇TlN體積〇/〇相等,初始WC塗層(球形模型)將幾 乎為129不米厚,且將包括全部顆粒之約重量%。在 1500°C溶解將僅移除79奈米,或約6%塗層厚度,留下約 121奈米,或起始塗層厚度約94%,用於芯顆粒保護、芯 間顆粒距離均勻性及結構韌度。 由於該TCHP特徵,由(例如)增加鈷層厚度增加存在的接 合劑相溶劑之量為可根據本文所述方法使用的另一可行燒 結方法。例如,使鈷重量百分比增加高於霤匕“燒結中通 常百分比作為提供所需溶解、毛細管作用、WC動力學及 TCHP緻密之方法變得可行。應記住,在TCHp中,由於真 實耐磨性正甴芯顆粒提供,WC主要作為韌性基質材料作 為存在。因此,所增加的鈷將在燒結期間加到該量之液 相’同時在冷卻後使斷裂韌度增加。 燒結可在選自下列之製程發生:燒結擠壓、真空、粉末 注模、塑化擠壓、熱壓、熱等壓擠壓(HIP)、燒結-HIP、 燒結爐、雷射熔覆方法、電漿熔覆、高速加氧燃料 102496.doc •24· 1362304 (HVOF)、火花電漿燒結、壓力電漿燒結、壓力傳送媒介 物、動態/爆炸性緊壓、燒結鑄造、快速成形(rapid prototyping)、電子束及電弧。 在TCHP中,WC塗層保護芯顆粒。首先,在燒結期間, 尤其在"可溶芯”組中,WC塗層可保護芯塗層不由金屬接 合劑溶解’亦可保護基質不受(例如)TiN、ZrN、NbC有害 污染。在使用期間,高耐磨性TCHP芯顆粒可保護wC-Co 支樓基質在燒結後不磨損,而支撐基質保護脆相不斷裂及 • 拉出。圖2描繪典型TCHP材料之經燒結微結構。 具有小硬芯顆粒大小及在晶粒間由薄鈷聯結物分離低於 1微米的韌性、奈米大小殼之TCHp結構改良(例如)彈性、 硬度、斷裂韌度及強度。在一非限制具體實施例中,即使 利用低硬度材料(例如,鈷),由於接近表面(且均接近具有 亞微米晶粒之表面)自位錯的假想應力,複合性質仍高於 磨耗複合物中可能者。 、,口亚⑼棚 料,可設計該材料以提供最佳性能(如,韌度、強度 摩擦係數及硬度)平衡。在一非限制具體實施例中,> 及自TCHP製造的其他工具中觀察到操作改良為,例女 在工件和工具間界面的較低摩擦係數,產生減低的敎 耗及形成弧坑,且需要較少加4力及_使用外心 劑,最終產生較長工具壽命及較佳製程控制;⑻與鐵4 反應,減低接著及擴散、側面或模磨損,且依·欠延辛 模的使料命;及⑷經燒結工具的微結構,其中顆粒j 102496.doc -25- 1362304 強錢材料(例如,wc)形成用於卫具的多孔性支揮 在觀結構,㈣,提供用於硬顆粒芯(例如,啊的表面 順從且緊密接合的保護層,使它們保持在適當位置,並允 許在抗磨工具表面最佳暴露及硬相保持 製造之物件形成對照,在習知方法…:I02496.doc •18· The entire unsintered compacted powder body is evenly distributed. In some embodiments, this can be achieved by adding a cobalt atom (or other material containing an outer layer on the particle) during coating to the target c〇:Wc ratio encapsulating the high adjacent WC coated TCHP particle. The surface is reached. This continues until the desired c〇:wc ratio is evenly distributed over the TCHP particles and the entire powder. This TCHp feature allows for multiple conditions to be adapted to different target TCHP compositions, for example, by (a) protecting the core particles from dissolution by the bonding agent, and (b) providing adjacent tough support structures. The result is a higher sintering temperature than those used in conventional WC-Co materials, while reducing the need for high external pressure without the risk of WC grain growth and strength loss. A more uniform Co-knife also produces better microstructure consistency and uniform distribution of anti-wear core particles. The resulting TCHP uniform microstructure has excellent microstructural integrity. This produces fewer structural defects and is further converted to better, more consistent material properties with attendant performance improvements. In certain embodiments, the sintering can be carried out under a variety of conditions for a sufficient time 'such as temperature and/or consolidation pressure to achieve a high in the outer layer, the intermediate layer, or both, in terms of the layer volume excluding the core particle volume ( For example, 99 5 vol% of the liquid phase, for example, 70 vol%, further up to a volume of 45 〇/〇 in terms of the layer volume excluding the core particle volume. In some embodiments, the sintering temperature can range from 600»c to about 8 〇〇 (rc). In a particular embodiment, the sintering temperature can range from 6 〇〇〇c to 1700 °C. For example, 1250. (: to 1700. (In another embodiment, the sintering temperature may range from 1700 ° C to about 8000 ° C. In a non-limiting embodiment, the sintering temperature may be 6 〇〇 to 1 700 ° C, and in the layer volume excluding the volume of the core particles, the amount of liquid phase 102496.doc 1362304 can be in the range of 6 to 44% by volume. Absolute pressure of a certain pressure, such as 'in the range of 0 absolute pressure to atmospheric pressure. "vacuum" sintering pressure is typically in the 丨-760 Torr (Ding 〇 (76 〇 =1 = 1 atmosphere), ... The handle is pressureless. Sintering. In this case, subatmospheric pressure is used. There are two purposes: to control the chemical reaction rate and control the physical process during different temperature ranges used during the sintering process. Not limited to) nitrogen, nitrogen, helium, hydrogen, helium, helium, helium , acetylene acetylene oxidation, carbon dioxide and their mixtures and related compounds. It should be understood that π no pressure " sintering only refers to sintering or consolidation at the sintering temperature, not during cold or warm pressing process (eg, cold Isobaric extrusion (cip) forms a pre-fired (or raw) article. During the compacting step, the external consolidation pressure is generally applied in an amount sufficient to form a "raw" object. It is clear to the skilled person that sintering Not carried out during warming or cooling. The bonding agents commonly used to increase the strength of the articles formed from the TCHP described herein include, but are not limited to, rocky soil, stearic acid, and ethyl bis-stearylamine ( EBS), plasticizers (such as 'polyethylene, polyethylene glycol or synthetic resin) and similar related organic compounds. Some TCHP core powders, such as nitrides, including but not limited to TiN, ZrN and HfN ' Reacting from the nitrogen to a high sintering temperature. Release of the Τι atom without a may consume the carbon WC coating, resulting in a de-stoichiometric condition that is detrimental to the mechanical properties of TCHP. It can be inhibited or promoted by using sub-atmospheric pressure. Examples of P reactions include oxidation and reduction reactions (eg, decarburization, deoxygenation, denitrification, degassing or chemical decomposition of different components of the core powder or coating in I02496.doc -20-1362304). Consistent sintered parts and further A dense and stable process is required to control these oxidation and reduction reactions. Some TCHP core particles are very irregular in shape and may require the addition of a lubricant to help them consolidate because they are not rounded by dissolution. In addition, thin 〇 and Co TCHP The coating needs to protect against oxygen and moisture that is not exposed to air, which may require additional polymeric protective coatings. Examples of physical TCHP methods that can be controlled by using subatmospheric pressure control include polymeric material delivery (e.g., debinding or delubing rate), rate of volatilization, rate of thermal transfer, and possible thermal decomposition of the constituent materials. Polymeric materials are used as dispersible cements and lubricants in such TCHP applications for protective encapsulation and increased shelf life, for example, including the foregoing, for example, paraffin, stearic acid, ethyl bis-stearylamine (EBS), plasticizers (such as polyvinyl alcohol, polyethylene glycol or synthetic resins) and similar related organic compounds. Pressures below atmospheric pressure are generally not used for consolidation purposes. The purpose of the absolute pressure above atmospheric pressure is to consolidate the PM parts. However, gas pressures above atmospheric pressure also solve the control problems of the above chemical reactions. It will be appreciated that the volume of the liquid phase in the outer or interlaminar layer may be increased by at least one parameter selected from the group consisting of sintering temperature, sintering pressure and binder material content. One non-limiting example of a cement material is cobalt. In the local = the whole TCHP body, the very uniform c〇 distribution reduces the high external pressure by allowing the sintering temperature to force to the 1275 C eutectic point to obtain the liquid phase i required for material transport and TCHp densification. need. I02496.doc 1362304 In sintered TCHP, even at the hypoeutectic temperature, the wet turbid angle of the recorded layer on the coating can be small and further, for example, can be ruthenium. In a specific embodiment, 'directly applied to the TCHP on the WC layer (4) only need to move a very short distance, ie wet turbidity and cover the WC coating. Between heating TCHI^, the outer atoms in each wc layer first diffuse, then Dissolved into the outer Co layer. The wc layer dissolves evenly from the outside to the inside. At TCHPt, these layers reach a thermodynamic equilibrium and have a liquid phase that is required to greatly reduce junction mobility. In some embodiments, the cobalt does not penetrate into the coating of the core particles. For example, there may be highly adjacent WCow coated surface coating structures that are typically close to the CVD coating on tool inserts and other articles. The CVD deposition of WC(i_x) polycrystals in a sedimentation degree can be as small as the conventionally ground wc·Co particles and more closely packed up to two orders of magnitude. During the wc(lx) coating carbonization to stoichiometry, the coating There is grain growth in the polycrystal (depending on the carbonization temperature). However, the close proximity of cobalt to these polycrystals should allow the coating polycrystal to dissolve uniformly around the WC coating, and equilibrium can limit grain growth. In 3 and 4, it can be seen that in the sintered wc coating structure, the polycrystals can be one order of magnitude smaller than the conventionally ground WC-Co polycrystals. In another embodiment, 'significant Co-combination occurs. Grain growth up to about 1 micron can occur in the region. The impermeability of the TCHP WC coating to Co intrusion of silver can be attributed, at least in part, to the following explanation. It goes without saying that WC and Co in TCHP are chemically similar to conventional ones. The WC and Co in the hard metal blend can be determined by evaluating the WC-Co phase diagram (see Figure 5) (see Figure 6), using a coating of 94% by weight (: -6 wt% c〇) The composition was sintered at 1500 ° C from 50% by volume of particles (75% by weight) WC coating 102496.doc -22· 1362304 When forming a typical TCHP target matrix, 87.1% by weight of the WC coating (or 92.7% of the initial 50% by volume WC coating) remains as a protective solid wc in the TCHP coating on the TCHP core particles. Externally dissolved, the residual solid WC can only be present as a target core-protective and structural coating. Due to the softening and near liquid phase, some particle rearrangements are expected, but only rearrangement is not sufficient to provide complete density'. Additional WC liquefaction. Even with very low liquid volume, a dense effect can be obtained. Since the liquid phase is uniformly distributed in the TCHP, it is almost completely along all wc surfaces without a combination or ladder. Very low volume liquid Co cement. Most liquid phase sintering can be provided. The WC dissolution should provide the rest of the liquid phase sintering. As mentioned above, the TCHP particles (the coating is generally dissolved from the outside, leaving undissolved protective properties around the core particles). The structural layer is re-sinked and nucleated to reinforce the existing particle coating, or as a power transmission pore and gap filler. In this paper, "gap filler refers to a material that fills the gap between adjacent particles (small space). The WC coating in the Co bond is only partially soluble for densification, wc reprecipitation repair/recrystallization and the integrity of the adjacent TCHP microstructure matrix. Only the Co and WC mobility required is the transport material to fill the coated The reduction between the core particles is required to be adjacent to the gap. On the Lina, there are at least two ways to increase the dissolution of the solute in the solvent: (曰1) increase the amount of solvent present (in a particular embodiment, c〇; WC4 ratio) '(2) increase the temperature of the solvent and solute' and (3) reduce the waste force on the solvent and solute. In fact, only two ways increase the amount of liquid phase existing between the sintered TCHP. Discuss the first two approaches. Some number of core particles (e.g., transition metal carbides and nitrides) will chemically interact with I02496.doc • 23-1362304 == cement. These core particles are called households: two! Increasing the temperature increase, even if the _sintering temperature: is increased enough to provide the amount required for the liquid phase used in the LPS, the thickness wc will still exist to protect the "soluble core" group of particles from unrecorded. Any additional liquid phase should be increased to a high temperature to achieve the desired minimum density to achieve full density ("lubricant + gap filler + capillary attracting material, for example, in a particular embodiment, such as a 1 micron core TCHP, TiN particles and WC^〇TlN volume 〇/〇 are equal, the initial WC coating (spherical model) will be almost 129 mm thick and will include about 5% by weight of the total particles. Dissolution at 1500 °C will only remove 79 Nano, or about 6% coating thickness, leaving about 121 nm, or about 94% initial coating thickness for core particle protection, inter-core particle distance uniformity and structural toughness. Due to the TCHP characteristics, The amount of binder phase solvent present, for example, by increasing the thickness of the cobalt layer, is another feasible sintering method that can be used according to the methods described herein. For example, increasing the weight percent of cobalt above the slippery "normal percentage in sintering as provided The methods required for dissolution, capillary action, WC kinetics, and TCHP densification become feasible. It should be remembered that in TCHp, WC is mainly present as a tough matrix material due to the true wear resistance of the positive core particles. The added cobalt will be added to the amount of liquid phase during sintering while increasing the fracture toughness after cooling. Sintering can occur in a process selected from the group consisting of sintering extrusion, vacuum, powder injection molding, plasticizing extrusion. , hot pressing, hot isostatic pressing (HIP), sintering-HIP, sintering furnace, laser cladding method, plasma cladding, high-speed oxygenated fuel 102496.doc •24· 1362304 (HVOF), spark plasma sintering , pressure plasma sintering, pressure transfer media, dynamic / explosive compaction, sintering casting, rapid prototyping, electron beam and arc. In TCHP, WC coating protects the core particles. First, during sintering, especially In the "soluble cores" group, the WC coating protects the core coating from dissolution by the metal binder' and also protects the substrate from harmful contamination such as TiN, ZrN, NbC. High wear resistance TCHP during use The core particles protect the wC-Co branch matrix from wear after sintering, while the support matrix protects the fragile phase from breaking and pulling out. Figure 2 depicts the sintered microstructure of a typical TCHP material with small hard core particle size and in-crystal Thin cobalt linkage Separating less than 1 micron toughness, TCHp structure improvement of nano-sized shells, for example, elasticity, hardness, fracture toughness, and strength. In a non-limiting embodiment, even with low hardness materials (eg, cobalt), due to The imaginary stress near the surface (and close to the surface with submicron grains) self-dislocation, the composite property is still higher than that in the wear composite.,,,,,,,,,,,,,,,,,,,,, (e.g., toughness, strength coefficient of friction, and hardness) balance. In a non-limiting embodiment, > and other tools manufactured from TCHP have been observed to improve the operation, such as the lower interface between the workpiece and the tool. Friction coefficient, resulting in reduced burnout and formation of craters, and requires less 4 force and _ use of external agent, resulting in longer tool life and better process control; (8) reaction with iron 4, reducing the subsequent and diffusion, The side or the mold is worn, and the life of the die is delayed; and (4) the microstructure of the sintered tool, wherein the particles j 102496.doc -25-1362304 strong money material (for example, wc) is formed for the sanitary ware many The pore-supporting structure, (iv), provides a protective layer for the hard particle core (for example, the surface is compliant and tightly bonded, keeping them in place and allowing optimal exposure and hard phase on the surface of the anti-wear tool Keep the manufactured objects in contrast, in the conventional method...:
劇性降低於顆粒間存在的接合劑強度,且接合劑自身降低 勃度水平及f曲強&,或其中經燒結物件完全被塗佈,以 給予硬度’其中薄塗層具有有限壽命或斷裂。 作為芯顆粒在内側而不在外側佈置硬相合金使硬相合金 (在完成研磨後於外部表面暴露)比在任何已知習知材料中 可能者以更大比例或厚度在整個經燒結微結構分佈。這本 身可(例如)增加耐磨性,減低與工件之化學作用,並顯著 降低摩擦係h工具壽命可由精更新由相反滑動表面磨 損或拉開的表面晶粒而提高。 很多可能芯材料的耐磨性及接著性f亦自其在習知材料 中的11質瞭解,所以,其作為芯顆粒之性質根據本發明可 ,預剃在某些非限制具體實施例中,由於怎顆粒用已知 材料(例如,wc)塗佈,—起摻合及燒結具有數種不同芯材 料之絰塗佈顆粒將促進提高多種性能。因此降低開發及試 驗花費,同時提供具有獨特性質之最終材料。因而,在各 顆粒具有能夠強力附著其鄰近顆粒以在整個燒結物件基材 形成韌性夕孔支撐系統之韌性殼(中間層)時設計燒結微結 構產生具有高強度、高彈性模數、斷裂勤度及硬合金含量 組合之燒結物件。 102496.doc -26· 1362304 在某些具體實施例中’產生的物件宏觀結構為由勃性、 =緊密、相互接合的經塗佈顆粒殼所組成之多孔微結構 各包含及支標至少-種選自機械和化學接合芯顆 粒、晶體、纖維及晶須之材料,且在完成研磨及拋光期間 在外部表面於橫截面暴露^使芯顆粒所用不同材料及周圍 中間層組合最佳化之原理允許在㈣知材料不可達到的水 平組合正常抵觸的物件性能,如,強度及硬度。 此觀念可給予材料設計者可單獨或組合使:的多個工具 及提供使TCHP顆粒結構(中間層厚度、大小、芯材料)和混 合物(使不同粉末整合成工具及物件區域)適應以單—物件 或工具滿足很多不同獨特、組合及專門需要條件之容易及 總體控制之簡單方法。 另外’用標準強材料(例如’ wc)作為勒性外部顆粒殼 戲劇性減少研究、開發及工業化工作,因為只需用一種物 質反應前驅氣體(例如,碳化鎢)塗佈粉末顆粒,而非多個 外部基材塗層中所用的很多複雜前驅體及反應劑氣體。此 等顆粒材料似乎由碳化鎢顆粒製成一樣燒結,例如,已知 用接合劑(如,鈷)很強接合到相鄰碳化鎢顆粒。例如,可 使顆粒上的碳化鎢塗層厚度增加,以滿足更多挑戰性強度 應用,或在更關鍵磨耗應用中降低,以解決大多數設計問 題。例如,可很容易使芯顆粒大小增加,以滿足用於抗磨 才貝的更嚴格尚要’或為更南強度應用降低。藉由選擇芯材 料,亦可達到使用已知或發現在用於側面磨損或弧坑磨損 之特定應用中表現更佳的具有不同性質(如硬度和摩擦係 I02496.doc -27- 1362304 數)之不同芯顆粒材料。亦可摻合以上厚度、直徑及芯讨 料粉末參數,以解決大多數標準應用問題。 自TCHP顆粒製成的物件使成為不匹配組合性質物件的 為知材料中單獨存在的強度、硬度、高彈性模數、斷裂韌 度、與工件之低作用及低摩擦係數之最佳機械性能組合。 CHP本貝上具有在製造、表面改質或元件、組合件及機 械修理方面的無限用途。單元件組包括切割、成形、研 磨'則畺、石油和採礦及建築工具。非工具元件包括生物 锊藥、軍事、電子、體育、熱處理及化妝應用。廣泛產業 〜用發現於農業、民用、伐木和紙、石化、橡膠和塑膠、 運輸、飛機/航空航天、海運 '建築及能源部門。因此, 該材料極適用於多組物件,包括(例如): 工具,如拉絲模、擠壓模、煅模、切割及壓印模、模 型、成形輥、注模、剪、鑽、銑及車床刀具、鋸、爐架、 鐵又、鉸刀、龍頭及模具; 單獨機械零件,如齒輪、凸輪、軸頸、噴嘴、密封裝 置、閥座、泵葉輪、絞盤、槽輪、軸承及磨損表面; 整合、共燒結7C件,以代替配件内燃機連桿、軸承,及 /或在粉狀金屬(P/Μ)機械零件提供硬表面區域’以代替利 用加熱處理區域之煅或機械加工的鋼零件,如凸輪軸、傳 輸零件、印表機/影印機零件; 重工業物件,如深井鑽頭、採礦及移土設備所用的齒狀 物、軋鋼廠所用的熱軋輥;及 電機械元件,如存儲驅動器讀頭、專用磁體。 I02496.doc -28- 宏觀均句而非外部塗佈的經固結TCHP物件可给予 或供應商經濟再研磨及再利用初始磨耗物件之機:。二 如拉絲模、螺旋鑽、銳刀及水喷嘴之工具尤其重要。绝 熟諳此藝者應瞭解,可在不脫離其寬發明概 具體實施例作出變化。因此,岸 ,述 一 馮n付,本發明不限於所揭 不的特定具體實施例,而用於在覆蓋附加請求項所界定本 發明之主旨和範圍内的各個改進。 旦除非另外指日月’說明書和請求項中所用的所有表示成分 量、反應條件等之數字在所有例t應作為受"約”修飾理 =’ 約’’意指所表示數字的平均仏5%。因此,除非相反 才曰月,以了 S兑明書和附加言奢求項中閣述的S字參數為可依 尋求由本發明獲得所需性質而變化的近似值。 【圖式簡單說明】 圖1為假二元WC-Co相圖。 圖2代表典型TCHP燒結物件。 圖3為一 SEM相片,顯示即使在包含過多Co時,TCHP結 構仍很完整》 圖4為一 SEM相片’顯示在燒結期間及之後有效防止wc 層溶解。 圖5代表在不同燒結溫度不同TCHp材料之模型。這比較 在不同液相燒結條件下顆粒溶解 圖6為在不同溫度和鈷含量的計算wC-Co固體和液相組 合物之表。 圖7為液相燒結TCHP之微結構相片。 102496.docDrastically reduced in the strength of the joint present between the particles, and the bonding agent itself reduces the level of boring and f-boom & or wherein the sintered article is completely coated to impart hardness 'where the thin coating has a limited life or break . Arranging the hard phase alloy as the core particles on the inside rather than on the outside makes the hard phase alloy (exposed to the outer surface after completion of the grinding) more likely to distribute in a larger proportion or thickness throughout the sintered microstructure than in any known materials. . This can, for example, increase wear resistance, reduce chemical interaction with the workpiece, and significantly reduce friction system h tool life can be improved by finely refining the surface grains that are worn or pulled by the opposite sliding surface. The wear resistance and adhesion f of many possible core materials are also known from their 11 quality in the known materials, so that their properties as core particles can be pre-shaved in certain non-limiting embodiments in accordance with the present invention. Since the particles are coated with known materials (e.g., wc), blending and sintering the ruthenium coated particles having several different core materials will promote improved performance. This reduces development and testing costs while providing the final material with unique properties. Therefore, the sintered microstructure is designed to have high strength, high modulus of elasticity, and fracture toughness when each particle has a tough shell (intermediate layer) capable of strongly adhering its adjacent particles to form a toughness support system throughout the sintered article substrate. And sintered materials with a combination of hard alloy content. 102496.doc -26· 1362304 In some embodiments, the macroscopic structure of the resulting article is a porous microstructure consisting of bovine, = tight, inter-bonded coated particle shells, and at least one species A material selected from the group consisting of mechanically and chemically bonded core particles, crystals, fibers and whiskers, and which is exposed to the cross-section of the outer surface during the grinding and polishing process to optimize the combination of the different materials used for the core particles and the surrounding intermediate layer. Combine the properties of normal objects, such as strength and hardness, at (4) the level at which the material is unattainable. This concept can be given to the material designer to individually or in combination: a plurality of tools and provide for the TCHP particle structure (intermediate layer thickness, size, core material) and mixture (to integrate different powders into tools and object areas) to accommodate An easy way for an object or tool to meet the many easy, and overall controls of many different unique, combined, and specialized needs. In addition, the use of standard strong materials (such as 'wc) as a representative external particle shell dramatically reduces research, development and industrialization work, because only one substance is used to react the precursor gas (for example, tungsten carbide) to coat the powder particles instead of multiple Many complex precursors and reactant gases used in external substrate coatings. These particulate materials appear to be sintered as if they are made of tungsten carbide particles, for example, it is known that a bonding agent (e.g., cobalt) is strongly bonded to adjacent tungsten carbide particles. For example, the thickness of the tungsten carbide coating on the particles can be increased to meet more challenging strength applications or reduced in more critical wear applications to solve most design problems. For example, it is easy to increase the core particle size to meet the more stringent requirements for anti-wearing shells or to reduce for more southern strength applications. By selecting the core material, it is also possible to achieve different properties (such as hardness and friction system I02496.doc -27-1362304) which are known or found to perform better in specific applications for side wear or crater wear. Different core particle materials. The above thickness, diameter and core powder parameters can also be blended to solve most standard application problems. The article made of TCHP particles makes the combination of the strength, hardness, high modulus of elasticity, fracture toughness, low action with the workpiece and low mechanical friction of the known material in the material that does not match the combined nature. . CHP has an unlimited use in manufacturing, surface modification or component, assembly and mechanical repair. The single component group includes cutting, forming, grinding, and oil and mining and construction tools. Non-tool components include biopharmaceutical, military, electronics, sports, heat treatment, and cosmetic applications. A wide range of industries ~ found in agriculture, civil, logging and paper, petrochemical, rubber and plastic, transportation, aircraft / aerospace, marine 'building and energy sector. Therefore, the material is extremely suitable for a wide range of objects, including, for example: tools such as wire drawing dies, extrusion dies, forging dies, cutting and stamping dies, models, forming rolls, injection molding, shearing, drilling, milling and lathes. Tools, saws, hobs, irons, reamers, faucets and moulds; individual mechanical parts such as gears, cams, journals, nozzles, seals, valve seats, pump impellers, winches, sheaves, bearings and wear surfaces; Integrating and co-sintering 7C parts to replace the internal combustion engine connecting rods, bearings, and/or providing hard surface areas in powdered metal (P/Μ) mechanical parts to replace the forged or machined steel parts using heat treated areas, Such as camshafts, transmission parts, printer/photocopyer parts; heavy industrial items such as deep wells, teeth used in mining and earthmoving equipment, hot rolls used in rolling mills; and electromechanical components such as storage drive read heads Special magnets. I02496.doc -28- Macroscopic sentences rather than externally coated consolidated TCHP objects can give or suppliers the opportunity to economically re-grind and reuse the initial abrasive objects: Tools such as wire drawing dies, augers, sharp knives and water nozzles are especially important. Those skilled in the art should understand that changes may be made without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed, but is intended to cover various modifications within the spirit and scope of the invention as defined by the appended claims. Unless otherwise stated, all numbers indicating the amount of ingredients, reaction conditions, etc. used in the specification and claims are in all cases t should be treated as "about" 5%. Therefore, unless the opposite is the case, the S-characteristics in the S-book and the extravagant terms are approximate values that can be changed by seeking the desired properties of the present invention. Figure 1 is a pseudo binary WC-Co phase diagram. Figure 2 represents a typical TCHP sintered object. Figure 3 is a SEM photograph showing that the TCHP structure is still intact even when too much Co is contained. Figure 4 shows an SEM photo 'shown in Effective prevention of wc layer dissolution during and after sintering Figure 5 represents a model of TCHp material at different sintering temperatures. This compares particle dissolution under different liquid phase sintering conditions. Figure 6 shows the calculation of wC-Co solids at different temperatures and cobalt content. Table of liquid phase compositions. Figure 7 is a photomicrograph of a liquid phase sintered TCHP.
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/864,502 US7736582B2 (en) | 2004-06-10 | 2004-06-10 | Method for consolidating tough coated hard powders |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200603917A TW200603917A (en) | 2006-02-01 |
TWI362304B true TWI362304B (en) | 2012-04-21 |
Family
ID=35459710
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094119344A TWI362304B (en) | 2004-06-10 | 2005-06-10 | Method for consolidating tough coated hard powders |
Country Status (3)
Country | Link |
---|---|
US (1) | US7736582B2 (en) |
AR (1) | AR050161A1 (en) |
TW (1) | TWI362304B (en) |
Families Citing this family (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9682425B2 (en) * | 2009-12-08 | 2017-06-20 | Baker Hughes Incorporated | Coated metallic powder and method of making the same |
US7674671B2 (en) | 2004-12-13 | 2010-03-09 | Optomec Design Company | Aerodynamic jetting of aerosolized fluids for fabrication of passive structures |
WO2006091875A2 (en) * | 2005-02-24 | 2006-08-31 | University Of Virginia Patent Foundation | Amorphous steel composites with enhanced strengths, elastic properties and ductilities |
US7441610B2 (en) * | 2005-02-25 | 2008-10-28 | Smith International, Inc. | Ultrahard composite constructions |
US8617456B1 (en) | 2010-03-22 | 2013-12-31 | The United States Of America As Represented By The Secretary Of The Air Force | Bulk low-cost interface-defined laminated materials and their method of fabrication |
US9120245B1 (en) | 2007-05-09 | 2015-09-01 | The United States Of America As Represented By The Secretary Of The Air Force | Methods for fabrication of parts from bulk low-cost interface-defined nanolaminated materials |
US9162931B1 (en) | 2007-05-09 | 2015-10-20 | The United States Of America As Represented By The Secretary Of The Air Force | Tailored interfaces between two dissimilar nano-materials and method of manufacture |
WO2008140786A1 (en) | 2007-05-11 | 2008-11-20 | Sdc Materials, Inc. | Method and apparatus for making uniform and ultrasmall nanoparticles |
US8575059B1 (en) | 2007-10-15 | 2013-11-05 | SDCmaterials, Inc. | Method and system for forming plug and play metal compound catalysts |
US8101286B2 (en) * | 2008-06-26 | 2012-01-24 | GM Global Technology Operations LLC | Coatings for clutch plates |
US8550792B2 (en) * | 2008-06-30 | 2013-10-08 | Eaton Corporation | Energy conversion device and method of reducing friction therein |
US8039096B2 (en) * | 2008-06-30 | 2011-10-18 | Eaton Corporation | Friction- and wear-reducing coating |
WO2011017318A1 (en) * | 2009-08-04 | 2011-02-10 | Allomet Corporation | Tough coated hard particles consolidated in a tough matrix material |
US8727042B2 (en) | 2009-09-11 | 2014-05-20 | Baker Hughes Incorporated | Polycrystalline compacts having material disposed in interstitial spaces therein, and cutting elements including such compacts |
US8579052B2 (en) * | 2009-08-07 | 2013-11-12 | Baker Hughes Incorporated | Polycrystalline compacts including in-situ nucleated grains, earth-boring tools including such compacts, and methods of forming such compacts and tools |
WO2011031549A2 (en) * | 2009-08-27 | 2011-03-17 | Smith International, Inc. | Method of forming metal deposits on ultrahard materials |
CA2777110C (en) | 2009-10-15 | 2014-12-16 | Baker Hughes Incorporated | Polycrystalline compacts including nanoparticulate inclusions, cutting elements and earth-boring tools including such compacts, and methods of forming such compacts |
US8893828B2 (en) * | 2009-11-18 | 2014-11-25 | Smith International, Inc. | High strength infiltrated matrix body using fine grain dispersions |
US8950518B2 (en) * | 2009-11-18 | 2015-02-10 | Smith International, Inc. | Matrix tool bodies with erosion resistant and/or wear resistant matrix materials |
US10240419B2 (en) | 2009-12-08 | 2019-03-26 | Baker Hughes, A Ge Company, Llc | Downhole flow inhibition tool and method of unplugging a seat |
US8470112B1 (en) * | 2009-12-15 | 2013-06-25 | SDCmaterials, Inc. | Workflow for novel composite materials |
US8803025B2 (en) | 2009-12-15 | 2014-08-12 | SDCmaterials, Inc. | Non-plugging D.C. plasma gun |
US9126191B2 (en) | 2009-12-15 | 2015-09-08 | SDCmaterials, Inc. | Advanced catalysts for automotive applications |
US8545652B1 (en) * | 2009-12-15 | 2013-10-01 | SDCmaterials, Inc. | Impact resistant material |
US9039916B1 (en) | 2009-12-15 | 2015-05-26 | SDCmaterials, Inc. | In situ oxide removal, dispersal and drying for copper copper-oxide |
US9149797B2 (en) | 2009-12-15 | 2015-10-06 | SDCmaterials, Inc. | Catalyst production method and system |
US8557727B2 (en) | 2009-12-15 | 2013-10-15 | SDCmaterials, Inc. | Method of forming a catalyst with inhibited mobility of nano-active material |
US8652992B2 (en) | 2009-12-15 | 2014-02-18 | SDCmaterials, Inc. | Pinning and affixing nano-active material |
GB201102148D0 (en) * | 2011-02-08 | 2011-03-23 | Ucl Business Plc | Layered bodies, compositions containing them and processes for producing them |
US8669202B2 (en) | 2011-02-23 | 2014-03-11 | SDCmaterials, Inc. | Wet chemical and plasma methods of forming stable PtPd catalysts |
US8631876B2 (en) | 2011-04-28 | 2014-01-21 | Baker Hughes Incorporated | Method of making and using a functionally gradient composite tool |
US9080098B2 (en) | 2011-04-28 | 2015-07-14 | Baker Hughes Incorporated | Functionally gradient composite article |
US8778259B2 (en) | 2011-05-25 | 2014-07-15 | Gerhard B. Beckmann | Self-renewing cutting surface, tool and method for making same using powder metallurgy and densification techniques |
US9139928B2 (en) | 2011-06-17 | 2015-09-22 | Baker Hughes Incorporated | Corrodible downhole article and method of removing the article from downhole environment |
US9707739B2 (en) | 2011-07-22 | 2017-07-18 | Baker Hughes Incorporated | Intermetallic metallic composite, method of manufacture thereof and articles comprising the same |
US9833838B2 (en) | 2011-07-29 | 2017-12-05 | Baker Hughes, A Ge Company, Llc | Method of controlling the corrosion rate of alloy particles, alloy particle with controlled corrosion rate, and articles comprising the particle |
US9643250B2 (en) | 2011-07-29 | 2017-05-09 | Baker Hughes Incorporated | Method of controlling the corrosion rate of alloy particles, alloy particle with controlled corrosion rate, and articles comprising the particle |
US9033055B2 (en) | 2011-08-17 | 2015-05-19 | Baker Hughes Incorporated | Selectively degradable passage restriction and method |
JP2014524352A (en) | 2011-08-19 | 2014-09-22 | エスディーシーマテリアルズ, インコーポレイテッド | Coated substrate for use in catalysis and catalytic converters and method for coating a substrate with a washcoat composition |
US9109269B2 (en) | 2011-08-30 | 2015-08-18 | Baker Hughes Incorporated | Magnesium alloy powder metal compact |
US9090956B2 (en) | 2011-08-30 | 2015-07-28 | Baker Hughes Incorporated | Aluminum alloy powder metal compact |
US9856547B2 (en) | 2011-08-30 | 2018-01-02 | Bakers Hughes, A Ge Company, Llc | Nanostructured powder metal compact |
US9643144B2 (en) | 2011-09-02 | 2017-05-09 | Baker Hughes Incorporated | Method to generate and disperse nanostructures in a composite material |
US9505064B2 (en) | 2011-11-16 | 2016-11-29 | Kennametal Inc. | Cutting tool having at least partially molded body and method of making same |
US9010416B2 (en) | 2012-01-25 | 2015-04-21 | Baker Hughes Incorporated | Tubular anchoring system and a seat for use in the same |
US9605508B2 (en) | 2012-05-08 | 2017-03-28 | Baker Hughes Incorporated | Disintegrable and conformable metallic seal, and method of making the same |
PT2900404T (en) | 2012-09-27 | 2021-11-16 | Allomet Corp | Methods of forming a metallic or ceramic article having a novel composition of functionally graded material and articles containing the same |
US9511352B2 (en) | 2012-11-21 | 2016-12-06 | SDCmaterials, Inc. | Three-way catalytic converter using nanoparticles |
US9156025B2 (en) | 2012-11-21 | 2015-10-13 | SDCmaterials, Inc. | Three-way catalytic converter using nanoparticles |
US20140234549A1 (en) * | 2013-02-15 | 2014-08-21 | Mahle International Gmbh | Thermally sprayed wear-resistant piston ring coating |
US20140263194A1 (en) * | 2013-03-15 | 2014-09-18 | Lincoln Global, Inc. | Cored non-arc consumable for joining or overlaying and systems and methods for using cored non-arc consumables |
JP5807850B2 (en) * | 2013-06-10 | 2015-11-10 | 住友電気工業株式会社 | Cermet, cermet manufacturing method, and cutting tool |
WO2015013545A1 (en) | 2013-07-25 | 2015-01-29 | SDCmaterials, Inc. | Washcoats and coated substrates for catalytic converters |
CN103469285B (en) * | 2013-08-23 | 2016-01-20 | 浙江工贸职业技术学院 | Laser melting coating the plating film forming liquid of Ni-based molybdenum disulfide wear-resistant composite film and application thereof |
US9816339B2 (en) | 2013-09-03 | 2017-11-14 | Baker Hughes, A Ge Company, Llc | Plug reception assembly and method of reducing restriction in a borehole |
CA2926135A1 (en) | 2013-10-22 | 2015-04-30 | SDCmaterials, Inc. | Compositions of lean nox trap |
JP2016536120A (en) | 2013-10-22 | 2016-11-24 | エスディーシーマテリアルズ, インコーポレイテッド | Catalyst design for heavy duty diesel combustion engines |
US10865465B2 (en) | 2017-07-27 | 2020-12-15 | Terves, Llc | Degradable metal matrix composite |
US10689740B2 (en) | 2014-04-18 | 2020-06-23 | Terves, LLCq | Galvanically-active in situ formed particles for controlled rate dissolving tools |
US10150713B2 (en) | 2014-02-21 | 2018-12-11 | Terves, Inc. | Fluid activated disintegrating metal system |
US11167343B2 (en) | 2014-02-21 | 2021-11-09 | Terves, Llc | Galvanically-active in situ formed particles for controlled rate dissolving tools |
WO2015143225A1 (en) | 2014-03-21 | 2015-09-24 | SDCmaterials, Inc. | Compositions for passive nox adsorption (pna) systems |
JP5807851B1 (en) | 2014-04-10 | 2015-11-10 | 住友電気工業株式会社 | Cermets and cutting tools |
US9943918B2 (en) * | 2014-05-16 | 2018-04-17 | Powdermet, Inc. | Heterogeneous composite bodies with isolated cermet regions formed by high temperature, rapid consolidation |
US10378450B2 (en) | 2014-05-27 | 2019-08-13 | United Technologies Corporation | Chemistry based methods of manufacture for MAXMET composite powders |
US10858297B1 (en) | 2014-07-09 | 2020-12-08 | The United States Of America As Represented By The Secretary Of The Navy | Metal binders for insensitive munitions |
KR102440771B1 (en) * | 2014-12-12 | 2022-09-06 | 마테리온 코포레이션 | Additive manufacturing of articles comprising beryllium |
US9910026B2 (en) | 2015-01-21 | 2018-03-06 | Baker Hughes, A Ge Company, Llc | High temperature tracers for downhole detection of produced water |
EP3256308B1 (en) | 2015-02-10 | 2022-12-21 | Optomec, Inc. | Fabrication of three-dimensional structures by in-flight curing of aerosols |
US10378303B2 (en) | 2015-03-05 | 2019-08-13 | Baker Hughes, A Ge Company, Llc | Downhole tool and method of forming the same |
US10221637B2 (en) | 2015-08-11 | 2019-03-05 | Baker Hughes, A Ge Company, Llc | Methods of manufacturing dissolvable tools via liquid-solid state molding |
US10016810B2 (en) | 2015-12-14 | 2018-07-10 | Baker Hughes, A Ge Company, Llc | Methods of manufacturing degradable tools using a galvanic carrier and tools manufactured thereof |
CN106001550B (en) * | 2016-06-03 | 2018-10-19 | 广东工业大学 | It is a kind of with TiC-Ni-Mo2C alloys be wear-resisting phase wear-proof metal ceramic and the preparation method and application thereof |
CN106001561B (en) * | 2016-06-03 | 2018-10-23 | 广东工业大学 | A kind of multistage composite cermet, preparation method and shield cutter |
CN105970212A (en) * | 2016-07-22 | 2016-09-28 | 贵州高峰石油机械股份有限公司 | Method and magnetizing device for assisting in laser cladding on rotating workpiece |
CN106345996A (en) * | 2016-09-18 | 2017-01-25 | 广东工业大学 | Composite metal ceramic as well as preparation method and application thereof |
CN106216662A (en) * | 2016-09-18 | 2016-12-14 | 广东工业大学 | A kind of cermet particles and preparation method and application |
CN106270492A (en) * | 2016-09-18 | 2017-01-04 | 广东工业大学 | A kind of composite cermet and preparation method and application |
CN106345995A (en) * | 2016-09-18 | 2017-01-25 | 广东工业大学 | Composite metal ceramic as well as preparation method and application thereof |
CN106216663A (en) * | 2016-09-18 | 2016-12-14 | 广东工业大学 | A kind of cermet particles and preparation method thereof application |
CN106346004B (en) * | 2016-09-18 | 2018-10-19 | 广东工业大学 | A kind of hard alloy and preparation method thereof of high-wearing feature and high tenacity |
CN107217186B (en) * | 2017-06-06 | 2018-08-21 | 重庆文理学院 | A kind of preparation method of modified metal based composites |
TWI767087B (en) | 2017-11-13 | 2022-06-11 | 美商阿普托麥克股份有限公司 | Methods for controlling the flow of an aerosol in a print head of an aerosol jet printing system, and apparatuses for depositing an aerosol |
AT16480U1 (en) * | 2018-04-20 | 2019-10-15 | Plansee Composite Mat Gmbh | Target and method of making a target |
CN109628884B (en) * | 2018-12-03 | 2021-05-11 | 江苏锋泰工具有限公司 | Surface metallization process of diamond |
WO2021058702A1 (en) * | 2019-09-25 | 2021-04-01 | Evonik Operations Gmbh | Metal bodies and method for production thereof |
ES2896334T3 (en) | 2019-09-25 | 2022-02-24 | Evonik Operations Gmbh | Metal foam bodies and process for their production |
ES2843747B2 (en) * | 2020-01-20 | 2023-05-24 | Mecanizacion Ind Astillero S A | ROLLS FOR ROLLING WITH A COATING OF TUNGSTEN CARBIDE ALLOYS AND PROCEDURE FOR OBTAINING THE SAME |
CN111621683A (en) * | 2020-06-09 | 2020-09-04 | 齐鲁工业大学 | Ti (CN) -based self-lubricating metal ceramic cutter material added with alumina-coated calcium fluoride composite powder and preparation method thereof |
CN112247142B (en) * | 2020-10-21 | 2022-07-26 | 九江学院 | Double-hard-phase double-bonding-phase metal carbide ceramic powder with core-shell structure and preparation method thereof |
CN112609157B (en) * | 2020-11-20 | 2023-06-16 | 江苏科技大学 | Wide-temperature-range self-lubricating nano multilayer film material and preparation method thereof |
CN113172228B (en) * | 2021-04-26 | 2022-05-13 | 中北大学 | TC (tungsten carbide)4-Al3Ti laminated composite board and preparation method thereof |
CN116411275B (en) * | 2023-04-13 | 2023-10-24 | 佳木斯大学 | Preparation method of laser cladding in-situ authigenic titanium boride-titanium carbide-copper composite coating |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2370242A (en) | 1943-01-15 | 1945-02-27 | Mallory & Co Inc P R | Refractory metal composition |
US3019103A (en) | 1957-11-04 | 1962-01-30 | Du Pont | Process for producing sintered metals with dispersed oxides |
GB1574007A (en) | 1975-12-24 | 1980-09-03 | Johnson Matthey Co Ltd | Cermets |
DE3546113A1 (en) | 1985-12-24 | 1987-06-25 | Santrade Ltd | COMPOSITE POWDER PARTICLES, COMPOSITE BODIES AND METHOD FOR THE PRODUCTION THEREOF |
CH686888A5 (en) * | 1993-11-01 | 1996-07-31 | Ufec Universal Fusion Energy C | composite metal-ceramic high tenacity and process for its manufacture. |
US5773735A (en) * | 1996-11-20 | 1998-06-30 | The Dow Chemical Company | Dense fine grained monotungsten carbide-transition metal cemented carbide body and preparation thereof |
ES2526604T3 (en) | 1997-05-13 | 2015-01-13 | Allomet Corporation | Hard powders with tough coating and sintered articles thereof |
-
2004
- 2004-06-10 US US10/864,502 patent/US7736582B2/en active Active
-
2005
- 2005-06-10 TW TW094119344A patent/TWI362304B/en not_active IP Right Cessation
- 2005-06-13 AR ARP050102408A patent/AR050161A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TW200603917A (en) | 2006-02-01 |
US20050275143A1 (en) | 2005-12-15 |
AR050161A1 (en) | 2006-10-04 |
US7736582B2 (en) | 2010-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI362304B (en) | Method for consolidating tough coated hard powders | |
KR101215656B1 (en) | Method for consolidating Tough Coated Hard Powders | |
TWI649294B (en) | Method of forming a metal or ceramic article having a novel composition of functionally graded materials and articles containing the composition | |
US8697259B2 (en) | Boron carbide composite materials | |
Lipke et al. | Near net-shape/net-dimension ZrC/W-based composites with complex geometries via rapid prototyping and displacive compensation of porosity | |
KR20120097485A (en) | Tough coated hard particles consolidated in a tough matrix material | |
WO2007032348A1 (en) | High-strength cemented carbide and process for producing the same | |
KR0121456B1 (en) | Method for produced metal matrix composite bodies | |
US6517953B1 (en) | Metal matrix composite body having a surface of increased machinability and decreased abrasiveness | |
JP2014122425A (en) | Method of compacting hard coated hard powder | |
JP2009527456A (en) | Intermetallic compound-containing composite and method for producing the same | |
JPH08109432A (en) | Cubic boron nitride sintered compact containing hard alloy as binding material and its production | |
JPH05507122A (en) | Porous metal matrix composite material and manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |