TWI360852B - Method for cutting and molding in small windows an - Google Patents

Abstract

Disclosed are a method for cutting and molding in small windows and a device formed from the same. According to the method, a substrate strip has a plurality of small windows at sides or corners. The substrate strip further has an outer surface including a plurality of window molding regions encircling the small windows and extending into the scribing lines. A plurality of chips are disposed on the substrate strip. A plurality of electrically connecting components are formed in the small windows. Next, a molding compound is formed on the window molding regions and in the small windows so as to encapsulate the electrically connecting components and to extend to the scribe lines. When package singulation, portion of the molding compound on the scribe lines is cut off simultaneously. Accordingly, the issue of mold flash around the small windows can be effectively reduced, peeling of wiring layer and solder mask on the substrate unit can be prevented by increasing bonding area of the molding compound on the substrate strip.

Description

Ι36Ό852 IX. Description of the Invention: [Technical Field] The present invention relates to a singulation cutting technique in a manufacturing technique of a window type semiconductor package structure, and more particularly to a small window mold sealing method and a package structure formed therefor . [Prior Art] Window type ball grid array structure (Window BGA) or micro room

The fine-pitch ball grid array (FBGA) package structure is the mainstream of semiconductor chip package products in recent years. It is a circuit substrate carrying a wafer with a window, and is electrically connected through a window with a plurality of metal bonding wires. The circuit board and the wafer are connected. Provides semiconductor ass and wire protection with a gel (encapuUnt). However, the surface of the lower surface of the substrate must form a partial molding area around the window. If improperly handled, the problem of mdding flash is likely to occur. However, in the conventional window type lattice array package structure, the window provided on the substrate is only a single and narrow central slot. There is still a gap between the die seal area and the external pad, and the die overburden can still be controlled. However, in the new generation of window-type semiconductor package structure, a plurality of small windows σ are arranged on the side of the substrate and the ridge to improve the electrical density and the micro-pitch of the 2-terminal terminal, but this will cause the die to overflow. The problem is more prone to occur, and the spacing between the die-sealing area and the external pad is smaller, and the die overburden will affect the quality of the electrical connection. As is shown in Fig. 1, a semiconductor package structure 100 having a small window is known. The main I includes a substrate unit 110, a wafer m, a plurality of electrical connection elements 130, and a gel 140. The base unit 11 is formed by cutting a 6 Ι36Ώ852 substrate strip. The substrate unit 110 has a die-bonding surface 111, an external surface 112, and a plurality of small windows 113 extending through the substrate unit 110. As shown in FIG. 2, the small windows 113 are formed on the side or corner 隅 of the substrate unit 11 and the external surface 11 2 includes a plurality of window molding regions 114 surrounding the small windows 113. But not extending to the corresponding side of the substrate unit 110 and the corner 隅β, the substrate unit 110 further has a central slot 115 formed in the central region of the substrate unit 11 (), and the φ external surface 11 2 Including a lower molding area 11 7 ' surrounding the central slot 115» In addition, as shown in the figure, the substrate unit u has a plurality of pads 6 formed on the external surface 丨i 2 Can be used to set a plurality of external terminals 150' commonly used as solder balls. As shown in FIG. 1 , the wafer 120 is disposed on the surface of the substrate unit and has a plurality of pads on the active surface by adhesion of a die bond 16 0 . 121. The electrical connecting elements 130 formed by the wire are formed in the small windows 113 and the central slot 152, and the electrical connecting elements are used to pass through the small windows η3 and the central slot. 11 5, the pads 丨 2 〇 of the wafer i 2 are electrically connected to the 忒 substrate unit 丨〇 1 丨〇. The encapsulant i 4 is formed on the die-bonding surface 111 and the external surface 112 of the substrate unit η , to seal the wafer 12 and the

, a - u"μ double-mounting, more than the 11 4 mold overflowing glue is very easy to contaminate the external mats 1 6 terminal I50 can not be smoothly joined to all of the external mats beyond the window mold Zone 11 6 causes the outer 116. In addition, ' 7 1360852 is easy to make the side of the substrate unit 剥离 剥离 线路 线路 及 及 及 及 及 及 及 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 剥离 线路 剥离 线路 线路 线路 线路 线路 线路 线路 线路 线路 线路 线路 线路 基板 基板

- Again, 'when the point a and the wire bonding operation have been completed in the conventional window type semiconductor packaging process', the lower mold must be in accordance with the central slot 11 of the substrate unit 11 and the small windows α when the molding process is performed. The 丨3 position is designed to open the corresponding lower cavity. Therefore, when the number of small windows of the substrate unit 110 is increased, the design of the lower mold will be more complicated. The cost is higher and the problem of over-molding is more complicated. Significantly serious. SUMMARY OF THE INVENTION The main object of the present invention is to provide a small window die-cutting method and a package structure formed thereof, in addition to reducing the probability of molding a glue spillage on a side window or a corner of a substrate unit, When the substrate strip dicing operation is performed, the phenomenon that the circuit of the substrate unit and the solder resist layer are peeled and delaminated can be reduced, thereby improving the quality and reliability of the packaged product. A second object of the present invention is to provide a small window die-cutting method and a package structure formed thereby, which can simplify the design of the mold under the stamper and reduce the cost of the package jig. ~ Another purpose of the winter invention is to improve the process yield by controlling and changing the area where the glue may be applied to the substrate. A small window slat according to the present invention comprises a plurality of methods comprising: providing a gate of a primitive, "plate early and a plurality of dicing streets formed between the substrates - the substrate: early a cat day surface, an external surface 8 Ι 36 Ό 852, and a plurality of small windows extending through the substrate strip, the small windows having side edges or corners of the substrate units, and the external surface includes a plurality of window molding regions Retaining the small windows and extending to the cutting lanes. Thereafter, a plurality of wafers are disposed on the surface of the die of the substrate strip to be within the substrate units without covering the scribe lines. Then, a plurality of electrical connection elements are formed in the small windows to electrically connect the wafers to the substrate strips. Then, a gel is formed on the window molding regions 3 of the substrate strip to seal the electrical connection members to extend to the scribe lines. Finally, the dicing lines are cut along the dicing lines and portions of the encapsulant at the window sealing regions to separate the substrate units. Further, the package structure formed by the above method is disclosed. The object of the present invention and solving the technical problems thereof can be further realized by the following technical measures. In the aforementioned small window molding cutting method, each window molding area can be

Surrounding at least two small windows adjacent to the sides and including scribe lines located between the small windows. In the aforementioned small window molding cutting method, each of the window molding regions may surround at least four small windows adjacent to the corners and include scribe line staggered portions between the small windows. In the foregoing small window die-cutting method, the outer surface of the substrate strip may be provided with an overflow-over (four) track, which is aligned with the scribe lines and penetrates (four) the window chess seal area. In the aforementioned small window molding cutting method, small windows in the molding area of the same window may be in communication. 9 The wafers may have a plurality of pads in the small window molding and cutting method of the electrical connection elements 4, which are aligned with the connections of the small windows. In the aforementioned small window mold-cutting section ^β^, the weight area of the smectic wafer on the substrate strip may be not less than seventy of the pair of strips for the wafer-scale package structure. In the foregoing small window die-cutting method, the electrical connections may include a plurality of bonding wires. Μ In the aforementioned small window molding, the cutting board is used for the nail cutting method, and the substrate strip may have a plurality of The central spurs of the substrate strips are formed in the central region of the substrate units. In the small window molding cutting method described above, the encapsulation system can be formed more in the central slots of the substrate strip. In the aforementioned small window molding and cutting method, the encapsulation system may be further formed on the die surface of the substrate strip to seal at least a portion of the wafers. In the foregoing small window molding cutting method, the substrate strip may further have a plurality of interfaces formed outside the external surface. In the foregoing small window molding and cutting method, the method further comprises the steps of: providing a plurality of external terminals on the external pads 9 [Embodiment] According to the first embodiment of the present invention, a small window molding cutting is provided. Method and package structure formed. Figure 3 is a schematic illustration of a peripheral surface of a substrate strip used in a semiconductor package structure and a partial enlargement of one of the substrate units. The fourth Ι36Ό852 i 4F is a partial cross-sectional view of the substrate strip in the method of fabricating the semiconductor package structure. First, the small window molding and cutting method as shown in FIGS. 3 and 4 includes providing a substrate strip 2?, comprising a plurality of substrate units 210 and a plurality of dicing streets formed between the substrate units 21? twenty one. The substrate unit 210 can be a wafer carrier of a memory card, a ball grid array package (BGA) or a tantalum planar array package (LGA). The substrate strip 2 has a die-bonding surface 2H, an external surface 212, and a plurality of small windows 213 extending through the substrate strip 2 φ φ. The small windows 213 are formed on the side edges or corners of the substrate units 21 and are connected to the external surface 212 ′ by the adhesive surface 211 and the external surface 212 includes a plurality of window molding gates 4 . It surrounds the small windows 2 1 3 and extends to the cutting lanes 2 i . In addition, the substrate strip 20 may further have a plurality of pads 216 formed on the external surface 212 for engaging the external terminals 25 (as shown in the first drawing). In this embodiment, the substrate strip 2 can further have a plurality of central slots 2 15 penetrating through the substrate strip 20 formed in a central region of the plurality of substrate units 21 . And the outer surface 212 includes a plurality of lower molding regions 2 1 7 ' surrounding the central slots 2 15 . In the present embodiment, the lower molding regions 217 of the adjacent substrate units 210 may be connected to each other. Then, as shown in FIG. 4, a plurality of wafers 220 are disposed on the die-bonding surface 211 of the substrate strip 20, and the wafers 220 are disposed in the substrate units 2i〇 without covering the dicing streets 2 1, and a plurality of pads 22 1 located on the active surface are usually arranged around the active surface of the wafer, and can also be arranged at the periphery of the active surface of the wafer and the center. For example, a bonding layer such as a B-stage printing layer or a bonding layer of PI (p〇lyimide, polyacrylamide) Ι Ό Ό Ό 2 2 2 2 2 2 2 2 2 2 2 , , , , The surface of the substrate strip 20 is attached to the crystallized surface 211. The ridges 221 are aligned with the small windows 214 and the central slot 2 15 to facilitate subsequent electrical connections. Moreover, preferably, the mounting area of the wafers 22 on the substrate strip 20 is not less than 70% of the area of the surface of the corresponding substrate unit 2 i , for the wafer size package structure. . • After 'as shown in Fig. 4C, a plurality of electrical connecting elements 230 are formed in the "!" Within the window 21 3, even some of the electrical connection elements may be formed in the central slots 21 5 .啻 沾 ML ML / n -3⁄4 some electrical connection elements 23 通过 through the small window 2 1 3 and the middle of the π ο, c a slot 215 to the wafer 220 The solder pads 221 are electrically connected to the substrate < In the present example, the electrical connection elements 230 are wire bonds formed by wire bonding. Then, as shown in FIG. 4D, the 々 々 v 成 一封 一封 一封 一封 一封 一封 胶 胶 胶 胶 胶 胶 胶 胶 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门 门Cao connection element 230. In the present embodiment, the sealing body 240 is formed in the lower molding regions 217 and covers the back surface of the second solar sheet 220 to seal the remaining electrical connecting members 23. m _ and far from the wafer 220. Therefore, as shown in Fig. 5, the encapsulant 240 is further traversed through the scribe lines 21. As shown in FIG. 3, at the side position of the substrate unit 21, each window molding area 2 14 can surround at least two small windows 2 1 3 close to the side and include 3 bits. These small windows 2 1 3 door - the intersection of the 21 roads. At the corner of the substrate at an angle of το 210, each of the outer-molded regions 2 14 can be surrounded by > the four phases adjacent to the corners of the small port 2 1 3 and contained in the small 12 1360852 The scribe line η staggered between the windows 213. In the embodiment A, the encapsulant 240 is an epoxy molding compound (Ep〇xy M〇mng C — 'EMC), and the substrate strip 2 is clamped by the upper and lower molds when the mold is scraped, and the preheating is good. The resin is extruded into the mold. After the resin is filled and hardened, the sealant 240 can be formed, and the finished product can be removed by mold opening. As shown in Fig. 4E, in the above-described small window molding and cutting method, there may be further included a step of: setting a plurality of external terminals 25 to the external pads #216. The external terminals 250 may comprise a plurality of metal balls, solder paste, contact pads or contact pins. In this embodiment, the external terminals are formed as fresh balls to form a small window type ball grid array package, and the wafers 220 mounted on the substrate strip 20 are electrically connected to the external terminals 25 Connection relationship for surface bonding a 々k < Press 0 external printed circuit board (PCB). Finally, as shown in Fig. 4F, the substrate strip 20 is cut along the scribe lines by a dicing tool fastener to singulate a plurality of semiconductor package structures (as shown in Fig. 6). In addition to cutting to the substrate strip 20, it is cut during the cutting process to the portion of the sealing body 24G that passes through the cutting lanes 21 in the window molding regions 214. Right; 隹; ^ 甘 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上The parts of the dicing streets 2 i can function as cutting protective shims, which can reduce the phenomenon of peeling and delamination of the circuit of the substrate unit and the anti-corrosion layer, thereby improving the quality and reliability of the packaged product. In addition, the encapsulant 240 further includes a dicing street 21 in the possible overflow area of the external surface 212, which can reduce the area of the molding overfill in the substrate unit 21 1336Ό852 and the risk, and greatly reduce the mold overflow. The possibility of glue contaminating the outer pads 216. Further, the present invention discloses a package structure formed by the above-described small window molding cutting method. As shown in FIG. 6, the package structure 2 〇〇 main package 3 substrate 7L 210, a wafer 220, a plurality of electrical connection elements 23 〇, and the package substrate 21G is a substrate strip 2g ( As shown in FIG. 3, the substrate unit 21 has a plurality of small windows 213 extending through the surface 211 of the point BB to the external surface 212. The small windows are formed on the side or corner of the substrate unit 210. In the present embodiment, the small windows 213 are adjacent to and may not be connected to the sides or corners of the substrate unit 21A. And as shown in Fig. 3, the outer surface 212 includes a plurality of window molding regions 214 that surround the small windows 213 and extend to the sides or corners of the substrate unit 210. The wafer 22 is disposed on the surface 211 of the die bond. The electrical connecting elements 230 are formed in the small windows 213 to electrically connect the wafer 220 and the substrate unit 21A. In addition, the encapsulant 240 is formed on the window molding regions 214 of the substrate unit 21 to seal the electrical connection members 23, and the encapsulant 24 has a connection to the external surface. The first cutting side surface 224 is formed by simultaneously forming and aligning with the side edge or corner of the substrate unit 2 10 when the substrate is singulated and separated, and the first cutting side 2 has a The protective thickness of the external surface 212 is protruded so that the circuit of the substrate unit 21 and the solder resist layer do not peel and delaminate. In addition, the encapsulant 24 has a second cut side surface 243 connected to the viscous surface 2 11 which is tangential to the side or corner of the substrate unit 210. Accordingly, the encapsulant 240 has a plurality of window molding portions 24 1 ' formed in the window molding regions 2 i 4 and having the first cutting side 242. Structure: colloid? A small window molding and cutting method and a plurality of window slats 241 of the slats 2b are disclosed and covered to the cutting path 21 of the splicing surface 212.

The phenomenon that the small window 213 of the side edge or the corner 容易 is easy to overflow is further provided. When the substrate strip 20 is diced, the protruding surface is provided by the die sealing portion (4). The first-cutting is to prevent the circuit of the substrate unit 21 and the solder resist layer from being emitted, and the phenomenon of the 77 layer can improve the bonding force of the side edges or corners of the substrate unit 210 and maintain the structure of the substrate. Strength to improve the quality and reliability of the package σ. Block

In a second embodiment of the present month, another package construction of the small window mold knives method is disclosed. Referring to Figures 7 and 8, FIG. 7 is an illustration of an external surface of a substrate unit of another semiconductor package structure, and FIG. 8 is a schematic view of the surface of the semiconductor package structure. The semiconductor package structure 300 mainly includes a substrate unit 310, a wafer 32, a plurality of electrical connection elements 330, and a gel 340. The substrate unit 31 has a die-bonding surface 3!! an external surface 312 and a plurality of small windows 313 extending through the substrate unit 310. The substrate unit 31 is formed by cutting a substrate strip 3 (as shown in FIG. 7), and a dicing street 3 is disposed between the adjacent surface of the adjacent substrate unit 3 33. The lanthanide system is disposed on the surface of the die bond 311. The electrical connection elements 33 are formed in the small windows to electrically connect the wafers 320 to the substrate unit 3 1 . As shown in FIG. 7 , the small windows 313 are formed on the side or corner of the substrate unit 15 Ι 36 Ό 852 , and the external surface 312 includes a plurality of window molding regions 314 surrounding the small windows 313 . Extending to the side or corner of the substrate unit 3 〇. In this embodiment, the small windows 313 in the adjacent substrate unit 3 and the window molding area 314 are connected to reduce the area of the side surface of the substrate strip 30, and the substrate unit 3 is prevented. The effect of peeling delamination and the moisture resistance of the product occur when cutting. In addition, the substrate unit 310 may further have a plurality of central slots 315 extending through the substrate unit 31, which are formed in a central region of the substrate units 31, and the external surface 31 2 includes a lower mold. The sealing zone 3丨7 surrounds the central slots 315 but may not extend to the cutting lanes 31. In addition, the substrate strip 30 may further have a plurality of pads 316 formed on the external surface 312, and may be used for arranging a plurality of external terminals 35 〇 electrically connected via the substrate unit 3 To the external terminals 350, the semiconductor package structure 3 can be surface-bonded to an external printed circuit board (not shown). The encapsulant 340 is formed on the window molding regions 314 of the substrate unit 31 to seal the electrical connection members 33A. The sealant 34 has a first cutting side 342 protruding from the outer surface 312, which is cut to the side or corner of the substrate unit 310. In addition, the sealant 34 has a second cut side 343 that is dog-out and attached to the surface 101 of the die, which is cut to the side or corner of the substrate unit 31. Since the small windows '313 are connected to the corresponding side edges or corners of the substrate unit 31, the first cutting side 342 and the second cutting side 343 are connected to each other at the small windows 313. The side of the substrate unit 3iq is separated by ". After the sealant Ι36Ό852, the sealant 340 forms a window seal 341 in each of the window molding regions 314. Since the small windows 3 1 3 are connected to the side edges or corners of the substrate unit 3 1 切割 after cutting, the gaps formed by the side gates or the corners L shape can simplify the design of the mold under the mold, and further Fixture cost in the packaging process. Preferably, as shown in FIG. 7, the substrate strip 3 is disposed on the external surface 312, and an overflow channel 32 is disposed in the scribe line 31 and passes through the window molds. The sealing zone 314 is used to make the cutting channel 314 which is to be cut off as the predetermined area of the overflowing glue, so as to avoid the occurrence of the coating overflow in the substrate unit which can be contaminated to the external pads 316. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any person skilled in the art can make use of the above-disclosed or modified equivalents to equivalent embodiments, but without departing from the technical scope of the present invention (4) or more, any of the above embodiments may be made in accordance with the technical spirit of the present invention. Simple modifications, equivalent changes and modifications are still within the scope of the technical solution of the present invention. [Simplified description of the drawing] Fig. 1: A cross section of a conventional ball grid array package structure - sound Fig. 2: A conventional ball grid array package structure. schematic diagram. Fig. 3 of the substrate ternary external surface of the substrate. According to the first embodiment of the present invention, the substrate strip for use in the splicing of the substrate strip is a partially enlarged schematic circle of the surface unit. <<Medium-substrate 17 Ι 36 Ό 852 4A to: Fig.: According to the first embodiment of the present invention, the substrate strip = a partial sectional view in the manufacturing method of the conductor package structure. Fig. 5 is a schematic view showing the external surface of the substrate after the molding, in accordance with the present invention. Fig. 6 is a cross-sectional view of the semiconductor package structure in accordance with a first aspect of the present invention and an acoustic embodiment. Figure 7 is a schematic illustration of an external surface of a substrate unit used in another semiconductor package construction in accordance with a second embodiment of the present invention. According to a second embodiment of the present invention, the semi-conductive (four) assembly has a schematic cross section. [Main component symbol description] 2 0 substrate strip 21 cutting path 3 2 overflow plastic channel 3 0 substrate strip 31 cutting path 40 cutting tool I 0 0 semiconductor package structure 11 2 external surface 11 5 central slot II 〇 substrate unit 111 sticky Crystal surface 11 3 small window 114 window molding area 116 external pad 117 lower molding area 120 wafer 121 pad 1 5 0 external terminal 130 electrical connection element 140 encapsulant 1 60 0 adhesive 200 semiconductor package structure 210 substrate unit 211 adhesive surface 212 external surface 1360852 213 small window 214 window D molding area 215 216 external pad 2 Π lower molding area 220 wafer 221 pad 230 electrical connection element 240 sealing body 241 242 first cutting side 243 second cutting side 250 External terminal 260 Adhesive 300 Semiconductor package: 3 10 Substrate unit 3 11 Adhesive surface 3 12 313 Small window 314 Window molding area 3 15 316 External pad 317 Lower mold area 320 Wafer 321 Solder pad 330 Electrical Connecting element 340 sealing body 341 342 first cutting side 343 second cutting side 350 external terminal central slot window molding part External surface, central slot, window molding

19

Claims (1)

1360852 X. Patent application scope: 1. A small window mold sealing method comprising: providing a substrate strip comprising a plurality of substrate units and a plurality of substrate units formed between the substrate units (cutting it, the substrate strip having a crystal surface, an external surface, and a plurality of small windows penetrating the substrate strip, the small windows are formed on the side edges or corners of the substrate units, and the external surface comprises a plurality of window molding regions, Between the _ small windows and extending to the dicing streets; a plurality of wafers are disposed on the surface of the substrate strip, the wafers are located in the substrate units without covering the dicing streets; Forming a plurality of electrical connecting elements within the small windows to electrically electrically connect the wafers to the substrate strips; # forming a gel on the substrate strips to form a "molding area to densely connect the electrical connecting elements Extending to the dicing streets; and 'cutting the substrate strip along the scribe lines and the portion of the encapsulant in the die sealing region to separate the substrate units. The small window die-cutting method according to claim 1, wherein each of the window molding regions surrounds at least two adjacent to the window and includes a scribe line located between the small windows. The small window molding cutting method according to the item 1, wherein the die sealing area surrounds at least four small mouths adjacent to the corners and includes a cross section of the cutting path between the small windows. In the patent scope 帛i item, the outer surface of the substrate strip is reserved with a #cutting cutting method, and a glue overflow channel is reserved, which is 20 Ι36Ό852 through the window molding areas. The small window mold sealing method, the small window in the molding area of the same window is the small window molding cutting method, wherein the wafer systems have a plurality of solder pads, and the system is aligned with the small i port 'for the connection of the # electrical connection elements. Hungary The small window die-cutting method according to the first aspect of the invention, wherein the wafers have a surface area of the substrate unit on the substrate strip, and a corresponding surface-package structure. A small window mold-cutting method according to the above-mentioned application, wherein the electrical connecting elements comprise a plurality of fresh lines. Appropriate to the scribe lines and wear them, as in the patent application range 1 where the adjacent substrate units are connected. b. If you apply for a patent, such as applying for a patent (4)! The small window molding and cutting method of the present invention, wherein the substrate strip further has a plurality of central slots extending through the substrate strip, and is formed in a central region of the substrate units. The small window molding cutting method according to claim 9, wherein the sealing system is formed in the central slots 11 of the substrate strip, as in the patent application scope! Or the small window sealing method of claim 10, wherein the encapsulation system is formed on the substrate strip to seal at least a portion of the wafers. The small window molding and cutting method according to the first aspect of the invention, wherein the substrate strip further has a plurality of outer surfaces formed on the external surface, and the invention is in the form of a patent. The scope of the _ ... called a copy of the τ knife 钊 法 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另 另14. A type of package structure formed by a window mold sealing method, comprising: a substrate ^ 'system formed by cutting a substrate strip, the substrate unit 1 having a sticky surface, an external surface, and a plurality of through The small openings of the substrate unit are formed on the side or corner of the substrate unit, and the external surface transmits &amp; The clothing system includes a plurality of window molding regions surrounding the small windows and extending to the side edges or corners of the substrate unit; -S曰, the film is placed on the surface of the bonding crystal. The base is not covered by its ic. . - ^ 主 主 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 该 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The two sealants are formed on the windows of the substrate unit: = sexual connection elements, the sealant system has - protruding from the outer or corners. Cutting the side surface, which is tangent to the side edge 15 of the substrate unit, and the small window formed by the small window of claim 14 of the patent application scope is formed by the cutting method t, wherein the small The side or corner of the window element. $逋到4基板早16, as described in claim 14 of the patent application, the method of cutting and cutting is aligned to the wafer system having a plurality of pads, in the small window, For the connection of the electrical connecting elements: the sealing 槿i ^ formed by the small window described in claim 14 of the patent scope. 1j Method The wafers in the H are disposed on the substrate unit 22 1360852, and the area is not less than 70% of the surface area of the substrate unit to form a wafer size package structure. The package structure formed by the small window die-cutting method of claim 14, wherein the electrical connection elements comprise a plurality of bonding wires. 19. The package structure formed by the small window die-cutting method of claim 14, wherein the substrate unit further has a central slot formed in a central region of the substrate unit. 20. The package structure formed by the small window die-cutting method of claim 19, wherein the encapsulation system is formed further in the central slot of the substrate unit. 21. The package structure formed by the small window molding method of the method of 专利14&lt;2(), wherein the sealing system is further formed on the die-bonding surface of the plate unit to seal the At least the part of the wafer. 22. The small window mold-cutting party as described in claim 21 of the patent application scope) The package structure formed, wherein the encapsulation system has a second tangential plane connecting the surface of the viscous I (4) tangential to the corner of the substrate unit 23 23, such as a swearing range - η The package structure is formed, wherein the substrate unit further has a plurality of interfaces outside the external surface. 24. The package structure formed by the small window die-cutting of claim 23, further comprising a plurality of external terminals, which are external to each other.