13.60525 loo年i〇月1.3日按正番換頁 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種模仁，特別涉及一種具有保護層之模仁 及其製備方法。 [0002] • 【先前技術】 模仁廣泛應用於模壓成型製程，特別係製造光學玻璃産 品，如非球面玻璃透鏡、球透鏡、棱鏡等，採用直接模 壓成型（Direct Press-molding)技術可直接生產光學 玻璃產品，無需打磨、拋光等後續加工步驟，可大大提 高生產效率及産量’且産品質量好。但直接模壓成型法 對於模仁之化學穩定性、抗熱衝擊性能、機械強度、表 面光滑度等要求較高。因此，模壓成型技術之發展實際 上主要取決於模仁材料及模仁製造技術之進步。對於模 壓成型之模仁一般有以下要求： [0003] (1)在咼溫時，具有良好之剛性 '耐機械衝擊強度及硬度 » # [0004] (2)在反復及快速加熱冷卻之熱衝擊下模仁不產生裂紋及 變形； [0005] (3)在高溫時模仁成型表面與光學玻璃不發生化學反應， 不黏附玻璃； [0006] (4)不發生高溫氧化； [0007] (5)加工性能好，易加工成高精度及高表面光潔度之型面 9 [0008] 094107455 (6)成本低。 表單編號删1 ^ 3 17 I 1003377417-0 1360525 [0009] [0010] [0011] [0012] [0013] 094107455 100年10月13日核正替换頁 傳統模仁大多採用不銹鋼或耐熱合金作爲模仁材料，這 種模仁容易發生高溫氧化，在反復熱衝擊作用下，會發 生晶粒長大，從而模仁表面變粗糙，黏結玻璃。 爲解決上述問題，非金屬及超硬合金被用於模仁。據報 導’碳化石夕（SiC)、氮化石夕（si3N4)、碳化鈦（TiC)、碳 化鎢（WC)及碳化鎢-銘合金已經被用於製造模仁。然而， 上述各種碳化物陶瓷硬度非常高，很難加工成所需要之 外形，特別係南精度非球面形。而超硬合金除難以加工 外’使用一段時間之後還可能發生高溫氧化。 因此，以碳化物或超硬合金爲模仁基底，其表面形成有 其他材料鍍層或覆層之複合結構模仁成爲新的發展方向 。典型複合結構模仁如美國專利第4, 685, 948號及第 5, 202, 156號。 美國專利第4, 685, 948號揭示一種用於直接模壓成型光 學玻璃産品的複合結構模仁。其採用高強度的超硬合金 、碳化物陶瓷或金屬陶瓷作爲模仁基底，並在模仁的模 壓面形成有銥（Ir)保護層，或銥（Ir)與鉑（pt)、銖 (Re)、鉞（Os)、鈷（Rh)或釘（Ru)的合金保護層，或釕 (Ru)保護層’或釕（Ru)與鉬（pt)、銖（Re)、餓（〇s)、 錢（Rh)的合金保護層。 美國專利第5, 202, 1 56號揭示一種製備用於光學玻璃產 品的複合結構模仁的方法。其採用高強度的超硬合金、碳化物陶瓷或金屬陶瓷作爲模仁基底，並在模仁的模壓 面形成一層類金剛石膜（DLC，Diamond Like C^fborO 頁 表單編號A0101 第4頁/共l7 1003377417-0 1360525 100年.10月13日修正替換頁 保護層。 [0014] 上述複合結構模仁之保護層雖然能起到防止模仁基底與 被成形體間發生粘著現象，以及防止成形時周圍氣體中 之氧氣作用而使模仁基體之性能惡化之作用。惟，製作 該保護層時需先針對模仁基體進行研磨而後再鍍上保護 層’如果要使脫膜容易，則與欲模壓產品接觸之表面需 具有適當之表面粗糙度（約〇. 2〜1. 2μπ〇。因為粗糙度太 低則不易脫膜’粗糙度太高則會影響成形體設計之形狀 • 。為了使保護層達到此粗糙度範圍，因此模仁基體表面 也需研磨至此粗糙度範圍’然而，此等級之粗糙度需使 用號數較大之研磨工具，其結果會使模仁基底表層產生 一加工變質層’而使此模仁強度與耐久性都大幅下降。 [0015] • 如第一圖所示，2002年7月3日公開之第〇1 139835. 3號 中國大陸申請揭露一種模仁10，該模仁之基體丨丨成形表 面形成一厚度為2〜5μιη之中間層12，該中間層12為白金-銀合金層；在該令間層12表面覆蓋一白金膜13，該白金 膜13與成形體接觸之表面粗縫度比模仁基體&表面粗 糙度要大。且該白金膜13之表面粗链度為〇 21 2叫。 惟，該模仁使用之白金膜及白金_錶合金成本過高。 [0016] 有鑒於此^:供―種能降低成本，且具有良好脫膜性及 使用壽命長之模仁及其製備方法實爲必要。 【發明内容】 [0017] 以下’將以若干實施例說明—種能降低成本，且具有良 好脫膜性及使用壽命長之模仁。 094107455 表單編號A0101 第5頁/共π頁 1003377417-0 1360525 [0018] [0019] [0020] [0021] [0022] [0023] [0024] [0025] [0026] [0027] [0028] [0029] [0030] [0031] [0032] 094107455 100年10月13日孩正替換百 以及通過這些實施例說明一種能降低成本，且具有良好 脫膜性及使用壽命長之模仁之製備方法。 爲實現上述内容’提供一種模仁，其包括·： 模仁基體，其具有一與欲模壓產品相對應之模壓面； 一形成於該模壓面之粘著層； 一形成於該枯著層之擴散阻隔層；及 一形成於該擴散阻隔層之類金剛石層，該類金剛石層之 最表層之表面粗糙度比模仁基體表面粗糙度要大。 其中，該類金剛石層之最表層之表面粗糙度為〇.2〜丨 m 〇 以及，提供一種模仁之製備方法，其步驟包括： 提供一模仁基體，研磨該模仁基體之模壓面； 清洗研磨後之模仁基體； 形成一粘著層於該模仁基體之模壓面； 形成一擴散阻隔層於該粘著層表面； € 形成一類金剛石層於擴散阻隔層表面； 使該類金剛石層之最表層之表面粗糙度比模仁基體表 粗糙度要大。 與先前技術相較，本技術方案之模仁採用多層中間層及 類金剛石層結構取代貴金屬膜結構，起到降低成本 用。另外，該模仁由於類金剛石最表層之表面粗糙产大 表單編號A0101 第6頁/共π頁 ^03377417-0 1360525 100年.10月13日修正替換頁 於該模仁基體表面粗縫度，使類金剛石之最表層之表面 粗糙度保持在最適合脫膜之範圍内（〇 2~丨2印）；而且 該模仁基體表面之表面粗糙度小於〇〇5μιη，加工時不會 產生嚴重之加工變質層，而使此模仁具有較長之使用壽 命。故，本技術方案之模仁具有良好脫膜性、使用壽命 長、降低成本之優點。 [0033] 【實施方式】 下面將結合附圖及實施例對本發明作進一步之詳細說明 〇 • [0034] 請參閱第二圖，本發明第一實施例之模仁2〇，包括：模 仁基體21，其具有一與欲模壓產品相對應之模壓面；一 形成於該模壓面之枯著層22 ; —形成於該钻著層22之擴 散阻隔層23 ;及一形成於該擴散阻隔層23之類金剛石芦 24 ’該類金剛石層24之最表層之表面粗糙度比模仁基體 21表面粗糙度要大》本實施例中模仁基體21為碳化鶴製 成，粘著層22為鈦金屬層，擴散阻隔層23為氮化餘層。 # [0035] 本實施例之模仁基體之模壓面表面粗糙度為〇. 05um以下 ，該粗糙度之模壓面很少形成較大之加工變質層， 且月& 與鈦粘著層致密結合，故，能延長模仁之使用壽命◊類 金剛石層24具有較高之硬度值及較低之摩擦係數，能滿 足模仁對材料之要求。而該類金剛石層24之最表層之表 面粗糖度為〇.2~1.2μπι左右。最表層具有該粗鍵度範圍 之模仁具有較佳性能’若該粗縫度小於0. 2 μ m，則成步體 不易脫膜，若該粗糙度大於1. 2μιη，則容易影響欲模壓產 品設計之形狀。 094107455. 表單編號A0101 第7頁/共17頁 ^03377417-0 1360525 [0036] [0037] [0038] [0039] [0040] 094107455 100年10月13日修正替換百 本實施例之粘著層22之厚度範圍為0. 05〜Ο.ίμιη;該擴散 阻隔層23之厚度範圍為0. 05〜0. Ιμιη ;該類金剛石層之厚 度範圍為0. 5〜3μιη。該粘著層22主要用於增加擴散阻隔 層23、類金剛石層24與模仁基體21之間之附著性。該擴 散阻隔層23用於防止活性原子與後續濺鍍之類金剛石層 24產生反應，而影響類金剛石層24性能。 請一併參閱第三圖及第四圖，本發明第二實施例提供該 模仁20之製備方法，其包括以下步驟： 步驟100，提供一模仁基體21，研磨該模仁基體21之模壓 € 面。可採用較小號數之研磨工具將該模壓面研磨至0. 0 5μ m以下之表面粗糙度。 步驟200，清洗研磨後之模仁基體21。首先需對研磨後之 模仁基體21做基本清洗：放入丙酮溶液中以超音波震盪 清洗20分鐘，再放入乙醇溶液中以超音波震盪清洗10分 鐘；然後，採用氮氣槍喷幹該模仁基體21 ;接著將該模 仁基體21放進磁控濺鍍機40之真空腔體41中進行濺射清 _ 洗。 如第四圖所示，將模仁基體21置於該真空腔體41内部並 通過匹配網路45與壓射頻電源46相連；該真空腔體41先 通過機械泵42形成低真空，然後開啟高真空閥43，並通 過渦輪泵44使真空腔體41之底壓小於l(T5Torr。通過第 一流量控制器47、第二流量控制器48分別通入氬氣和氮 氣，使真空腔體41壓力達到2〜7xlO_3Torr ;將陰極49 與直流電源51相連，使模仁基體21與陰極49之間形成電 表單編號A0101 第8頁/共17頁 1003377417-0 1360525 100年10月13日修正替換頁 場；於模仁基體21與陰極49之間形成電漿區52，電離産 生之正離子及電子高速轟擊模仁基體21之模壓面而達到 清洗模仁基體21之目的。該濺射清洗步驟中該模仁基體 21之偏壓為300V，濺射清洗時間需保持10分鐘以上。 [0041] 步驟300，形成一粘著層22於該模仁基體21之模壓面。本 實施例通過偏壓反應濺射法來沈積該粘著層22。 [0042] 广 • 如第四圖所示，將清洗完之模仁基體21置於該真空腔體 41内部並通過匹配網路45與壓射頻電源46相連；將一鈦 金屬靶材（圖未示）設置於陰極49上方，並通過該陰極49 與直流電源51相連。該真空腔體41先通過機械泵42形成 低真空，然後開啟高真空閥43，並通過渦輪泵44使真空 腔體41之底壓小於10_5Torr ;通過第一流量控制器47通 入氬氣，使真空腔體41壓力達到2~7xlO_3Torr ;使模仁 基體21與鈦金屬靶材之間形成電場，於模仁基體21與鈦 金屬靶材之間形成電漿區52，電離産生之正離子及電子 高速轟擊鈦金屬乾材，使該乾材上之原子或分子激射出 • 來，於模仁基體21上形成一層厚度為0. 05~0. Ιμιη範圍内 之鈦粘著層22。本步驟設置之模仁基體21偏壓範圍為-20V — 60V。 [0043] 步驟400，形成一層擴散阻隔層23於該粘著層22表面。本 步驟400與步驟300大致相同，不同之處在於：通過第一 流量控制器47、第二流量控制器48同時通入氬氣和氮氣 。通過該步驟可於鈦粘著層22表面形成一層厚度為 0. 05〜0. Ιμιη範圍内之氮化鈦擴散阻隔層23。 094107455 表單編號A0101 第9頁/共17頁 1003377417-0 [0044]136052513.60525 loo year i〇 month 1.3 page according to the original page VI. Description of the invention: [Technical field of the invention] [0001] The present invention relates to a mold core, and more particularly to a mold core having a protective layer and a preparation method thereof. [0002] • [Prior Art] Molding is widely used in the molding process, especially in the manufacture of optical glass products, such as aspherical glass lenses, ball lenses, prisms, etc., which can be directly produced by Direct Press-molding technology. Optical glass products, without the need for subsequent processing steps such as grinding and polishing, can greatly improve production efficiency and yield 'and good product quality. However, the direct compression molding method requires high chemical stability, thermal shock resistance, mechanical strength, and surface smoothness of the mold core. Therefore, the development of compression molding technology actually depends on the advancement of mold core materials and mold manufacturing technology. For molded parts, there are generally the following requirements: [0003] (1) Good temperature resistance to mechanical shock strength and hardness at room temperature » # [0004] (2) Thermal shock in repeated and rapid heating and cooling The lower mold core does not cause cracks and deformation; [0005] (3) At high temperature, the molded surface of the mold does not chemically react with the optical glass, and does not adhere to the glass; [0006] (4) High temperature oxidation does not occur; [0007] (5 ) Good processing performance, easy to process into high precision and high surface finish profile 9 [0008] 094107455 (6) Low cost. Form No. 1 ^ 3 17 I 1003377417-0 1360525 [0009] [0011] [0013] 094107455 October 13, 100 nuclear replacement page traditional mold core mostly using stainless steel or heat resistant alloy as a mold The material, the mold is prone to high temperature oxidation, and under repeated thermal shock, grain growth will occur, and the surface of the mold will become rough and the glass will be bonded. In order to solve the above problems, non-metal and super-hard alloys are used for the mold core. It has been reported that carbon carbide (SiC), nitrite (si3N4), titanium carbide (TiC), tungsten carbide (WC) and tungsten carbide-ing alloy have been used to manufacture mold cores. However, the above various carbide ceramics have a very high hardness and are difficult to process into a desired shape, particularly a south precision aspherical shape. In addition to being difficult to process, superhard alloys may undergo high temperature oxidation after a period of use. Therefore, it is a new development direction to use carbide or super-hard alloy as the base of the mold, and the composite structure with other materials coated or coated on the surface has become a new development direction. Typical composite structures are disclosed in U.S. Patent Nos. 4,685,948 and 5,202,156. U.S. Patent No. 4,685,948 discloses a composite structural mold for direct compression molding of optical glass products. It uses a high-strength super-hard alloy, carbide ceramic or cermet as the base of the mold, and forms an iridium (Ir) protective layer on the molded surface of the mold, or iridium (Ir) and platinum (pt), 铢 (Re ), alloy protective layer of bismuth (Os), cobalt (Rh) or nail (Ru), or ruthenium (Ru) protective layer 'or ruthenium (Ru) and molybdenum (pt), ruthenium (Re), hungry (〇s) , alloy (Rh) alloy protective layer. U.S. Patent No. 5,202,156 discloses a method of preparing a composite structural mold for use in an optical glass product. It uses high-strength super-hard alloys, carbide ceramics or cermets as the base of the mold, and forms a diamond-like film on the molded surface of the mold core (DLC, Diamond Like C^fborO, page number No. A0101, page 4/total l7 1003377417-0 1360525 Correction of the replacement page protective layer on October 13th. [0014] The protective layer of the above-mentioned composite structure mold can prevent adhesion between the base of the mold and the formed body, and prevent the surrounding from being formed. The action of oxygen in the gas causes the performance of the matrix of the mold to deteriorate. However, when the protective layer is formed, it is necessary to first grind the matrix of the mold and then apply a protective layer. If the release is easy, the molded product is intended to be molded. The surface to be contacted should have a suitable surface roughness (about 2. 2~1. 2μπ〇. Because the roughness is too low, it is not easy to remove the film.) If the roughness is too high, it will affect the shape of the molded body. • In order to achieve the protective layer This roughness range, so the surface of the matrix of the mold must also be ground to this roughness range. However, the roughness of this grade requires the use of a larger number of abrasive tools, and the result is a mold. The surface layer of the base produces a processing metamorphic layer', which greatly reduces the strength and durability of the mold. [0015] • As shown in the first figure, the application of China No. 1 139835. 3, published on July 3, 2002 A mold core 10 is disclosed. The base 丨丨 forming surface of the mold core forms an intermediate layer 12 having a thickness of 2 to 5 μm, and the intermediate layer 12 is a platinum-silver alloy layer; the surface of the intervening layer 12 is covered with a platinum film 13, The rough surface of the platinum film 13 in contact with the formed body is larger than the surface roughness of the mold base & and the surface of the platinum film 13 has a thick chain of 〇21 2 . However, the platinum film used in the mold core is used. And the cost of the platinum alloy is too high. [0016] In view of this, it is necessary to provide a mold having a good release property and a long service life, and a preparation method thereof. 0017] The following 'will be described in several embodiments - a mold which can reduce cost and has good release property and long service life. 094107455 Form No. A0101 Page 5 / Total π Page 1003377417-0 1360525 [0018] [0019 [0020] [0025] [0025] [0025] [00 [0028] [0028] [0029] [0032] 094107455 October 13th, 100th, the child is replacing 100 and through these examples to illustrate a cost reduction, and good release properties and use A method for preparing a long-life mold core. To provide the above-mentioned contents, a mold core is provided, comprising: a mold core having a mold surface corresponding to a molded product; an adhesive layer formed on the mold surface; a diffusion barrier layer formed on the dry layer; and a diamond layer formed on the diffusion barrier layer, the surface roughness of the outermost layer of the diamond-like layer being greater than the surface roughness of the matrix of the mold core. Wherein, the surface roughness of the outermost layer of the diamond-like layer is 〇.2~丨m 〇 and a method for preparing the mold core, the steps comprising: providing a mold core body, grinding the mold surface of the mold core; a post-grinding matrix of the mold; forming an adhesive layer on the molding surface of the matrix of the mold; forming a diffusion barrier layer on the surface of the adhesive layer; forming a diamond-like layer on the surface of the diffusion barrier layer; The surface roughness of the outermost layer is greater than that of the matrix of the matrix. Compared with the prior art, the mold of the present invention replaces the precious metal film structure with a plurality of intermediate layers and a diamond-like layer structure, thereby reducing the cost. In addition, the mold core is rough due to the surface roughness of the diamond-like surface. Form No. A0101 Page 6 / Total π page ^03377417-0 1360525 100 years. October 13 correction replacement page on the surface of the mold core rough seam, The surface roughness of the diamond-like outermost layer is maintained within the range most suitable for stripping (〇2~丨2 printing); and the surface roughness of the surface of the mold core is less than 〇〇5μιη, which does not cause serious processing. Processing the metamorphic layer, so that the mold has a long service life. Therefore, the mold of the technical solution has the advantages of good release property, long service life and low cost. [Embodiment] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. [0034] Referring to the second figure, the mold core of the first embodiment of the present invention includes: a matrix of a mold core 21, which has a molding surface corresponding to the molded product to be molded; a dry layer 22 formed on the molding surface; a diffusion barrier layer 23 formed on the drilling layer 22; and a diffusion barrier layer 23 formed thereon Such a diamond reed 24' The surface roughness of the outermost layer of the diamond layer 24 is larger than the surface roughness of the matrix base 21. In this embodiment, the matrix base 21 is made of carbonized crane, and the adhesive layer 22 is made of titanium. The layer, the diffusion barrier layer 23 is a nitrided layer. # [0035] The surface roughness of the molding surface of the mold base of the present embodiment is 〇. 05um or less, and the molded surface of the roughness rarely forms a large processing metamorphic layer, and the moon & is densely bonded with the titanium adhesion layer. Therefore, the service life of the mold core can be prolonged. The diamond-like carbon layer 24 has a high hardness value and a low friction coefficient, and can satisfy the requirements of the mold core. The surface roughness of the outermost layer of the diamond-like layer 24 is about 2.2~1.2μπι. The mold layer having the thickest range of the outermost layer has a better performance. If the roughness is less than 0.2 μm, the step body is not easy to release the film. If the roughness is greater than 1.2 μm, the mold pressure is easily affected. The shape of the product design. 094107455. Form No. A0101 Page 7 of 17^03377417-0 1360525 [0036] [0040] [0040] 094107455 October 13, 100 amendments to replace the adhesive layer 22 of the present embodiment 5〜3μιη。 The thickness of the thickness of the diamond layer is 0. 5~3μιη。 The thickness of the thickness of the thickness of the layer is 0. 05~0μιη. The adhesive layer 22 is mainly used to increase the adhesion between the diffusion barrier layer 23, the diamond-like layer 24, and the mold base 21. The diffusion barrier layer 23 serves to prevent the active atoms from reacting with the subsequent sputter-like diamond layer 24 and affecting the properties of the diamond-like layer 24. Referring to the third and fourth figures, a second embodiment of the present invention provides a method for preparing the mold core 20, which comprises the following steps: Step 100, providing a mold core body 21, and molding the mold base body 21 € face. The surface roughness of the molded surface may be milled to a thickness of less than 0.05 μm using a smaller number of abrasive tools. In step 200, the ground matrix 21 after grinding is washed. Firstly, the ground mold base 21 after grinding is basically cleaned: it is ultrasonically shaken for 20 minutes in an acetone solution, and then ultrasonically shaken for 10 minutes in an ethanol solution; then, the mold is sprayed with a nitrogen gun. The matrix body 21; the matrix base 21 is then placed in a vacuum chamber 41 of a magnetron sputtering machine 40 for sputter cleaning. As shown in the fourth figure, the mold base 21 is placed inside the vacuum chamber 41 and connected to the piezoelectric RF power source 46 via a matching network 45; the vacuum chamber 41 is firstly vacuumed by the mechanical pump 42 and then turned on. The vacuum valve 43 and the bottom pressure of the vacuum chamber 41 are less than 1 (T5 Torr) by the turbo pump 44. The pressure of the vacuum chamber 41 is made by introducing argon gas and nitrogen gas through the first flow controller 47 and the second flow controller 48, respectively. 2~7xlO_3Torr is reached; the cathode 49 is connected to the DC power source 51, and an electric form number A0101 is formed between the mold base 21 and the cathode 49. Page 8/17 pages 1003377417-0 1360525 October 13th revised replacement page field A plasma region 52 is formed between the matrix body 21 and the cathode 49, and the positive ions generated by ionization and electrons are rapidly bombarded with the molding surface of the matrix body 21 to achieve the purpose of cleaning the matrix body 21. In the sputtering cleaning step, The bias of the mold base 21 is 300 V, and the sputtering cleaning time needs to be maintained for more than 10 minutes. [0041] Step 300, forming an adhesive layer 22 on the molding surface of the mold base 21. This embodiment is splashed by a bias reaction. The adhesion layer 22 is deposited by spraying. [0042] Guang • As shown in the fourth figure, the cleaned mold base 21 is placed inside the vacuum chamber 41 and connected to the piezoelectric RF power source 46 via the matching network 45; a titanium metal target (not shown) is disposed. Above the cathode 49, and connected to the DC power source 51 through the cathode 49. The vacuum chamber 41 is first formed into a low vacuum by the mechanical pump 42, then the high vacuum valve 43 is opened, and the bottom of the vacuum chamber 41 is pressed by the turbo pump 44. Less than 10_5 Torr; argon gas is introduced through the first flow controller 47 to bring the pressure of the vacuum chamber 41 to 2~7x10 Torr; an electric field is formed between the mold base 21 and the titanium target, and the matrix body 21 and the titanium metal target are formed. The plasma region 52 is formed between the materials, and the positive ions and electrons generated by the ionization are bombarded with the titanium metal dry material, so that the atoms or molecules on the dry material are lasing, and a thickness of 0.05 is formed on the matrix of the mold core. ~0. Titanium adhesion layer 22 in the range of Ιμιη. The mold base body 21 provided in this step has a bias range of -20V - 60 V. [0043] Step 400, a diffusion barrier layer 23 is formed on the surface of the adhesion layer 22. This step 400 is substantially the same as step 300, and is different. The nitrogen in the range of 0. 05~0. Ιμιη is formed on the surface of the titanium adhesion layer 22 by the first flow controller 47 and the second flow controller 48. Titanium diffusion barrier layer 23. 094107455 Form No. A0101 Page 9 of 17 1003377417-0 [0044] 1360525
[ϊ〇〇年10月13日修正替換頁I 步驟500，形成一層類金剛石層以於該擴散阻隔層u表面 。將純石墨棒靶材替換下鈦金屬靶材，通過第一流量控 3~20xl〇_3Tori•。本步驟設置之模仁基體21偏壓範圍為 -50V—i50V。通過該步驟可於氮化鈦擴散阻隔層23表面 形成一層厚度為〇. 5~3μιη範圍内之類金剛石層24。 [0045] 制器47通入甲烷（ci^)氣體，使真空腔體41壓力達到 步驟600，將沈積完該類金剛石層24之模仁2〇放入加熱設 備（圖未示）中加熱使該類金剛石之最表層之表面粗趟度 達到〇· 2〜1. 2μιη »在該加熱設備中將該模仁20加熱至 200~300度，同時通入氬氣及氮氣，並保持該溫度〇 小時’此步驟之目的係使類金剛石層之晶粒生長而使與 成形體接觸之類金剛石層最表面之表面粗糙度逹到所需 之0. 2〜1. 2μιη 〇 [0046] [0047] 094107455 可以理解的係，本技術方案之模仁基體除碳化鎢等硬質 合金外還可採用不鏽鋼或碳化矽等材料製造；粘著層除 採用鈦金屬外還玎採用鉻金屬材料製造。本技術方案之 模仁製備方法除通過濺射法外還可採用化學氣相沈積法 沈積粘著層、擴散陴隔層及類金剛石層，其中濺射法包 括偏壓反應濺射、射頻淹1射及共錢射° 本技術方案之模仁採用多層中間層及類金剛石層結構取 代貴金屬膜結構，起到降低成本之作用。另外，該模仁 由於類金剛石最表層之表面粗糙度大於該模仁基體表面 粗縫度，使類金剛石之最表層之表面粗較度保持在最適 合脫膜之範圍内（Ο.2'"1;。111);而且該模仁基體表面之 表面粗糙度小於〇.05μΙΠ，加工時不會產生嚴重之加工變 第10頁/共17頁 表單編號Α0101 ^03377417-0 1360525 1100年.10 月 13 日 質層’而使此模仁具有較長之使用壽命。故，本技術方 〜· 案之模仁具有良好脫膜性'使用壽命長、降低成本之優 [0048] 綜上所述’本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施例 ，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0049] 第一圖係先前技術之第01139835.3號中國大陸申請之模 仁截面結構示意圖。 [0050] 第二圖係本技術方案之模仁截面結構示意圖。 [0051] 第三圖係本技術方案之模仁之製備方法步驟示意圖。 [0052] 第四圖係本技術方案採用之濺射設備結構示意圖。 【主要元件符號說明】 [0053] 模仁：20 [0054] 模仁基體：21 [0055] 粘著層：22 [0056] 擴散阻隔層：23 [0057] 類金剛石層：2 4 [0058] 磁控濺鍍機：40 [0059] 真空腔體：41 094107455 表單編號Α0101 第11頁/共17頁 1003377417-0 1360525 100年10月13日修正雜頁 [0060] 機械泵：42 [0061] 高真空閥：43 [0062] 渦輪泵：44 [0063] 匹配網路：45 [0064] 壓射頻電源：46 [0065] 第一流量控制器： 47 [0066] 第二流量控制器： 48 [0067] 陰極：49 [0068] 直流電源：51 [0069] 電漿區：52[Replacement page I, step 500, on October 13, the following year, a diamond-like layer is formed to form the surface of the diffusion barrier layer u. The pure graphite rod target was replaced by a titanium metal target, and the first flow rate was controlled by 3~20xl〇_3Tori•. The mold base 21 set in this step has a bias range of -50V to i50V. Through this step, a diamond-like layer 24 having a thickness in the range of 0.5 to 3 μm can be formed on the surface of the titanium nitride diffusion barrier layer 23. [0045] The controller 47 is introduced with methane gas to bring the pressure of the vacuum chamber 41 to step 600, and the mold core 2 of the diamond-like layer 24 is placed in a heating device (not shown) for heating. The surface roughness of the outermost layer of the diamond is 〇·2~1. 2μιη » In the heating device, the mold core 20 is heated to 200-300 degrees, while argon gas and nitrogen gas are introduced, and the temperature is maintained. 2〜1. 2μιη 〇[0047] [0047] [0046] [0046] [0046] [0046] [0046] [0046] 094107455 It can be understood that the mold base of the technical solution can be made of stainless steel or tantalum carbide in addition to the hard alloy such as tungsten carbide; the adhesive layer is made of chrome metal material in addition to titanium metal. In the preparation method of the mold of the present invention, in addition to the sputtering method, the adhesion layer, the diffusion barrier layer and the diamond-like layer may be deposited by chemical vapor deposition, wherein the sputtering method includes bias reactive sputtering, radio frequency flooding. Shot and total money shot ° The mold of this technical solution uses a multi-layer intermediate layer and a diamond-like layer structure to replace the precious metal film structure, thereby reducing the cost. In addition, since the surface roughness of the diamond-like outermost layer is larger than the rough surface of the surface of the mold core, the surface roughness of the diamond-like outer surface layer is kept within the range most suitable for stripping (Ο.2'" ;1;.111); and the surface roughness of the surface of the mold core is less than 〇.05μΙΠ, and no serious processing changes will occur during processing. Page 10/Total 17 Page Form NumberΑ0101^03377417-0 1360525 1100年10 On the 13th of the month, the layer has a longer service life. Therefore, the mold of the present technology has good release property. The service life is long and the cost is reduced. [0048] In summary, the invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0049] The first figure is a schematic diagram of the cross-sectional structure of a mold applied in the Chinese patent No. 01139835.3 of the prior art. [0050] The second figure is a schematic diagram of the cross-sectional structure of the mold core of the present technical solution. [0051] The third figure is a schematic diagram of the steps of the preparation method of the mold core of the technical solution. [0052] The fourth figure is a schematic structural view of a sputtering apparatus used in the present technical solution. [Main component symbol description] [0053] Mold: 20 [0054] Mold base: 21 [0055] Adhesive layer: 22 [0056] Diffusion barrier: 23 [0057] Diamond-like layer: 2 4 [0058] Magnetic Control Sputter: 40 [0059] Vacuum Chamber: 41 094107455 Form No. 101 0101 Page 11 / Total 17 Page 1003377417-0 1360525 October 13 Revision Order [0060] Mechanical Pump: 42 [0061] High Vacuum Valve: 43 [0062] Turbo pump: 44 [0063] Matching network: 45 [0064] Pressurizing RF power: 46 [0065] First flow controller: 47 [0066] Second flow controller: 48 [0067] Cathode :49 [0068] DC power supply: 51 [0069] Plasma area: 52
094107455 表單编號A0101 第12頁/共17頁 1003377417-0094107455 Form No. A0101 Page 12 of 17 1003377417-0