1360000 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種光源總成，特別是一種運用在背光模組可 縮短散熱途徑、提升散熱效果之光源總·成。 【先前技術】 液晶顯示器（Liquid Crystal Display ’ LCD )具有省電、重量軔、 低輻射及易攜帶等優點，可廣泛應用於電視、電腦螢幕、筆記型1360000 IX. Description of the Invention: [Technical Field] The present invention relates to a light source assembly, and more particularly to a light source assembly that can be used in a backlight module to shorten a heat dissipation path and improve a heat dissipation effect. [Prior Art] Liquid Crystal Display (LCD) has the advantages of power saving, weight reduction, low radiation and easy portability, and can be widely used in televisions, computer screens, and notebooks.
電腦、汽車導航系統、行動通訊裝㈣，已逐漸取代傳統的顯示 器’成為市面上之主流產品。其中，用以提供光源的關鍵零纽件 之一即是背光模組（Backlight Modu丨e )，其目的在於將發光元件所 發射之點光源或線光源，進—步形成均勾之面光源，以提供液晶 面板使用。 目剐市面上之發光元件通常係運用光電轉換之原理，將電能轉 換成光，’然而，由於本身材料特性之限制，當發光元件進行光電 轉換的時候’必'然有—部分的電能未能轉換成光，而改以轨能的 方式散發。可以想見地，若此熱能無法即時且有效地加以去除， 將導致發光it件溫度上升。當發光元件長時間處在高溫㈣1 使得發光波長飄移、發光效率降低，甚至縮短發光元件之使用壽 第1圖所示為習知運用於背光模、组之發光会且件1〇〇，發光组件 Z包含金屬殼體⑻、導熱軟㈣2、電路板⑻以及複數個發 光兀件104。其中，金屬殼體1〇1係 - 用不承载該導熱軟墊102以及 電路板1 03 ’而為了提供穩定電流及控 4A 彳工剌，各發光元件104通常直 接設置於電路板1〇3上，並藉由第— 上JL精㈣電極1〇4 與電路板103電性連接。更明確而言 f屬殼體⑻通常為背域組之背极 高亮度之發光二極體。 —田毛光’”且件〗〇〇於操作狀態時，電能會從電路板】〇3並藉 ^極IG4a與第：電極_傳送至發㈣HM，發光元:】04 更曰進仃電㈣I換產生光與熱。其m經由發u件丨〇4之 先面（相對於電路板_發射，而部分熱㈣會從發光元件104Computers, car navigation systems, and mobile communication devices (4) have gradually replaced traditional displays, becoming the mainstream products on the market. One of the key components for providing a light source is a backlight module (Backlight Modu丨e), the purpose of which is to form a light source or a line source emitted by the light-emitting element to form a surface light source. To provide LCD panel use. The light-emitting components on the market are usually based on the principle of photoelectric conversion, which converts electrical energy into light. However, due to the limitations of its own material properties, when the light-emitting components are photoelectrically converted, it must be – some of the electrical energy fails. Converted into light, and distributed in the way of rail energy. It is conceivable that if this thermal energy cannot be removed immediately and effectively, it will cause the temperature of the illuminating element to rise. When the illuminating element is at a high temperature for a long time (4) 1 so that the illuminating wavelength shifts, the illuminating efficiency is lowered, and even the use of the illuminating element is shortened. FIG. 1 shows a conventional illuminating unit for use in a backlight module, a group, and a light emitting unit. Z includes a metal casing (8), a thermal conductive soft (four) 2, a circuit board (8), and a plurality of light-emitting elements 104. Wherein, the metal casing 1〇1 is used to carry the thermal pad 102 and the circuit board 103', and in order to provide a stable current and control the 4A, the light-emitting elements 104 are usually directly disposed on the circuit board 1〇3. And electrically connected to the circuit board 103 by the first-up JL fine (four) electrode 1〇4. More specifically, f is a housing (8) which is usually a high-intensity light-emitting diode of the back domain group. - 田毛光'" and pieces 〗 〇〇 In the operating state, the electric energy will be from the circuit board 〇 3 and by the pole IG4a and the first: the electrode _ to the hair (four) HM, the illuminating element: 】 04 more 仃 仃 (4) I change produced Light and heat. The m is transmitted through the front surface of the 丨〇 4 (relative to the board _ emission, and part of the heat (four) will be from the illuminating element 104
之底面ϋ過電路板103與導熱軟塾1〇2傳導至金屬殼體ίο】後， 進而散發至外界。 :路板丨03之材料特性具有較高之熱阻抗’前述熱傳導 之熱忐需經過電路板103、散熱軟墊102以及金屬殼體丨〇1 2傳導至外界，將因為散熱途徑過長而導致散熱效果不佳。而 ，者免度的需求逐漸增加，發光元件所產生的熱能亦隨之增加， 散熱效果不佳將會降低發光元件1〇4之發光效率並縮短發光元件 】〇4之使用壽命。The bottom surface of the circuit board 103 and the thermal conductive soft 塾1〇2 are conducted to the metal casing ίο, and then radiated to the outside. : The material properties of the road board 丨 03 have a high thermal resistance. The heat of the above-mentioned heat conduction needs to be conducted to the outside through the circuit board 103, the heat dissipation pad 102 and the metal case 丨〇12, which will result in a long heat dissipation path. The heat dissipation is not good. However, the demand for freedom is gradually increased, and the heat energy generated by the light-emitting elements is also increased. The poor heat dissipation effect will reduce the luminous efficiency of the light-emitting element 1〇4 and shorten the service life of the light-emitting element 〇4.
’習知之發光組件！ 〇〇中， '而發光元件104通常採用 習知技術中，爲增加散熱效率，電路板1〇3或有採用以金屬（例 如·紹或鋼）為核心所製成之金屬製印刷電路板（咖c⑽州㈣ 咖汕b〇ard，MCPCB);此外，亦有將發光元件ι〇4與散熱片 (therma丨heat_sink)結合者，企圖利用散熱片的高導熱率，將發 光元件104之熱能加速傳導至電路板丨〇3，以降低發光元件1〇4 之溫度。然而，由於電路板丨03本身的熱阻抗仍然過高以上改 善方式對於整體散熱效果之提升，仍相當有限。 匕卩 14著冗度需求之增加，如何提高發光組件之散熱效果， 1360000 > 乃是目前業界所欲解決之重要課題。 【發明内容】 .·. 轉明之一目的在於提出一種光源總成及背光模組，藉由縮短 _ 發光模組之累積熱能向外發散之散熱途徑，以提升其散熱效果。 本發明之另-目的在於提出一種光源總成及背光模組藉由電 路板之設計上的變更，將其配置於發光模組之—外側。相較於習 知技術將電路板配置於發光模組之底部，本發日月之設計，使得發 ^ 光模組之散熱途徑不受電路板阻隔，以提升其散熱效果。 本發明之又-目的在於提出一種光源總成及背光模組，由於將 電路板配置於發光模組之—外側，而非設置於發光模組之散熱路 徑上，故不須考慮電路板本身之熱傳導功能，故電路板之材料選 擇上具有更大彈性，可進而節省成本。 為達上述目的，本發明揭露一種光源總成，該光源總成包含一 導熱結構、-發光模組、至少_電路板以及—導線模組。 * »、、、 、、。構”有表面°亥發光模組係設置於該導熱結構之表面上，該 籲電路板則設置於該發光模組之一外側，並利用導線模組電性連接 該電路板及該發光模組。藉此，該發光模組所產生之熱量適可直 接經由該導熱結構向外傳導。 本發明更揭露-種背光模組，該背光模組包含一金屬殼體以及 -光源總成。該光源總成係設置於該金屬殼體上，且該光源總成 ’ 匕3 $熱結構、—發光模組、至少-電路板以及-導線模組。 • 導熱結構係、實f上與該金屬殼體接觸，該導熱結構具有-表面， 。亥心光模組係“又置於該導熱結構之表面上，該電路板則設置於該 心光模組之-外側，且於該金屬殼體上，並利用導線模組電性連 1360000 接該至少-電路板及該發光模組。藉此，該發光模組所產生之熱 量適可直接經由該導熱結構，傳導至該金屬殼體。 在參閱圖式及隨後描述之實施方式後，該技術領域具有通常知 谶者便瞭解本發明之目的，以及本發明之技術手段及實施態樣。 【實施方式】 本發明之第-實施例如第2A圖與第2B圖所示，第2A圖係為 本發明第-實施例之光源總成2GG之側面示意圖，第2B圖係為本 土明第-實〜例之光源總成之俯視圖。在本實施例中，光源 總成200包含導熱結構2(H、發光模組2〇2、電路板2〇3以及導線 模組204。導熱結構201具有表面2〇u，發光模組2〇2即係設置 於導熱職201之表面2仏上。於本實施例中，電路板加係設 置於發光模組202之-外側，並利用導線模組·以電性連接電 路板203及發光馳202。藉此，發光模組2〇2所產生之熱能，適 可直接經由導熱結構則向外傳導，而不會受到電路板加之阻 隔。 詳言之，在本實施例中之導熱結構2〇1較佳係包含一軟塾，當 魯光4美組2 0 2設置於軟勢卜祖，-r w 厂翌上時可增加光源總成200之整體平整 度，並使光源總成200更易盥豆仙松ζ ^^ 约他模組結合。此外，發光模組202 可包含複數個發光元件则，各發光元件較佳如發光二極 體’且發光二極體具有二電極2咖；導線模組綱包含複數條導 線204a ’導線模組204係藉由兮婪僧^ 错由4專導線2〇4a電性連接於該等電極 202a及電路板203，直中嗜笙道括w 導線204a可以是利用如焊接或是埶 壓等方式與該等電極2〇2a f彳±$& . . „ … 电丨王逑接。在此亚不限定該等發光元 202丨之連接方式，該等發光 件2021可以疋並聯、串聯或是部份 I360〇〇〇 並聯、部分串聯之方式連接，此領域 光元件202!之數量以及實際使用之％知識者可以根據發 接方式。 而s。整發光元件202丨之連 =财，光源總成2〇。更包含複數個散熱片 升放熱效果。該等散熱片2〇5分庫 置，且分別與該等發光元件则之㈣發光元件则設 片205可先與該等發光元件勘处入…^分相接觸。該等散熱 一同設置在導熱結構加上，或° ^寻發光元件则 設置在導熱結構加上，當該以先將該等散熱片- 結合時，係將該等發光元件之=:件2021與該導熱結構-μ L 寻&元凡件之發熱部分接觸於該等散熱片咖 。*領域具㈣常知财可財 限定該等散熱片2〇5之設置方式。H周整’本發明並不 總成2°°可更包含至少-膠材2°6,設置於— ;Χ=Γ2°2之間’用―一於該 ·，，、'，°構之千面2〇ia上。於本發明之苐—竇 散熱片205係間隔Μ豎於1邋献 ，材206與 ㈣魏構2〇1上，然本發明並不限定 ^寫之設置方式，爲簡化製程，膠材2〇6也可以是整面設置 ;以導熱結構201之平面2〇la上， 耸·％袖u > 丹肘忒寺發先兀件2021與該 根:實二設置在該膠材206上，此領域具有通常知識者可以 貫際而求调整膠材206之設置方式。 在第2B圖中，本發明之光源總成雇可更包含 電路板2〇3上’用以將外部訊號（圖未標示^ = 1360000 藉由本發明所揭露之光學總成_，發光模組2〇2所產生之熱能 適可直接經由該導熱結構2〇1向外 肖外傳導，而不需經過熱組抗係數 較高之電路板203，此不但可大φ5纩y血上 犬Μ細紐散熱途徑，且有效提升散熱 效果。此外，電路板203不再偈限於發光额2〇2之設置，可有 效減少電路板203之面積，亦可節省材料成本。 第3圖係為本發明之第-眘 弟一貫％例，如圖所示為本發明所提供之 背光模組300’較佳係為—種平面顯示器之背光模組。背光模組 扇包含金屬殼體30!以及如前述第一實施例所揭露之光源總成 _。金屬殼體具有底面3Gla以及至少—側邊纖，於本實施例 中，光源總成200係設置金屬殼體則之至少一側邊則^。光 源總成200之導熱結構2〇1(請一併參閱第仏圖所示）係實質上與 該金屬殼體3(M之至少-側邊鳩接觸；而電路板卿青一併參 閱第2B圖所示）則係設置於該發光模组2〇2之外側，且位於該金 屬殼體3(H i。藉此，發光模組2〇2所產生之熱能適可直接經由 導熱結構201 ’傳導至金屬殼體3〇卜進而向外發散。 藉由本發明所提供之背光模組300,發光模組加所產生之熱能 僅需經由導熱結構201以及金屬殼體3〇ι即可傳導至外界’且由匕 於導熱結構20丨與金屬殼體301皆具有良好之熱傳導係數，相較 於習知之光源組件結構，本發明所提供之f光模組剔不需經過 熱組抗係數較高之電路板，可大幅縮短散熱途徑且提升散熱效果。 第4圖係為本發明之第三實施例，如圖所示為本發明所揭露之 另一背光模、组400’背光模，组400包含金屬殼體4〇1以及如本發明 H施例之光源總成2〇〇。金屬殼體具有底面4〇ia以及至少 !0 1360000 一側邊401b，與本發明之第二實施例之背光模組300之差異在於 光源總成200係設置該金屬殼體401之至少一底面401 a上。其他 部分請參照第二實施例所述，在此不再贅述。 如同本發明之第二實施例所提供之背光模組3〇〇，藉由本發明所 提供之背光模組400亦可縮短散熱途徑且可提升散熱效果。'The familiar light-emitting components! In the middle, 'the light-emitting element 104 is generally used in the prior art, in order to increase the heat dissipation efficiency, the circuit board 1〇3 or the metal printed circuit board made of metal (for example, sho or steel) as the core ( C (10) State (4) Curry b〇ard, MCPCB); In addition, there is also a combination of the light-emitting element ι〇4 and the heat sink (therma丨heat_sink) in an attempt to accelerate the thermal energy of the light-emitting element 104 by utilizing the high thermal conductivity of the heat sink. Conducted to the board 丨〇3 to lower the temperature of the light-emitting elements 1〇4. However, since the thermal impedance of the board 丨03 itself is still too high, the improvement in the overall heat dissipation effect is still quite limited.匕卩 14 With the increase in the demand for redundancy, how to improve the heat dissipation effect of the light-emitting components, 1360000 > is an important issue that the industry is currently trying to solve. SUMMARY OF THE INVENTION One of the purposes of the invention is to provide a light source assembly and a backlight module, which can improve the heat dissipation effect by shortening the heat dissipation path of the accumulated thermal energy of the illuminating module. Another object of the present invention is to provide a light source assembly and a backlight module which are disposed on the outer side of the light-emitting module by a design change of the circuit board. Compared with the prior art, the circuit board is disposed at the bottom of the light-emitting module, and the design of the hair and the moon makes the heat-dissipating way of the light-emitting module not blocked by the circuit board, thereby improving the heat-dissipating effect. Another object of the present invention is to provide a light source assembly and a backlight module. Since the circuit board is disposed on the outer side of the light emitting module instead of being disposed on the heat dissipation path of the light emitting module, it is not necessary to consider the circuit board itself. The heat conduction function makes the material selection of the circuit board more flexible, which in turn can save costs. To achieve the above object, the present invention discloses a light source assembly comprising a heat conducting structure, a light emitting module, at least a circuit board, and a wire module. * », ,, ,,. The surface of the light-emitting module is disposed on the surface of the heat-conducting structure, and the circuit board is disposed outside one of the light-emitting modules, and electrically connected to the circuit board and the light-emitting module by using a wire module Therefore, the heat generated by the light-emitting module can be directly transmitted through the heat-conducting structure. The present invention further discloses a backlight module, which comprises a metal casing and a light source assembly. The assembly is disposed on the metal casing, and the light source assembly is a 'thermal structure, a light-emitting module, at least a circuit board and a wire module. · a heat-conducting structure, a solid f and the metal shell In the body contact, the heat conducting structure has a surface, and the Heiguang optical module is “on the surface of the heat conducting structure, and the circuit board is disposed on the outer side of the core light module, and is on the metal shell And using the wire module to electrically connect the 1360000 to the at least the circuit board and the light emitting module. Thereby, the heat generated by the light-emitting module can be directly transmitted to the metal casing via the heat-conducting structure. The objects of the present invention, as well as the technical means and embodiments of the present invention, will be apparent to those skilled in the art in view of the appended claims. [Embodiment] The first embodiment of the present invention is shown in Figs. 2A and 2B, and Fig. 2A is a side view of the light source assembly 2GG of the first embodiment of the present invention, and Fig. 2B is a native Mingdi- A top view of the light source assembly of the actual example. In this embodiment, the light source assembly 200 includes a heat conducting structure 2 (H, a light emitting module 2〇2, a circuit board 2〇3, and a wire module 204. The heat conducting structure 201 has a surface 2〇u, and the light emitting module 2〇2 That is, it is disposed on the surface 2 of the heat conducting member 201. In this embodiment, the circuit board is disposed on the outer side of the light emitting module 202, and electrically connected to the circuit board 203 and the light emitting diode 202 by using the wire module. Therefore, the heat energy generated by the light-emitting module 2〇2 can be directly transmitted through the heat-conducting structure without being blocked by the circuit board. In detail, the heat-conducting structure in the embodiment 2〇1 Preferably, the system includes a soft palate. When the Luguang 4 US group 2 0 2 is set on the soft potential Buzu, the -rw factory can increase the overall flatness of the light source assembly 200, and make the light source assembly 200 more easy to be used. In addition, the light-emitting module 202 can include a plurality of light-emitting elements, each of which is preferably a light-emitting diode and the light-emitting diode has two electrodes; The outline contains a plurality of wires 204a. The wire module 204 is electrically connected by 4 wires. The electrodes 202a and the circuit board 203 are connected to the electrodes 202a, and the wires 12a can be connected to the electrodes by means of soldering or rolling, etc. 2〇2a f彳±$& In this case, the connection mode of the light-emitting elements 202 is not limited, and the light-emitting elements 2021 can be connected in parallel, in series or in part by I360〇〇〇 in parallel and partially in series. The number of 202! and the actual use of the knowledge can be based on the way of sending. s. The whole illuminating element 202 连 = = 财, light source assembly 2 〇. Also contains a plurality of heat sinks to enhance the heat release effect. 2 〇 5 points of the library, and respectively with the illuminating elements, (4) illuminating elements, the 205 may be in contact with the illuminating elements. The heat is added together in the heat conducting structure, Or the illuminating element is disposed in the heat conducting structure, and when the heat sink is first combined, the light emitting element is: the member 2021 and the heat conducting structure - μ L 寻 & The heat-generating part of the piece is in contact with the heat sinks. * Fields (4) Common knowledge Cai Ke Cai limits the way in which these fins 2〇5 are set. H Weekly 'The invention does not have a total of 2°°, but may further contain at least - 2°6 of glue, set at — Χ=Γ2°2 'Using one' on the ·,,, ', ° 之 之 〇 〇 。 。 。 。 。 于 于 本 本 窦 窦 窦 窦 窦 窦 窦 窦 窦 窦 205 205 205 205 205 205 205 205 205 205 205 205 205 205 205 205 205 205 205 205 205 However, the present invention is not limited to the setting method of writing, in order to simplify the process, the rubber material 2〇6 may also be disposed on the whole surface; the plane of the heat conducting structure 201 is 2〇la, the towering·% sleeve u > The 忒 发 发 20 20 2021 and the root: the second is placed on the glue 206, in this field, the general knowledge can be adjusted to adjust the setting of the glue 206. In FIG. 2B, the light source assembly of the present invention may further include a circuit board 2'' for external signals (not shown ^=1360000 by the optical assembly disclosed by the present invention_, the light-emitting module 2 The heat energy generated by 〇2 can be directly transmitted to the outside through the heat conducting structure 2〇1 without passing through the circuit board 203 having a high thermal resistance coefficient, which can not only be large φ5纩y blood on the dog bar The heat dissipation path is effective, and the heat dissipation effect is effectively improved. In addition, the circuit board 203 is no longer limited to the setting of the light-emitting amount 2〇2, which can effectively reduce the area of the circuit board 203 and save material cost. FIG. 3 is the first embodiment of the present invention. - Shen Di has always been a case, as shown in the figure, the backlight module 300' provided by the present invention is preferably a backlight module of a flat display. The backlight module fan comprises a metal casing 30! The light source assembly disclosed in the embodiment has a bottom surface 3G1a and at least a side fiber. In the embodiment, the light source assembly 200 is provided with at least one side of the metal housing. 200 heat conduction structure 2〇1 (please refer to the figure at the same time) Substantially contacting the metal casing 3 (at least the side edge of the M; and the circuit board is shown in FIG. 2B) is disposed on the outer side of the light emitting module 2〇2 and located at the metal The housing 3 (H i ), whereby the thermal energy generated by the light-emitting module 2 〇 2 can be directly transmitted to the metal housing 3 via the heat-conducting structure 201 ′ to further diverge outward. The backlight module provided by the invention 300, the thermal energy generated by the illuminating module is only required to be transmitted to the outside through the heat conducting structure 201 and the metal casing 3 且, and since the heat conducting structure 20 丨 and the metal casing 301 have good heat transfer coefficients, the phase Compared with the conventional light source component structure, the f-light module provided by the invention does not need to pass through a circuit board with a high thermal resistance coefficient, which can greatly shorten the heat dissipation path and improve the heat dissipation effect. FIG. 4 is the first embodiment of the present invention. The third embodiment, as shown in the figure, is another backlight module, group 400' backlight module disclosed in the present invention. The group 400 comprises a metal casing 4〇1 and a light source assembly 2〇〇 according to the embodiment of the present invention. The housing has a bottom surface 4〇ia and at least !0 1360000 one side 401b The backlight assembly 300 of the second embodiment of the present invention is different in that the light source assembly 200 is disposed on at least one bottom surface 401 a of the metal housing 401. For other parts, please refer to the second embodiment, and no longer As the backlight module 3 provided in the second embodiment of the present invention, the backlight module 400 provided by the present invention can also shorten the heat dissipation path and improve the heat dissipation effect.
綜上所述’本發明所提供之光源總成2〇〇與背光模組3〇〇、4〇〇 等結構’將具有較高熱組抗之電路板3〇〇從散熱途徑中移除，改 設於發光模組202之外側，就發光模組202 i散熱而言，不但可 和百Μ散熱途徑，更有效提升散熱效果。此外，更由於電路板3〇〇 本身不須具備熱傳導之功能，故其材料選擇上具有更多之彈性， 且尺寸設計亦不受發光模組2〇2侷限，皆可達到節省成本之效果。 上述之實施例僅用來例舉本發明之實施態樣，以及闡粹本發明 之技術特徵’並非用來限制本發明之範，。任何熟悉此技術者可 輕易完成之改變或均等性之安排均屬於本發明所主張之範圍，本 發明之權利範圍應以申請專利範圍為準。In summary, the structure of the light source assembly 2〇〇 and the backlight module 3〇〇, 4〇〇, etc. provided by the present invention removes the circuit board 3 with high thermal resistance from the heat dissipation path. It is disposed on the outer side of the light-emitting module 202, and the heat-dissipating effect of the light-emitting module 202 i can not only improve the heat dissipation effect but also the heat dissipation path. In addition, since the circuit board 3〇〇 itself does not need to have the function of heat conduction, the material selection has more flexibility, and the size design is not limited by the light-emitting module 2〇2, and the cost-saving effect can be achieved. The above-described embodiments are merely illustrative of the embodiments of the present invention, and the technical features of the present invention are not intended to limit the scope of the present invention. Any change or singularity that can be easily accomplished by those skilled in the art is within the scope of the invention, and the scope of the invention should be determined by the scope of the patent application.
【圖式簡單說明】 第1圖係為習知之發光組件之側視圖； 第2Α圖係為本發明之第—實施例之側面示意圖 第2Β圖係為本發明之第-實施例之俯視圊； 第3圖係為本發明之第二實施例之立體圖；以及 第4圖係為本發明之笛_ 第二貫施例之立體圖。 【主要7C件付號說明】 1〇0 發光組件 1360000BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a conventional light-emitting component; FIG. 2 is a side view of a first embodiment of the present invention; FIG. 2 is a plan view of a first embodiment of the present invention; Figure 3 is a perspective view of a second embodiment of the present invention; and Figure 4 is a perspective view of a second embodiment of the present invention. [Main 7C payment instructions] 1〇0 lighting components 1360000
101 金屬殼體 102 導熱軟墊 103 電路板 104 發光元件 104a 第一電極 104b 第二電極 200 光源總成 201 導熱結構 201a 表面 202 發光模組 2021 發光元件 202a 電極 203 電路板 204 導線模組 204a 導線 205 散熱片 206 膠材 207 連接器 300 、 400 背光模組 301 、 401 金屬殼體 301a ' 401a 底面 301b ' 401b 側邊 (S ) 12101 metal housing 102 thermal pad 103 circuit board 104 light-emitting element 104a first electrode 104b second electrode 200 light source assembly 201 heat-conducting structure 201a surface 202 light-emitting module 2021 light-emitting element 202a electrode 203 circuit board 204 wire module 204a wire 205 Heat sink 206 glue 207 connector 300, 400 backlight module 301, 401 metal housing 301a ' 401a bottom surface 301b ' 401b side (S) 12