TWI354514B - Printed circuit board guiding fixture - Google Patents

Printed circuit board guiding fixture Download PDF

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Publication number
TWI354514B
TWI354514B TW97112272A TW97112272A TWI354514B TW I354514 B TWI354514 B TW I354514B TW 97112272 A TW97112272 A TW 97112272A TW 97112272 A TW97112272 A TW 97112272A TW I354514 B TWI354514 B TW I354514B
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TW
Taiwan
Prior art keywords
circuit board
plate
guiding
magnetic body
cover plate
Prior art date
Application number
TW97112272A
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Chinese (zh)
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TW200944074A (en
Inventor
shu-tao Li
Zhong-Gai Gu
Wen Chin Lee
Cheng Hsien Lin
Original Assignee
Zhen Ding Technology Co Ltd
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Application filed by Zhen Ding Technology Co Ltd filed Critical Zhen Ding Technology Co Ltd
Priority to TW97112272A priority Critical patent/TWI354514B/en
Publication of TW200944074A publication Critical patent/TW200944074A/en
Application granted granted Critical
Publication of TWI354514B publication Critical patent/TWI354514B/en

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  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

1100年08月25日 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明涉及電路板製作裝置技術領域,特別涉及一種電 路板引導治具。 【先前技術】 [0002] 柔性電路板(FI exible Printed Circui t Board, FPC)具有體積小’重量輕,可做立體組裝及動態可撓曲 等優點,被越來越廣泛之應用於各種可攜式電子產品中 ,特別係行動電話、數位相機、掌上電腦等輕薄之可檇 式電子產品。參見文獻Takao Yamazaki,Yoshimichi Sogawa, Rieka Yoshino, Keiichiro Kata,[Announcement of Invention] [Technical Field] [0001] The present invention relates to the field of circuit board manufacturing apparatuses, and in particular to a circuit board guiding fixture. [Previous Technology] [0002] The flexible board (FIC) has the advantages of small size, light weight, three-dimensional assembly and dynamic flexibility, and is widely used in various portable applications. Among the electronic products, it is especially a thin and light electronic product such as a mobile phone, a digital camera, and a palmtop computer. See the literature Takao Yamazaki, Yoshimichi Sogawa, Rieka Yoshino, Keiichiro Kata,

Ichiro Hazeyama, and Sakae Kitajo, Real ChipIchiro Hazeyama, and Sakae Kitajo, Real Chip

Size Three-Dimensional Stacked Package, IEEE Transactions on Advanced Packaging, 2005, 28(3), 397-403.Size Three-Dimensional Stacked Package, IEEE Transactions on Advanced Packaging, 2005, 28(3), 397-403.

[0003] 由於FPC薄且柔軟,端部易發生捲曲,因此於Fpc水平生 產製程中,通常將FPC用膠帶固定於引導治具,如剛性較 大之基板,然後將固定有Fpc之引導治具放置於水平傳送 裝置,使FPC可平整之經過水平傳送裝置,完成Fpc之水 平生產製程,從而防止FPC端部由於捲曲而卡入水平傳送 裝置之接口或縫隙處,5丨起產品報廢。惟,採用上述方 法氙作完畢FPC,需將5丨導治具及膠帶與Fpc剝離 。於剝 離過程tFPC易被壓傷或折損,而且還可能存在Fpc表面 之膠帶去除不完全’使得FPC表面存在殘膠,從而造成 產品良率下降。 表單蝙號A0101 第5頁/共21頁 1003312606-0 1354514 Γ____ 10ΰ年OS月2与日接正替換頁 【發明内容】 [0004]有鑑於此,提供一種電路板引導治異,以避免電路板被 壓傷或折損,以及表面殘膠之問題,從而提高產品良率 實屬必要。 [0005] 以下將以實施例說明一種電路板引導治具。 [0006] 一種電路板引導治具,其包括夾持部與引導部。該夾持 部包括承載板及與承載板相對應之蓋板。該承載板具有 承載面、底面、第一側面及第二側面。該承載面朝向該 蓋板,用於承載電珞板。該底面與該承載面相對。該第 丨 一侧面與第二側面相對且同時與該承載面及底面相接。 該承載板設有第一磁性體,該蓋板設有與第一磁性體相 對應之第二磁性體。失持部藉由第一磁性體與第二磁性 體之相互作用,將電路板夾持於承載板與蓋板之間。該 引導部與承載板之第二側面相連接,用於引導被夹持於 承載板與蓋板之間之電路板進行移動。該導引部具有相 對之第一側壁與第二側壁、以及相對之頂壁與底壁,該 第一侧壁與第二側壁均與該頂壁與底壁相連,該底壁與 底面共面,該導引部之高度大於或等於該承載板與蓋板 之厚度之和。 [0007] 〇97112272 與先前技術相比,該電路板引導治具藉由承載板之第一 磁性體與蓋板之第二磁性體之間之相互作用力,將電路 板平整地固定於承載板與蓋板之間,另外,引導部避免 蓋板相對承載板移動》夹持部與引導部之配合使電路板 順利經過水平傳送裝置,避免由於剝離電路板與5丨導治 具,所引起之電路板被壓傷或折損,以及表面殘膠之問 表單編號A0101 第6頁/共21頁 1〇〇33126〇6-〇 1354514 [0008] [0009] 100年08月25日接正替換頁 題,從而提高產品良率。 【實施方式】 下面將對本技術方案複數實施例提供之電路板引導治具 作進一步詳細說明。 請參閱圖1至圖4,本技術方案第一實施例提供之電路板 引導治具10包括夹持部110與設置於夾持部110之引導部 120 ° [0010][0003] Since the FPC is thin and soft, the end portion is prone to curling. Therefore, in the Fpc horizontal production process, the FPC is usually taped to a guiding jig, such as a rigid substrate, and then the Fpc guiding fixture is fixed. Placed on the horizontal transfer device, the FPC can be leveled through the horizontal transfer device to complete the horizontal production process of the FPC, thereby preventing the FPC end from being caught in the interface or gap of the horizontal transfer device due to curling, and the product is scrapped. However, if the FPC is completed by the above method, the 5 丨 guiding fixture and tape should be peeled off from the FPC. During the stripping process, tFPC is easily crushed or broken, and there may be incomplete removal of the tape on the Fpc surface, which causes residual glue on the surface of the FPC, resulting in a decrease in product yield. Form bat number A0101 Page 5 / 21 pages 1003312606-0 1354514 Γ ____ 10 years of the year OS 2 and the day of the replacement page [invention] [0004] In view of this, provide a circuit board guidance to avoid the circuit board It is necessary to increase the yield of the product by being crushed or damaged, as well as the problem of surface residue. [0005] A circuit board guiding jig will be described below by way of example. [0006] A circuit board guiding jig includes a clamping portion and a guiding portion. The clamping portion includes a carrier plate and a cover plate corresponding to the carrier plate. The carrier plate has a bearing surface, a bottom surface, a first side surface and a second side surface. The bearing surface faces the cover plate for carrying the electric raft. The bottom surface is opposite the bearing surface. The first side of the first side is opposite to the second side and simultaneously meets the bearing surface and the bottom surface. The carrier plate is provided with a first magnetic body, and the cover plate is provided with a second magnetic body corresponding to the first magnetic body. The missing portion sandwiches the circuit board between the carrier plate and the cover plate by the interaction of the first magnetic body and the second magnetic body. The guiding portion is coupled to the second side of the carrier plate for guiding the circuit board held between the carrier plate and the cover plate to move. The guiding portion has opposite first and second side walls, and opposite top and bottom walls, wherein the first side wall and the second side wall are connected to the top wall and the bottom wall, and the bottom wall is coplanar with the bottom surface The height of the guiding portion is greater than or equal to the sum of the thicknesses of the carrier plate and the cover plate. [0007] 〇97112272 Compared with the prior art, the circuit board guiding fixture fixes the circuit board flatly on the carrier board by the interaction force between the first magnetic body of the carrier plate and the second magnetic body of the cover plate Between the cover plate and the cover plate, in addition, the guide portion prevents the cover plate from moving relative to the carrier plate. The cooperation between the clamping portion and the guiding portion allows the circuit board to smoothly pass through the horizontal conveying device, thereby avoiding the peeling of the circuit board and the 5 丨 guiding tool. The circuit board is crushed or damaged, and the surface residue is in the form No. A0101 Page 6 / 21 pages 1〇〇33126〇6-〇1354514 [0008] [0009] 100 years on August 25, the replacement page title , thereby improving product yield. [Embodiment] The circuit board guiding jig provided in the plural embodiments of the present technical solution will be further described in detail below. Referring to FIG. 1 to FIG. 4, the circuit board guiding fixture 10 according to the first embodiment of the present invention includes a clamping portion 110 and a guiding portion disposed on the clamping portion 110. [0010]

該夾持部11〇包括承載板ill及與承載板ηι相對應之蓋 板112’用於將電路板夾持於承載板與蓋板112之間 。承載板111之尺寸、形狀均與蓋板112之尺寸、形狀相 對應’其具體尺寸、形狀與電路板之尺寸、形狀相配合 為宜,以便夾持電路板《本實施例中,承載板丨丨丨與蓋板 112均為長方體,且承載板1U與蓋板112之尺寸相同。 該承載板111具有承載面1111、底面1112、第一侧面 1113及第二側面1Π7。該承載面mi朝向蓋板112,用 於放置電路板。該底面1112與承載面liii相對》該第一 側面1113與第二侧面111 7相對’且同時與承載面1111及 底面1112相接》 [0011] 該承載板111設有第一磁性體Π14。該第一磁性體1114 可為磁鐵,亦可為鐵、鈷、鎳及其合金或化合物等可被 磁鐵吸引之材料。請參閱圖2,本實施例中,第一磁性體 1114為一與承載板11 i之尺寸、形狀相同之片狀磁鐵,其 内喪於承載板111内,即第一磁性體1114嵌設於承載面 1111及底面1112之間。 097112272 表單編號A0101 第7頁/共21頁 1003312606-0 1354514 [0012]當然,第一磁性體1114之尺寸不限,其亦可小於承载板 111之尺寸。第一磁性體1114之形狀不限,其可為塊狀、 枉狀或其他形狀之磁性體。第一磁性體1114之位置不限 ,除可内嵌於承載板111以外,還可固定於承載板111之 承載面1111上。另外’可根據夾持需要,於承載板lu設 置一或複數個第一磁性體1114,從而達到相同之夾持效 果。 [0013] 該承載板111開設第一凹槽1116。第一凹槽1116自第一The clamping portion 11A includes a carrier plate ill and a cover plate 112' corresponding to the carrier plate ηι for clamping the circuit board between the carrier plate and the cover plate 112. The size and shape of the carrier plate 111 correspond to the size and shape of the cover plate 112. The specific size and shape of the carrier plate 111 are matched with the size and shape of the circuit board, so as to clamp the circuit board. In this embodiment, the carrier plate 丨Both the cymbal and the cover plate 112 are rectangular parallelepiped, and the carrier plate 1U is the same size as the cover plate 112. The carrier plate 111 has a bearing surface 1111, a bottom surface 1112, a first side surface 1113, and a second side surface 1Π7. The bearing surface mi faces the cover plate 112 for placing the circuit board. The bottom surface 1112 is opposite to the bearing surface liii. The first side surface 1113 and the second side surface 111 7 are opposite each other and are simultaneously connected to the bearing surface 1111 and the bottom surface 1112. [0011] The carrier plate 111 is provided with a first magnetic body Π14. The first magnetic body 1114 may be a magnet, or may be a material that can be attracted by a magnet such as iron, cobalt, nickel, an alloy thereof, or a compound. Referring to FIG. 2, in the embodiment, the first magnetic body 1114 is a chip magnet having the same size and shape as the carrier plate 11 i, and is buried in the carrier plate 111, that is, the first magnetic body 1114 is embedded in Between the bearing surface 1111 and the bottom surface 1112. 097112272 Form No. A0101 Page 7 of 21 1003312606-0 1354514 [0012] Of course, the size of the first magnetic body 1114 is not limited, and may be smaller than the size of the carrier plate 111. The shape of the first magnetic body 1114 is not limited, and it may be a magnetic body of a block shape, a braid shape or the like. The position of the first magnetic body 1114 is not limited, and may be fixed to the bearing surface 1111 of the carrier plate 111 in addition to being embedded in the carrier plate 111. In addition, one or a plurality of first magnetic bodies 1114 may be disposed on the carrier plate lu according to the clamping requirements, thereby achieving the same clamping effect. [0013] The carrier plate 111 defines a first recess 1116. The first groove 1116 is from the first

側面1113向承載板111内部開設,並貫穿承載面mi與 底面1112,從而可露出放置於承載板丨π之電路板之線路 部分。第一凹槽1116之形狀及於承載板111之開設位置可 根據實際電路板設計而決定9本實施例中,第一凹槽 1116為長方體凹槽’自第一側面1113中部向承載板111 内部開設。當然,該承載板111亦可不開設第一凹槽1116 ,僅需使用時將電路板之邊緣放置於承載面1111,以使 電路板之線路不被遮蓋即可。 [0014] 為方便定位並固定電路板及蓋板112,承載板111設置有 定位件1115。本實施例中,承載板111上設置有兩個圓柱 形之定位件1115。兩個定位件111 5分別設置於第一凹槽 1116之相對兩侧之承載板111上,並自承載面1111向蓋 板112方向延伸,從而可將電路板平整之固定於承載板 111。該定位件1115之數量、大小及位置可根據實際生產 中之電路板設計而定。當然,承載板111亦可不設置定位 件1115,只要使電路板可準確平整地放置於承載板111上 即可。 097112272 表單編號A0101 第8頁/共21頁 1003312606-0 1354514 100年08月25日梭正替換頁 [0015] 該蓋板11 2用於與承載板111配合,以夾持電路板。蓋板 112具有夾持面1121、與夹持面1121相對之頂面1122、 與引導部120相對之第三側面1123及與第三側面1123相 對之第四側面1124 »夾持面1121與承載面1111對應配合 ,用於與電路板接觸。該第三側面11 23及第四側面1124 分別與夾持面1121及頂面1122相接。蓋板112設置有第 • [0016] 二磁性體1125,從而承載板111與蓋板112藉由第一磁性 體1114與第二磁性體1125之相互吸引力,將電路板固定 夾持於承載面1111與夾持面1121之間。 該第二磁性體1125與承載板111之第一磁性體1114相對 應。以便第一磁性體1114與第二磁性體1125具有相互吸 引之作用力。即,第一磁性體1114為磁鐵時,第二磁形 體1125可為磁鐵,亦可為鐵、鈷、鎳及其合金或化合物 等可被磁鐵吸引之材料。當第一磁性體1114為鐵、鉛、 鎳及其合金或化合物等可被磁鐵吸引之材料時,第二磁 形體1125為磁鐵。本實施例中’第一磁性體1丨丨4為磁鐵 • ’相應地第二磁形體1125為磁鐵或鐵、鈷、鎳及其合金 或化合物等可被磁鐵吸引之材料β另外,第二磁性體 1125之形狀、數量以及設置位置亦與第一磁性體1114相 對應,即第二磁性體1125為尺寸與蓋板112相同之片體, 其内嵌於夾持面1121與頂面1122之間或者固定於夾持面 im。 [0017] 5玄蓋板112還開設有與第一凹槽1116對應之第二凹槽 1126,以保證電路板之線路部分不被遮蓋,第二凹槽 11 26與第一凹槽π 16形狀相同、開設位置相互對應。本 097112272 表單編號A0101 第9頁/共21頁 1003312606-0 1354514 ioo年08另25自核正替被茛 實施例中,第二凹槽11 26自第四側面1124向蓋板112内. 部開設’貫穿夹持面1121與頂面1122。當然,根據電路 板兩面線路分佈之不同,第二凹槽1126亦可開設於其他 位置。甚至當電路板僅具有單面線路時,亦可不開設第 一凹槽1116 » [0018] 另外,蓋板112可開設有與定位件1115相對應之通孔 1127 ’以供定位件1115穿過,從而通孔1127可與定位件 1115配合定位蓋板112 » [0019] 從而’承載板111與蓋板112可藉由定位件ιι15與通孔 1127相配合實現定位固定,並藉由第一磁性體“Μ與第 二磁性體1125之相互作用力將電路板夾持於承載面丨丨i j 與夾持面1121之間。 [0020] 該引導部120連接於承載板ill之第二側面,用於引 導被夹持部11 〇夾持之電路板進行水平運動。該引導部 120可藉由焊接、黏膠、一體成型或其他連接方式與承載 板111連接。本實施例中,引導部12〇為長方體,其藉由 黏膠與承載板111連接。該引導部丨2〇具有第一側壁121 、第二側壁123、頂壁122及底壁124。該第一側壁121與 第二側壁123相對,且均與第一側面1113平行。該頂壁 122與底壁124相對。底壁124與底面1112共面》優選地 ,該引導部120之高度大於或等於承載板1U與蓋板112 之厚度之和,使蓋板112之第二側面1123可完全抵靠於第 一側壁121。本實施例中,弓丨導部12G之高度大於承載板 與蓋板112之厚度之和。 097112272 表單編號A0101 第10頁/共21頁 1003312606-0 1354514 100年08月25日梭正替换頁 ,可先將電路 [0021] 使用本實施例提供之電路板引導治具1〇時 板放置於承載板111之承載面1111,使定位件1115穿過 電路板之定位孔。其次,使蓋板112之夾持面1121朝向電 路板’第三側面1123與引導部120之第一側壁121相對, 將定位件1115穿入蓋板112之通孔1127,從而將蓋板112 玫置於電路板上,並使第三側面1123與第一側壁121相接 觸。從而,電路板於承載板111之第一磁性體1114與蓋板 112之第二磁性體1125之間相互吸引力之作用下,可被平 整之夾持於承載板111與蓋板112之間,並最後於引導部 ® 120之帶動下經過水平傳送裝置。由於蓋板112抵靠於引 導部120,因此蓋板112不會相對於承載板111產生移動 ,保證電路板於傳送過程中之平整性與穩定性。 [0022] 電路板引導治具之寬度為60mm至250mm。相應地,該引 導部120之高度可小於或等於2〇ram。承載板111之寬度可 為20mm至60mm 。 [0023] 優選地,電路板引導治具1〇之材料為耐酸域之塑膠,如 • 聚丙烯、聚氣乙烯等,以免被具有酸鹼性之溶液(如顯 影液、蝕刻液等)腐蝕損傷。當然,電路板引導治具10 亦可採用性能穩定之金屬或其他材料。 [0024] 請參閱圖3,本技術方案第二實施例提供之電路板引導治 具20與第一實施例中之電路板引導治具1〇大致相同,其 區別在於承載板2Π與引導部220 —體成型,且第一凹槽 211 6自第一側面2113、第一側壁221分別向承載板211與 引導部220内部延伸’並貫穿承載板211與引導部220 » 即,第一凹槽2116貫穿承載板211之承載面2111與底面 097112272 表單編號 A0101 第 1丨頁/共 21 頁 1003312606-0 1354514 ioo年08月25日梭正眷換頁 2112,並貫穿引導部220之頂壁222及底壁224,從而可 方便地藉由第一凹槽2116自引導部220—側從承載板211 上移取蓋板212。當然,該第一凹槽2116亦可不貫穿引導 部220之底壁224,即,於引導部220部分之第一凹槽 2116之深度小於引導部220之高度。The side surface 1113 is opened to the inside of the carrier plate 111 and penetrates the bearing surface mi and the bottom surface 1112 so as to expose the line portion of the circuit board placed on the carrier board 丨π. The shape of the first recess 1116 and the position of the carrying plate 111 can be determined according to the actual circuit board design. In the present embodiment, the first recess 1116 is a rectangular parallelepiped groove 'from the middle of the first side 1113 toward the inside of the carrying board 111. open. Of course, the carrier plate 111 may not have the first recess 1116. The edge of the circuit board is placed on the bearing surface 1111 only when the board is used, so that the circuit board is not covered. [0014] In order to facilitate positioning and fixing the circuit board and the cover 112, the carrier plate 111 is provided with a positioning member 1115. In this embodiment, the carrier plate 111 is provided with two cylindrical positioning members 1115. The two positioning members 111 5 are respectively disposed on the opposite side of the first recess 1116 and extend from the bearing surface 1111 toward the cover 112 so that the circuit board can be flatly fixed to the carrier 111. The number, size and position of the positioning members 1115 can be determined according to the circuit board design in actual production. Of course, the carrier plate 111 may not be provided with the positioning member 1115 as long as the circuit board can be accurately placed on the carrier plate 111. 097112272 Form No. A0101 Page 8 of 21 1003312606-0 1354514 August 25, 2014 Shuttle Replacement Page [0015] The cover plate 11 2 is used to cooperate with the carrier plate 111 to clamp the circuit board. The cover plate 112 has a clamping surface 1121, a top surface 1122 opposite to the clamping surface 1121, a third side surface 1123 opposite to the guiding portion 120, and a fourth side surface 1124 opposite to the third side surface 1123. The clamping surface 1121 and the bearing surface The 1111 is matched for use in contact with the board. The third side surface 11 23 and the fourth side surface 1124 are in contact with the clamping surface 1121 and the top surface 1122, respectively. The cover plate 112 is provided with a second magnetic body 1125, so that the carrier plate 111 and the cover plate 112 are fixedly clamped to the bearing surface by the mutual attraction between the first magnetic body 1114 and the second magnetic body 1125. 1111 is between the clamping surface 1121. The second magnetic body 1125 corresponds to the first magnetic body 1114 of the carrier plate 111. Therefore, the first magnetic body 1114 and the second magnetic body 1125 have a mutual attraction force. That is, when the first magnetic body 1114 is a magnet, the second magnetic body 1125 may be a magnet, or may be a material that can be attracted by a magnet such as iron, cobalt, nickel, an alloy thereof or a compound. When the first magnetic body 1114 is a material which can be attracted by a magnet such as iron, lead, nickel, an alloy thereof or a compound, the second magnetic body 1125 is a magnet. In the present embodiment, the first magnetic body 1丨丨4 is a magnet. 'The second magnetic body 1125 is a magnet or a material that can be attracted by a magnet such as iron, cobalt, nickel, an alloy or a compound thereof. The shape, the number, and the position of the body 1125 also correspond to the first magnetic body 1114. That is, the second magnetic body 1125 is the same size as the cover plate 112, and is embedded between the clamping surface 1121 and the top surface 1122. Or fixed to the clamping surface im. [0017] The fifth cover 112 is further provided with a second recess 1126 corresponding to the first recess 1116 to ensure that the circuit portion of the circuit board is not covered, and the second recess 11 26 and the first recess π 16 shape The same and the opening positions correspond to each other. This 097112272 Form No. A0101 Page 9/Total 21 Page 1003312606-0 1354514 ioo Year 08 Another 25 self-nuclear replacement for the bedding embodiment, the second groove 11 26 is opened from the fourth side 1124 to the cover 112. 'through the clamping surface 1121 and the top surface 1122. Of course, the second recess 1126 can be opened at other locations depending on the distribution of the lines on both sides of the board. Even when the circuit board has only a single-sided line, the first recess 1116 may not be opened. [0018] In addition, the cover 112 may be provided with a through hole 1127 ′ corresponding to the positioning member 1115 for the positioning member 1115 to pass through. Therefore, the through hole 1127 can cooperate with the positioning member 1115 to position the cover plate 112. [0019] Thus, the carrier plate 111 and the cover plate 112 can be positioned and fixed by the positioning member ι15 and the through hole 1127, and the first magnetic body is supported by the first magnetic body. The interaction force between the crucible and the second magnetic body 1125 clamps the circuit board between the bearing surface 丨丨ij and the clamping surface 1121. [0020] The guiding portion 120 is coupled to the second side of the carrier plate ill for The circuit board held by the clamping portion 11 is guided to perform horizontal movement. The guiding portion 120 can be connected to the carrier plate 111 by welding, adhesive, integral molding or other connection. In the embodiment, the guiding portion 12 is The rectangular parallelepiped is connected to the carrier plate 111 by an adhesive. The guiding portion 〇2 has a first side wall 121, a second side wall 123, a top wall 122 and a bottom wall 124. The first side wall 121 is opposite to the second side wall 123. And both are parallel to the first side 1113. The top wall 122 and the bottom 124. The bottom wall 124 is coplanar with the bottom surface 1112. Preferably, the height of the guiding portion 120 is greater than or equal to the sum of the thicknesses of the carrier plate 1U and the cover plate 112, so that the second side surface 1123 of the cover plate 112 can completely abut The first side wall 121. In this embodiment, the height of the bow guide 12G is greater than the sum of the thickness of the carrier plate and the cover 112. 097112272 Form No. A0101 Page 10 of 21 1003312606-0 1354514 August 25, 100 The shuttle is replacing the page, and the circuit can be first placed on the bearing surface 1111 of the carrier board 111 by using the circuit board guiding fixture provided in this embodiment, so that the positioning member 1115 passes through the positioning hole of the circuit board. The clamping surface 1121 of the cover 112 is opposite to the first side wall 121 of the guiding portion 120 toward the third side 1123 of the circuit board, and the positioning member 1115 is inserted into the through hole 1127 of the cover 112, thereby placing the cover 112 On the circuit board, the third side surface 1123 is in contact with the first side wall 121. Thus, the circuit board acts on the mutual attraction between the first magnetic body 1114 of the carrier plate 111 and the second magnetic body 1125 of the cover plate 112. The bottom plate can be clamped to the carrier plate 111 and the cover plate 112. And finally, the horizontal conveying device is driven by the guiding portion 120. Since the cover plate 112 abuts against the guiding portion 120, the cover plate 112 does not move relative to the carrier plate 111, ensuring that the circuit board is in the process of transmission. Flatness and Stability [0022] The width of the board guiding jig is 60 mm to 250 mm. Accordingly, the height of the guiding portion 120 may be less than or equal to 2 ram. The carrier plate 111 may have a width of 20 mm to 60 mm. [0023] Preferably, the material of the circuit board guiding fixture 1 is an acid-resistant plastic, such as polypropylene, polyethylene, etc., so as not to be corroded by an acid-alkaline solution (such as a developing solution, an etching solution, etc.). . Of course, the board guiding fixture 10 can also be made of metal or other materials with stable performance. Referring to FIG. 3, the circuit board guiding jig 20 provided in the second embodiment of the present invention is substantially the same as the circuit board guiding jig 1 in the first embodiment, and the difference is that the carrying board 2 and the guiding portion 220 are different. The body is formed, and the first groove 2116 extends from the first side surface 2113 and the first side wall 221 to the inside of the carrier plate 211 and the guiding portion 220 respectively and penetrates the carrier plate 211 and the guiding portion 220. That is, the first groove 2116 Carrying surface 2111 and bottom surface 097112272 penetrating the carrying plate 211 Form No. A0101 Page 1 / 21 pages 1003312606-0 1354514 Io year of the 25th page of the shuttle page 2112, and through the top wall 222 and the bottom wall of the guiding portion 220 224, so that the cover 212 can be easily removed from the carrying plate 211 from the guiding portion 220 side by the first recess 2116. Of course, the first recess 2116 may not penetrate the bottom wall 224 of the guiding portion 220, that is, the depth of the first recess 2116 at the portion of the guiding portion 220 is smaller than the height of the guiding portion 220.

[0025] 請參閱圖4,本技術方案第三實施例提供之電路板引導治 具30與第一實施例中之電路板引導治具1〇大致相同,其 區別在於承載板311與引導部320相接處開設取板孔330 ,且取板孔330未與第一凹槽3116相連通,其自承載面 3111與頂壁322分別向承載板311與引導部320内部延伸 ,即向底面3112、底壁324方向延伸,用於藉由取板孔 330取下蓋板312。取板孔330可貫穿承載板311之底面 2112與引導部320之底壁324或者不貫穿承載板311之底 面2112與引導部320之底壁324。工作人員可方便地藉由 取板孔330自承載板311取下蓋板312 » [0026] 請參閱圖5,本技術方案第四實施例提供之電路板引導治 具40與第一實施例中之電路板引導治具10大致相同,其 區別在於第一磁性體4114固定於承載板411之承載面 4111,第二磁性體4125固定於夾持面4121。 [0027] 綜上所述,本發明確已符合發明專利之要件,遂依法提 出專利申請。惟,以上所述者僅為本發明之較佳實施方 式,自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ,皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 1003312606-0 097112272 表單編蚝Α0101 第12頁/共21頁 1354514 100年08月25日修正替換頁 [0028] 圖1係本技術方案第一實施例提供之電路板引導治具立體 分解圖。 [0029] 圖2係本技術方案第一實施例提供之電路板引導治具之剖 面圖。 [0030] 圖3係本技術方案第二實施例提供之電路板引導治具之立 體分解圖。 [0031] 圖4係本技術方案第三實施例提供之電路板引導治具之立 體分解圖。[0025] Referring to FIG. 4, the circuit board guiding jig 30 provided by the third embodiment of the present invention is substantially the same as the circuit board guiding jig 1 of the first embodiment, and the difference is that the carrying board 311 and the guiding part 320 are different. The plate hole 330 is opened at the junction, and the plate hole 330 is not in communication with the first groove 3116. The self-supporting surface 3111 and the top wall 322 respectively extend toward the inside of the carrier plate 311 and the guiding portion 320, that is, the bottom surface 3132. The bottom wall 324 extends in the direction of the cover plate 312 by taking the plate hole 330. The plate hole 330 can extend through the bottom surface 2112 of the carrier plate 311 and the bottom wall 324 of the guiding portion 320 or the bottom surface 2112 of the carrier plate 311 and the bottom wall 324 of the guiding portion 320. The cover plate 312 can be easily removed from the carrier 311 by the plate hole 330. [0026] Referring to FIG. 5, the circuit board guiding fixture 40 according to the fourth embodiment of the present invention is the same as the first embodiment. The circuit board guiding jig 10 is substantially the same, except that the first magnetic body 4114 is fixed to the bearing surface 4111 of the carrier plate 411, and the second magnetic body 4125 is fixed to the clamping surface 4121. [0027] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. [Simple description of the drawing] 1003312606-0 097112272 Form Compilation 0101 Page 12/Total 21 Page 1354514 Correction Replacement Page of August 25, 100 [0028] FIG. 1 is a circuit board guiding treatment provided by the first embodiment of the present technical solution. With a stereo exploded view. 2 is a cross-sectional view showing a circuit board guiding jig provided by the first embodiment of the present technical solution. 3 is a perspective exploded view of a circuit board guiding jig provided by a second embodiment of the present technical solution. [0030] FIG. 4 is a perspective exploded view of a circuit board guiding jig provided by a third embodiment of the present technical solution.

[0032] 圖5係本技術方案第四實施例提供之電路板引導治具之剖 面圖。 【主要元件符號說明】 [0033] 電路板引導治具:10、20、30、40 [0034] 夾持部:110 [0035] 承載板:111、211、311、4115 is a cross-sectional view of a circuit board guiding jig provided by a fourth embodiment of the present technical solution. [Main component symbol description] [0033] Circuit board guiding jig: 10, 20, 30, 40 [0034] Clamping portion: 110 [0035] Carrier plate: 111, 211, 311, 411

[0036] 承載面:1111、2111、3111、4111 [0037] 底面:1112、2112、3112 [0038] 第一側面:111 3、211 3 [0039] 第一磁性體:1114、4114 [0040] 定位件:1115 [0041] 第一凹槽:1116、2116、3116 [0042] 第二側面:1117 097112272 表單編號A0101 第13頁/共21頁 1003312606-0 1354514 100年08月25日梭正替換頁 [0043] 蓋板:112、212、312 [0044] 夾持面:1121 [0045] 頂面:1122 [0046] 第三側面:1123 [0047] 第四侧面:1124 [0048] 第二磁性體:1125 [0049] 第二凹槽:1126 [0050] 通孔:1127 [0051] 引導部:120、220、320 [0052] 第一侧壁:121、221 [0053] 頂壁:122、222、322 [0054] 第二側壁:123 [0055] 底壁:124、224、324 [0056] 取板孔:330[0036] bearing surface: 1111, 2111, 3111, 4111 [0037] bottom surface: 1112, 2112, 3112 [0038] first side: 111 3, 211 3 [0039] first magnetic body: 1114, 4114 [0040] positioning Item: 1115 [0041] First groove: 1116, 2116, 3116 [0042] Second side: 1117 097112272 Form number A0101 Page 13 / Total 21 page 1003312606-0 1354514 100 years of August 25 Shuttle replacement page [ 0043] Cover: 112, 212, 312 [0044] Clamping surface: 1121 [0045] Top surface: 1122 [0046] Third side: 1123 [0047] Fourth side: 1124 [0048] Second magnetic body: 1125 [0049] Second groove: 1126 [0050] Through hole: 1127 [0051] Guide portion: 120, 220, 320 [0052] First side wall: 121, 221 [0053] Top wall: 122, 222, 322 [ 0054] Second side wall: 123 [0055] Bottom wall: 124, 224, 324 [0056] Take the hole: 330

097112272 表單編號A0101 第14頁/共21頁 1003312606-0097112272 Form No. A0101 Page 14 of 21 1003312606-0

Claims (1)

1354514 100年08月25日修正替換頁 七、申請專利範圍: 1 . 一種電路板引導治具’其改進在於,其包括夹持部與引導 部,該夾持部包括承載板及與承載板相對應之蓋板’該承 載板具有承載面、底面、第一側面及第二側面’該承載面 朝向該蓋板,用於承載電路板,該底面與該承載面相對, 該第一側面與第二側面相對且同時與該承載面及底面相接 ,該承載板設有第一磁性體,該蓋板設有與第一磁性體相 對應之第二磁性體,從而夾持部藉由第—磁性體與第二磁 性體之相互作用’將電路板夹持於承載板與蓋板之間,·該 引導部與承載板之第二側面相連接,用於引導被夾持於承 載板與蓋板之間之電路板進行移動,該導引部具有相對之 第一側壁與第二側壁、以及相對之頂壁與底壁,該第一侧 壁與第二側壁均與該頂壁與底壁相連,該底壁與底面共面 ,該導引部之高度大於或等於該承載板與蓋板之厚度之和 〇 2 .如申請專利範圍第1項所述之電路板引導治具,其中,該 電路板引導治具採用耐酸鹼之塑膠製成。 3 .如申請專利範圍第1項所述之電路板引導治具,其中,該 該蓋板具有夾持面及與夾持面相對之頂面,承載面與夾持 面用於與電路板接觸。 4 .如申請專利範圍第3項所述之電路板引導治具,其中,該 第一磁性體内嵌於承載面與底面之間或固設於承載面,該 第二磁性體内嵌於夾持面與頂面之間或放置於夾持面。 5 ·如申請專利範圍第1項所述之電路板引導治具,其中,該 第—磁性體為磁鐵,該第二磁性體為鐵磁材料。 097112272 表單編號A0101 第15頁/共21頁 1003312606-0 1354514 ίοο年08月25日 如申請專利範圍第1項所述之電路板引導治具,其中,讀 第一磁性體為鐵磁材料,該第二磁性體為磁鐵。 如申請專利範圍第1項所述之電路板引導治具,其中,讀 承載板開設第一凹槽,該第一凹槽自第一側面向承載板内 部延伸’並貫穿底面與承載面,以露出放置於承載板之電 路板之線路部分。 8 .如申請專利範園第7項所述之電路板引導治具,其中,該 蓋板開設與該第一凹槽位置相對應之第二凹槽,該第二凹 槽之形狀與該第一凹槽相同。 9 .如申請專利範圍第7項所述之電路板引導治具,其中’讀 第一凹槽向承載板内延伸至與承載板相連之引導部内,並 貫穿引導部之底壁與頂壁,用於藉由第一凹槽自引導部一 側從承載板上移取蓋板。 10 .如申請專利範圍第7項所述之電路板引導治具’其中’該 承載板與引導部相接處開設取板孔,用於藉由取板孔取下 蓋板,該承載板具有承載面,該引導部具有頂璧’該取板 孔自承載面與頂壁分別向承載板與引導部内部延伸’用於 藉由取板孔自引導部一側從承載板上移取蓋板。 11 .如申請專利範圍第1項所述之電路板引導治具,其中,該 承載板具有定位件,該定位件自承載板向蓋板方向延伸, 該蓋板開設有與定位件相配合之通孔,從而藉由定位件與 通孔之配合定位固持承載板與蓋板。 097112272 表單編號Α0101 第16頁/共21頁 1003312606-01354514 Correction and replacement page on August 25, 100. Patent application scope: 1. A circuit board guiding fixture is improved in that it comprises a clamping portion and a guiding portion, the clamping portion comprising a carrier plate and a carrier plate Corresponding cover plate, the carrier plate has a bearing surface, a bottom surface, a first side surface and a second side surface. The bearing surface faces the cover plate for carrying a circuit board, the bottom surface is opposite to the bearing surface, the first side and the first side The two sides are opposite to each other and are simultaneously connected to the bearing surface and the bottom surface. The carrier plate is provided with a first magnetic body, and the cover plate is provided with a second magnetic body corresponding to the first magnetic body, so that the clamping portion is The interaction between the magnetic body and the second magnetic body 'clamps the circuit board between the carrier plate and the cover plate. · The guiding portion is connected to the second side surface of the carrier plate for guiding and being clamped on the carrier plate and the cover plate The circuit board between the boards is moved, the guiding portion has opposite first and second side walls, and opposite top and bottom walls, the first side wall and the second side wall are opposite to the top wall and the bottom wall Connected, the bottom wall is coplanar with the bottom surface The height of the guiding portion is greater than or equal to the sum of the thicknesses of the carrying plate and the cover plate. The circuit board guiding jig according to claim 1, wherein the circuit board guiding jig adopts acid resistance. Made of alkali plastic. 3. The circuit board guiding jig according to claim 1, wherein the cover has a clamping surface and a top surface opposite to the clamping surface, and the bearing surface and the clamping surface are for contacting the circuit board. . 4. The circuit board guiding jig according to claim 3, wherein the first magnetic body is embedded between the bearing surface and the bottom surface or is fixed on the bearing surface, and the second magnetic body is embedded in the clip. Between the holding surface and the top surface or on the clamping surface. The circuit board guiding jig according to claim 1, wherein the first magnetic body is a magnet and the second magnetic body is a ferromagnetic material. 097112272 Form No. A0101, page 15 of 21, 1003312606-0, 1354514, the circuit board guiding jig of claim 1, wherein the first magnetic body is a ferromagnetic material, The second magnetic body is a magnet. The circuit board guiding jig according to claim 1, wherein the reading carrier plate defines a first recess, the first recess extends from the first side toward the inside of the carrying board and penetrates the bottom surface and the carrying surface to The line portion of the circuit board placed on the carrier board is exposed. 8. The circuit board guiding jig according to claim 7, wherein the cover plate defines a second groove corresponding to the first groove position, and the shape of the second groove is different from the first groove One groove is the same. 9. The circuit board guiding jig according to claim 7, wherein the reading first groove extends into the guiding portion of the carrier plate and is connected to the bottom wall and the top wall of the guiding portion, The cover plate is used to remove the cover plate from the carrier plate from the side of the guide by the first groove. 10. The circuit board guiding jig of the seventh aspect of the invention, wherein the receiving plate and the guiding portion are connected to each other to open a cover plate, wherein the carrying plate has a cover plate a bearing surface, the guiding portion has a top cymbal 'the take-up plate hole extends from the bearing surface and the top wall respectively to the inside of the carrying plate and the guiding portion' for removing the cover plate from the carrying plate by the taking plate hole from the guiding portion side . The circuit board guiding jig according to claim 1, wherein the carrier plate has a positioning member extending from the carrier plate toward the cover plate, and the cover plate is configured to cooperate with the positioning member. The through hole is configured to fix the carrier plate and the cover plate by the positioning of the positioning member and the through hole. 097112272 Form number Α0101 Page 16 of 21 1003312606-0
TW97112272A 2008-04-03 2008-04-03 Printed circuit board guiding fixture TWI354514B (en)

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TWI354514B true TWI354514B (en) 2011-12-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496522B (en) * 2012-12-12 2015-08-11 Inventec Corp Feeding assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496522B (en) * 2012-12-12 2015-08-11 Inventec Corp Feeding assembly

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