1354176 100年10月3修正替換頁 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種影像穩定裝置，更明確地說，本 發明係有關一種微型影像穩定裝置。 【先前技術】 現今數位相機許多都強調具有防手震、之功能。其中一 種做法便是在相機的影像感測元件（如C C D、C Μ Ο S)上設置 影像穩定裝置，以使當相機震動時，影像感測元件能同等 地移動，而影像在影像感測元件上成像的情況便不會受到 震動的影響而提供使用者方便性。然而現今的數位相機尺 寸越來越小而使得影像穩定裝置的尺寸亦需越小。因此， 先前技術便提出利用微機電系統技術的影像穩定裝置。 請參考第1圖。第1圖係為一利用微機電系統技術之 影像穩定裝置100之示意圖。影像穩定裝置100包含一影 像處理電路110、一致動器控制電路120、四組靜電致動器 131、132、133 與 134、一基板 170、一承載平台 150、一 影像感測元件160及一排線140。影像感測元件160包含 一影像感測面】61。致動器控制電路12 0耦接於靜電致動 器131〜134，用以控制靜電致動器131〜134的位移行為。 靜電致動器131〜134 —端固定於基板170上，另一端固定 於承載平台150上，用以根據致動器控制電路120的控制 1354176 訊號，產生相對應的位移，而承载平台15〇並可因此在盖 板I二上形成相對的位移。舉靜電致動器⑴$例，靜電 致動為 13 3 包含一 ^ jz. 1 〇 〇 Q €k3 — 疋子13化與一轉子133b。定子]333固 定於基板】7〇上而轉子^固定於承載平台j6〇之一側（如 圖示）。而定子】33a與轉子133b之間之距離係由致動器控 制電路12〇所傳送的控制訊號所決定。舉例來說，當致動 器控制電路12G所傳送的控制訊號的㈣越高，則定子 仙與轉子⑽之間之距離就越小；反之，當致動器控 制電路120所傳送的控制訊號的電壓越低，則定子】…與 轉子]34之間之距離就越大。因此，距離d便可經由致 動器控制電路12G來作調整。另外三組靜電致動器⑶、 】32、U4也是相同的情況。這樣—來，致動器控制電路⑶ 便可分別控制靜電致動器131〜134，而使承載平台能 夠相對於基板m作X方向或γ方向的位移。影像感測元 件⑽固定於承載平纟150上，且與承載平纟15〇並益任 =電性搞接。因此影像感測元件⑽便可隨著承載平台⑼ =動。影像感測元件160上之影像感測面161用以接收光 學影像而相對應地於影像感測元们6〇上產生電子訊號。 影像處理電路m經由排線140輕接於影像感測=件 160’用以接收影像感測元件160所產生之電子訊號並分析 該電子訊，以產生影像。因此，在基板17〇受到震動的時 候’致動器控制電路120便會傳送控制訊號給靜電致動器 1354176 】00年]0月19日修正替換頁 ---—------ 131〜134’而讓承載平台15〇產生相反的震動以抵銷基板 170之震動對於影像感測元件160的影響。如此一來，在 基板170受到震動的時候，對於影像感測元件〗5〇實際上 是不會感受到震動，因此所接收的光學影像也會是穩定 的。而最後影像處理電路根據影像感測元件16〇所產 生的影像也會是穩定的。 請簽考第2圖。第2圖係為先前技術之影像穩定裴置 100之組裝示意圖。如圖所示，當靜電致動器131〜134以 及承載平台150在基板〗70上完成後，影像感測元件16〇 會再黏著於承載平台15〇上並固定，然後再將排線14〇耦 接到影像感測元件160上並固定。影像感測元件〗6〇上設 有複數個導體墊162(pad)(如銅箔）而排線140上設有複數 個相對應的接腳丨41，在組裝時，導體墊162上會先刷上 錫膏，然後排線140可點膠固定於影像感測元件16〇上的 導體墊162，然後進行加熱。如此排線14〇便可將其接腳 141麵接於影像感測元件〗的銅箔墊162上。 由上可知，先前技術之影像穩定裝置〗〇〇需要兩道組 裝程序：1.先將影像感測元件160黏著於承載平台15〇上、 2·再將排線140耦接於影像感測元件16〇上。而這兩道程 序對於生產過程來說，是較為繁瑣的，因此不便於生產。 另外’先剷技,之影像穩定裝置100，由於有排線1 耦接於影像感測元件160上，因此，在承載平台15〇與基 6 叫 41761354176 October 3, pp. Amendment Page 6. SUMMARY OF THE INVENTION: Field of the Invention The present invention relates to an image stabilization apparatus, and more particularly to a miniature image stabilization apparatus. [Prior Art] Many digital cameras today emphasize the function of anti-shake. One of the methods is to set an image stabilization device on the image sensing component (such as CCD, C Μ Ο S) of the camera, so that when the camera vibrates, the image sensing component can move equally, and the image is in the image sensing component. The upper imaging condition is not affected by the vibration and provides user convenience. However, the size of today's digital cameras is getting smaller and smaller, and the size of the image stabilization device needs to be smaller. Therefore, the prior art has proposed an image stabilization device using MEMS technology. Please refer to Figure 1. Figure 1 is a schematic illustration of an image stabilization device 100 utilizing MEMS technology. The image stabilization device 100 includes an image processing circuit 110, an actuator control circuit 120, four sets of electrostatic actuators 131, 132, 133 and 134, a substrate 170, a carrying platform 150, an image sensing component 160 and a row. Line 140. Image sensing component 160 includes an image sensing surface 61. The actuator control circuit 120 is coupled to the electrostatic actuators 131-134 for controlling the displacement behavior of the electrostatic actuators 131-134. The electrostatic actuators 131-134 are fixed on the substrate 170 at the other end, and the other end is fixed on the carrying platform 150 for generating a corresponding displacement according to the control 1354176 signal of the actuator control circuit 120, and the carrying platform 15 is folded. A relative displacement can thus be formed on the cover plate II. For example, the electrostatic actuator (1), the electrostatic actuation is 13 3 including a ^ jz. 1 〇 〇 Q € k3 — the dice 13 is coupled to a rotor 133b. The stator 333 is fixed to the substrate 7 而 and the rotor ^ is fixed to one side of the carrying platform j6 ( (as shown). The distance between the stator 33a and the rotor 133b is determined by the control signal transmitted by the actuator control circuit 12A. For example, the higher the (four) of the control signal transmitted by the actuator control circuit 12G, the smaller the distance between the stator and the rotor (10); conversely, when the control signal transmitted by the actuator control circuit 120 is The lower the voltage, the greater the distance between the stator and the rotor]34. Therefore, the distance d can be adjusted via the actuator control circuit 12G. The other three sets of electrostatic actuators (3), 32, and U4 are also the same. Thus, the actuator control circuit (3) can control the electrostatic actuators 131 to 134, respectively, so that the carrier platform can be displaced in the X direction or the γ direction with respect to the substrate m. The image sensing element (10) is fixed on the carrying raft 150 and is connected to the carrying raft 15 and is electrically connected. Therefore, the image sensing element (10) can be moved with the carrying platform (9). The image sensing surface 161 on the image sensing component 160 is configured to receive an optical image and correspondingly generate an electronic signal on the image sensing element. The image processing circuit m is connected to the image sensing component 160 via the cable 140 for receiving the electronic signal generated by the image sensing component 160 and analyzing the electronic signal to generate an image. Therefore, when the substrate 17 is subjected to vibration, the actuator control circuit 120 transmits a control signal to the electrostatic actuator 1354176. 00 years] October 19th correction replacement page ----------- 131 The 134's cause the carrier platform 15 to generate an opposite shock to counteract the effects of the vibration of the substrate 170 on the image sensing element 160. As a result, when the substrate 170 is subjected to vibration, the image sensing element does not actually feel the vibration, so the received optical image is also stable. Finally, the image generated by the image processing circuit based on the image sensing element 16 is also stable. Please sign the second picture. Figure 2 is an assembled view of a prior art image stabilization device 100. As shown in the figure, after the electrostatic actuators 131 to 134 and the carrier platform 150 are completed on the substrate 70, the image sensing element 16 再 will be adhered to the carrier platform 15 并 and fixed, and then the cable 14 〇 It is coupled to the image sensing element 160 and fixed. The image sensing component is provided with a plurality of conductor pads 162 (such as copper foil), and the cable 140 is provided with a plurality of corresponding pins 41. When assembled, the conductor pads 162 are first assembled. The solder paste is applied, and then the cable 140 is glued to the conductor pad 162 on the image sensing element 16 and then heated. Thus, the pin 141 can be connected to the copper foil pad 162 of the image sensing element. As can be seen from the above, the prior art image stabilization device requires two assembly procedures: 1. First, the image sensing component 160 is adhered to the carrier platform 15 , and then the cable 140 is coupled to the image sensing component. 16 〇. These two procedures are cumbersome for the production process and therefore inconvenient to produce. In addition, the image stabilization device 100 has a cable 1 coupled to the image sensing component 160. Therefore, the carrier platform 15 and the base 6 are called 4176.
的移動造成影響。舉例來說，排線14。：.二 °15C 也會產生彈力，而影響承裁平二：到形變的時候The movement has an impact. For example, the cable 14 is wired. :. Two °15C will also produce elastic force, and the impact of the contraction level two: to the time of deformation
會產生的彈力大小是無法預“ ‘夕助’且排線HO 後所移動的释戶，方合戽引、e “’承載平台150最 預期的位』“㈣排線_的影響，而無法達到 【發明内容】 -致動器控制電_二二:二:影像穩定裝置輕接於 承截平△ /、〜像處理電路，並包含-基板；— 承载千。，以可移動之方式設於該基板 :蝴元件;，，固定地設於該基板之 ^二=設於該儲之上，其t該影像處理電路輕= 1 =，—彈性㈣，連接於該㈣與該承載平台之 間’一導線，設於該彈性雖 〜 上，一纟而祸接於該導體墊， 另-^由_”臂延伸於該承載平台之上 :像感測元件…微型致動器，設於該承載平二 基^間’用來«致_控制電路之控制訊號整: 承載平台相對於該基板之位置。 Μ 本發明另提供一種微型影像穩定裝置，用來穩定—參 像感測凡件。該影像敎裝置_於—致動器 ； 一⑽處理電路，並包含一基板：—承載平台，以可:動 之方式设於該基板之上，用來承載該影像感測元件；一錨 1354176 ~ - ί ^ . ]00年10月id曰修正替換頁 點，固定地設於該基板之上；一第一導體墊，固定地設於 該錨點之上，其中該影像處理電路耦接該第一導體墊；一 彈性懸臂，其一端連接於該錨點；一連接臂，連接於該彈 性懸臂之另一端；一第二導體墊，用來耦接該影像感測元 件，以接收該影像感測元件之訊號；一導線，設於該彈性 懸臂之上，一端耦接於該第一導體墊，另一端耦接於該第 二導體墊；及一微型致動器，耦接於致動器控制電路，用 來根據致動器控制電路之控制訊號，調整該承載平台相對 於該基板之位置。 【實施方式】 請參考第3圖。第3圖係為本發明之利用微機電系統 技術之影像穩定裝置300之第一實施例之示意圖。如圖所 示，影像穩定裝置300包含一影像處理電路110、一致動 器控制電路120、四組靜電致動器331、332、333與334、 一基板370、一承載平台350、一影像感測元件360、四錨 點341〜344、四導體墊381〜384、四導線391〜394、四導體 墊3811〜3844(未圖示）、四彈性懸臂301〜304。影像感測元 件360包含一影像感測面361。致動器控制電路120耦接 於致動器331〜334,用以控制致動器331〜334的位移行為。 致動器331〜334 —端固定於基板370上，另一端固定於承 載平台350上，用以根據致動器控制電路120的控制訊號， 產生相對應的位移，而承載平台350並可因此在基板370 上形成相對的位移。這樣一來，致動器控制電路〗20便可 8 1354176 100年K丨月].9 3修正替換頁 分別控制致動器331〜334 . ^7 .，. τ ———……… '叩便承戰平台350能夠相對於 基板37Q作X方向或Y方向的位移。継341〜344固定於 基板上；導體墊381〜地則分別固定在錨點341〜344上。 彈性懸臂秦304分別連接於如341〜與承載平台 3 5 0之間’ 一方面用以錯中1却丁， …疋不载平台350在致動器331〜334 皆未動作時可以停置於—初始位置，另—方面可以用來承 載導線39K394。冑、線391〜394 1輕接於導體塾 381〜384 ’另一端延伸於承載平台350上並固定（益電性連 接），體墊3811〜3844分別柄接於導線別〜394並固定於 承載平台350上（無電性連接）。影像感測元件36〇固定於 承載平台350上’與承載平台35〇並無任何電性 透過打線封f紐晶封裝的方式㈣導體墊38η〜3δ44: ㈣39】〜394作電性連接。因此影像感測元件36〇便可隨 著承載平台350移動。影像感測元件遍上之影像 : 用以接收光學影像而相對應地於影像感測元件⑽、上 產生電子訊號。㈣減理電路11G❹職接於導體塾 38〗〜384，因此影像處理電路11〇可以經由導體^ 38卜384、導線391〜394、導體墊3811〜3844，耦接至^像 ㈣元件挪，而接收影像感測元件細之電子訊號:因 此，在基板370文到震動的時候，致動器控制電路 =專送控制訊號給致動器331〜334,而讓承裁平台35〇產 目反的震動以抵鎖基板37〇之震動對於影像感測元件 的影響。如此-來’在基板，受到震動的時候，對 9 Ϊ354176 100干1〇月19日修正替換頁 於影像感測元件360實際上是不會感受至，因此所 收的光學衫像也會是穩定的。而最後影像處理電路11 〇根 據影像感測το件360所產生的影像也會是穩定的。另外， 錦點、導體藝、導線及彈性懸臂之設計位置與數目，本發 明於弟3圖中僅為-示範說明’使用者可根據實際上使用 之需求變化。 月ί考第4目帛4圖係為本發明之景多像穩定裝置期 之第-實施例以覆晶封裝之剖面示意圖。第4圖所示剖面 部分係為錯點381與錯點384側面看過去的剖面，如第3 圖所標示400的部分的剖面圖。然而為了方便說明，圖中 僅以虛線描繪致動器331的部分，但實際上致動器是存在 ^圖中的。於第4圖中，實際上，㈣34】是經由一絕緣 才再與基板別作固定，如此方可確保沒有電性之 而彈性懸臂3〇1則連接於承載平台350與錯點341 如圖示）。導體墊381、3811與導線39ι係透過 層421固定於彈性懸臂朗與承載平台350之上，如;^ 可確保沒有電性之連結。而對於 女此亦 為了與導㈣與394作二:=36。來說’ 件360的感測面361的另 因此在影像感測元 以舜曰々壯 面扠置導體墊461與464，並 輕接 元件_的導體塾州與464 伟為Μ射^ 394 °"^自縣技财許乡種方式， 亥辑中具有通常知識者所熟知，於此本發明並不，羊 述’僅舉一實施例作為代表。本發明即採以錫球… 1354176 ]00年j〇月丨9 3修正替換頁 與414來纣影像感測元件360與彈性懸臂上之導線實; 晶封衷。影像感測元件360的導體墊461與464，相對地 黏上錫球41】與414 ε而導體墊461與464再連接於感測 面361。在當影像感測元件360要耦接於導線391與394 時’會先放置影像感測元件360於承載平台350上的正確 位置，然後加熱。如此一來錫球411與414熱熔，進而連 接導體塾461與導線39]、導體墊464與導線394。因此， 當影像感測元件360於承載平台35〇上組裝完成時，影像 處理電路11〇便可經由導體墊38卜導線391、導體塾加卜 導體墊461，耗接於感測面36卜進而接收影像感測元件 360所傳送之電子訊號。 ，請參考f 12圖。第12圖係為本發明之影像穩定裝置 :00之第1施例之以打線封裝之剖面示意圖。第12圖所 示^面部分係為錫點381與錯點384側面看過去的剖面， 如弟3圖所標示彻的部分的剖面圖。然而為了方便說明， =僅以虛線騎致動器331的部分，但實際上致動器是 子t的。於第12圖中’實際上，難341是經由〜 才再與基板37。作固定，如此方可伽有電 之連、、。而彈性懸臂3〇1則連接於承載平台35〇與錯點 341之間（如圖示）。導 ’'、 ㈣轰馬M 墊381、3幻〗與導線391係透過〜 ’、’巴、’、彖層42 ]固定於彈性縣劈3〇 士廿1 + 5早301與承載平台350之上，如 此亦可確保沒有電性之連結如 ,,. . 向對於影像感測元件360漆 沉，為了與導線39〗與394作電性^ 电Γ生之連結，因此在影 1354176 100年10 .日修正替換百 的周圍設置導體墊461與464， 測元件360的感測面 並以打線封裝技術’將導線1271與]274轉接於導體墊3811 與3844。的線封裝技術有❹種方式，係為該領域中具 有通常知識者所熟知，於此本發明並不詳加闡述，僅舉— 實施例作為代表。本發明將影像感測元件36〇的導體墊46] 與464分別以打線封裝將導線i27〗與】274耦接，再將導 線]271與1274分別與導體墊3811與3844耦接。因此， 當影像感測元件36G於承載平台35〇上組裝完成時，影像 處理電路11〇便可經由導體墊381、導線391、導體墊381卜 導線1271、導體墊461，耦接於感測面361，進而接收影 像感測凡件360所傳送之電子訊號。另外，承載平台 上亦置有非導電黏膠J，用以黏著影像感測元件36〇。 。月夯考第5圖。第5圖係為本發明之影像穩定裝置3〇〇 之第貝轭例之以覆晶封裝之組裝示意圖。如圖所示，本 心月之衫像穩疋裝置300在組裝時，僅需以覆晶封裝技 術，；人就能夠將影像感測元件360固定於承載平台35〇 上同％並；^成與各導線之搞接。舉覆晶封裝技術的其中一 種實施方式來說，本發明之影像穩定裝置3〇〇，在組裝時， 可將影像感測元件360黏上錫球411、412、413與414(未 圖示），然後將影像感測元件360放到正確位置後加熱，如 此7L成組裝。本發明之影像穩定裝置3〇〇所需要的組裝方 法，明顯較先前技術簡單許多而提供使用者更大的便利性。 請參考第13圖。第】3圖係為本發明之影像穩定裝置 1354176 ,. - -The amount of spring force that can be generated is the effect of the release of the "Early Help" and the movement of the line after the HO, and the effect of the "fourth line of the most anticipated position" of the "bearing platform 150" Reach [Invention] - Actuator control power _ 22: 2: Image stabilization device is lightly connected to the intercepting flat △ /, ~ image processing circuit, and contains - substrate; - carrying thousands., set in a movable manner The substrate: a butterfly element; is fixedly disposed on the substrate; the second image is disposed on the storage, and the image processing circuit is lightly = 1 =, - elastic (four), connected to the (four) and the carrying platform a 'one wire, which is disposed on the elastic layer, is attached to the conductor pad, and the other arm extends from the carrier platform: like a sensing element...a microactuator, located at The control unit is used to control the signal of the control circuit: the position of the carrying platform relative to the substrate. Μ The present invention further provides a miniature image stabilization device for stabilizing-parameter sensing. The image processing device has a processing circuit and includes a substrate: a carrying platform disposed on the substrate in a movable manner for carrying the image sensing component; an anchor 1354176 ~ - ί ^ . ] October 2010 id 曰 correction replacement page point, fixedly disposed on the substrate; a first conductor pad, fixedly disposed above the anchor point, wherein the image processing circuit is coupled to the a first conductive pad; an elastic cantilever, one end of which is connected to the anchor point; a connecting arm connected to the other end of the elastic cantilever; and a second conductive pad for coupling the image sensing component to receive the image a signal of the sensing component; a wire disposed on the elastic cantilever, one end coupled to the first conductor pad and the other end coupled to the second conductor pad; and a micro actuator coupled to the actuation And a control circuit for adjusting a position of the carrying platform relative to the substrate according to a control signal of the actuator control circuit. [Embodiment] Please refer to Figure 3. Figure 3 is a schematic illustration of a first embodiment of an image stabilization device 300 utilizing MEMS technology of the present invention. As shown, the image stabilization device 300 includes an image processing circuit 110, an actuator control circuit 120, four sets of electrostatic actuators 331, 332, 333 and 334, a substrate 370, a carrier platform 350, and an image sensing device. Element 360, four anchor points 341 to 344, four conductor pads 381 to 384, four wires 391 to 394, four conductor pads 3811 to 3844 (not shown), and four elastic cantilevers 301 to 304. Image sensing component 360 includes an image sensing surface 361. The actuator control circuit 120 is coupled to the actuators 331-334 for controlling the displacement behavior of the actuators 331-334. The actuators 331 334 334 are fixed on the substrate 370 and the other end is fixed on the carrying platform 350 for generating a corresponding displacement according to the control signal of the actuator control circuit 120, and the carrier platform 350 can be A relative displacement is formed on the substrate 370. In this way, the actuator control circuit 20 can be used to control the actuators 331 to 334. ^7 .,. τ ———......... '叩The battle platform 350 can be displaced in the X direction or the Y direction with respect to the substrate 37Q. The ridges 341 to 344 are fixed to the substrate; the conductor pads 381 to 143 are fixed to the anchor points 341 to 344, respectively. The elastic cantilever Qin 304 is respectively connected between, for example, 341~ and the carrying platform 305. On the one hand, it is used to make a mistake, and the platform 350 can be stopped when the actuators 331 to 334 are not in operation. - Initial position, otherwise - can be used to carry wire 39K394.胄, line 391~394 1 is lightly connected to the conductor 塾381~384', and the other end extends on the carrying platform 350 and is fixed (electrically connected), and the body pads 3811~3844 are respectively connected to the wires 394 and fixed on the bearing. On platform 350 (no electrical connection). The image sensing element 36 is fixed on the carrying platform 350. The mounting platform 35 is not electrically connected to the carrying platform 35. (4) The conductor pads 38n~3δ44: (4) 39]~394 are electrically connected. Therefore, the image sensing element 36 can move with the carrying platform 350. The image of the image sensing component is used to receive the optical image and correspondingly generate an electronic signal on the image sensing component (10). (4) The reduction circuit 11G is connected to the conductors 38 to 384, so the image processing circuit 11 can be coupled to the (4) component via the conductors 38, 384, 391 to 394, and the conductor pads 3811 to 3844. Receiving the fine electronic signal of the image sensing component: therefore, when the substrate 370 is vibrating, the actuator control circuit=delivers the control signal to the actuators 331-334, and the contracting platform 35 is reversed. The vibration is used to counteract the influence of the vibration of the substrate 37 on the image sensing element. So - when the substrate is shaken, the 9 Ϊ 354176 100 dry 1 〇 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 19 of. Finally, the image generated by the image processing circuit 11 based on the image sensing τ is 360. In addition, the design position and number of the dots, the conductors, the wires, and the elastic cantilever are only shown in the drawings of the present invention - the user can vary according to the needs of the actual use. The fourth item of Fig. 4 is a schematic cross-sectional view of the flip-chip package of the first embodiment of the present invention. The cross-sectional portion shown in Fig. 4 is a cross-sectional view of a portion taken at the side of the point 381 and the point 384 of the error point 384, as indicated by Fig. 3. However, for convenience of explanation, only a portion of the actuator 331 is depicted by a broken line in the drawing, but actually the actuator is present in the figure. In Fig. 4, in fact, (4) 34] is fixed to the substrate via an insulation, so as to ensure that there is no electrical property, and the elastic cantilever 3〇1 is connected to the carrying platform 350 and the wrong point 341 as shown. ). The conductor pads 381, 3811 and the wires 39 are fixed to the elastic cantilever and the carrying platform 350 through the layer 421, such as to ensure that there is no electrical connection. For women, this is also for the guide (4) and 394 for two: =36. In other words, the sensing surface 361 of the piece 360 is further disposed on the image sensing element with the conductor pads 461 and 464, and the conductor of the component _ is 塾 与 与 与 与 394 394 ° "^ From the county technology, the way of the township, the general knowledge of the people in the series is well known, and the present invention does not, the sheep's description is only one embodiment. The invention adopts a solder ball... 1354176] 00 years j〇月丨9 3 correction replacement page and 414 纣 image sensing element 360 and the wire on the elastic cantilever; The conductor pads 461 and 464 of the image sensing element 360 are oppositely bonded to the solder balls 41 and 414 ε and the conductor pads 461 and 464 are reconnected to the sensing surface 361. When the image sensing element 360 is to be coupled to the wires 391 and 394, the image sensing element 360 is placed in the correct position on the carrying platform 350 and then heated. As a result, the solder balls 411 and 414 are thermally fused, thereby connecting the conductors 461 and the wires 39], the conductor pads 464 and the wires 394. Therefore, when the image sensing device 360 is assembled on the carrying platform 35, the image processing circuit 11 can be connected to the sensing surface 36 via the conductor pad 38, the conductor 391, and the conductor pad 461. The electronic signal transmitted by the image sensing component 360 is received. Please refer to the figure f 12 . Figure 12 is a cross-sectional view showing the wire-stamping package of the first embodiment of the image stabilization device of the present invention. The surface of the surface shown in Fig. 12 is a cross-sectional view of a portion viewed from the side of the tin spot 381 and the wrong point 384, as shown in the figure of the third drawing. However, for convenience of explanation, = only the portion of the actuator 331 is rided in a broken line, but the actuator is actually sub-t. In Fig. 12, in fact, the difficulty 341 is via the ~ again with the substrate 37. Fixed, so that there is a connection between electricity and electricity. The elastic cantilever 3〇1 is connected between the carrying platform 35〇 and the wrong point 341 (as shown). Guide '', (4) 轰马 M pad 381, 3 illusion and wire 391 series through ~ ', '巴, ', 彖 layer 42] fixed in the flexible county 劈 3 gentleman 廿 1 + 5 early 301 and the carrying platform 350 In this way, it is also ensured that there is no electrical connection such as, for example, to the image sensing component 360, in order to make a connection with the wires 39 and 394, so in the shadow 1354176 100 years 10 The corrections replace the surrounding conductor pads 461 and 464, and the sensing faces of the component 360 are sensed and the wires 1271 and 274 are transferred to the conductor pads 3811 and 3844 by wire bonding techniques. There are several ways in which the wire encapsulation technique is well known to those of ordinary skill in the art, and the present invention is not described in detail, and is merely representative. In the present invention, the conductor pads 46] and 464 of the image sensing device 36 are respectively coupled to the wires 274 and 274 by wire bonding, and the wires 271 and 1274 are coupled to the conductor pads 3811 and 3844, respectively. Therefore, when the image sensing device 36G is assembled on the carrying platform 35, the image processing circuit 11 can be coupled to the sensing surface via the conductor pad 381, the wire 391, the conductor pad 381, the wire 1271, and the conductor pad 461. 361, further receiving the image sensing the electronic signal transmitted by the component 360. In addition, a non-conductive adhesive J is also disposed on the carrying platform for adhering the image sensing element 36〇. . The fifth month of the test. Fig. 5 is a schematic view showing the assembly of the first embodiment of the image stabilization device 3 of the present invention in a flip chip package. As shown in the figure, the heart-shaped shirt-like stabilization device 300 only needs to be flip-chip packaging technology when assembling, and the person can fix the image sensing component 360 on the carrying platform 35〇 and the same; Connect with each wire. In one embodiment of the flip chip packaging technology, the image stabilization device 3 of the present invention can be attached to the solder balls 411, 412, 413 and 414 (not shown) during assembly. Then, the image sensing element 360 is placed in the correct position and heated, so that 7L is assembled. The assembly method required for the image stabilization device 3 of the present invention is significantly simpler than the prior art and provides greater convenience to the user. Please refer to Figure 13. The third figure is the image stabilization device of the present invention 1354176 ,. - -
. 100主K丨月]9 Ξ修正替換I 300之第一實施例之以打線封裝之組裝示意圖。如圖所示， 本發明之影像穩定裝置300在組裝時，僅需以打線封裝技 術=一次就能夠將影像感測元件360固定於承載平台350 上同時並完成與各導線之耦接。本發明之影像穩定裝置300 ' 所需要的組裝方法，明顯較先前技術簡單許多而提供使用 者更大的便利性。 請參考第6圖。第6圖係為本發明之影像穩定裝置300 之第二實施例之以覆晶封裝之剖面示意圖。與第4圖不同 的是，於第6圖中，影像感測元件360的感測面361是面 向基板370的。因此，在基板370與承載平台350上相對 應地設置孔洞，以提供光學影像路徑，使光學影像可以從 基板3 7 0的下方進入而成像於影像感測面3 61。如此，根 據第4圖與第6圖之設計，影像感測元件360之感測面361 便可有兩種方向可以選擇，更提高了本發明之實用性。 請參考第14圖。第14圖係為本發明之影像穩定裝置 300之第二實施例之以打線封裝之刳面示意圖。與第12圖 不同的是，於第14圖中，影像感測元件360的感測面361 是面向基板370的。相關封裝方式如同第12圖，於此不再 贅述。因此，在基板370與承載平台350上相對應地設置 孔洞，以提供光學影像路徑，使光學影像可以從基板370 的下方進入而成像於影像感測面3 61。 請參考第7圖。第7圖係為本發明之影像穩定裝置300 之第二實施例之以覆晶封裝示意圖。如圖所示，本發明之 1354176 _ . ]00年〗0月β日修正替換頁 影像穩定裝置300在組裝時，僅需以覆晶封裝技術，一次 就能夠將影像感測元件360固定於承載平台350上同時並 完成與各導線之耦接。更明確地說，本發明之影像穩定裝 置300，在組裝時，可將影像感測元件360黏上錫球411、 412、4〗3與414(未圖示）；然後將影像感測元件360放到 正確位置後加熱，如此完成組裝。本發明之影像穩定裝置 300所需要的組裝方法，明顯較先前技術簡單許多而提供 使用者更大的便利性。 請參考第15圖。第15圖係為本發明之影像穩定裝置 300之第二實施例之以打線封裝之組裝示意圖。如圖所示， 本發明之影像穩定裝置300在組裝時，僅需以打線封裝技 術，一次就能夠將影像感測元件360固定於承載平台350 上同時並完成與各導線之耦接。本發明之影像穩定裝置300 所需要的組裝方法，明顯較先前技術簡單許多而提供使用 者更大的便利性。 請參考第8圖。第8圖係為本發明之靜電致動器之示 意圖。本發明所使用之致動器331〜334，可為如第8圖所 示之靜電式致動器，於此僅以致動器3 31來舉例。如圖所 示，靜電式致動器331包含定子331a與轉子331b。定子 331a與轉子331b皆以梳狀結構構成，如圖所示。定子331a 固定於基板370上；轉子331b固定於承載平台350上。定 子331a包含導體墊331g，因此致動器控制電路120可傳 送一電壓Va至導體墊331g，使定子331a接收電壓Va。轉 14 1354176 100年10月】9日修正替換頁 子33]b包含了彈性懸臂33〗c、錨點 錨點331 d固定於基板370上.導體墊33 ]f固定於錨點33id 上，因此致動器控制電路120可傳送一電壓Vb至導體墊 33If ’經由彈性懸臂33】c，傳送至轉子33]b ;使轉子 接收電壓Vh因此，靜電式致動器33】便可根據電壓％ 與Vb的差異大小，控制轉子33ia與定子33]b間的距離 D2，進而改變距離D，而改變承載平台35〇在基板3川上 的相對位置。 請參考第16圖。第圖係為本發明之靜電致動微型 影像穩定裝置1600之示意圖。微型影像穩定裝置16〇〇所 使用之致動器’係為如第8圖所示之靜電致動器。微髮影 像穩定裝置1600包含一基板167〇、一承載平台165〇、四 錨點]641〜1644、四導體墊1621〜1624、四導體墊 1681&〜16843、四導體墊1681卜168413、靜電致動器之定子 1631a 1634a邊電致動器之轉子i63ib〜1634b、四導體墊 1631c〜1634c、四導體墊1631d〜i634d、四彈性懸臂 】60〗a〜1604a 、四彈性懸臂1601b〜1604b 、四導線 1691a〜1694a、四導線169仆〜169仆。承載平台165〇用以 承載景彡像感測元件166〇並連接靜電致動器之轉子 1631b〜1634b。錨點1641〜1644固定於基板167〇之上，其 與基板]670之間可間隔一絕緣層用以隔離電性；錨點 1641〜1644係用來提供固定點給靜電致動器之轉子 1631b〜1634b且錨點164i〜1644 '靜電致動器之轉子 1354176 10Q年10月1 ^ 3修正替換頁 163 lb〜1634b、彈性懸臂 160la〜1604a、彈性懸臂 1604b〜〗604b為半導體製程中同一層蝕刻出來之結構且有 電性之連結；因此’錨點164〗〜1644上分別設置有導體塾 1621〜1624 ’用來接收·—共同電位Vcom，如此·一來靜電致 動器之轉子16·? 1 b〜1634b便相同具有電位Vcom。錦點 1641〜〗644上另分別置有導體墊1681a〜1684a及 168〗b〜〗684b’其與錨點1641〜1644之間可間隔絕緣層用以 隔離電性。導體墊1681a〜1684a及168〗b〜】684b分別連接 導線1691a〜1694a及1691b〜1694b ’用來接收影像處理電 路之號再經由導線1691 a〜1694a及169] b〜1694b傳送至 影像感測元件1660。而導線1691a〜]694a及1691b〜〗694b 可如同前述方式設置於彈性懸臂1601a〜16〇4a及 1601b〜1604b之上，其間亦可間隔絕緣層以隔離電性。而 導線1691a〜1694a及1691b〜1694b與影像感測元件1660可 在經由如前述之錫球的方式作電性連接。靜電致動器之定 子1631a〜1634a係分別固定於基板〗67〇之上；而導體墊 1631e〜1634c ' 1631d〜1634d係分別設置於靜電致動器之定 子1631a〜1634a之上。導體墊1631c〜1634c係用來分別接 X電壓VI〜V4，如此靜電致動器之定子1631c〜]634c就分 別具有電位VI〜V4。舉靜電致動器之轉子1631b與定子 1631a為例：如此一來，靜電致動器之轉子l63】b的電位 為Vc〇m，定子1631a之電位為V1，而彼此的距離便可根 據電位Vcom與VI的差異來決定；因此，使用者可分別調 16 13-54176 . . - i- 100年10月19 s修正替換頁 整W位V1〜V4來調整各靜電致動器所移動的距離。另外， 導體墊163〗d〜1634d係分別用來量測各靜電致動器的等效 電容值以算出各靜電致動器之轉子與定子之間的距離。 請參考第9圖。第9圖係為本發明之電熱致動器之示 ' 意圖。本發明所使用之致動器331〜334，可為如第9圖所 示之電熱式致動器，於此僅以致動器3 31來舉例。如圖所 示，電熱式致動器331包含四電阻器3311、331J、331K、 331L及一樞軸331H。四電阻器33II〜331L之結構皆相同 於此僅以電阻器331L來作說明。電阻器331L包含二錨點 A1與A2、二導體墊P1與P2、高電阻R2及低電阻R1。 錨點A1與A2固定於基板370上；導體墊P1與P2則分別 固定於錨點A1與A2上。高電阻R2 —端耦接於錨點A2， 另一端與低電阻R1短路在一起。低電阻R1 —端耦接於錨 點A1，另一端與低電阻R2短路在一起。另外，高電阻R2 與低電阻R1兩者短路處黏接於枢軸331H。低電阻R]之 電阻值較低，高電阻R2之電阻值較高，因此，在通過相同 電流時，兩者所產生的熱能不同，上升的溫度不同，因此 膨脹的大小也有所差異，所以可以利用通過電流的大小， 改變高電阻R2與低電阻R1的形變量，進而改變距離D的 大小。因此致動器控制電路120可傳送二電壓Va與Vb分 別至導體墊A1與A2。而電壓Va與Vb的差異決定流通高 電阻R2與低電阻R]的電流大小，亦即形變大小。因此， 電熱式致動器331便可根據電壓Va與Vb的差異大小，控 1354176 ]00年]0月lb g修正替換頁 制距離D，而改變承載平台350在基板370上的相對位置。 請參考第10圖。第10圖係為本發明之電磁致動器之 示意圖。本發明所使用之致動器331〜334，可為如第10圖 所示之電磁式致動器，於此僅以致動器3 31來舉例。如圖 所示，電磁式致動器331包含電磁鐵331a與磁鐵331b。 電磁鐵331a固定於基板370上；磁鐵331b固定於承載平 台350上。電磁鐵33〗a包含鐵心以及纏繞於鐵心的導線、 導體墊33 lg與33 If。導線一端耦接於導體墊33 lg，一端 耦接於導體墊331f。因此致動器控制電路120可傳送二電 壓Va與Vb分別至導體墊331g與331f來控制導線所流通 之電流。而導線上流通電流的大小將影響電磁鐵3 1 a的磁 力。當電磁鐵3 31 a的磁力越大’磁鐵3 1 b將會被吸的較 近。當電磁鐵33]b的磁力越小，磁鐵331b將會被吸的較 遠。因此，電磁式致動器331便可根據電壓Va與Vb的差 異大小’控制電磁鐵3 31 a與磁鐵3 31 b間的距離D 2 ’進而 改變距離D，而改變承載平台350在基板370上的相對位 置。 請參考第11圖。第11圖係為本發明之壓電致動器之 示意圖。本發明所使用之致動器331〜334，可為如第11圖 所示之壓電式致動器，於此僅以致動器3 31來舉例。如圖 所示，壓電式致動器331包含壓電材質331a、二錨點331d、 二導體墊331f與331g。壓電材質331a —端固定於基板370 上，另一端固定於承載平台350上。壓電材質331a可為高 1354176- * · : ——»———一 — • f - 八工茂兩I丨.H . . [1^牟10月替換頁 刀）全芑 π ^(poly〜vinyiidence fluoride’PVDF)或 """"" 鉛材料（]eadZirconatetita腿e，PZT)。壓電材質33la的特性 係為接受到電壓的時候，會產生形變’而形變量的大小與 接收電壓的大小成正比。錨點331d固定於基板上，而 . 導體墊33】§與331f分別固定於錨點”^上而分別再以導 、·泉 < 心至壓電材質331 a。因此致動器控制電路〗2〇可傳送 二電壓Va與Vb分別至導體墊331§與331f來控制壓電= 貝331a所接收的電壓。而當壓電材質33u所接收的電壓 越大，形變越大；反之，當壓電材質33】&所接收的電璧^ 小，形變越小。因此，致動器控制電路】2〇便可透過傳送 電壓Va與Vb的差異大小來改變距離D，而改變承載平台 3 5 0在基板3 70上的相對位置。 請參考f 17圖。帛17圖係為本發明之利用微機電系 統技術之第三實施例之影像穩定裝置17〇〇之示意圖。第 17圖為衫像％疋裝置之上視圖。如圖所示，影像穩定裝 置1700包含一影像處理電路110、一致動器控制電路120、 一基板370、一影像感測元件36〇、四錨點nUa〜]74ia、 四錨點1711b〜1741b、四導體墊1712a〜1742a、四導體墊 1712b〜1742b、四錯點1715〜Π45、四導體墊171 8〜1748、 四導線ΠΠ〜1747、四導體墊1716〜1746、四彈性懸臂 17〗4〜Π44、四連接臂17〗3〜1743(有部分連接臂係位於影像 感測元件360之下方因此被擋住）。影像感測元件36〇包含 一影像感測面361及四導體墊461〜464耦接於影像感側面 1354176 J00年10月Ι9· 3修正替換頁 361用以傳送影像訊號。影像穩定裝置“〇另包 致動器ACI1〜Αςχ_4設置於影像感測元件360之下方及— 承載平台1850(因為第17圖為上視圖，因此被影像感測元 件J60擋住）。連接臂〗713〜1743用以非電性耦接於影像感 測元件360。承載平台1850非電性耦接於靜電致動器 ACTI〜ACT4，用以承載影像感測元件36〇。靜電致動器 ACT1〜ACT4分別經由錨點17ila〜1741a、nub〜mib分 別執接至導體墊1712a〜1742a、1712b〜1742b。致動器控制 電路120耦接於導體墊1712a〜n42a、17]2b〜]74孔，用以 分別控制靜電致動器ACT1〜ACT4的位移行為以控制承載 平台1850的位置進而控制影像感測元件36〇的位置。影像 感測元件360上之影像感測面361用以接收光學影像而相 對應地於影像感測元件360上產生電子訊號。而影像處理 電路110則分別耦接於導體墊1718〜1748，因此影像處理 電路110可以經由導體墊1718〜1748、導線1717〜1747、導 體墊1716〜1746,再經由打線方式設置的導線1719〜1749， 分別耦接至影像感測元件360之導體墊46〗〜464，而接收 影像感測元件360之電子訊號。而由於有彈性懸臂 1714〜1744之設置，因此可以在影像感測元件360與基板 370有相對移動時，彈性懸臂1714〜1744可以伸縮以使影 像感測訊號能順利從影像感測元件360傳送至影像處理電 路110。因此’在基板370受到震動的時候，致動器控制 電路120便會傳送控制訊號給致動器ACT1〜ACT4,而讓承 20 载平台1850彥生相反的帝、 ~ 反的辰动以抵銷基板370之震動對於影 隊感測το仵360的影響。如 „ pi „ „ X°此—來，在基板370受到震動 於影像感測元件挪實際上是不會感受到震 3此所錢的光學影像也會是敎的1最後影像處 =路m根據影像感測元件36Q所產生的影像也會是穩 二值得注意的是，影像穩定裝置测中，對於影像感 相關傳送路徑’與致動器致動訊號及相關傳送路 2疋完全分開的。也就是說，在製程上，影像感測訊號 ^專达路徑與致動器致動訊號的傳送路徑是可以分開進行 ‘作，對於使用者來說較為便利。此外，此實施例之—特 2在於致動器與承載平台設置於影像感測^件的垂直投 ^把圍内(由上視圖可看出，致動器與承載平台完全包覆於 5V像感測元件的下方），目的係為縮小使用空間 ，如此本發 ”像u衣置1700的尺寸將更能有效地縮小以符合 =用者的需要。另夕卜，錄點、導體墊、導線及彈性懸臂之 。又5十位置與數目，本發明於第】7圖中僅為—示範說明，使 用者可根據實際上使用之需求變化。 凊蒼考第18圖。第18圖係為本發明之影像穩定裝置 牙夕除心像感測元件後之示意圖。第】8圖係為說明影 像t疋衣置17〇〇位於影像感測元件下方之元件。如圖所 示位於衫像感測元件36〇下方的元件包含了部分的連接 t ]7]3〜]743、彈性懸臂n〜f4、f55〜f58、f51〜朽4、錨點 1840、非導電性黏膠J】〜J8、承載平台1850、靜電微型致 1354176 100年10月id曰修正替換頁 動器ACT1〜ACT4c 了定子ACTla〜A(^^微型致動器ACT]〜ACT4分別包含 ACTla〜ACT4a分別與轉子ACTlb〜AC 丁4b。定子 動器控制電路120 於錫點ni】a〜17仏，用以接收致. 100 main K ] ] 9 Ξ Ξ Ξ Ξ I 。 。 。 。 。 。 。 。 。 。 。 。 。 。 I I I As shown in the figure, when the image stabilization device 300 of the present invention is assembled, the image sensing component 360 can be fixed to the carrier platform 350 at the same time and the coupling with the wires can be completed by using the wire bonding technology. The assembly method required for the image stabilization device 300' of the present invention is significantly simpler than the prior art and provides greater convenience to the user. Please refer to Figure 6. Figure 6 is a cross-sectional view showing a flip chip package of a second embodiment of the image stabilization device 300 of the present invention. Different from Fig. 4, in Fig. 6, the sensing surface 361 of the image sensing element 360 is facing the substrate 370. Therefore, holes are formed in the substrate 370 corresponding to the carrying platform 350 to provide an optical image path, so that the optical image can be imaged from below the substrate 370 and imaged on the image sensing surface 361. Thus, according to the designs of Figures 4 and 6, the sensing surface 361 of the image sensing element 360 can be selected in two directions, which further enhances the utility of the present invention. Please refer to Figure 14. Figure 14 is a schematic view of a second embodiment of the image stabilization device 300 of the present invention in a wire-wrapped package. Different from Fig. 12, in Fig. 14, the sensing surface 361 of the image sensing element 360 faces the substrate 370. The related packaging method is the same as Fig. 12 and will not be described here. Accordingly, holes are provided in the substrate 370 corresponding to the carrier platform 350 to provide an optical image path such that the optical image can be imaged from below the substrate 370 to be imaged on the image sensing surface 361. Please refer to Figure 7. FIG. 7 is a schematic diagram of a flip chip package according to a second embodiment of the image stabilization device 300 of the present invention. As shown in the figure, the 1354 _ _ 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 The coupling to each of the wires is simultaneously performed on the platform 350. More specifically, in the image stabilization device 300 of the present invention, the image sensing element 360 can be adhered to the solder balls 411, 412, 4, 3, and 414 (not shown); and then the image sensing element 360 is attached. Heat it in the correct position and complete the assembly. The assembly method required for the image stabilization device 300 of the present invention is significantly simpler than the prior art and provides greater convenience to the user. Please refer to Figure 15. Figure 15 is a schematic view showing the assembly of the wire-wrap package of the second embodiment of the image stabilization device 300 of the present invention. As shown in the figure, when the image stabilization device 300 of the present invention is assembled, it is only necessary to use the wire bonding technology to fix the image sensing component 360 to the carrier platform 350 at the same time and to complete the coupling with the wires. The assembly method required for the image stabilization device 300 of the present invention is significantly simpler than the prior art and provides greater convenience to the user. Please refer to Figure 8. Figure 8 is a schematic illustration of an electrostatic actuator of the present invention. The actuators 331 to 334 used in the present invention may be electrostatic actuators as shown in Fig. 8, and only the actuators 31 are exemplified here. As shown, the electrostatic actuator 331 includes a stator 331a and a rotor 331b. Both the stator 331a and the rotor 331b are constructed in a comb structure as shown. The stator 331a is fixed to the substrate 370; the rotor 331b is fixed to the carrying platform 350. The stator 331a includes a conductor pad 331g, so that the actuator control circuit 120 can transmit a voltage Va to the conductor pad 331g to cause the stator 331a to receive the voltage Va. Turn 14 1354176 October 100] The 9th modified replacement page 33] b includes an elastic cantilever 33 〗 C, and the anchor anchor point 331 d is fixed on the substrate 370. The conductor pad 33 ] f is fixed on the anchor point 33id, so The actuator control circuit 120 can transmit a voltage Vb to the conductor pad 33If 'via the elastic cantilever 33] c to the rotor 33]b; the rotor receives the voltage Vh. Therefore, the electrostatic actuator 33 can be based on the voltage % The difference in size of Vb controls the distance D2 between the rotor 33ia and the stator 33]b, thereby changing the distance D, and changing the relative position of the carrier platform 35 on the substrate 3. Please refer to Figure 16. The figure is a schematic illustration of an electrostatically actuated micro image stabilization device 1600 of the present invention. The actuator used in the micro image stabilization device 16A is an electrostatic actuator as shown in Fig. 8. The micro-image stabilization device 1600 comprises a substrate 167A, a carrier platform 165〇, four anchor points 641~1644, four conductor pads 1621~1624, four conductor pads 1681&~16843, four conductor pads 1681 168413, electrostatically induced The stators 1631a to 1634a of the actuator are electrically driven by rotors i63ib to 1634b, four-conductor pads 1631c to 1634c, four-conductor pads 1631d to i634d, four elastic cantilevers 60'a to 1604a, four elastic cantilevers 1601b to 1604b, and four wires. 1691a~1694a, four wires 169 servants ~ 169 servants. The carrying platform 165 is configured to carry the image sensing element 166 and connect the rotors 1631b to 1634b of the electrostatic actuator. The anchor points 1641~1644 are fixed on the substrate 167A, and an insulating layer is spaced apart from the substrate 670 for isolating electrical properties; the anchor points 1641~1644 are used to provide a fixed point to the rotor 1631b of the electrostatic actuator. ~1634b and anchor point 164i~1644 'Rotor of electrostatic actuator 1354176 October 10 1 3 correction replacement page 163 lb~1634b, elastic cantilever 160la~1604a, elastic cantilever 1604b~〗 604b for the same layer etching in semiconductor process The structure is connected and electrically connected; therefore, the anchors 1621 to 1624 are respectively provided with conductors 1621 to 1624' for receiving the common potential Vcom, and thus the rotor 16 of the electrostatic actuator. 1 b to 1634b have the same potential Vcom. The gold dots 1641 to 644 are respectively provided with conductor pads 1681a to 1684a and 168 bb to 684b', and an insulating layer is spaced apart from the anchor points 1641 to 1644 for isolating electrical properties. The conductor pads 1681a to 1684a and 168 IBb to 684b are respectively connected to the wires 1691a to 1694a and 1691b to 1694b' for receiving the image processing circuit and then transmitted to the image sensing device via the wires 1691 a to 1694a and 169] b to 1694b. 1660. The wires 1691a to 694a and 1691b to 694b may be disposed on the elastic cantilevers 1601a to 16A4a and 1601b to 1604b as described above, and may be spaced apart from each other to isolate electrical properties. The wires 1691a to 1694a and 1691b to 1694b and the image sensing element 1660 can be electrically connected via a solder ball as described above. The stators 1631a to 1634a of the electrostatic actuator are respectively fixed on the substrate 67; and the conductor pads 1631e to 1634c' 1631d to 1634d are respectively disposed on the stators 1631a to 1634a of the electrostatic actuator. The conductor pads 1631c to 1634c are used to respectively connect the X voltages VI to V4, so that the stators 1631c to 634c of the electrostatic actuator have potentials VI to V4, respectively. Taking the rotor 1631b and the stator 1631a of the electrostatic actuator as an example, the potential of the rotor l63]b of the electrostatic actuator is Vc〇m, the potential of the stator 1631a is V1, and the distance between the two is based on the potential Vcom. The difference from the VI is determined; therefore, the user can adjust 16 13-54176 respectively. - i- 100 October 19 s correction replacement page full W bits V1 ~ V4 to adjust the distance moved by each electrostatic actuator. Further, the conductor pads 163'd to 1634d are respectively used to measure the equivalent capacitance values of the respective electrostatic actuators to calculate the distance between the rotor and the stator of each of the electrostatic actuators. Please refer to Figure 9. Figure 9 is an illustration of the electrothermal actuator of the present invention. The actuators 331 to 334 used in the present invention may be electrothermal actuators as shown in Fig. 9, and only the actuators 31 are exemplified here. As shown, the electrothermal actuator 331 includes four resistors 3311, 331J, 331K, 331L and a pivot 331H. The structures of the four resistors 33II to 331L are the same, and only the resistor 331L will be described here. The resistor 331L includes two anchor points A1 and A2, two conductor pads P1 and P2, a high resistance R2, and a low resistance R1. The anchor points A1 and A2 are fixed on the substrate 370; the conductor pads P1 and P2 are respectively fixed to the anchor points A1 and A2. The high resistance R2 is coupled to the anchor point A2 and the other end is shorted to the low resistor R1. The low resistance R1 is coupled to the anchor point A1 and the other end is shorted to the low resistor R2. In addition, a short circuit between the high resistance R2 and the low resistance R1 is adhered to the pivot 331H. The low resistance R] has a low resistance value, and the high resistance R2 has a high resistance value. Therefore, when the same current is passed, the thermal energy generated by the two is different, and the rising temperature is different, so the magnitude of the expansion is also different, so By using the magnitude of the passing current, the shape variable of the high resistance R2 and the low resistance R1 is changed, thereby changing the magnitude of the distance D. Therefore, the actuator control circuit 120 can transmit the two voltages Va and Vb to the conductor pads A1 and A2, respectively. The difference between the voltages Va and Vb determines the magnitude of the current flowing through the high resistance R2 and the low resistance R], that is, the magnitude of the deformation. Therefore, the electrothermal actuator 331 can change the relative position of the carrier platform 350 on the substrate 370 according to the difference between the voltages Va and Vb, and the replacement of the page distance D by the 0 lb g correction. Please refer to Figure 10. Fig. 10 is a schematic view showing the electromagnetic actuator of the present invention. The actuators 331 to 334 used in the present invention may be electromagnetic actuators as shown in Fig. 10, and only the actuators 31 are exemplified here. As shown in the figure, the electromagnetic actuator 331 includes an electromagnet 331a and a magnet 331b. The electromagnet 331a is fixed to the substrate 370; the magnet 331b is fixed to the carrier platform 350. The electromagnet 33 ???a includes a core and a wire wound around the core, and conductor pads 33 lg and 33 If. One end of the wire is coupled to the conductor pad 33 lg , and one end is coupled to the conductor pad 331 f . Therefore, the actuator control circuit 120 can transmit the two voltages Va and Vb to the conductor pads 331g and 331f, respectively, to control the current flowing through the wires. The magnitude of the current flowing on the wire will affect the magnetic force of the electromagnet 3 1 a. When the electromagnet 3 31 a has a larger magnetic force, the magnet 3 1 b will be sucked closer. When the magnetic force of the electromagnet 33]b is smaller, the magnet 331b will be sucked farther. Therefore, the electromagnetic actuator 331 can change the distance D 2 ' between the electromagnet 3 31 a and the magnet 3 31 b according to the difference magnitude of the voltages Va and Vb to change the distance D, and change the carrying platform 350 on the substrate 370. Relative position. Please refer to Figure 11. Fig. 11 is a schematic view showing the piezoelectric actuator of the present invention. The actuators 331 to 334 used in the present invention may be piezoelectric actuators as shown in Fig. 11, and only the actuators 31 are exemplified here. As shown in the figure, the piezoelectric actuator 331 includes a piezoelectric material 331a, two anchor points 331d, and two conductor pads 331f and 331g. The piezoelectric material 331a is fixed to the substrate 370 at one end and fixed to the carrying platform 350 at the other end. Piezoelectric material 331a can be high 1354176- * · : ——»————一—• f - 八工茂二 I丨.H . . [1^牟 October replacement page knife) 芑π ^(poly~ Vinyiidence fluoride'PVDF) or """"" lead material (]eadZirconatetita leg e, PZT). The characteristic of the piezoelectric material 33la is that when a voltage is received, a deformation is generated, and the magnitude of the shape variable is proportional to the magnitude of the received voltage. The anchor point 331d is fixed on the substrate, and the conductor pad 33] § and 331f are respectively fixed on the anchor point "^ and respectively guided by the spring, the heart to the piezoelectric material 331a. Therefore, the actuator control circuit" 2〇 can transmit two voltages Va and Vb to the conductor pads 331 and 331f respectively to control the voltage received by the piezoelectric=be 331a. When the voltage received by the piezoelectric material 33u is larger, the deformation is larger; The electric material 33]& receives the electric 璧^ small, the smaller the deformation. Therefore, the actuator control circuit can change the distance D by changing the difference between the transmission voltages Va and Vb, and change the carrying platform 3 5 0 is the relative position on the substrate 3 70. Please refer to the figure f 17 which is a schematic diagram of the image stabilization device 17 of the third embodiment using the MEMS technology of the present invention. Above view of the device, as shown, the image stabilization device 1700 includes an image processing circuit 110, an actuator control circuit 120, a substrate 370, an image sensing element 36, and four anchor points nUa~]74ia. Four anchor points 1711b~1741b, four conductor pads 1712a~1742a, four conductors 1712b~1742b, four-point point 1715~Π45, four-conductor pad 171 8~1748, four-wire ΠΠ~1747, four-conductor pad 1716~1746, four elastic cantilever 17〗4~Π44, four connecting arms 17〗 3~1743 ( A portion of the connecting arm is located below the image sensing component 360 and is thus blocked. The image sensing component 36 includes an image sensing surface 361 and four conductor pads 461 to 464 coupled to the image sensing side 1354176. · 3 correction replacement page 361 for transmitting image signals. The image stabilization device "the other package actuators ACI1 ~ Αςχ_4 are disposed under the image sensing element 360 and - the carrying platform 1850 (because the 17th picture is a top view, The image sensing element J60 blocks). The connecting arms 713 to 1743 are non-electrically coupled to the image sensing element 360. The carrier platform 1850 is non-electrically coupled to the electrostatic actuators ACTI~ACT4 for carrying the image sensing elements 36A. The electrostatic actuators ACT1 to ACT4 are respectively connected to the conductor pads 1712a to 1742a and 1712b to 1742b via the anchor points 17ila to 1741a and nub to mib, respectively. The actuator control circuit 120 is coupled to the conductor pads 1712a to n42a, 17] 2b to 74 holes for controlling the displacement behavior of the electrostatic actuators ACT1 ACT ACT4 to control the position of the carrier platform 1850 and thereby control the image sensing component. 36〇 position. The image sensing surface 361 on the image sensing component 360 is configured to receive an optical image and correspondingly generate an electronic signal on the image sensing component 360. The image processing circuit 110 is respectively coupled to the conductor pads 1718 to 1748. Therefore, the image processing circuit 110 can be connected via the conductor pads 1718 to 1748, the wires 1717 to 1747, the conductor pads 1716 to 1746, and the wires 1719 to 1749 which are arranged by wire bonding. The antenna pads 46 to 464 of the image sensing component 360 are coupled to the electronic signals of the image sensing component 360. Because of the arrangement of the elastic cantilevers 1714~1744, the elastic cantilever 1714~1744 can be extended and contracted when the image sensing component 360 and the substrate 370 are relatively moved, so that the image sensing signal can be smoothly transmitted from the image sensing component 360 to Image processing circuit 110. Therefore, when the substrate 370 is subjected to vibration, the actuator control circuit 120 transmits a control signal to the actuators ACT1 to ACT4, and the opposite of the 20-stage platform 1850 is offset. The vibration of the substrate 370 affects the effect of the frame sensing το仵360. Such as „ pi „ „ X° this - come, the substrate 370 is shaken by the image sensing element, the actual optical image will not be felt. The optical image of the money will also be the last image of the = = road m according to The image generated by the image sensing component 36Q is also stable. It is worth noting that the image stabilization device is completely separated from the actuator actuation signal and the associated transmission path 2 in the image sensing related transmission path. That is to say, in the process, the image sensing signal ^the dedicated path and the actuator actuating signal transmission path can be separately performed, which is convenient for the user. In addition, the second embodiment of this embodiment lies in The actuator and the carrying platform are disposed in the vertical projection of the image sensing member (as seen from the upper view, the actuator and the carrying platform are completely covered under the 5V image sensing element), the purpose is Reduce the use of space, so the size of the hair "like the size of the 1700 will be more effectively reduced to meet the needs of users. In addition, recording points, conductor pads, wires and elastic cantilevers. Further, the position and number of the tenth, the present invention is only exemplified in the seventh drawing, and the user can vary according to the needs of the actual use.凊 考 test the 18th picture. Figure 18 is a schematic view of the image stabilization device of the present invention after the heart image sensing element. Fig. 8 is a diagram showing the image placed on the underside of the image sensing element. The elements located below the shirt image sensing element 36〇 as shown therein include partial connections t]7]3~]743, elastic cantilever n~f4, f55~f58, f51~mortem 4, anchor point 1840, non-conductive Viscose J J ~ ~ J8, carrying platform 1850, electrostatic mini to 1354176 October 100 id 曰 correction replacement pager ACT1 ~ ACT4c stator ACTla ~ A (^ ^ micro actuator ACT) ~ ACT4 respectively contain ACTla ~ ACT4a is respectively connected to the rotor ACTlb~AC D4b. The stator actuator control circuit 120 is at the tin point ni]a~17仏 for receiving
Via〜V4a。轉子Act 4體墊】7l2a〜1742a所傳送之電壓 搞接於㈣nllb〜l7:〜ACT4b分別經由彈性懸臂fl〜『 經由導體墊1712b〜ο/ ’用以接收致動器控制電路120 致動器A⑶〜ACT4所傳送之電壓州,。而靜電 vlb屬之間的差^更可分別根據電壓％〜V4a與 ]的是異乜移來調整承载平台18 板370的位置，進而_感測元件36。的相=基 承載平台敝經由彈性懸… = Α(ΓΑετ4uw利„導電 將衫像感測兀件3一著於承載平台185Q之上 縣 f51〜f58的設置係作為績输 彈性浴臂 卞馮緩衝用途及增強承載平台 定性，使用者可根據需要修改設計。連接臂1? 於影像感測兀件360下方的部分分別設置了 JW4用以將影像感測元件36〇黏著於連接臂=生= 之上。如此靜電致動器ACT1〜ACT4便可控制承 18 5 0以移動影像感測元件3 6 〇，而移動的影像感測元件^ 所產生的影像感測訊號亦可經由彈性縣臂 〜 丄4〜1744及相 關的導體墊與導線傳送至影像處理電路11〇。 及相 ^ 囚此，靜雷 致動器ACT1〜ACT4控制影像感測元件36〇的 影響到影像感測it件36G所傳送的影像感測訊號而提^ 22 1354176 i叫年]0月Via ~ V4a. The voltage transmitted by the rotor Act 4 body pad 7l2a~1742a is connected to (4) nllb~l7:~ACT4b via the elastic cantilever fl~" via the conductor pads 1712b~ο/' for receiving the actuator control circuit 120 actuator A(3) ~ ACT4 transmitted by the voltage state. The difference between the static electricity vlb genus can further adjust the position of the carrier platform 18 plate 370 according to the voltage %~V4a and the difference, and further the sensing element 36. The phase = base bearing platform 敝 via elastic suspension... = Α ΓΑ ΓΑ τ τ 4 4 „ 导电 导电 导电 衫 衫 衫 感 感 衫 感 感 感 感 感 承载 承载 承载 f f f f f f f f f f f f f f f f f f f f f f f f Use and enhance the bearing platform qualitative, the user can modify the design as needed. The connecting arm 1? The part below the image sensing element 360 is respectively provided with JW4 for attaching the image sensing element 36 to the connecting arm = raw = Therefore, the electrostatic actuators ACT1~ACT4 can control the bearing 1850 to move the image sensing component 3 6 〇, and the image sensing signal generated by the moving image sensing component can also pass through the elastic county arm 丄4~1744 and related conductor pads and wires are transmitted to the image processing circuit 11A. In contrast, the static lightning actuators ACT1~ACT4 control the influence of the image sensing element 36〇 to the image sensing device 36G. Image sensing signal and mention ^ 22 1354176 i called year] 0 month
用者更大的便利性C ^ i考第]9圖。弟]9圖係為本發明之影像穩定裝置 -〇〇以，了線封裝之剖面示意圖。第19圖所示剖面部分係 如弟18圖所標示】9〇〇的部分的剖面圖。於第19圖中每Users have greater convenience C ^ i test page 9]. The younger brother] is a schematic diagram of the image stabilization device of the present invention. The section shown in Fig. 19 is a cross-sectional view of a portion of the 〇〇 9 如 as shown in the figure of the 18th. In Figure 19, each
站、〗743是分別經由絕緣層12與16才再與基板37〇 作固定γ如此方可確保沒有電性之連結。彈性懸臂】724則 連接於連接f ] 723與錫點Π25之間。彈性懸臂ι744則連 接於連接臂丨743與錫點⑽之間。導體墊Π28、Π26與 導線]727係透過―絕緣層II固定於錫點1725、彈性懸臂 17_4 |4連接臂1723之上，如此亦可確保沒有電性之連結。 導體墊】748、1746與導線1747係透過—絕緣層17固定於 錨點m5、彈性懸臂1744與連接臂m3之上，如此亦可 破保沒有電性之連結。連接臂㈣經由非導電性黏H 像㈣元件。連接臂1743㈣料電性轉 ^者於影像感測元件36Q。而對於影像感測元件360 2 ’為了與導線]726與1746作電性之連結，因此在影 疋件360的感測面361的周圍設置導體堅462兔 並以打線封裝技術，將導線1729與⑽純於導體 咖。而打線封裝技術有許多種方式，係為該 Ϊ 2有通常知識者所熟知，於此本發明並不詳加闊 =:电致動益ACT2透過-絕緣層13固定於基板η。之 致^:確保沒有電性之連結。彈性懸臂说 毛致動“2與承載平台刪之間。彈性懸臂㈣接： 1354176 _ ]00年]0月id 3修正替換頁 承載平台1850與錨點1840之間。錨點1840透過一絕緣層 14固定於基板370之上，如此可確保沒有電性之連結。靜 電致動器ACT4透過一絕緣層15固定於基板370之上，如 此可確保沒有電性之連結。彈性懸臂f58耦接於靜電致動 器ACT4與承載平台1850之間。彈性懸臂f54耦接於承載 平台1850與錨點1840之間。承載平台1850透過非導電性 黏膠J7與J8將影像感測元件360黏著於承載平台1850之 上。因此，當影像感測元件360於承載平台1850上組裝完 成時，影像處理電路110便可經由（1)導體墊1728、導線 1727、導體墊1726、導線1729、導體墊462，耦接於感測 面361以及（2)導體墊1748、導線1747、導體墊1746、導 線〗749、導體墊464，耦接於感測面361，進而接收影像 感測元件360所傳送之電子訊號。 請參考第20圖。第20圖係為本發明之影像穩定裝置 1700之佈局示意圖。使用者可根據第20圖的佈局方式， 來實現影像穩定裝置Π〇〇。於第20圖中，B表示導線、G 表示非導電黏膠、AN表示錨點、C表示承載平台、ACT 表示靜電致動器及MB表示微形排線。微形排線包含了前 述之導線、導體墊、彈性懸臂以及連接臂。值得注意的是， 於第20圖中，四個靜電致動器的轉子部分，其電壓係為相 同，亦即其控制電壓部分係為耦接在一起。如此僅需分別 控制四個靜電致動器的定子部分的電壓，便可分別控制這 四個靜電致動器位移的程度，以達成穩定影像感測元件的 24 1354176 -. 丨-=- • ’ iOC··年]0月IS日修正替換頁 |_ 目9勺c 另外，本發明之影像穩定裝置1 700雖僅舉以打線封裝 方式來實現，然而使用者亦可根據本發明所揭露之覆晶封 裝方式來實現影像穩定裝置1700，其技術特徵已如前述， 於此不再贅述。 以上所述僅為本發明之較佳實施例，凡依本發明申請 專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範 圍。 【圖式簡單說明】 第1圖係為一利用微機電系統技術之影像穩定裝置之示意 圖。 第2圖係為先前技術之影像穩定裝置之組裝示意圖。 第3圖係為本發明之影像穩定裝置之第一實施例之示意 圖。 第4圖係為本發明之影像穩定裝置之第一實施例之剖面示 意圖。 第5圖係為本發明之影像穩定裝置之第一實施例之組裝示 意圖。 第6圖係為本發明之影像穩定裝置之第二實施例之剖面示 意圖。 第7圖係為本發明之影像穩定裝置之第二實施例之組裝示 意圖。 參 * 第8圖係為本發明之靜電致動器之示意圖。 25 1354176 100年]0月19 5修正替換頁 第9圖係為本發明之電熱致動器之示意圖。 第10圖係為本發明之電磁致動器之示意圖。 第11圖係為本發明之壓電致動器之示意圖。 第12圖係為本發明之影像穩定裝置之第一實施例之以打 線封裝之剖面示意圖。 第13圖係為本發明之影像穩定裝置之第一實施例之以打 線封裝之組裝示意圖。 第14圖係為本發明之影像穩定裝置之第二實施例之以打 線封裝之剖面示意圖。 第15圖係為本發明之影像穩定裝置之第二實施例之以打 線封裝之組裝示意圖。 第16圖係為本發明之靜電致動微型影像穩定裝置之示意 圖。 第17圖係為本發明之利用微機電系統技術之第三實施例 之影像穩定裝置之示意圖。 第18圖係為本發明之影像穩定裝置移除影像感測元件後 之示意圖。 第19圖係為本發明之影像穩定裝置以打線封裝之剖面示 意圖。圖。 第20圖係為本發明之影像穩定裝置之佈局示意圖。 【主要元件符號說明】 100、300、1600 影像穩定裝置 110 影像處理電路 26 1354176 120 131-134 器 'i 1 〇〇主1G € i δ 5修正替換頁 致動器控制電路 33卜334、Α；[〜Α4、ACT1 〜ACT4、ACT 致動 ]33a、1631a〜1634a、ACTla〜ACT4a 定子 133b、1631b〜1634b、ACTlb〜ACT4b轉子 170 > 370 150 、 350 160 、 360 161 、 361 D J 、 J1〜J8 140 141The station 743 is fixed to the substrate 37 via the insulating layers 12 and 16, respectively, so as to ensure that there is no electrical connection. The elastic cantilever 724 is connected between the connection f] 723 and the tin point Π25. The elastic cantilever ι 744 is connected between the connecting arm 743 and the tin point (10). The conductor pads 28, Π 26 and wires 727 are fixed to the tin point 1725 and the elastic cantilever 17_4 | 4 connecting arm 1723 via the insulating layer II, so that the electrical connection is ensured. The conductor pads 748, 1746 and the conductor 1747 are fixed through the insulating layer 17 to the anchor point m5, the elastic cantilever 1744 and the connecting arm m3, so that the electrical connection can be broken. The connecting arm (4) passes through the non-conductive adhesive H-image (4) component. The connecting arm 1743 (4) is electrically transferred to the image sensing element 36Q. For the image sensing component 360 2 'in order to electrically connect with the wires 726 and 1746 , a conductor 462 rabbit is disposed around the sensing surface 361 of the imaging member 360 and the wire 1729 is (10) Pure to conductor coffee. There are many ways of wire bonding technology, which are well known to those skilled in the art, and the present invention is not broadly defined. =: The electroactive ACT2 is fixed to the substrate η through the insulating layer 13. ^^: Make sure there is no electrical connection. The elastic cantilever says that the hair is actuated between "2 and the load-bearing platform. The elastic cantilever (four) is connected: 1354176 _] 00 years] The zero id 3 correction replaces the page between the load-bearing platform 1850 and the anchor point 1840. The anchor point 1840 is transmitted through an insulating layer 14 is fixed on the substrate 370, so as to ensure that there is no electrical connection. The electrostatic actuator ACT4 is fixed on the substrate 370 through an insulating layer 15, so that there is no electrical connection. The elastic cantilever f58 is coupled to the static electricity. Between the actuator ACT4 and the carrying platform 1850, the elastic cantilever f54 is coupled between the carrying platform 1850 and the anchoring point 1840. The carrying platform 1850 adheres the image sensing component 360 to the carrying platform 1850 through the non-conductive adhesives J7 and J8. Therefore, when the image sensing component 360 is assembled on the carrying platform 1850, the image processing circuit 110 can be coupled via (1) the conductor pad 1728, the wire 1727, the conductor pad 1726, the wire 1729, and the conductor pad 462. The sensing surface 361 and (2) the conductor pad 1748, the wire 1747, the conductor pad 1746, the wire 749, and the conductor pad 464 are coupled to the sensing surface 361 to receive the electronic signal transmitted by the image sensing element 360. Reference 20 Fig. 20 is a schematic view showing the layout of the image stabilization device 1700 of the present invention. The user can implement the image stabilization device according to the layout of Fig. 20. In Fig. 20, B indicates a wire and G indicates a non- Conductive adhesive, AN for anchor point, C for load bearing platform, ACT for electrostatic actuator and MB for micro-wire. The micro-wire includes the aforementioned wire, conductor pad, elastic cantilever and connecting arm. Yes, in Figure 20, the rotor sections of the four electrostatic actuators have the same voltage, that is, their control voltage sections are coupled together. Thus, it is only necessary to separately control the stators of the four electrostatic actuators. Part of the voltage, you can control the degree of displacement of the four electrostatic actuators separately to achieve stable image sensing components 24 1354176 -. 丨-=- • 'iOC··year]0 month IS correction replacement page | _ mesh 9 c c In addition, the image stabilization device 1 700 of the present invention is implemented by a wire bonding method, but the user can also implement the image stabilization device 1700 according to the flip chip package disclosed in the present invention, and the technical features thereof Already The above description is only the preferred embodiment of the present invention, and all the equivalent changes and modifications made by the scope of the present invention should be covered by the present invention. Fig. 1 is a schematic diagram of an image stabilization device using MEMS technology. Fig. 2 is a schematic view showing the assembly of the image stabilization device of the prior art. Fig. 3 is a first embodiment of the image stabilization device of the present invention. Figure 4 is a schematic cross-sectional view showing a first embodiment of the image stabilization device of the present invention. Figure 5 is a schematic illustration of the assembly of the first embodiment of the image stabilization device of the present invention. Figure 6 is a cross-sectional view showing a second embodiment of the image stabilization device of the present invention. Figure 7 is a schematic illustration of the assembly of the second embodiment of the image stabilization device of the present invention. Reference Fig. 8 is a schematic view of the electrostatic actuator of the present invention. 25 1354176 100 years] October 19 5 Correction replacement page Fig. 9 is a schematic view of the electrothermal actuator of the present invention. Figure 10 is a schematic view of the electromagnetic actuator of the present invention. Figure 11 is a schematic view of a piezoelectric actuator of the present invention. Figure 12 is a cross-sectional view showing the first embodiment of the image stabilization device of the present invention in a wire package. Figure 13 is a schematic view showing the assembly of the first embodiment of the image stabilization device of the present invention in a wire package. Figure 14 is a cross-sectional view showing the second embodiment of the image stabilization device of the present invention in a wire package. Figure 15 is a schematic view showing the assembly of the wire-stamped package of the second embodiment of the image stabilization device of the present invention. Figure 16 is a schematic view of the electrostatically actuated micro image stabilization device of the present invention. Figure 17 is a schematic diagram of an image stabilization apparatus using a third embodiment of the MEMS technology of the present invention. Figure 18 is a schematic diagram of the image stabilization device of the present invention with the image sensing element removed. Fig. 19 is a cross-sectional view showing the image stabilizing device of the present invention in a wire-wrapped package. Figure. Figure 20 is a schematic view showing the layout of the image stabilization device of the present invention. [Main component symbol description] 100, 300, 1600 image stabilization device 110 image processing circuit 26 1354176 120 131-134 device 'i 1 〇〇 main 1G € i δ 5 correction replacement page actuator control circuit 33 334, Α; [~Α4, ACT1~ACT4, ACT actuation] 33a, 1631a to 1634a, ACTla~ACT4a stators 133b, 1631b to 1634b, ACTlb~ACT4b rotor 170 > 370 150 , 350 160 , 360 161 , 361 DJ , J1 to J8 140 141
1670 1650 、 1850 、 C 基板 承載平台 影像感測元件 影像感測面 距離 非導電性黏膠 排線 接腳 162、46卜 464、33 If、33 lg、381 〜384、P：[、P2、1631c〜1634c、 1631d〜1634d 、 1621〜1624 、 1681a〜1684a 、 1681b〜1684b 、 】712a〜:1742a、1712b〜1742b、1718〜1748、1716〜】746 導 體墊 3311、331J、331K、331L R1、R2 331H 341 、342、343、344、 βΐά 電阻器 電阻 才區軸 Al 、Α2 1715〜1745 J 71 la〜1741a、171 lb〜1741 b、1840、AN錨點 301 〜304、331c、] 601a〜1604a、] 601b〜1604b、1714〜1744 27 1354176 . 100年10月id a修正替換頁 fl〜f4、f51〜f58、F 彈性懸臂 391〜394 、 1271〜1274 、 1691a〜1694a 、 169]b〜1694b 、 1717〜1747 、 1719〜1749 導線 421、424、431、11〜17 絕緣層 411〜414 錫球 V1〜V4、Vcom 電壓 1713〜17431670 1650, 1850, C substrate bearing platform image sensing device image sensing surface distance non-conductive adhesive cable pin 162, 46 464, 33 If, 33 lg, 381 ~ 384, P: [, P2, 1631c ~1634c, 1631d~1634d, 1621~1624, 1681a~1684a, 1681b~1684b, 712a~:1742a, 1712b~1742b, 1718~1748, 1716~]746 Conductor pads 3311, 331J, 331K, 331L R1, R2 331H 341, 342, 343, 344, βΐά Resistor resistance area axis A1, Α2 1715~1745 J 71 la~1741a, 171 lb~1741 b, 1840, AN anchor point 301~304, 331c,] 601a~1604a,] 601b~1604b, 1714~1744 27 1354176. October 100 id a correction replacement page fl~f4, f51~f58, F elastic cantilever 391~394, 1271~1274, 1691a~1694a, 169]b~1694b, 1717~ 1747, 1719~1749 Conductors 421, 424, 431, 11~17 Insulation 411~414 Tin ball V1~V4, Vcom Voltage 1713~1743
微型排線 G 連接臂Miniature cable G connecting arm
MB 非導電性黏膠 28MB non-conductive adhesive 28